Monitor

Abstract

The utility model provides a monitor which comprises a substrate, a rear shell and a plurality of electronic elements, a first cavity is defined by the substrate and the rear shell, and the electronic elements are contained in the first cavity. The substrate is provided with a plurality of heat dissipation openings corresponding to the electronic elements, the rear shell comprises a rear cover made of metal materials, and the side edge of the rear shell is provided with heat dissipation holes. The first cavity communicates with the outside through the heat dissipation holes and the heat dissipation openings. The electronic component comprises a first main board and a second main board which are fixed on the substrate, a heat dissipation channel is formed between the first main board and the heat dissipation opening, and the second main board is attached to the rear cover. Different electronic elements in the monitor can dissipate heat through different parts on the shell, heat dissipation assemblies are reduced, the situation that the heat dissipation assemblies occupy the internal space of the monitor is avoided, and meanwhile the good heat dissipation effect is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the field of medical equipment, and in particular relates to a monitor. Background Art

[0002] With the development of medical technology, electronic equipment such as monitors have also been widely used in the medical field. The functions of existing monitors are constantly enriched, and the number of circuit components inside the monitors is increasing, which makes the monitors have higher and higher requirements for heat dissipation. Monitors on the market usually use fans as heat dissipation components. If there are multiple heating elements in the monitor, multiple heat dissipation components are required, which takes up a lot of space. If the heat dissipation components are reduced, a good heat dissipation effect cannot be achieved. Utility Model Content

[0003] The technical purpose of the utility model is to provide a monitor, aiming to solve the problem that multiple heating components of the monitor require multiple heat dissipation components, and the heat dissipation components occupy a large space.

[0004] In order to solve the above technical problems, the utility model is implemented as follows: a monitor includes a substrate, a rear shell and a plurality of electronic components, the substrate and the rear shell enclose a first cavity, and the electronic components are accommodated in the first cavity; the substrate is provided with a plurality of heat dissipation ports corresponding to the electronic components, the rear shell is provided with heat dissipation holes, the rear shell includes a rear cover made of metal, and the first cavity is connected to the outside through the heat dissipation holes and the heat dissipation ports;

[0005] The electronic component includes a first main board and a second main board fixed on the substrate, a heat dissipation channel is formed between the first main board and the heat dissipation port, and a heat generating area of ​​the second main board is attached to the back cover.

[0006] Furthermore, the monitor further comprises a screen assembly and a front shell, the front shell having an opening capable of fitting the substrate, the screen assembly, the front shell and the substrate enclose a second cavity, the front shell is provided with at least one row of front shell heat dissipation holes, and the second cavity is connected to the outside through the front shell heat dissipation holes;

[0007] The screen assembly includes a screen and a screen bracket. The screen bracket is fixed to the screen and connected to the second cavity. The screen bracket is made of metal and is provided with a plurality of through holes.

[0008] Furthermore, the substrate includes a base and a bottom plate, the first main board includes a first port, and the first port is connected to the bottom plate; the second main board includes a second port, and the second port is connected to the bottom plate.

[0009] Furthermore, the first mainboard also includes a first chip and a heat sink connected to the first chip, and the first chip and the heat sink face the heat dissipation channel.

[0010] Furthermore, the second mainboard includes a second chip, the second chip is the heat generating area, the second chip is attached to the back cover, and a heat conductor is provided at the attachment point between the second chip and the back cover.

[0011] Furthermore, the bottom plate is provided with first heat dissipation holes corresponding to the first main board, and the bottom plate is also provided with second heat dissipation holes corresponding to the second main board.

[0012] Furthermore, the electronic component also includes a battery assembly, which includes a fixing frame and a battery fixed in the fixing frame. One side of the fixing frame is fixedly connected to the substrate, and the other side opposite to the fixing frame is attached to the back cover. The heat conductor is provided at the attachment point between the fixing frame and the back cover.

[0013] Furthermore, the electronic component further comprises a converter, and a third heat dissipation hole is formed on the rear shell near the converter.

