Electronic device

Abstract

The utility model provides an electronic device. The electronic equipment comprises a shell which is provided with a first through hole and a first channel, the first through hole penetrates through the shell in the first direction, the first channel extends in the second direction, the second direction intersects with the first direction, one end of the first channel is exposed out of the shell, and the other end of the first channel is communicated with the first through hole; the first enclosing piece is fixed on one side of the shell and covers an opening in one side of the first through hole; the second enclosing piece is fixed on the other side of the shell and covers an opening in the other side of the first through hole, and a communicating hole is formed in the second enclosing piece; the microphone is fixed to the side, back on to the first through hole, of the second enclosure part, and the microphone communicates with the first through hole through the communicating hole. According to the electronic equipment provided by the invention, the shell is designed, so that the first enclosure part, the shell and the second enclosure part can define the sound transmission channel of the microphone, and the light and thin design of the position, where the microphone is mounted, of the shell is realized, so that the light and thin design of the whole electronic equipment is facilitated.

Description

Technical Field

[0001] The present application relates to the field of audio technology, and in particular to an electronic device. Background Art

[0002] In electronic devices with audio design, the microphone is usually installed on the middle frame of the electronic device, and a sound transmission channel is set in the middle frame to connect the microphone with the outside world. Since the middle frame needs to be installed with the microphone and the sound transmission channel connected to the microphone is designed, the thickness of the middle frame is relatively large, making it difficult to achieve a lightweight design. Utility Model Content

[0003] The present application provides an electronic device, which includes a microphone, a first enclosure, a housing, and a second enclosure, wherein the housing is designed so that the first enclosure, the housing, and the second enclosure can enclose a sound transmission channel of the microphone, thereby realizing a lightweight design of the housing where the microphone is installed, thereby facilitating a lightweight design of the electronic device as a whole.

[0004] The present application provides an electronic device, which includes a shell, having a first through hole and a first channel, the first through hole penetrating the shell along a first direction, the first channel extending along a second direction, the second direction intersecting the first direction, one end of the first channel exposed from the shell, and the other end of the first channel connected to the first through hole; a first enclosure, fixed to one side of the shell and covering one side opening of the first through hole; a second enclosure, fixed to the other side of the shell and covering the other side opening of the first through hole, the second enclosure being provided with a connecting hole; and a microphone, the microphone being fixed to a side of the second enclosure facing away from the first through hole, the microphone being connected to the first through hole via the connecting hole.

[0005] In the present application, a sound transmission channel is formed by enclosing a shell, a first enclosure and a second enclosure, so that the microphone can pick up sound through the sound transmission channel. A first through hole is set to penetrate the shell in the Z direction, and the first enclosure and the second enclosure block the two sides of the first through hole to enclose and form a second channel (i.e., part of the sound transmission channel), and a connecting hole is set in the second enclosure, and the connecting hole, the second channel and the first channel are connected in sequence to form a sound transmission channel. Therefore, the sound transmission channel is not formed by integral molding of the shell, but is formed by enclosing the top surface of the first enclosure structure, the bottom surface of the second enclosure structure and the shell. Since the first enclosure and the second enclosure are not part of the shell and are not constrained by the strength of the shell, the setting of the sound transmission channel is decoupled from the minimum thickness required for the strength of the shell, and the thickness of the shell is not limited by the sound transmission channel, so the shell thickness can be thinned. In other words, the middle frame can achieve a thinning design, which is conducive to the lightweight design of electronic equipment.

[0006] In some possible implementations, the housing has a first slot and a second slot disposed opposite to each other along a first direction, and the first through hole penetrates the slot bottom wall of the first slot and the slot bottom wall of the second slot. The first slot accommodates the first enclosure, and the second slot accommodates at least part of the second enclosure and the microphone.

[0007] In this implementation, by providing the first groove and the second groove, the thickness of the housing in the area where the first through hole is provided can be reduced. Since the microphone is installed corresponding to the first through hole, the housing can be designed to be thinner at the location where the microphone is installed. In addition, by providing the first groove to accommodate the first enclosure and providing the second groove to accommodate at least part of the second enclosure and the microphone, it is beneficial to reduce the additional space occupied by the first enclosure, the second enclosure and the microphone in the Z direction, which is beneficial to the overall thinning design of the housing.

[0008] In some possible implementations, along the first direction, a groove depth of the second groove is greater than a groove depth of the first groove.

[0009] In this implementation, the second groove is enabled to have a larger accommodating space, which is beneficial for the second groove to better accommodate the second enclosure and the microphone, thereby improving the space utilization of the groove structure of the shell. That is, the first groove with a smaller groove depth is used to accommodate the first enclosure, and the second groove with a larger groove depth is used to accommodate the second enclosure and the microphone, thereby improving the space utilization of each groove structure of the shell, which is beneficial to the overall thinning design of the shell.

[0010] In some possible implementations, a surface of the microphone facing away from the bottom wall of the first groove is located in the second groove.

[0011] In this implementation, the microphone is not arranged higher than the top surface of the shell in the thickness direction of the electronic device, so that the microphone does not occupy additional dimensional space in the thickness direction of the electronic device, which is beneficial to the overall thinning design of the shell.

[0012] In some possible implementations, along the first direction, the first channel is biased toward a side close to the microphone relative to the first through hole.

[0013] In this implementation, since the wall thickness of the shell on both sides of the first channel along the Z direction along the extension direction of the first channel (i.e., the X direction) needs to meet the structural strength requirements, the first channel is offset along the Z direction relative to the side of the first through hole close to the microphone, which is beneficial to maintaining the consistency of the wall thickness of the shell on both sides of the first channel along the Z direction, and is beneficial to the overall thickness reduction design of the shell after the microphone is installed. If the first channel is not offset relative to the first through hole, or the first channel is offset relative to the side of the first through hole away from the microphone, the microphone is offset relative to the first channel toward the Z direction, which can also be understood as the microphone being raised relative to the first channel. At this time, in order to ensure the structural strength of the shell at the first channel, in one case, by setting the thickness of the shell at the first channel to just meet the structural strength requirements, the microphone will be higher than the top surface of the shell in the area where the first channel is set, so that the microphone part exceeds the second slot setting, which leads to the overall thickness of the shell being too large after the microphone is installed, making it difficult to reduce the thickness of the electronic device. In another case, by setting the wall thickness of the shell at the side of the first channel close to the microphone so that the microphone can be completely accommodated in the second groove, the overall wall thickness of the shell at the location where the first channel is set will be too large, which will also make it difficult to achieve a thinning design for the electronic device. Therefore, along the Z direction, the first channel is offset relative to the side of the first through hole close to the microphone, and the thickness of the area of ​​the shell where the first channel is set and the thickness of the area of ​​the shell where the microphone is installed can be reasonably designed, so that the overall thickness of the shell at the microphone after the microphone is installed will not be greater than the thickness of the shell at the location where the first channel is set, and the shell at the location where the first channel is set can be designed according to the thickness of the adjacent structural strength, thereby achieving a thinning design of the overall thickness of the shell, and the overall thickness will not increase after the microphone is installed, which is conducive to the overall thinning design of the electronic device.

