Double-layer micro-channel direct cooling system

Abstract

The utility model relates to the technical field of batteries, in particular to a double-layer micro-channel direct cooling system which comprises an upper liquid cooling plate and a lower liquid cooling plate, the upper liquid cooling plate and the lower liquid cooling plate are arranged up and down in the first preset direction, and the flowing directions of refrigerants in the upper liquid cooling plate and the lower liquid cooling plate are opposite. Therefore, in the double-layer micro-channel direct cooling system provided by the invention, the upper liquid cooling plate and the lower liquid cooling plate are designed, the flowing directions of refrigerants in the upper liquid cooling plate and the lower liquid cooling plate are opposite, and the refrigerants are coupled with each other, so that the temperature distribution of the liquid cooling plates is more uniform. In addition, expansion valves are integrated at inlets of the upper liquid cooling plate and the lower liquid cooling plate, accurate flow control can be achieved according to system requirements, the integration degree is high, stability and reliability are achieved, and the efficiency of the refrigerating system is improved.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a double-layer microchannel direct cooling system. Background Art

[0002] At present, battery packs are equipped with a single-layer liquid cooling plate with refrigerant flowing inside. In the traditional direct cooling plate solution, the refrigerant in the liquid cooling plate causes the temperature of the back-end process of the direct cooling plate to be too low or too high due to pressure drop or overheating, resulting in excessive temperature difference between the batteries. Utility Model Content

[0003] The purpose of this application is to provide a double-layer microchannel direct cooling system, which to a certain extent solves the traditional direct cooling plate solution existing in the prior art, the refrigerant in the single-layer liquid cooling plate causes the temperature of the direct cooling plate rear end process to be too low or too high due to pressure drop or overheating, resulting in the technical problem of excessive temperature difference in the battery.

[0004] The present application provides a double-layer microchannel direct cooling system, comprising: an upper liquid cooling plate and a lower liquid cooling plate, wherein the upper liquid cooling plate and the lower liquid cooling plate are arranged up and down along a first preset direction, and the flow directions of the refrigerants in the upper liquid cooling plate and the lower liquid cooling plate are opposite.

[0005] In the above technical solution, further, the double-layer microchannel direct cooling system further includes a first flow channel component, a second flow channel component and a third flow channel component; wherein the first flow channel component and the third flow channel component are sequentially spaced along the second preset direction;

[0006] Along a direction perpendicular to the second preset direction, the second flow channel component is arranged in sequence with the first flow channel component and the third flow channel component respectively; the first flow channel component, the second flow channel component and the third flow channel component respectively form an upper flow channel and a lower flow channel that are arranged at intervals.

[0007] In any of the above technical solutions, further, the upper liquid cooling plate and the lower liquid cooling plate are arranged between the first flow channel assembly and the second flow channel assembly, and the upper liquid cooling plate is respectively connected to the upper flow channels of the two, and the lower liquid cooling plate is respectively connected to the lower flow channels of the two;

[0008] The upper liquid cooling plate and the lower liquid cooling plate are arranged between the third flow channel assembly and the second flow channel assembly, and the upper liquid cooling plate is respectively connected with the upper flow channels of the two, and the lower liquid cooling plate is respectively connected with the lower flow channels of the two.

[0009] In any of the above technical solutions, further, the double-layer microchannel direct cooling system also includes a valve, a first aggregate flow channel and a second aggregate flow channel; the valve forms two groups of interfaces, and each group of interfaces includes two connected interfaces;

[0010] The inlet end of the upper circulation channel of the first flow channel component and the inlet end of the lower circulation channel of the third flow channel component are respectively connected to one of a group of interfaces of the valve via the first collecting flow channel; the outlet end of the upper circulation channel of the first flow channel component and the outlet end of the lower circulation channel of the third flow channel component are respectively connected to one of the other group of interfaces of the valve via the second collecting flow channel.

[0011] In any of the above technical solutions, further, the double-layer microchannel direct cooling system also includes a valve, a first diverter and a second diverter; the valve forms two groups of interfaces, and each group of interfaces includes two connected interfaces;

[0012] The inlet end of the upper circulation channel of the first flow channel component and the inlet end of the lower circulation channel of the third flow channel component are respectively connected to one of a group of interfaces of the valve via the first diverter; the outlet end of the upper circulation channel of the first flow channel component and the outlet end of the lower circulation channel of the third flow channel component are connected to one of the other group of interfaces of the valve via the second diverter.