[0014] Furthermore, the heat conductor is thermal grease.

[0015] Furthermore, the substrate is made of metal.

[0016] Compared with the prior art, the monitor in the utility model has the following beneficial effects: the utility model discloses a monitor, including a substrate, a rear shell and a plurality of electronic components, the substrate and the rear shell enclose a first cavity, and the electronic components are accommodated in the first cavity; the substrate is provided with a plurality of heat dissipation ports corresponding to the electronic components, the rear shell is provided with heat dissipation holes, the rear shell includes a back cover made of metal material, the first cavity is connected to the outside world through the heat dissipation holes and the heat dissipation ports; the electronic components include a first main board and a second main board fixed on the substrate, a heat dissipation channel is formed between the first main board and the heat dissipation ports, and the heating area of ​​the second main board is attached to the back cover. In the monitor of the utility model, different electronic components can dissipate heat through different parts on the monitor housing, and multiple heat dissipation components are not required. The heat dissipation components occupy little space inside the monitor and can ensure good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an exploded view of the monitor in the embodiment of the utility model;

[0018] Figure 2 It is a bottom view of the monitor in the embodiment of the utility model;

[0019] Figure 3is a cross-sectional view of a monitor in an embodiment of the utility model;

[0020] Figure 4 It is a side view of the monitor substrate in the embodiment of the utility model.

[0021] In the accompanying drawings, the reference numerals represent: 100, monitor; 110, screen assembly; 111, screen; 112, screen bracket; 120, front shell; 121, front shell heat dissipation hole; 130, substrate; 131, base; 1311, heat dissipation port; 1312, protrusion; 132, bottom plate; 1321, first heat dissipation hole; 1322, second heat dissipation hole; 140, rear shell; 141, rear cover; 1421, third heat dissipation hole; 150, electronic component; 151, first main board; 1511, first chip; 1512, first port; 1513, radiator; 152, second main board; 1521, second chip; 1522, second port; 153, battery assembly; 1531, fixing frame; 1532, battery; 154, converter; 160, heat conductor. DETAILED DESCRIPTION

[0022] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0025] Example:

[0026] As attached Figure 1 In this embodiment, a monitor 100 includes: a substrate 130, a rear shell 140 and a plurality of electronic components 150, the substrate 130 and the rear shell 140 enclose a first cavity, and the electronic components 150 are accommodated in the first cavity; the substrate 130 is provided with a plurality of heat dissipation ports 1311 corresponding to the electronic components 150, the rear shell 140 is provided with heat dissipation holes, the rear shell 140 includes a metal back cover 141, and the first cavity is connected to the outside through the heat dissipation holes and the heat dissipation ports 1311;

[0027] The electronic component 150 includes a first main board 151 and a second main board 152 fixed on the substrate 130 . A heat dissipation channel is formed between the first main board 151 and the heat dissipation opening 1311 . The heat generating area of ​​the second main board 152 is attached to the back cover 141 .

[0028] Specifically, in this embodiment, as shown in the attached Figure 1 and 4 The substrate 130 is in a groove shape, and the groove-shaped substrate 130 provides a larger space for the first cavity, thereby providing a larger space for the electronic components 150 in the first cavity, so that the spacing between multiple electronic components 150 is increased, which is beneficial to the heat dissipation of the electronic components 150. In this embodiment, preferably, the heat dissipation port 1311 is directly opposite to the orthographic projection of the electronic component 150 and the area is smaller than the orthographic projection area of ​​the electronic component 150. Each heat dissipation port 1311 is rectangular. In other embodiments, the heat dissipation port 1311 can also be a heat dissipation mesh. The heat dissipation port 1311 is not limited in shape, number and size, as long as it can provide a channel for the electronic component 150 to dissipate heat.