[0014] In some possible implementations, the first enclosure and the second enclosure enclose the first through hole to form a second channel, and the volume of the first channel is greater than the volume of the second channel.

[0015] In this implementation, by setting the volume of the first channel to be larger than the volume of the second channel, the resonance frequency of the microphone can be increased, thereby improving the use effect of the microphone.

[0016] In some possible implementations, the inner diameter of the first channel is greater than or equal to 0.8 mm.

[0017] In this implementation, it is helpful to improve the resonance frequency of the microphone. For example, the inner diameter of the first channel can be, but is not limited to, 0.8 mm, or 0.9 mm, or 1 mm, or other values ​​greater than 0.8 mm.

[0018] In some possible implementations, the first enclosure and the second enclosure enclose the first through hole to form a second channel, and a dimension of the second channel along the first direction is greater than 0.6 mm, and a dimension of the second channel along the second direction is greater than 1 mm.

[0019] In this implementation, it is advantageous to achieve a short channel size and a large channel inner diameter at the second channel, thereby increasing the resonance frequency of the microphone to improve the use effect of the microphone. For example, the size of the second channel along the Z direction may be 0.61 mm, or 0.62 mm, or 0.63 mm, or 0.64 mm, or 0.65 mm, or other values ​​greater than 0.6 mm. The size of the second channel along the X direction may be 1.1 mm, or 1.2 mm, or 1.3 mm, or 1.4 mm, or 1.5 mm, or other values ​​greater than 1 mm.

[0020] In some possible implementations, the first through hole includes a first portion and a second portion that are connected, one end of the second portion of the first through hole is connected to the first channel, and the other end of the second portion of the first through hole is connected to the first portion of the first through hole. The first portion of the first through hole passes through the bottom wall of the first groove and the bottom wall of the second groove, the second portion of the first through hole passes through the bottom wall of the first groove, and the side wall of the second groove close to the first channel covers the portion of the second portion of the first through hole that is away from one end of the first groove.

[0021] In this implementation, since the first channel is biased toward one side of the microphone relative to the first through hole along the thickness direction of the electronic device, a bending connection structure exists at the connection between the first channel and the first through hole, and the side wall of the second groove close to the first channel blocks the part of the second part of the first through hole away from one end of the first groove, so that the connecting wall can serve as the side wall of the bending connection structure, so that the second part of the first through hole can be connected to the first channel.

[0022] In some possible implementations, the housing further comprises a fourth groove, the fourth groove is recessed in the bottom wall of the second groove, and the fourth groove is arranged around the first portion of the first through hole. The electronic device further comprises a first adhesive member, the first adhesive member is filled in the fourth groove, and the first adhesive member bonds the housing and the second enclosure.

[0023] In this implementation, the fourth groove is provided to improve the stability of the first adhesive component, thereby improving the stability of the first adhesive component bonding the shell and the second enclosure, thereby improving the sealing between the second enclosure and the shell.

[0024] In some possible implementations, the width of the fourth groove is greater than 0.6 mm, and the depth of the fourth groove is greater than 0.1 mm.

[0025] In this implementation, since the width of the fourth groove can be greater than 0.6 mm and the depth of the fourth groove can be greater than 0.1 mm, the fourth groove can accommodate a sufficient amount of the first adhesive, which is beneficial to improving the strength of the first adhesive bonding the shell and the second enclosure to improve the bonding stability.

[0026] In some possible implementations, the second groove has a first surface, the first surface is located in the second groove and is arranged close to the first channel, and the angle between the first surface and the bottom wall of the second groove is in the range of 0° to 90°. The second enclosure includes a first portion and a second portion connected to each other, and the first portion of the second enclosure is bonded to the first bonding member. The electronic device also includes a second bonding member, and the second bonding member is bonded between the second portion of the second enclosure and the first surface.

[0027] In this implementation, material reduction design can be performed in the area of ​​the second groove close to the first part and the third part of the connecting arm, so that the second part of the connecting wall protrudes out of the first part and the third part of the connecting wall in the Z direction, which is beneficial to the weight reduction design of the shell, thereby facilitating the lightweight design of the shell and reducing material costs.

[0028] In some possible implementations, the housing further includes a rubber stopper, the rubber stopper is convexly disposed on the first surface, the rubber stopper extends along a third direction, and along the third direction, the size of the rubber stopper is larger than the size of the first through hole, the third direction is perpendicular to the first direction and intersects with the second direction. The second adhesive member is disposed around the rubber stopper.

[0029] In this implementation, since the first surface is provided with a rubber block, when the second adhesive member flows between the second part of the second enclosure and the first surface before solidification, the second adhesive member in a fluid state will be blocked by the rubber block to prevent the second adhesive member in a fluid state from flowing into the first through hole, thereby preventing the second adhesive member from leaking into the sound transmission channel and affecting the sound transmission effect of the sound transmission channel. Therefore, when the second adhesive member is solidified to form a thick second adhesive member, the second adhesive member can be arranged around the rubber block.

[0030] In some possible implementations, the first bonding member is connected to the second bonding member.

[0031] In this implementation, the second adhesive member can be connected to the first adhesive member, which is conducive to providing adhesive members everywhere between the second enclosure and the shell to improve the bonding effect between the second enclosure and the shell, thereby improving the sealing effect between the second enclosure and the shell.

[0032] In some possible implementations, the housing further comprises a third groove, the third groove is recessed in the groove bottom wall of the second groove, the third groove is arranged around the first part of the first through hole, the fourth groove is recessed in the groove bottom wall of the third groove, and the third groove accommodates the first part of the second enclosure. The housing further comprises a glue storage groove, the glue storage groove is recessed in the groove bottom wall of the second groove, and connects the third groove and the fourth groove, the glue storage groove is located at both ends of the third groove, and the first surface located at both sides of the glue blocking block extends into the glue storage groove.