[0013] In any of the above technical solutions, further, the double-layer microchannel direct cooling system also includes a first three-way joint and a second three-way joint, and the inlet end of the upper flow channel of the first flow channel component and the inlet end of the lower flow channel of the third flow channel component correspond to the two interfaces of the first three-way joint one by one and are connected;

[0014] The outlet end of the upper circulation channel of the first flow channel component and the outlet end of the lower circulation channel of the third flow channel component correspond to the two interfaces of the second three-way connector one by one and are connected.

[0015] In any of the above technical solutions, further, the double-layer microchannel direct cooling system also includes a conveying component, and the first flow channel component, the third flow channel component, the first aggregate flow channel and the second aggregate flow channel are formed on the same conveying component.

[0016] In any of the above technical solutions, further, the double-layer microchannel direct cooling system also includes a conveying component, and the first flow channel component, the third flow channel component, the first aggregate flow channel and the second aggregate flow channel are respectively formed in different conveying components.

[0017] In any of the above technical solutions, further, the valve is an expansion valve.

[0018] In any of the above technical solutions, further, the double-layer microchannel direct cooling system further includes a first upper flow channel, a second upper flow channel, a first lower flow channel and a second lower flow channel; wherein the first upper flow channel and the second upper flow channel are arranged at intervals along a second preset direction, and the upper liquid cooling plate is arranged between the two;

[0019] The two sides of the upper liquid cooling plate are respectively connected to the first upper flow channel and the second upper flow channel; the first lower flow channel and the second lower flow channel are arranged at intervals along the second preset direction, and the lower liquid cooling plate is arranged between the two; the two sides of the lower liquid cooling plate are respectively connected to the first lower flow channel and the second lower flow channel.

[0020] In any of the above technical solutions, further, the upper liquid cooling plate and the lower liquid cooling plate are each formed with a plurality of heat exchange channels, and any of the heat exchange channels extends along the second preset direction; the plurality of heat exchange channels are parallel to the large surface of the corresponding upper liquid cooling plate or the lower liquid cooling plate, and are arranged sequentially and spaced apart along a direction perpendicular to the second preset direction.

[0021] Compared with the prior art, the beneficial effects of this application are:

[0022] In the double-layer microchannel direct cooling system provided in the present application, an upper liquid cooling plate and a lower liquid cooling plate are designed, and the refrigerant flows in opposite directions in the upper liquid cooling plate and the lower liquid cooling plate, and couples with each other, so that the temperature distribution of the liquid cooling plate is more uniform. In addition, expansion valves are integrated at the inlet of the upper liquid cooling plate and the lower liquid cooling plate, which can realize precise flow control according to system needs, with high integration, stability and reliability, and improve the efficiency of the refrigeration system. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A schematic diagram of the structure of a double-layer microchannel direct cooling system provided in Example 1 of the present application;

[0025] Figure 2 Another structural schematic diagram of the double-layer microchannel direct cooling system provided in Example 1 of the present application;

[0026] Figure 3Another structural schematic diagram of the double-layer microchannel direct cooling system provided in Example 1 of the present application;

[0027] Figure 4 for Figure 3 A schematic diagram of the enlarged structure at A;

[0028] Figure 5 A schematic diagram of the refrigerant flow in the double-layer microchannel direct cooling system provided in Example 1 of the present application;

[0029] Figure 6 Another schematic diagram of the refrigerant circulation of the double-layer microchannel direct cooling system provided in Example 1 of the present application;

[0030] Figure 7 Another schematic diagram of the refrigerant circulation of the double-layer microchannel direct cooling system provided in Example 2 of the present application;

[0031] Figure 8 Another schematic diagram of the refrigerant flow in the double-layer microchannel direct cooling system provided in Example 2 of the present application.

[0032] Reference numerals:

[0033] 1-valve, 2-first flow channel assembly, 3-upper liquid cooling plate, 31-first upper liquid cooling plate, 32-second upper liquid cooling plate, 4-lower liquid cooling plate, 41-first lower liquid cooling plate, 42-second lower liquid cooling plate, 5-second flow channel assembly, 6-third flow channel assembly. DETAILED DESCRIPTION

[0034] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0035] The components of the embodiments of the present application generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed, but merely represents the selected embodiments of the present application.

[0036] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of this application.