[0029] As attached Figures 1 to 4In this embodiment, the back cover 141 is arranged opposite to the substrate 130, and a heat dissipation channel is formed between the first main board 151 and the heat dissipation port 1311. The heat generated by the first main board 151 when working will leave the first cavity through the heat dissipation port 1311. The second main board 152 is attached to the back cover 141, and the heat generated by the second main board 152 when working will be transferred to the outside through the metal back cover 141. This can avoid using fans or multiple radiators 1513 for heat dissipation when there are multiple main boards inside the monitor 100, which takes up space; on the other hand, because the back cover 141 is arranged opposite to the substrate 130, the first main board 151 dissipates heat through the heat dissipation port 1311 of the substrate 130, and the second main board 152 dissipates heat through the back cover 141, so the heat dissipation directions of the first main board 151 and the second main board 152 are opposite, which avoids the heat dissipation directions of the first main board 151 and the second main board 152 being opposite, resulting in the heat generated by the first main board 151 and the second main board 152 affecting each other. Preferably, the surface of the back cover 141 is serrated, which can increase the heat dissipation area and speed up the heat dissipation speed. In other embodiments, the heat dissipation method of the first mainboard 151 is not limited to allowing the heat generated by the first mainboard 151 to leave the first cavity through the heat dissipation port 1311, but can also be achieved by attaching a heat conductor 160 to the heating element of the first mainboard 151, and the heat conductor 160 transfers the heat to the substrate 130, and then the substrate 130 transfers the heat to the outside of the first cavity.

[0030] Furthermore, as attached Figure 1 The monitor 100 also includes a screen 111 assembly 110 and a front shell 120. The front shell 120 has an opening that can be embedded with a substrate 130. The screen 111 assembly 110, the front shell 120 and the substrate 130 are enclosed to form a second cavity. At least one row of heat dissipation holes of the front shell 120 is provided on the front shell 120. The second cavity is connected to the outside through the heat dissipation holes of the front shell 120.

[0031] The screen 111 assembly 110 includes a screen 111 and a screen 111 bracket. The screen 111 bracket is fixed on the screen 111 and connected to the second cavity. The screen 111 bracket is made of metal.

[0032] Specifically, the screen 111 in this embodiment is a large-sized LCD screen, which generates a large amount of heat. Therefore, this embodiment provides two structures to reduce the temperature of the LCD screen. On the one hand, when the screen 111 generates heat, the temperature of the air in the second cavity rises. Two rows of heat dissipation holes of the front shell 120 are provided on the upper side of the front shell 120. The hot air rises and passes through the heat dissipation holes of the front shell 120 to the outside. The outside air enters the second cavity, which increases the heat dissipation efficiency of the screen 111. On the other hand, the screen 111 bracket is made of aluminum material and is provided with multiple through holes, and is tightly attached to the screen 111 that needs to dissipate heat. The aluminum material has good thermal conductivity and high heat exchange efficiency with the air, which can accelerate the reduction of the temperature of the screen 111.

[0033] In this embodiment, as shown in the attached Figure 1 and 3 The opening of the embedded substrate 130 is located in the center of the front shell 120, and the edge where the opening is connected to the substrate 130 is extended and gathered, so that the edge where the opening is connected to the substrate 130 is in close contact, ensuring the sealing of the edge, making the monitor 100 more stable, and preventing the heat generated by each electronic component 150 from entering the outside from the edge during use to reduce the heat dissipation efficiency. Preferably, the surface of the substrate 130 facing the screen 111 assembly 110 also has a cylindrical protrusion 1312, and the surface of the screen 111 bracket facing the substrate 130 has a corresponding assembly rack. After the substrate 130 is embedded in the opening, the cylindrical protrusion 1312 is inserted into the corresponding assembly rack, so that the substrate 130 is fixedly connected to the screen 111 bracket. This assembly method only uses the substrate 130 and the screen 111 bracket on the screen 111 assembly 110, and the screen 111 assembly 110, the front shell 120 and the substrate 130 can be assembled together, which is convenient for the disassembly and installation of the monitor 100. In other embodiments, the screen 111 assembly 110, the front shell 120 and the substrate 130 may also be connected in a variety of detachable ways such as threaded connection and snap connection.