[0033] In the present implementation, since the glue storage groove can be recessed in the bottom wall of the second groove and connect the third groove and the fourth groove, the glue storage groove can be located at both ends of the third groove, and the parts of the first surface located on both sides of the glue blocking block can extend into the glue storage groove, so that the second adhesive member in a fluid state can flow through the gap between the second part of the second enclosure and the first surface, and bypass the glue blocking block to flow to the two sides of the glue blocking block to the glue storage groove, so that the second enclosure in a fluid state can flow into the third groove through the glue storage groove, so that the second adhesive member in a fluid state can contact the first adhesive member, and then after the second adhesive member is solidified to form, the second adhesive member can be connected to the first adhesive member, which is conducive to realizing that adhesive members are arranged everywhere between the second enclosure and the shell to improve the bonding effect between the second enclosure and the shell, thereby improving the sealing effect between the second enclosure and the shell.

[0034] In some possible implementations, the electronic device further includes a seal and a circuit board, the microphone is mounted on the circuit board, and the seal is bonded between the second enclosure and the circuit board. The seal has a second through hole, the circuit board has a third through hole, the third through hole is connected to the second through hole along the first direction, and the microphone is arranged to cover an end of the third through hole away from the second enclosure.

[0035] In this implementation, by providing a sealing member, the sealing between the microphone and the circuit board and the second enclosure can be achieved, thereby improving the sealing of the sound transmission channel, which is beneficial to improving the sound pickup effect of the microphone.

[0036] In some possible implementations, along the first direction, a distance between an edge of an orthographic projection of the sealing member on the second enclosure and an edge of the second enclosure is less than 0.1 mm.

[0037] In this implementation, by setting the second enclosure to expand at least 0.1 mm compared to the size of the sealing member, it is possible to prevent the sealing member from being inverted and having a poor sealing effect after being offset on the second enclosure.

[0038] In some possible implementations, a surface of the second enclosure facing the sealing member has a limiting structure, and the sealing member is installed in the limiting structure.

[0039] In this implementation, by setting a limiting structure, it is possible to provide installation guidance for the seal to improve the installation accuracy of the seal, and it is also possible to provide limiting support for the seal after the seal is installed to prevent the seal from deviating or falling off after installation, thereby improving the sealing installation effect of the seal.

[0040] In some possible implementations, the housing further has a third groove, the third groove is recessed in the groove bottom wall of the second groove, the third groove is arranged around the first portion of the first through hole, the fourth groove is recessed in the groove bottom wall of the third groove, and the third groove accommodates part of the second enclosure. The sealing member is located in the third groove, the circuit board abuts against the surface of the sealing member away from the second enclosure, and is fixedly connected to the groove bottom wall of the second groove, and the sealing member is in a compressed state.

[0041] In this implementation, by abutting the sealing member with the circuit board and placing the sealing member in a compressed state, the gap between the circuit board and the sealing member, as well as the gap between the sealing member and the second enclosure member, can be eliminated, further improving the sealing performance between the circuit board and the second enclosure member, thereby improving the sealing performance between the connecting hole, the second through hole, and the third through hole, which is beneficial to improving the sound transmission effect of the sound transmission channel, thereby improving the use effect of the microphone. In addition, by fixing the circuit board to the bottom wall of the second groove, it is beneficial to ensure that the circuit board fully compresses the sealing member through the fixed connection between the bottom wall of the second groove and the circuit board, thereby improving the sealing performance between the circuit board and the second enclosure member.

[0042] In some possible implementations, the seal includes a sealing portion and a bonding portion stacked along a direction parallel to the first direction, the bonding portion bonds the second enclosure and the sealing portion, the side of the sealing portion facing away from the second enclosure abuts against the circuit board, and the compression amount of the sealing portion is in the range of 50% to 70%.

[0043] In this implementation, the circuit board and the sealing part can be in full contact, thereby improving the sealing performance between the circuit board and the second enclosure. For example, the compression amount of the sealing part can be, but is not limited to, 50%, 55%, 60%, 65%, 70%, or other values ​​between 50% and 70%.

[0044] In some possible implementations, the housing further comprises a fifth groove, which is recessed in the bottom wall of the first groove and is arranged around the first through hole. The housing further comprises a third adhesive member, which is located in the fifth groove and bonds the housing and the first enclosure.

[0045] In this implementation, the fifth groove is provided to improve the stability of the third adhesive component, thereby improving the stability of the third adhesive component bonding the shell and the first enclosure, thereby improving the sealing between the first enclosure and the shell.

[0046] In some possible implementations, the width of the fifth groove is greater than 0.6 mm, and the depth of the fifth groove is greater than 0.1 mm.

[0047] In this implementation, since the width of the fifth groove can be greater than 0.6 mm and the depth of the fifth groove can be greater than 0.1 mm, the fifth groove can accommodate a sufficient amount of the third adhesive, which is beneficial to improving the strength of the third adhesive bonding the shell and the first enclosure to improve the bonding stability.

[0048] In some possible implementations, the thickness of the second enclosure is greater than the thickness of the first enclosure.

[0049] In this implementation, since the second enclosure needs to carry the seal, circuit board and microphone, the first enclosure does not need to carry other components, so that the second enclosure has a higher strength requirement. Therefore, by setting the thickness of the second enclosure to be greater than the thickness of the first enclosure, it is beneficial to ensure the supporting strength of the second enclosure, and it is beneficial to achieve a thinning design at the first enclosure, which is beneficial to reducing the overall thickness of the shell after the microphone is installed.

[0050] In some possible implementations, the thickness of the first enclosure is in the range of 0 to 0.3 mm, which is conducive to thinning design.

[0051] In some possible implementations, the thickness of the second enclosure is in the range of 0 to 0.3 mm, which is conducive to thinning design.

[0052] In some possible implementations, the housing further has a first end surface, the first end surface is arranged to face away from the microphone. The first channel is exposed through the first end surface, and the opening of the first channel located at the first end surface is located at the center of the first end surface in the first direction.

