LED light source structure and backlight module

Abstract

The utility model discloses an LED light source structure and a backlight module. The LED light source structure comprises a support, an LED chip, a driving chip and a lens structure. A bracket; the LED chip is mounted on the bracket, the LED chip is a vertical chip, and the surface of one side, far away from the bracket, of the LED chip is covered with a fluorescent glue layer; the driving chip is located on the support, and the side, close to the LED chip, of the driving chip is connected with the LED chip through a lead. The lens structure is positioned on the bracket and covers the LED chip and the driving chip; according to the LED light source structure, the cost can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of light sources, and in particular to an LED light source structure and a backlight module. Background Art

[0002] The current LED light source is to set a positive LED chip in a bowl bracket, and then fill the entire bowl with fluorescent glue to cover and surround the LED chip; then cut it into independent lamp beads and set them on the circuit board, and set lenses accordingly to form a light board. The formation of the light board requires setting a bowl-shaped bracket, and at the same time, it is necessary to fill the entire bowl with fluorescent glue, which is costly.

[0003] Therefore, the current technology still needs to be improved and enhanced. Utility Model Content

[0004] The present application provides an LED light source structure and a backlight module, which can alleviate the problem of high cost of current LED light source structures.

[0005] The present application provides an LED light source structure, which includes a bracket, an LED chip, a driver chip and a lens structure; the bracket; the LED chip is mounted on the bracket, the LED chip is a vertical chip, and the surface of the LED chip on the side away from the bracket is covered with a fluorescent glue layer; the driver chip is located on the bracket, and the side close to the LED chip is connected to the LED chip through a lead; the lens structure is located on the bracket and covers the LED chip and the driver chip.

[0006] In the LED light source structure of some embodiments, the LED chip is a blue light LED chip, and the fluorescent adhesive layer is a yellow fluorescent powder adhesive layer.

[0007] In some embodiments of the LED light source structure, the lens structure has a receiving hole, which is located on a side of the lens structure close to the LED chip, and is used to receive the LED chip and the driver chip.

[0008] In the LED light source structure of some embodiments, a pit is provided on a side of the lens structure away from the LED chip and the driver chip, and the pit is located above the accommodating hole in the vertical direction.

[0009] In the LED light source structure of some embodiments, the cross section of the pit is circular, and two opposite sides of the longitudinal section of the pit are curved.

[0010] In the LED light source structure of some embodiments, the area of ​​the fluorescent adhesive layer away from the vertical chip is larger than the area of ​​the surface where the fluorescent adhesive layer and the vertical chip are attached, and the side surface of the fluorescent adhesive layer is an inclined surface.

[0011] In the LED light source structure of some embodiments, the fluorescent glue layer is in the shape of an inverted pyramid, and the cross section of the fluorescent glue layer in the vertical direction is in the shape of an inverted trapezoid.

[0012] In the LED light source structure of some embodiments, the angle between the side surface of the fluorescent glue layer and the horizontal direction of the vertical chip is 45°.

[0013] The embodiment of the present application further provides a backlight module, which includes a circuit board and a plurality of LED light source structures as described above, wherein the plurality of LED light source structures are located on the circuit board.

[0014] In some embodiments of the LED light source structure, multiple LED light source structures are arranged in a row on a circuit board, and the driving chips in the LED light source structures in the same row are connected in series.

[0015] The present application provides an LED light source structure and a backlight module, wherein the bracket in the LED light source structure is a plate-like structure without a bowl-cup setting, and the LED chip is directly mounted on the bracket, and the bowl-cup design can be omitted to achieve the purpose of cost saving. Correspondingly, in this embodiment, a vertical chip is directly used, and when filling the fluorescent glue layer, it is only necessary to cover the fluorescent glue layer on one side of the LED chip. Compared with covering the entire bowl-cup and the surroundings of the LED chip with the fluorescent glue layer, in this embodiment, the amount of fluorescent glue and fluorescent powder can be reduced, thereby reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0017] Figure 1 This is a schematic diagram of the structure of the LED light source provided in an embodiment of the present application.