[0034] Furthermore, if Figure 3 and 4 The substrate 130 includes a base 131 and a bottom plate 132 connected to the base 131 . The first main board 151 includes a first port 1512 connected to the bottom plate 132 . The second main board 152 includes a second port 1522 connected to the bottom plate 132 .

[0035] Specifically, in this embodiment, the first main board 151 and the second main board 152 are arranged in parallel and connected to the base plate 132. The base plate 132 is also provided with interfaces of other electronic components 150 in the area away from the first port 1512 and the second port 1522. The type, number and distribution of the interfaces can be easily designed by technicians in this field according to actual conditions and other requirements, and will not be described in detail here.

[0036] Furthermore, if Figure 1 and 3 The first mainboard 151 further includes a first chip 1511 and a heat sink 1513 connected to the first chip 1511 , and the first chip 1511 and the heat sink 1513 face the heat dissipation channel.

[0037] Specifically, in this embodiment, one end of the heat sink 1513 is fixed on the first main board 151, wherein the first chip 1511 is closely attached to the heat sink 1513. The other end of the heat sink 1513 is a heat sink fin, and the heat sink fin is close to the heat sink 1311 corresponding to the first main board 151. The first chip 1511 generates heat when working, and the generated heat is transferred to the heat sink 1513, and then transferred to the nearby air through the heat sink fins of the heat sink 1513, so that the nearby air is heated, and the heat sink 1311 is connected with the second cavity, and the heated air enters the second cavity through the heat sink 1311, and then is transferred to the outside through the front cover heat sink 1311 on the front cover, so that the first main board 151 completes heat dissipation and the temperature is reduced. In other embodiments, the radiator 1513 may also be a smaller air-cooled radiator 1513 or a water-cooled radiator 1513, and the connection between the first chip 1511 and the radiator 1513 may also be coated with thermally conductive materials such as thermal grease and thermally conductive silicone mud, so that the first chip 1511 is in full contact with the radiator 1513, which is beneficial to heat dissipation.

[0038] Furthermore, if Figure 1 and 3 The second main board 152 includes a second chip, which is a heat generating area. The second chip is connected to the back cover 141 , and a heat conductor 160 is provided at the joint between the second chip and the back cover 141 .

[0039] Specifically, in this embodiment, the joint of the back cover 141 and the second chip is provided with a protrusion 1312, and the joint of the second chip and the protrusion 1312 is provided with a heat conductor 160, and the protrusion 1312 prevents a gap from appearing at the joint of the second chip and the back cover 141, thereby increasing the effective heat dissipation area of ​​the second chip, and at the same time, a certain distance is kept between the second main board 152 and the back cover 141, thereby preventing the heat transferred from the second chip to the back cover 141 from affecting the second main board 152. The heat conductor 160 is also used to fill the gap between the second chip and the protrusion 1312, and timely conduct heat dissipation for the heat generated by the second chip when it is working.

[0040] Furthermore, if Figure 1~2 The bottom plate 132 is provided with first heat dissipation holes 1321 corresponding to the first main board 151 , and the bottom plate 132 is also provided with second heat dissipation holes 1322 corresponding to the second main board 152 .

[0041] Specifically, in this embodiment, the first heat dissipation holes 1321 and the second heat dissipation holes 1322 respectively corresponding to the first main board 151 and the second main board 152 are arranged on the bottom plate, which can also exchange the heat generated by the first main board 151 and the second main board 152 with the outside. It should be known that as long as the corresponding heat dissipation holes are arranged near the rear shell and the base plate of the monitor near the first main board 151 and the second main board 152, the hot air near the first main board 151 and the second main board 152 can be transferred to the outside.

[0042] Furthermore, if Figures 1 to 3 The electronic component 150 also includes a battery assembly 153, which includes a fixing frame 1531 and a battery 1532 fixed in the fixing frame 1531. One side of the fixing frame 1531 is fixedly connected to the substrate 130, and the other side opposite to the fixing frame 1531 is attached to the back cover 141. A heat conductor 160 is provided at the attachment point between the fixing frame 1531 and the back cover 141.