[0053] In this implementation, by setting the opening of the first channel located at the first end surface at the center of the first end surface in the Z direction, it is helpful to improve the appearance of the housing, thereby improving the appearance of the electronic device. In addition, it is helpful to set the first channel in the center of the housing along the Z direction, so that the thickness of the housing on both sides of the first channel along the Z direction is the same, which is helpful to set the same thickness of the housing on both sides of the first channel according to strength requirements, thereby facilitating a lightweight design of the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1A It is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0055] Figure 1B yes Figure 1A A schematic diagram of a partial structural breakdown of the electronic device shown;

[0056] Figure 2 yes Figure 1A A schematic diagram of a structure in which a microphone in an electronic device is installed in a housing in some embodiments;

[0057] Figure 3A It is a schematic diagram of the structure in which a microphone is installed in a middle frame in the prior art;

[0058] Figure 3B yes Figure 2 The embodiment shown and Figure 3A A schematic diagram showing a simulation comparison of microphones in the prior art at different frequencies;

[0059] Figure 4A yes Figure 2 A schematic diagram of a stereoscopic structure of a microphone installed on a housing in some embodiments;

[0060] Figure 4B yes Figure 4A The structure schematic diagram of the microphone installation structure in some embodiments after being cut along line AA;

[0061] Figure 5 yes Figure 4A A schematic diagram of a partial structural breakdown of the microphone mounting structure shown;

[0062] Fig. 6A yes Figure 4B The schematic diagram of the structure of the housing in some embodiments is shown;

[0063] Figure 6B yes Fig. 6A The shown housing is cut along BB and is a schematic structural diagram of some embodiments;

[0064] Figure 6C yes Fig. 6A A schematic diagram of the structure of the housing shown in another viewing angle;

[0065] Fig.6D yes Fig. 6A A schematic diagram of the structure of the housing shown in another viewing angle;

[0066] Fig. 7A yes Fig. 6A The schematic structural diagram of the housing provided with a first bonding member in some embodiments is shown;

[0067] Figure 7B yes Fig. 7A A schematic diagram of the structure of the housing in some embodiments in which the second enclosure is installed;

[0068] Figure 7C yes Figure 7B The schematic structural diagram of the housing in some embodiments provided with a second bonding member;

[0069] Fig.7D yes Figure 7C A schematic diagram of the structure of the housing shown without the second enclosure installed;

[0070] Fig. 8A yes Figure 7C The schematic diagram of the structure of the housing mounted seal is shown;

[0071] Figure 8B yes Figure 4A A schematic diagram of the structure of a sealing member in the microphone installation structure in some embodiments;

[0072] Fig. 9 yes Figure 8B The schematic diagram of the structure of the housing in some embodiments with a circuit board installed;

[0073] Fig. 10A yes Figure 6C A schematic structural diagram of a housing in some embodiments in which a third bonding member is installed;

[0074] Fig. 10B yes Fig. 10A A schematic diagram of the structure of the housing in some embodiments in which the first enclosure is installed;

[0075] Fig.11 yes Figure 4B A schematic diagram of the structure of the microphone installation structure shown in another viewing angle;

[0076] Fig.12 yes Figure 4A The illustrated schematic diagram is a schematic diagram of the assembly process of the microphone mounting structure in some embodiments. DETAILED DESCRIPTION

[0077] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0078] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Multiple" means at least two.

[0079] The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "inside", "outside", "top", "bottom", "side", etc., are only references to the directions of the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0080] In the embodiments of the present application, the limitations of the relative position relationship mentioned, such as parallel, vertical, aligned, etc. These limitations are all for the current state of the art, rather than absolutely strict limitations, and a small amount of deviation is allowed, and it is possible to be approximately parallel, approximately vertical, approximately aligned, etc. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. For example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0081] In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of the features.

[0082] Please refer to Figure 1A and Figure 1B , Figure 1A is a structural diagram of an electronic device 100 provided in an embodiment of the present application; Figure 1B yes Figure 1A A partial exploded schematic diagram of the structure of the electronic device 100 is shown.

[0083] In some embodiments, the electronic device 100 may be a foldable mobile phone, a straight-screen mobile phone, a tablet computer, a multimedia player, a headset, a laptop computer, a vehicle-mounted device, a foldable terminal device, a television, or a wearable device, etc., which has a sound pickup function. The wearable device may be a smart bracelet, a smart watch, a smart head display, smart glasses, etc. Figure 1A The electronic device 100 of the illustrated embodiment is described by taking a bar phone as an example. Of course, other types of electronic devices 100 may also adopt a similar structure, which will not be described in detail below.

[0084] Exemplarily, the electronic device 100 may include a housing 1, a display screen 2, and a microphone 3. The housing 1 is used to protect the internal electronic components of the electronic device 100. The housing 1 may include a middle frame 101 and a back cover 102, and the middle frame 101 is connected to the back cover 102. Exemplarily, the display screen 2 may be fixed to the middle frame 101. The display screen 2 is arranged opposite to the back cover 102, and the display screen 2 may enclose the interior of the electronic device 100 together with the middle frame 101 and the back cover 102. The display screen 2 may be a flexible display screen or a rigid display screen. The display screen 2 may be an organic light-emitting diode (OLED) display screen, a mini organic light-emitting diode (mini organic light-emitting diode) display screen, a micro organic light-emitting diode (microorganic light-emitting diode) display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD), etc.

[0085] The middle frame 101 may be provided with a sound transmission channel 1011. The number of the sound transmission channels 1011 may be one or more. Figure 1A The number of the sound transmission channels 1011 shown in the figure is 1. In other embodiments, the sound transmission channel 1011 may also be provided at the connection between the middle frame 101 and the display screen 2 or at the connection between the middle frame 101 and the back cover 102, etc.

[0086] Exemplarily, the microphone 3 may be installed in the middle frame 101, which is located inside the electronic device 100. Figure 1A The dotted line indicates the microphone 3. The microphone 3 can receive external sound of the electronic device 100 through the sound transmission channel 1011. For example, during a voice call, the microphone 3 can receive the user's voice through the sound transmission channel 1011.

[0087] In some embodiments, the process of microphone 3 picking up sound can be: microphone 3 picks up sound through sound transmission channel 1011, and converts the received sound signal into a current signal, and electronic device 100 converts the current signal into an analog signal, and performs analog-to-digital conversion on the analog signal to form a digital signal, and then transcodes to form an audio file. Among them, the external sound of electronic device 100 is transmitted to microphone 3 through sound transmission channel 1011, and drives the diaphragm in microphone 3 to vibrate, thereby driving the energized voice coil to vibrate in the magnetic field environment of the magnetic circuit component of microphone 3, thereby generating a current signal.