[0018] Figure 2 This is a schematic diagram of the structure of the fluorescent glue layer in the LED light source structure provided in an embodiment of the present application.

[0019] Figure 3 A structural schematic diagram of the light incident surface and the light emitting surface of the lens structure in the LED light source structure provided in an embodiment of the present application.

[0020] Figure 4 A circuit diagram of a driver chip in a backlight module provided in an embodiment of the present application.

[0021] Figure 5 A schematic diagram of the structure of the backlight module provided in an embodiment of the present application.

[0022] Reference numerals:

[0023] 11. bracket; 12. LED chip; 13. driver chip; 14. fluorescent adhesive layer; 15. lead wire; 16. lens structure; 161. light incident surface; 162. light emitting surface;

[0024] 21. Circuit board; 22. Diffuser plate; 23. Optical film; 24. Lamp support. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of technical features indicated. The features specified as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present utility model, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0027] See also Figure 1 The present embodiment provides an LED light source structure, including a bracket 11, an LED chip 12, a driver chip 13 and a lens structure 16; wherein, the bracket 11, the LED chip 12 is mounted on the bracket 11, the LED chip 12 is a vertical chip, and the surface of the side of the LED chip 12 away from the bracket 11 is covered with a fluorescent glue layer 14; the driver chip 13 is located on the bracket 11, and the side close to the LED chip 12 is connected to the LED chip 12 through a lead 15; the lens structure 16 is located on the bracket 11, and covers the LED chip 12 and the driver chip 13.

[0028] The bracket 11 in this embodiment is a plate-like structure without a bowl-cup setting. The LED chip 12 is directly mounted on the bracket 11, and the bowl-cup design can be omitted to achieve the purpose of cost saving. Correspondingly, in this embodiment, a vertical chip is directly used. When filling the fluorescent glue layer 14, it is only necessary to cover the fluorescent glue layer 14 on one side of the LED chip 12. Compared with covering the fluorescent glue layer 14 on the entire bowl and the surroundings of the LED chip 12, in this embodiment, the amount of fluorescent glue and fluorescent powder can be reduced, thereby reducing costs.

[0029] At the same time, the LED light source structure in this embodiment adopts an integrated arrangement of LED chips 12, driver chips 13 and lens structures 16, which can reduce the cost of making parts. Specifically, in the current LED chip 12, during the preparation process, a plurality of LED chips 12 are first mounted on an empty bracket 11, and then the crystal bonding wires and glue dispensing are performed, and then, a single LED lamp bead is cut, and then the single LED lamp bead is set on the circuit board and the lens structure 16 is set one by one, and the driver chip 13 is set accordingly, so that multiple LED chips 12 share one driver chip 13. In this embodiment, a plurality of LED chips 12 and the driver chip 13 corresponding to each chip are first mounted on the empty bracket 11 (the LED chip 12 in this embodiment has a fluorescent glue layer 14 on the surface before cutting), and then the crystal bonding wires are fixed, and then the lens is attached to the entire bracket 11. Finally, after cutting, a single LED light source structure is obtained and attached to the circuit board. Then, in this embodiment, the driver chip 13 is mounted in a uniform manner with a smaller distance between them, just like the LED chip 12 is mounted; currently, multiple LED chips 12 share one driver chip 13, and when the driver chips 13 are mounted, the distance between the two driver chips 13 is relatively larger, thereby increasing the mounting stroke and reducing the mounting efficiency. Therefore, in this embodiment, the integrated setting of the lens structure 16, the LED chip 12 and the driver chip 13 can save the mounting cost. At the same time, in this embodiment, one LED chip 12 corresponds to one driver chip 13, which can reduce the jumper setting of the circuit board compared to multiple LED chips 12 sharing one driver chip 13, thereby simplifying the layout of the circuit board.