[0043] In this embodiment, the battery assembly 153 is close to the top plate of the substrate 130 in the vertical direction, close to one side of the rear shell 140 in the horizontal direction, and is closely attached to the rear cover 141. The portion of the rear cover 141 close to the fixing frame 1531 forms a convex body inward, and the convex body is closely attached to the battery assembly 153. The fixing frame 1531 is made of metal material that is easy to dissipate heat. The heat of the battery 1532 is first transferred to the fixing frame 1531 made of metal material. The fixing frame 1531 is coated with a heat conductor 160. The heat conductor 160 makes the fixing frame 1531 fit closely to the rear cover 141, and the heat is transferred to the outside through the rear cover 141. In other embodiments, the position of the battery assembly can be anywhere in the first cavity, as long as it is ensured that it does not interfere with the heat generated by other electronic components.

[0044] Furthermore, if Figure 1 The electronic component 150 further includes a converter 154 , which is fixedly connected to the protrusion 1312 , and a third heat dissipation hole 1421 is formed in the rear shell 140 near the converter 154 .

[0045] In this embodiment, the converter 154 is an AC to DC converter. The converter 154 is close to a side edge of the rear shell 140 away from the battery assembly 153 in the horizontal direction, and a row of third heat dissipation holes 1421 are provided on the side edge, so that the converter 154 can keep a distance from the battery assembly 153, and avoid the heat emitted by the converter 154 and the battery assembly 153 when working to affect each other. At the same time, the heat of the battery assembly 153 is transferred to the outside through the rear cover 141, and the heat of the converter 154 is transferred to the outside through the third heat dissipation holes 1421, so that the heat dissipation channels of multiple electronic components 150 are different, which speeds up the heat dissipation efficiency.

[0046] In other embodiments, electronic components 150 such as the battery assembly 153, the converter 154, the first main board 151 and the second main board 152 may be located at other positions different from those in the present embodiment, as long as the above-mentioned electronic components 150 can be fixed in the first cavity, a certain distance is maintained between each electronic component 150, and the heat can be dissipated through multiple heat dissipation locations such as the heat dissipation port 1311 of the substrate 130, the heat dissipation holes of the rear shell 140 and the rear cover 141.

[0047] Furthermore, the heat conductor 160 is thermally conductive silicone grease.

[0048] In this embodiment, if Figure 1 and 3 As shown, preferably, the thermal grease is thermal grease mud, which is coated at the connection between the second chip and the protrusion 1312 of the back cover 141; the thermal grease mud is coated at the connection between the battery assembly 153 and the protrusion of the back cover 141. Thermal grease mud is a thermal grease with high viscosity, which can change its shape as required, and the thermal grease mud will not cross-link and solidify. When the electronic component 150 needs to be replaced during the assembly process, the thermal grease mud is easy to operate. Thermal grease mud can fill the gap between the heating area of ​​the electronic component 150 and the heat dissipation element, so that the heat is quickly exported to the heat dissipation element, thereby accelerating the heat dissipation efficiency. In other embodiments, silicon-based thermal conductors in different states can also be used, such as silicon wafers and silica gel, which also have high thermal conductivity.

[0049] Furthermore, the substrate 130 is made of metal.

[0050] Preferably, in this embodiment, the substrate 130 is an aluminum substrate 130 with light weight, good heat dissipation performance and low assembly cost. In other embodiments, the substrate 130 can also be other metal materials with good heat dissipation performance, such as a copper substrate 130 and an iron substrate 130.

[0051] Furthermore, if Figure 4 As shown, the substrate 130 is further provided with protrusions 1312 evenly distributed along the heat dissipation openings 1311 .