[0088] In other embodiments, the electronic device 100 may further include a plurality of microphones 3, and the plurality of microphones 3 may be used to receive sounds from multiple directions to improve the sound pickup effect.

[0089] It should be noted that Figure 1A and Figure 1B Some components of the electronic device 100 are shown schematically only, and the actual shapes and sizes of these components are not subject to Figure 1A , Figure 1B It should be understood that when the electronic device 100 is in other forms, the electronic device 100 may not include the display screen 2 , or the electronic device 100 may include multiple display screens 2 .

[0090] Next, the installation structure of the microphone 3 in the electronic device 100 is introduced.

[0091] Please refer to Figure 2 and Figure 3A , Figure 2 yes Figure 1A A schematic diagram showing a structure in which the microphone 3 of the electronic device 100 is installed in the housing 4 in some embodiments; Figure 3A It is a schematic diagram of the structure in which the microphone 3 is installed in the middle frame 101 in the prior art.

[0092] In some embodiments, the electronic device 100 may further include a housing 4, a first enclosure 5, and a second enclosure 6. The first enclosure 5 and the second enclosure 6 are disposed on opposite sides of the housing 4, and the housing 4, the first enclosure 5, and the second enclosure 6 may be enclosed to form a sound transmission channel 1011, and the microphone 3 may be disposed corresponding to the sound transmission channel 1011. In this embodiment, the housing 4, the first enclosure 5, and the second enclosure 6 are enclosed to form the sound transmission channel 1011, so that the microphone 3 can pick up sound through the sound transmission channel 1011.

[0093] It should be noted that, in some examples, the housing 4 may be the middle frame 101 of the electronic device 100. In other words, Figure 2 The housing 4 shown in the embodiment is a partial structure of the middle frame 101. In other examples, the housing 4 may be an independent structure, and the housing 4, the first enclosure 5, the second enclosure 6 and the microphone 3 together form a microphone 3 module. Correspondingly, a structure that cooperates with the housing 4 is provided in the middle frame 101, so that the microphone 3 module is installed in the middle frame 101 through the cooperation and installation of the housing 4 and the middle frame 101.

[0094] Exemplarily, the shell 4 may have a first through hole 401 and a first channel 402. The first through hole 401 may penetrate the shell 4 along a first direction, and the first channel 402 may extend along a second direction, and the second direction intersects with the first direction. One end of the first channel 402 is exposed from the shell 4, and the other end of the first channel 402 is connected to the first through hole 401. The first enclosure 5 may cover one side opening of the first through hole 401, and the second enclosure 6 may cover the other side opening of the first through hole 401, and the second enclosure 6 is provided with a connecting hole 601. The microphone 3 may be fixed to a side of the second enclosure 6 facing away from the first through hole 401, and the microphone 3 is connected to the first through hole 401 via the connecting hole 601.

[0095] It should be noted that the second enclosure 6 entirely covers one side opening of the first through hole 401 , wherein the connecting hole 601 on the second enclosure 6 also covers a partial area of ​​the first through hole 401 .

[0096] For ease of description, a coordinate system can be established, and the first direction is defined as the Z direction (also called the Z-axis direction, that is, the thickness direction of the electronic device 100), the second direction is the X direction (also called the X-axis direction), and the Y direction (also called the Y-axis direction) is perpendicular to the X direction and perpendicular to the Z direction. Specifically, the direction in which the first channel 402 extends toward the microphone 3 is defined as the positive direction of the X direction, the direction in which the first enclosure 5, the shell 4, the second enclosure 6 and the microphone 3 are arranged in sequence is the positive direction of the Z direction, and the positive direction of the Z direction is the direction after rotating 90° counterclockwise in a plane perpendicular to the XZ plane as the positive direction of the Y direction. It can be understood that the X direction, the Y direction and the Z direction are only for illustration, and in some other embodiments, the X direction, the Y direction and the Z direction can also be defined according to other references.

[0097] It should be noted that in the embodiment of the present application, the first direction is perpendicular to the second direction, that is, the Z direction is perpendicular to the X direction, and the intersection angle of the first direction and the second direction is not limited. In some other embodiments, the first direction and the second direction may be non-perpendicular.

[0098] It should be noted that the description of the "top" or "bottom" of each component in the following text can refer to the positive and negative directions of the Z axis in the coordinate system. The surface of the component facing the Z direction can be called the top surface, and the surface facing the negative direction of Z can be called the bottom surface.

[0099] In the prior art, see Figure 3A, usually the middle frame 101 is integrally formed with a sound transmission channel 1011, that is, there is a cavity inside the middle frame 101, and the cavity is the sound transmission channel 1011. However, the dimensions of the middle frame 101 along the Z direction need to have a certain thickness to ensure strength, and due to the appearance design of the electronic device 100, the sound transmission channel 1011 is usually required to be located at the middle position of the opening of the outer surface of the middle frame 101 in the Z direction, so that the dimensions of the middle frame 101 on both sides of the sound transmission channel 1011 along the Z direction need to meet certain values. In other words, Figure 3A The L1 marked in the figure needs to meet a certain value, for example, L1 needs to be greater than or equal to 0.3 mm, so as to ensure the structural strength of the middle frame 101. Therefore, in the prior art, it is difficult to reduce the thickness of the middle frame 101.

[0100] In addition, since the microphone 3 also has a certain thickness, after the microphone 3 is set in the middle frame 101, the sound pickup position of the microphone 3 will deviate from the center line of the middle frame 101. In other words, the surface of the microphone 3 that is attached to the middle frame 101 and faces the sound transmission channel 1011 will deviate from the center line of the middle frame 101 in the Z direction. However, there needs to be a certain thickness along the Z direction from the sound pickup position of the microphone 3 to the top of the middle frame 101 to ensure the strength of the middle frame 101, that is, Figure 3A The middle L2 needs to meet a certain value, which results in a relatively large thickness of the middle frame 101 , making it difficult to meet the requirement of miniaturization of the electronic device 100 .