[0030] In some embodiments, the LED chip 12 is a blue LED chip 12, and the fluorescent glue layer 14 is a yellow fluorescent glue layer. In this embodiment, the blue LED chip 12 can excite the yellow fluorescent powder in the fluorescent glue layer 14 to emit white light, thereby forming a white light LED light source structure.

[0031] See also Figure 2In some embodiments, the area of ​​the fluorescent glue layer 14 away from the vertical chip is larger than the area of ​​the surface where the fluorescent glue layer 14 and the vertical chip are attached, and the side of the fluorescent glue layer 14 is an inclined surface. In this embodiment, the fluorescent glue layer 14 is arranged on the vertical chip, and the area of ​​the fluorescent glue layer 14 is larger the farther away from the LED chip 12, and the side of the fluorescent glue layer 14 is an inclined surface, so that the edge of the fluorescent glue layer 14 gradually becomes thinner, so that the part of the fluorescent glue layer 14 with uniform thickness is directly opposite to the side with high luminous intensity of the LED chip 12, and the part of the fluorescent glue layer 14 with thinner thickness cooperates with the side with low luminous intensity of the LED chip 12, so as to achieve that the thickness of the fluorescent glue layer 14 corresponds to the distribution of luminous intensity of the LED chip 12; in this application, the blue light LED chip 12 excites the yellow phosphor in the fluorescent glue layer 14 to emit white light, and at the same time, the light emitted from the side of the LED chip 12 can excite the yellow phosphor in the edge of the fluorescent glue layer 14 to generate white light, and finally achieves the effect that the color of the aperture periphery is the same as that of the middle after the white light LED light source structure emits light as a whole, thereby improving the uniformity and consistency of the light output.

[0032] In some embodiments, the fluorescent glue layer 14 is in an inverted pyramid shape, and the cross section of the fluorescent glue layer 14 in the vertical direction is an inverted trapezoid. In this embodiment, the fluorescent glue layer 14 is set to be in an inverted pyramid shape, so that the cross section of the fluorescent glue layer 14 in the vertical direction is an inverted trapezoid, ensuring that the structure of the four edges of the fluorescent glue layer 14 is consistent, thereby ensuring that the light uniformity of the four sides of the LED light source structure is consistent.

[0033] In some embodiments, the angle ɑ between the side surface of the fluorescent glue layer 14 and the horizontal direction of the vertical chip is 45°.

[0034] See also Figure 3 In some embodiments, the lens structure 16 has a receiving hole, which is located on a side of the lens structure 16 close to the LED chip 12, and is used to receive the LED chip 12 and the driver chip 13. In this embodiment, the inner wall of the receiving hole is a light incident surface 161, and an LED chip 12 and a driver chip 13 are disposed in the receiving hole, so as to form an integrated structure of the lens structure 16, the LED chip 12 and the driver chip 13.

[0035] In some embodiments, a pit is provided on one side of the lens structure 16 away from the LED chip 12 and the driver chip 13, and the pit is located above the receiving hole in the vertical direction. In this embodiment, the pit is located at the center of the lens structure 16, and the inner wall of the pit constitutes part of the light emitting surface 162. The pit diverges the light that is relatively concentrated in the vertical direction, thereby making the light more uniform.

[0036] In some embodiments, the cross section of the pit is circular, and two opposite sides of the longitudinal section of the pit are curved.

[0037] In some embodiments, the lead 15 is a metal wire; the metal wire can be an aluminum wire, a gold wire, a copper wire, or the like.

[0038] Please also read Figure 4 and Figure 5 The embodiment of the present application further provides a backlight module, which includes a circuit board 21 and a plurality of LED light source structures, and the plurality of light source structures are located on the circuit board 21. The plurality of LED light source structures are arranged in a row on the circuit board 21, and the driving chips 13 in the LED light source structures in the same row are connected in series.