[0037] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0038] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] Refer to the following Figures 1 to 8 A double-layer microchannel direct cooling system according to some embodiments of the present application is described.

[0040] Embodiment 1

[0041] See also Figures 1 to 6 As shown, an embodiment of the present application provides a double-layer microchannel direct cooling system, including an upper liquid cooling plate 3 and a lower liquid cooling plate 4. Along a first preset direction, the upper liquid cooling plate 3 and the lower liquid cooling plate 4 are arranged up and down, and the flow directions of the refrigerants in the upper liquid cooling plate 3 and the lower liquid cooling plate 4 are opposite.

[0042] According to the structure described above, it can be seen that the refrigerant flows in opposite directions in the upper liquid cooling plate 3 and the lower liquid cooling plate 4 and couples with each other, so that the temperature distribution of the liquid cooling plates is more uniform.

[0043] In this embodiment, preferably, Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, the double-layer microchannel direct cooling system further includes a first flow channel component 2, a second flow channel component 5 and a third flow channel component 6; wherein the first flow channel component 2 and the third flow channel component 6 are sequentially arranged at intervals along the second preset direction;

[0044] Along the direction perpendicular to the second preset direction, the second flow channel component 5 is arranged in sequence with the first flow channel component 2 and the third flow channel component 6; the first flow channel component 2, the second flow channel component 5 and the third flow channel component 6 are respectively formed with upper flow channels and lower flow channels arranged at intervals.

[0045] Further, preferably, Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, an upper liquid cooling plate 3, i.e., a first upper liquid cooling plate 31, and a lower liquid cooling plate 4, i.e., a second lower liquid cooling plate 42, are disposed between the first flow channel assembly 2 and the second flow channel assembly 5, and the first upper liquid cooling plate 31 is respectively connected to the upper flow channels of the two, and the second lower liquid cooling plate 42 is respectively connected to the lower flow channels of the two;

[0046] An upper liquid cooling plate 3, i.e., the second upper liquid cooling plate 32, and a lower liquid cooling plate 4, i.e., the first lower liquid cooling plate 41, are arranged between the third flow channel assembly 6 and the second flow channel assembly 5, and the second upper liquid cooling plate 32 is respectively connected to the upper flow channels of the two, and the first lower liquid cooling plate 41 is respectively connected to the lower flow channels of the two.

[0047] According to the structure described above, the refrigerant flows into the upper liquid cooling plate 3 between the first flow channel assembly 2 and the second flow channel assembly 5, that is, the first upper liquid cooling plate 31, through the upper circulation channel of the first flow channel assembly 2, flows out of the first upper liquid cooling plate 31 after the heat exchange is completed, and flows into the upper liquid cooling plate 3 between the second flow channel assembly 5 and the third flow channel assembly 6, that is, the second upper liquid cooling plate 32 through the upper circulation channel of the second flow channel assembly 5 on the other side, forming a circulation.

[0048] At the same time, the refrigerant flows into the lower liquid cooling plate 4 between the third flow channel assembly 6 and the second flow channel assembly 5, that is, the first lower liquid cooling plate 41, through the lower circulation channel of the third flow channel assembly 6, flows out of the first lower liquid cooling plate 41 after the heat exchange is completed, and flows into the lower liquid cooling plate 4 between the second flow channel assembly 5 and the third flow channel assembly 6, that is, the second lower liquid cooling plate 42 through the lower circulation channel of the second flow channel assembly 5 on the other side, forming a circulation.

[0049] It can be seen that the refrigerant is circulated in the multiple upper liquid cooling plates 3 and the multiple lower liquid cooling plates 4 respectively. One circulation can realize the cooling of multiple battery modules, while ensuring the cooling efficiency, saving parts and further saving space, which helps to improve the energy density of the battery pack.

[0050] In this embodiment, preferably, Figure 1 and Figure 2 As shown, the double-layer microchannel direct cooling system also includes a valve 1, a first summary flow channel and a second summary flow channel (only the valve 1 is shown in the figure, while the first summary flow channel and the second summary flow channel are not shown); the valve 1 is formed with two groups of interfaces, and each group of interfaces includes two connected interfaces, that is, the valve 1 has a first interface, a second interface, a third interface and a fourth interface, wherein the first interface and the second interface are connected, and the third interface and the fourth interface are connected;

[0051] The inlet end of the upper circulation channel of the first flow channel component 2 and the inlet end of the lower circulation channel of the third flow channel component 6 are respectively connected to one of the interfaces in a group of interfaces of the valve 1 via the first collecting flow channel; the outlet end of the upper circulation channel of the first flow channel component 2 and the outlet end of the lower circulation channel of the third flow channel component 6 are respectively connected to one of the interfaces in another group of interfaces of the valve 1 via the second collecting flow channel.