[0101] Please continue to refer to Figure 2 In this embodiment, a first through hole 401 is provided that penetrates the shell 4 along the Z direction, and the first enclosure 5 and the second enclosure 6 cover both sides of the first through hole 401 to enclose and form a second channel 1012 (i.e., part of the sound transmission channel 1011), and a connecting hole 601 is provided in the second enclosure 6, and the connecting hole 601, the second channel 1012 and the first channel 402 are connected in sequence to form the sound transmission channel 1011. Therefore, the sound transmission channel 1011 is not formed integrally with the shell 4, but is formed by the top surface of the first enclosure 5, the bottom surface of the second enclosure 6 and the shell 4. Since the first enclosure 5 and the second enclosure 6 are not part of the shell 4 and are not restricted by the strength of the shell 4, the setting of the sound channel 1011 is decoupled from the minimum thickness required for the strength of the shell 4 (i.e., the Z-direction dimension), and the thickness of the shell 4 is not restricted by the sound channel 1011. Therefore, the thickness of the shell 4 can be thinned. In other words, the middle frame 101 can be designed to be thin, which is conducive to the lightweight design of the electronic device 100.

[0102] Specifically, in this embodiment, in order to meet the strength requirement, the area of ​​the shell 4 where the first through hole 401 is provided needs to meet a certain thickness. In other words, Figure 2The L3 marked in the figure needs to meet a certain value, that is, the dimension of the first through hole 401 along the Z direction needs to meet a certain value. In addition, the thickness of the shell 4 on both sides of the first channel 402 in the Z direction also needs to meet a certain value. In other words, Figure 2 The L4 marked in the figure needs to meet certain values.

[0103] It can be assumed that the shell 4 or the middle frame 101 needs to satisfy the value of the wall thickness at each location (that is, the dimension of the wall at each location in the Z direction) greater than or equal to W, and the values ​​of L1, L3, and L4 are all W.

[0104] In theory, the top surface of the microphone 3 will not be higher than the middle frame 101. Figure 2 The size of the first channel 402 in the Z direction is Figure 3A In the prior art, the dimensions of the sound transmission channel 1011 in the Z direction are the same. Figure 2 In the illustrated embodiment, the maximum thickness of the housing 4 may be 2×W+the dimension of the first channel 402 in the Z direction. Figure 3A In the prior art shown, the maximum thickness of the middle frame 101 can be 2×W + the dimension of the sound transmission channel 1011 in the Z direction + the thickness of the microphone 3. It can be concluded that compared with the prior art, the shell 4 provided in the embodiment of the present application can achieve a thinning design at the maximum thickness. The specific reduced dimension can be the thickness of the microphone 3, thereby achieving a thinning design of the shell 4, that is, achieving a thinning design of the middle frame 101.

[0105] Furthermore, in theory, Figure 2 In the embodiment shown, the dimension at the location where the microphone 3 is installed is W + the thickness of the first enclosure 5 + the thickness of the second enclosure 6. Figure 3A In the illustrated embodiment, the dimension at the location where the microphone 3 is installed is 2×W + the dimension of the sound transmission channel 1011 in the Z direction. Since the first enclosure 5 and the second enclosure 6 can be designed by using a material with higher strength, so that they can meet the strength requirements with a thinner dimension. It can be concluded that, compared with the prior art, the shell 4 provided in the embodiment of the present application can achieve a thinning design at the location where the microphone 3 is installed, and the specific reduced dimension can be W + the dimension of the sound transmission channel 1011 in the Z direction - the thickness of the first enclosure 5 - the thickness of the second enclosure 6, thereby achieving a thinning design of the shell 4 at the location where the microphone 3 is installed, which is beneficial to achieving the overall thinning design of the shell 4, that is, it is beneficial to achieve the overall thinning design of the middle frame 101. For example, W=0.3mm, in the prior art, the dimension of the sound transmission channel 1011 in the Z direction is 1mm, the thickness of the first enclosure 5 is 0.05mm, and the thickness of the second enclosure 6 is 0.1mm. Compared with the prior art, the embodiment of the present application achieves a 1.15mm thinning design at the installation location of the microphone 3, that is, a 71.9% thinning design.

[0106] It should be noted that the theoretical situation described above refers to structures other than the microphone 3, the shell 4 / middle frame 101, the first enclosure 5 and the second enclosure 6, and the microphone 3 will not be higher than the shell 4 / middle frame 101, for example, the size occupied by the sealing structure is not included.

[0107] It should be noted that the dimensions listed above are only for the purpose of describing in detail to facilitate the comparison between the embodiments of the present application and the prior art, and do not limit the dimensions of the various structures in the embodiments of the present application.

[0108] Please refer to Figures 2 to 3B , Figure 3B yes Figure 2 The embodiment shown and Figure 3A The figure shows a schematic diagram of simulation comparison of the microphone 3 in the prior art at different frequencies.

[0109] In the comparative simulation, Figure 2 In the embodiment shown, the length of the sound transmission channel 1011 is Figure 3A The lengths of the sound transmission channels 1011 in the prior art are the same. It can be seen from the simulation comparison that Figure 2 The sound pressure level of the microphone 3 at different frequencies shown in the embodiment is Figure 3A The microphone 3 of the prior art is basically the same. Therefore, compared with the prior art, the embodiment of the present application realizes a thinner design of the middle frame 101 without affecting the performance of the microphone 3.

[0110] Next, the specific structure of the microphone 3 being installed on the housing 4 will be described.

[0111] Please refer to FIG. 4A to FIG. 5 , Figure 4A yes Figure 2 The stereoscopic structural diagram of the microphone 3 installed on the housing 4 in some embodiments is shown; Figure 4B yes Figure 4A The schematic diagram of the structure of the microphone 3 installation structure in some embodiments after being cut along line AA; Figure 5 yes Figure 4A A schematic diagram of partial structural decomposition of the mounting structure of the microphone 3 is shown.

[0112] In some embodiments, the electronic device 100 may further include a first adhesive member 7, a second adhesive member 8, a sealing member 9, a circuit board 10, and a third adhesive member 11. The first adhesive member 7 and the second adhesive member 8 bond the second enclosure 6 to one side of the housing 4, and the third adhesive member 11 bonds the first enclosure 5 to the other side of the housing 4. The sealing member 9 may be disposed between the circuit board 10 and the second enclosure 6 to seal and connect the circuit board 10 and the second enclosure 6. The microphone 3 is mounted on the circuit board 10.

[0113] In this embodiment, the sealing between the second enclosure 6 and the shell 4 can be achieved by providing the first adhesive 7 and the second adhesive 8, the sealing between the first enclosure 5 and the shell 4 can be achieved by providing the third adhesive 11, and the sealing between the microphone 3 and the circuit board 10 and the second enclosure 6 can be achieved by providing the sealing member 9, thereby improving the sealing of the sound transmission channel 1011, which is beneficial to improving the sound pickup effect of the microphone 3.