[0039] As an embodiment, the driving chip 13 in this embodiment is a voltage stabilizing chip, and the model of the voltage stabilizing chip may be C1117M33. Of course, other models of driving chips 13 may also be selected in other embodiments, and the embodiment of the present application is not limited to this.

[0040] like Figure 4 As shown, taking the LED light source structure with two columns and eight rows on the lamp board as an example, the corresponding driver chip 13 is also set in two columns and eight rows. The VLED end of each driver chip 13 is connected to the corresponding LED chip 12, the positive electrode of the LED chip 12 is connected to the VLED+ voltage, the OUT end of each driver chip 13 is grounded, the VIN end of the first driver chip 13 in the first column is connected to the DI1 signal end, the VIN end of the first driver chip 13 in the second column is connected to the DI1A signal end, the GND end of the last driver chip 13 in the first column is connected to the DI1A signal end, and the VIN signal end of each other driver chip 13 in each column is connected to the GND end of the previous driver chip 13, so as to form a series connection relationship between the driver chips 13 in the same column in sequence. Among them, compared with multiple LED chips sharing one driver chip 13, the corresponding driver chip 13 is a multi-channel chip. In this embodiment, one LED chip corresponds to one driver chip 13, which can effectively reduce the number of jumpers. The LED chip and the driver chip 13 have the same common voltage, that is, the VLED+ voltage, so that one line can be reduced, thereby simplifying the layout of the circuit board 21.

[0041] In some embodiments, a diffusion plate 22 and an optical film 23 are stacked on the circuit board 21, and a lamp support 24 is further provided between the diffusion plate 22 and the circuit board 21. The lamp support 24 is provided to prevent the diffusion plate 22 and the optical film 23 from squeezing the LED light source structure. Since the LED light source structure is described in detail above, it will not be repeated here.

[0042] The LED light source structure provided in the embodiments of the present application is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. An LED light source structure, characterized in that: include: Bracket; An LED chip, wherein the LED chip is mounted on the bracket, the LED chip is a vertical chip, and a surface of the LED chip on one side away from the bracket is covered with a fluorescent glue layer; A driving chip, the driving chip is located on the bracket and connected to the LED chip through a lead at a side close to the LED chip; A lens structure is located on the bracket and covers the LED chip and the driver chip.

2. The LED light source structure according to claim 1, characterized in that: The LED chip is a blue light LED chip, and the fluorescent glue layer is a yellow fluorescent powder glue layer.

3. The LED light source structure according to claim 1, characterized in that: The lens structure has a receiving hole, the receiving hole is located at a side of the lens structure close to the LED chip, and the receiving hole is used to receive the LED chip and the driving chip.

4. The LED light source structure according to claim 3, characterized in that: A pit is arranged on a side of the lens structure away from the LED chip and the driving chip, and the pit is located above the accommodating hole in a vertical direction.

5. The LED light source structure according to claim 4, characterized in that: The cross section of the pit is circular, and two opposite sides of the longitudinal section of the pit are curved lines.

6. The LED light source structure according to claim 1 or 2, characterized in that: The area of ​​the fluorescent glue layer away from the vertical chip is larger than the area of ​​the surface where the fluorescent glue layer and the vertical chip are attached, and the side surface of the fluorescent glue layer is an inclined surface.

7. The LED light source structure according to claim 1 or 2, characterized in that: The fluorescent glue layer is in the shape of an inverted pyramid, and the cross section of the fluorescent glue layer in the vertical direction is in the shape of an inverted trapezoid.

8. The LED light source structure according to claim 7, characterized in that: The angle between the side surface of the fluorescent glue layer and the horizontal direction of the vertical chip is 45°.

9. A backlight module, characterized in that: The backlight module comprises: Circuit Board: A plurality of LED light source structures according to any one of claims 1 to 8, wherein the plurality of LED light source structures are located on the circuit board.

10. The backlight module according to claim 9, characterized in that: A plurality of the LED light source structures are arranged in a row on the circuit board, and the driving chips in the LED light source structures in the same row are connected in series.

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