[0052] According to the structure described above, the refrigerant flows into the first interface of the valve 1, and flows out from the second interface to the first collecting channel, and then is divided into two paths, one of which is delivered to the upper circulation channel of the first channel assembly 2, and the other is delivered to the lower circulation channel of the third channel assembly 6, and then flows into the first upper liquid cooling plate 31 and the first lower liquid cooling plate 41 respectively. When one path of refrigerant completes heat exchange in the first upper liquid cooling plate 31 and the second upper liquid cooling plate 32 in turn, and the other path of refrigerant completes heat exchange in the first lower liquid cooling plate 41 and the second lower liquid cooling plate 42 in turn, the two paths of refrigerant merge into the second collecting channel, and flow from the second collecting channel into the third interface of the valve 1, and finally flow out from the fourth interface.

[0053] Further, preferably, the valve 1 is an expansion valve, which can realize accurate flow control according to system requirements, has high integration, is stable and reliable, and improves the efficiency of the refrigeration system, and preferably, the valve 1 can be an electronic expansion valve or a thermal expansion valve, which can be selected according to actual needs. Of course, it is not limited to this, and the valve 1 can also be an ordinary four-way valve.

[0054] It should be noted that: not limited to the above-mentioned structure using valve 1 and the first and second aggregated flow channels, other structures can also be used to distribute the refrigerant, for example: the first type, the double-layer microchannel direct cooling system also includes valve 1, a first flow divider and a second flow divider, that is, the flow divider is used to replace the first and second aggregated flow channels; the valve 1 forms two groups of interfaces, and each group of interfaces includes two connected interfaces;

[0055] The inlet end of the upper circulation channel of the first flow channel component 2 and the inlet end of the lower circulation channel of the third flow channel component 6 are respectively connected to one of a group of interfaces of the valve 1 via a first diverter; the outlet end of the upper circulation channel of the first flow channel component 2 and the outlet end of the lower circulation channel of the third flow channel component 6 are connected to one of the other group of interfaces of the valve 1 via a second diverter.

[0056] The second type, a double-layer microchannel direct cooling system further includes a first three-way joint and a second three-way joint, and the inlet end of the upper flow channel of the first flow channel component 2 and the inlet end of the lower flow channel of the third flow channel component 6 correspond to the two interfaces of the first three-way joint one by one and are connected;

[0057] The outlet end of the upper flow channel of the first flow channel component 2 and the outlet end of the lower flow channel of the third flow channel component 6 correspond to and communicate with the two interfaces of the second three-way connector. It can be seen that the flow splitting function can also be achieved by using two three-way connectors, and the structure is simple, the number of parts is small, and the service life is long.

[0058] In addition, the number of upper liquid cooling plates 3 between the first flow channel assembly 2 and the second flow channel assembly 5 is not limited to one, but can be multiple, such as two, three, four, etc.; the number of lower liquid cooling plates 4 between the first flow channel assembly 2 and the second flow channel assembly 5 is not limited to one, but can be multiple, such as two, three, four, etc.; the number of upper liquid cooling plates 3 between the third flow channel assembly 6 and the second flow channel assembly 5 is not limited to one, but can be multiple, such as two, three, four, etc.; the number of upper liquid cooling plates 3 between the third flow channel assembly 6 and the second flow channel assembly 5 is not limited to one, but can be multiple, such as two, three, four, etc.

[0059] In this embodiment, preferably, Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, the double-layer microchannel direct cooling system further includes a conveying component, and the first flow channel component 2, the third flow channel component 6, the first aggregate flow channel and the second aggregate flow channel are formed on the same conveying component.

[0060] According to the structure described above, an upper flow channel, a lower flow channel and a collecting flow channel can be opened on the same conveying component, which has a high degree of integration and saves parts and occupied space.