[0114] Please refer to Figure 4B , Fig. 6A and Figure 6B , Fig. 6A yes Figure 4B The schematic diagram of the structure of the housing 4 in some embodiments is shown; Figure 6B yes Fig. 6A The shown shell 4 is a schematic structural diagram of some embodiments when cut along line BB.

[0115] In some embodiments, the housing 4 may have a first groove 403 and a second groove 404 disposed opposite to each other along the Z direction. The first through hole 401 may penetrate the groove bottom wall of the first groove 403 and the groove bottom wall of the second groove 404. The first groove 403 may accommodate the first enclosure 5, and the second groove 404 may accommodate at least part of the second enclosure 6 and the microphone 3.

[0116] In this embodiment, by providing the first groove 403 and the second groove 404, the thickness of the housing 4 in the area where the first through hole 401 is provided can be reduced, and since the microphone 3 is installed corresponding to the first through hole 401, the housing 4 can be designed to be thinner at the location where the microphone 3 is installed. In addition, by providing the first groove 403 to accommodate the first enclosure 5, and providing the second groove 404 to accommodate at least part of the second enclosure 6 and the microphone 3, it is beneficial to reduce the additional space occupied by the first enclosure 5, the second enclosure 6 and the microphone 3 in the Z direction, which is beneficial to the overall thinning design of the housing 4.

[0117] Exemplarily, along the Z direction, the groove depth of the second groove 404 can be greater than the groove depth of the first groove 403, so that the second groove 404 can have a larger accommodating space, which is beneficial for the second groove 404 to better accommodate the second enclosure 6 and the microphone 3, thereby improving the space utilization of the groove structure of the shell 4, that is, the first groove 403 with a smaller groove depth is used to accommodate the first enclosure 5, and the second groove 404 with a larger groove depth is used to accommodate the second enclosure 6 and the microphone 3, thereby improving the space utilization of each groove structure of the shell 4, which is beneficial to the overall thinning design of the shell 4.

[0118] Exemplarily, the surface of the bottom wall of the microphone 3 facing away from the first groove 403 can be located in the second groove 404, so that in the Z direction, the microphone 3 is not set higher than the top surface of the shell 4, so that the microphone 3 does not occupy additional space in the Z direction, which is beneficial to the overall thinning design of the shell 4.

[0119] Exemplarily, along the Z direction, the first channel 402 is offset relative to a side of the first through hole 401 close to the microphone 3 .

[0120] In this embodiment, since the wall thickness of the shell 4 along the Z direction on both sides of the first channel 402 along the extension direction (i.e., the X direction) needs to meet the structural strength requirements, the first channel 402 is offset along the Z direction relative to the side of the first through hole 401 close to the microphone 3, which is beneficial to maintaining the consistency of the wall thickness of the shell 4 along the Z direction on both sides of the first channel 402, and is beneficial to the thinning design of the overall thickness of the shell 4 after the microphone 3 is installed.

[0121] If the first channel 402 is not offset relative to the first through hole 401, or the first channel 402 is offset relative to the first through hole 401 away from the microphone 3, the microphone 3 is offset relative to the first channel 402 in the Z direction, which can also be understood as the microphone 3 is designed to be elevated relative to the first channel 402.

[0122] At this time, in order to ensure the structural strength of the shell 4 at the first channel 402, in one case, by setting the thickness of the shell 4 at the first channel 402 to just meet the structural strength requirement, the microphone 3 will be higher than the top surface of the shell 4 in the area where the first channel 402 is set, so that the microphone 3 is partially beyond the second groove 404, which results in the overall thickness of the shell 4 being too large after the microphone 3 is installed, making it difficult to design the electronic device 100 to be thinner.

[0123] In another case, by setting the wall thickness of the shell 4 on the side of the first channel 402 close to the microphone 3 so that the microphone 3 can be completely accommodated in the second groove 404, the overall wall thickness of the shell 4 at the location of the first channel 402 will be too large, which will also make it difficult to achieve a thinning design for the electronic device 100.

[0124] Therefore, along the Z direction, the first channel 402 is offset relative to the side of the first through hole 401 close to the microphone 3, so that the thickness of the area of ​​the shell 4 where the first channel 402 is set and the thickness of the area of ​​the shell 4 where the microphone 3 is installed can be reasonably designed, so that the overall thickness of the shell 4 at the microphone 3 after the microphone 3 is installed will not be greater than the thickness of the shell 4 at the place where the first channel 402 is set, and the shell 4 at the place where the first channel 402 is set can be designed according to the thickness of the adjacent structure strength, thereby realizing the overall thickness thinning design of the shell 4, and the overall thickness will not increase after the microphone 3 is installed in the shell 4, which is beneficial to the overall thinning design of the electronic device 100.

[0125] Please continue to refer to Figure 4B , Fig. 6A and Figure 6B In some embodiments, the first through hole 401 may include a first portion 401a and a second portion 401b connected to each other. One end of the second portion of the first channel 402 is connected to the first channel 402, and the other end of the second portion 401b of the first through hole 401 is connected to the first portion 401a of the first through hole 401. The first portion 401a of the first through hole 401 may penetrate the bottom wall of the first groove 403 and the bottom wall of the second groove 404. The second portion 401b of the first through hole 401 may penetrate the bottom wall of the first groove 403, and the side wall of the second groove 404 close to the first channel 402 is a connecting wall 405, and the connecting wall 405 may cover the portion of the second portion 401b of the first through hole 401 away from one end of the first groove 403.

[0126] In this embodiment, since the first channel 402 is biased toward one side of the microphone 3 relative to the first through hole 401 along the Z direction, a bending connection structure exists at the connection between the first channel 402 and the first through hole 401, and the side wall of the second groove 404 close to the first channel 402 blocks the part of the second part 401b of the first through hole 401 away from the end of the first groove 403, so that the connecting wall 405 can serve as the side wall of the bending connection structure, so that the second part 401b of the first through hole 401 can be connected to the first channel 402.

[0127] It should be noted that Fig. 6A and Figure 6B The dotted line at the first through hole 401 in the embodiment represents the boundary between the first part 401a and the second part of the first through hole 401. It can be understood that Fig. 6A and Figure 6B In the embodiment, the boundary line between the first portion 401a and the second portion of the first through hole 401 is only for illustration. In some other embodiments, the boundary line between the first portion 401a and the second portion of the first through hole 401 may also be located at other locations.