[0052] Preferably, if Figures 1 to 4As shown, four protrusions 1312 are arranged beside the four ends of each rectangular heat dissipation opening 1311. The protrusions 1312 are cylindrical and perpendicular to the bottom surface of the groove of the substrate 130. The other ends of the protrusions 1312 are fixedly connected to the four ends of the electronic component 150. The protrusions 1312 are used to fix the electronic component 150 between the rear shell 140 and the substrate 130, so that the electronic component 150 is stably fixed in the first cavity; on the other hand, the protrusions 1312 have a certain height, so that there is a distance between the electronic component 150 and the substrate 130, which is conducive to the heat of the electronic component 150 passing through the heat dissipation opening 1311. It should be known that the protrusions 1312 are only a structure for fixing and connecting the electronic component 150 and keeping a distance between the electronic component 150 and the substrate 130. In other embodiments, the protrusions 1312 can be brackets with a certain height, and the connection between the protrusions 1312 and the substrate 130 can also be a variety of connection methods such as threaded connection.

[0053] In this embodiment, the fixing frame 1531 of the battery assembly 153 is fixedly connected to the substrate 130 through the protrusion 1312. The protrusion can make the battery assembly 153 fit closely with the back cover 141, reduce the gap, increase the effective contact area, and facilitate heat dissipation. The converter 154 is also fixedly connected to the substrate 130 through the protrusion 1312. The height of the protrusion 1312 connected to the converter 154 is lower than the height of the protrusion 1312 connected to the battery assembly 153. This is because the multiple electronic components 150 other than the converter 154 use the substrate 130 and the back cover 141 for heat dissipation respectively. Keeping a distance between the converter 154 and the substrate 130 and the back cover 141 can prevent the heat transferred to the substrate 130 and the back cover 141 from affecting the converter 154.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A monitor, characterized in that: The device comprises a substrate, a rear shell and a plurality of electronic components, wherein the substrate and the rear shell are enclosed to form a first cavity, and the electronic components are accommodated in the first cavity; the substrate is provided with a plurality of heat dissipation openings corresponding to the electronic components, the rear shell is provided with heat dissipation holes, the rear shell comprises a rear cover made of metal, and the first cavity is connected to the outside through the heat dissipation holes and the heat dissipation openings; The electronic component includes a first main board and a second main board fixed on the substrate, a heat dissipation channel is formed between the first main board and the heat dissipation port, and a heat generating area of ​​the second main board is attached to the back cover.

2. The monitor according to claim 1, characterized in that: The monitor further includes a screen assembly and a front shell, the front shell having an opening capable of fitting the substrate, the screen assembly, the front shell and the substrate enclose a second cavity, the front shell is provided with at least one row of front shell heat dissipation holes, and the second cavity is connected to the outside through the front shell heat dissipation holes; The screen assembly includes a screen and a screen bracket, the screen bracket is fixed to the screen and connected to the second cavity, and the screen bracket is made of metal.

3. The monitor according to claim 1, characterized in that: The substrate includes a base and a bottom plate, the first main board includes a first port, and the first port is connected to the bottom plate; the second main board includes a second port, and the second port is connected to the bottom plate.

4. The monitor according to claim 3, characterized in that: The first mainboard further includes a first chip and a heat sink connected to the first chip, and the first chip and the heat sink face the heat dissipation channel.

5. The monitor according to claim 3, characterized in that: The second mainboard includes a second chip, the second chip is the heat generating area, the second chip is attached to the back cover, and a heat conductor is provided at the attachment point between the second chip and the back cover.

6. The monitor according to claim 3, characterized in that: The bottom plate is provided with first heat dissipation holes corresponding to the first main board, and the bottom plate is also provided with second heat dissipation holes corresponding to the second main board.

7. The monitor according to claim 1, characterized in that: The electronic component also includes a battery assembly, which includes a fixing frame and a battery fixed in the fixing frame. One side of the fixing frame is fixedly connected to the substrate, and the other side opposite to the fixing frame is attached to the back cover. A heat conductor is provided at the attachment point between the fixing frame and the back cover.

8. The monitor according to claim 1, characterized in that: The electronic component further comprises a converter, and a third heat dissipation hole is formed in the rear shell close to the converter.

9. The monitor according to claim 5 or 7, characterized in that: The heat conductor is thermally conductive silicone grease.

10. The patient monitor according to claim 1, characterized in that: The substrate is made of metal.

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