[0061] Of course, not limited to this, the following structure may also be adopted: for example, the double-layer microchannel direct cooling system also includes a conveying component, and the first flow channel component 2, the third flow channel component 6, the first aggregate flow channel and the second aggregate flow channel are respectively formed in different conveying components, that is, the first flow channel component 2 and the third flow channel component 6 each include two pipe fittings, one of which forms an upper flow channel, and the other pipe fitting forms a lower flow channel, the first aggregate flow channel is formed separately in a pipe fitting, and the second aggregate flow channel is formed separately in a pipe fitting, and the connected pipes can be directly connected or connected through joints, etc., and the specific design is based on actual needs.

[0062] Embodiment 2

[0063] See also Figure 7 and Figure 8As shown, an embodiment of the present application provides a double-layer microchannel direct cooling system, comprising an upper liquid cooling plate 3 and a lower liquid cooling plate 4. The upper liquid cooling plate 3 and the lower liquid cooling plate 4 are arranged up and down along a first preset direction, and the refrigerant in the upper liquid cooling plate 3 and the lower liquid cooling plate 4 flows in opposite directions;

[0064] The double-layer microchannel direct cooling system further includes a first upper flow channel, a second upper flow channel, a first lower flow channel and a second lower flow channel; wherein the first upper flow channel and the second upper flow channel are arranged at intervals along the second preset direction, and the upper liquid cooling plate 3 is arranged between the two;

[0065] The two sides of the upper liquid cooling plate 3 are respectively connected to the first upper flow channel and the second upper flow channel; the first lower flow channel and the second lower flow channel are arranged at intervals along the second preset direction, and the lower liquid cooling plate 4 is arranged between the two; the two sides of the lower liquid cooling plate 4 are respectively connected to the first lower flow channel and the second lower flow channel.

[0066] Further, preferably, both the upper liquid cooling plate 3 and the lower liquid cooling plate 4 are formed with a plurality of heat exchange channels, and any heat exchange channel extends along the second preset direction; the plurality of heat exchange channels are arranged in a large surface parallel to the corresponding upper liquid cooling plate 3 or the lower liquid cooling plate 4, and are arranged sequentially and spaced apart along a direction perpendicular to the second preset direction.

[0067] According to the structure described above, the refrigerant flows in from the first upper flow channel on one side, and respectively enters into the multiple heat exchange channels of the upper liquid cooling plate 3, flows in the forward direction along the second preset direction, and finally flows out from the second upper flow channel on the other side. At the same time, the refrigerant flows in from the second lower flow channel on the other side, and respectively enters into the multiple heat exchange channels of the lower liquid cooling plate 4, flows in the reverse direction along the second preset direction, and finally flows out from the second lower flow channel on one side. It can be seen that the refrigerant flows in opposite directions in the upper liquid cooling plate 3 and the lower liquid cooling plate 4, and is coupled to each other, so that the temperature distribution of the liquid cooling plate is more uniform.

[0068] It should be noted that the structure of the heat exchange channel is not limited to the above, and other structures may also be adopted. For example, a heat exchange channel may be set in each of the upper liquid cooling plate 3 and the lower liquid cooling plate 4, and this heat exchange channel is arranged in a winding manner along a direction perpendicular to the second preset direction in a large surface parallel to the upper liquid cooling plate 3 or the lower liquid cooling plate 4, and is designed according to actual needs.

[0069] In addition, the number of the upper liquid cooling plate 3 and the lower liquid cooling plate 4 is not limited to Figure 7 and Figure 8The number of the plurality of upper liquid cooling plates 3 and the plurality of lower liquid cooling plates 4 may be one or more than two, for example, three, four, five, etc., and may be specifically designed according to actual needs, and the plurality of upper liquid cooling plates 3 and the plurality of lower liquid cooling plates 4 are respectively arranged in sequence along the first upper flow channel, wherein the first upper flow channel and the first lower flow channel are arranged vertically and in parallel, and extend in the same direction, the first lower flow channel and the second lower flow channel are arranged vertically and in parallel, and extend in the same direction, and the first upper flow channel and the second upper flow channel are arranged in parallel.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A double-layer microchannel direct cooling system, characterized in that: include: The upper liquid cooling plate and the lower liquid cooling plate are arranged up and down along a first preset direction, and the refrigerant in the upper liquid cooling plate and the lower liquid cooling plate flows in opposite directions.

2. The double-layer microchannel direct cooling system according to claim 1 is characterized in that: The double-layer microchannel direct cooling system further includes a first flow channel component, a second flow channel component and a third flow channel component; wherein the first flow channel component and the third flow channel component are sequentially spaced along a second preset direction; Along a direction perpendicular to the second preset direction, the second flow channel component is arranged in sequence with the first flow channel component and the third flow channel component respectively; the first flow channel component, the second flow channel component and the third flow channel component respectively form an upper flow channel and a lower flow channel that are arranged at intervals.

3. The double-layer microchannel direct cooling system according to claim 2 is characterized in that: The upper liquid cooling plate and the lower liquid cooling plate are arranged between the first flow channel assembly and the second flow channel assembly, and the upper liquid cooling plate is respectively connected to the upper flow channels of the two, and the lower liquid cooling plate is respectively connected to the lower flow channels of the two; The upper liquid cooling plate and the lower liquid cooling plate are arranged between the third flow channel assembly and the second flow channel assembly, and the upper liquid cooling plate is respectively connected with the upper flow channels of the two, and the lower liquid cooling plate is respectively connected with the lower flow channels of the two.

4. The double-layer microchannel direct cooling system according to claim 3 is characterized in that: The double-layer microchannel direct cooling system further includes a valve, a first aggregate flow channel and a second aggregate flow channel; the valve forms two groups of interfaces, and each group of interfaces includes two interconnected interfaces; The inlet end of the upper circulation channel of the first flow channel component and the inlet end of the lower circulation channel of the third flow channel component are respectively connected to one of a group of interfaces of the valve via the first collecting flow channel; the outlet end of the upper circulation channel of the first flow channel component and the outlet end of the lower circulation channel of the third flow channel component are respectively connected to one of the other group of interfaces of the valve via the second collecting flow channel.

5. The double-layer microchannel direct cooling system according to claim 3 is characterized in that: The double-layer microchannel direct cooling system further includes a valve, a first flow divider and a second flow divider; the valve forms two groups of interfaces, and each group of interfaces includes two interconnected interfaces; The inlet end of the upper circulation channel of the first flow channel component and the inlet end of the lower circulation channel of the third flow channel component are respectively connected to one of a group of interfaces of the valve via the first diverter; the outlet end of the upper circulation channel of the first flow channel component and the outlet end of the lower circulation channel of the third flow channel component are connected to one of the other group of interfaces of the valve via the second diverter.

6. The double-layer microchannel direct cooling system according to claim 3, characterized in that: The double-layer microchannel direct cooling system further includes a first three-way joint and a second three-way joint, and the inlet end of the upper circulation channel of the first flow channel component and the inlet end of the lower circulation channel of the third flow channel component correspond to the two interfaces of the first three-way joint one by one and are connected; The outlet end of the upper circulation channel of the first flow channel component and the outlet end of the lower circulation channel of the third flow channel component correspond to the two interfaces of the second three-way connector one by one and are connected.

7. The double-layer microchannel direct cooling system according to claim 4, characterized in that: The double-layer microchannel direct cooling system further includes a conveying component, and the first flow channel component, the third flow channel component, the first aggregate flow channel, and the second aggregate flow channel are formed on the same conveying component.

8. The double-layer microchannel direct cooling system according to claim 4, characterized in that: The double-layer microchannel direct cooling system further includes a conveying component, and the first flow channel component, the third flow channel component, the first aggregate flow channel, and the second aggregate flow channel are respectively formed on different conveying components.

9. The double-layer microchannel direct cooling system according to claim 4, characterized in that: The valve is an expansion valve.

10. The double-layer microchannel direct cooling system according to claim 1, characterized in that: The double-layer microchannel direct cooling system further includes a first upper flow channel, a second upper flow channel, a first lower flow channel and a second lower flow channel; wherein the first upper flow channel and the second upper flow channel are arranged at intervals along a second preset direction, and the upper liquid cooling plate is arranged between the two; The two sides of the upper liquid cooling plate are respectively connected to the first upper flow channel and the second upper flow channel; the first lower flow channel and the second lower flow channel are arranged at intervals along the second preset direction, and the lower liquid cooling plate is arranged between the two; the two sides of the lower liquid cooling plate are respectively connected to the first lower flow channel and the second lower flow channel.

11. The double-layer microchannel direct cooling system according to claim 10, characterized in that: The upper liquid cooling plate and the lower liquid cooling plate are both formed with a plurality of heat exchange channels, and any of the heat exchange channels extends along the second preset direction; The plurality of heat exchange channels are arranged in sequence and at intervals in a large surface parallel to the corresponding upper liquid cooling plate or the lower liquid cooling plate and along a direction perpendicular to the second preset direction.

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