[0128] Exemplarily, the connecting wall 405 may include a first portion 405a, a second portion 405b, and a third portion 405c, and the first portion 405a, the second portion 405b, and the third portion 405c of the connecting wall 405 may be sequentially connected along the Y direction. The second portion 405b of the connecting wall 405 may correspond to a portion of the second portion 401b of the first through hole 401 that blocks one end away from the first groove 403, and the second portion 405b of the connecting wall 405 may protrude from the first portion 405a and the third portion 405c of the connecting wall 405 toward the Z direction.

[0129] In this embodiment, a material reduction design can be performed in the area of ​​the second groove 404 close to the first part 405a and the third part 405c of the connecting arm, so that the second part 405b of the connecting wall 405 protrudes from the first part 405a and the third part 405c of the connecting wall 405 in the Z direction, which is beneficial to the weight reduction design of the shell 4, thereby facilitating the lightweight design of the shell 4 and reducing material costs.

[0130] The second groove 404 may have a first surface 4051, and the first surface 4051 is located in the second groove 404 and is disposed close to the first channel 402. The angle between the first surface 4051 and the bottom wall of the second groove 404 (see Figure 6B The range of α in the angle may be in the range of 0° to 90°. For example, the value of α may be, but is not limited to, 1°, 5°, 30°, 60°, 70°, 80°, 90°, etc.

[0131] Among them, the first surface 4051 can be located at the second part 405b of the connecting wall 405, and the angle between the first surface 4051 and the bottom wall of the second groove 404 is not 90°, so that the first surface 4051 can be inclined toward the first channel 402 compared to the bottom wall of the second groove 404, which is beneficial to the material reduction design of the shell 4 near the first surface 4051, thereby facilitating the lightweight design of the shell 4 and reducing material costs.

[0132] The housing 4 may further include a rubber stopper 406 . The rubber stopper 406 may be protruding from the first surface 4051 , and may extend along the Y direction. In addition, along the Y direction, the size of the rubber stopper 406 is larger than the size of the first through hole 401 .

[0133] Exemplarily, the housing 4 may further include a third groove 407 . The third groove 407 may be recessed in the groove bottom wall of the second groove 404 . The third groove 407 may be disposed around the first portion 401 a of the first through hole 401 .

[0134] The housing 4 may further include a fourth groove 408 . The fourth groove 408 may be recessed in the groove bottom wall of the third groove 407 . The fourth groove 408 may be disposed around the first portion 401 a of the first through hole 401 .

[0135] The width of the fourth slot 408 (see Fig. 6A W1 in the fourth slot 408 may be greater than 0.6 mm. For example, the value of W1 may be, but is not limited to, 0.62 mm, 0.66 mm, 0.7 mm, 0.74 mm, or other values ​​greater than 0.6 mm. It should be noted that the width of the fourth slot 408 refers to the minimum spacing between the inner sidewall close to the first through hole 401 and the inner sidewall away from the first through hole 401 at each location of the fourth slot 408.

[0136] The depth of the fourth groove 408 (see Fig. 6A H1 in the fourth groove 408 may be greater than 0.1 mm. For example, the value of H1 may be, but is not limited to, 0.12 mm, 0.16 mm, 0.2 mm, 0.24 mm, or other values ​​greater than 0.1 mm. It should be noted that the depth of the fourth groove 408 refers to the distance between the bottom wall of the fourth groove 408 and the bottom wall of the third groove 407.

[0137] In which, the shell 4 can also have a glue storage groove 409, which can be recessed in the bottom wall of the second groove 404 and connect the third groove 407 and the fourth groove 408. The glue storage groove 409 can be located at both ends of the third groove 407, and the part of the first surface 4051 located on both sides of the glue blocking block 406 can extend into the glue storage groove 409.

[0138] It should be noted that Fig. 6A and Figure 6B In the embodiment, the third slot 407, the fourth slot 408 and the glue storage slot 409 are divided by dotted lines. It can be understood that Fig. 6A and Figure 6B The division of the third slot 407 , the fourth slot 408 , and the glue storage slot 409 in the embodiment is only for illustration. In some other embodiments, other divisions may be used for the third slot 407 , the fourth slot 408 , and the glue storage slot 409 .

[0139] It should be noted that, in some other embodiments, the shell 4 may not be provided with the third groove 407 , and the fourth groove 408 may be directly provided on the groove bottom wall of the second groove 404 .

[0140] Please refer to Fig. 6A and Figure 6C , Figure 6C yes Fig. 6A The schematic diagram of the structure of the housing 4 in another viewing angle is shown. It should be noted that: Figure 6C yes Fig. 6A A schematic diagram of the housing 4 is shown from a bottom perspective.

[0141] In some embodiments, the housing 4 may further include a fifth groove 410 . The fifth groove 410 may be recessed in the groove bottom wall of the first groove 403 , and the fifth groove 410 may be disposed around the first through hole 401 .

[0142] The width of the fifth slot 410 (see Figure 6CThe width of the fifth groove 410 refers to the minimum distance between the inner side wall close to the first through hole 401 and the inner side wall away from the first through hole 401 at each location of the fifth groove 410.

[0143] The depth of the fifth groove 410 may be greater than 0.1 mm (see Figure 6C For example, the value of H2 may be, but is not limited to, 0.12 mm, 0.16 mm, 0.2 mm, 0.24 mm, or other values ​​greater than 0.1 mm. It should be noted that the depth of the fifth groove 410 refers to the distance between the bottom wall of the fifth groove 410 and the bottom wall of the first groove 403.

[0144] Please refer to Figure 4B , Fig. 6A and Fig.6D , Fig.6D yes Fig. 6A The schematic diagram of the structure of the housing 4 is shown in another perspective. It should be noted that: Fig.6D hour Fig. 6A The housing 4 is shown in a schematic diagram from a left side perspective.

[0145] In some embodiments, the housing 4 may further have a first end surface 411, which is disposed away from the microphone 3. The first channel 402 is exposed through the first end surface 411, and the opening of the first channel 402 located at the first end surface 411 is located at the center of the first end surface 411 in the Z direction.

[0146] In this embodiment, by setting the opening of the first channel 402 located at the first end surface 411 at the center of the first end surface 411 in the Z direction, it is helpful to improve the appearance of the housing 4, thereby improving the appearance of the electronic device 100. In addition, it is helpful to set the first channel 402 in the center of the housing 4 along the Z direction, so that the thickness of the housing 4 on both sides of the first channel 402 along the Z direction is the same, which is helpful to set the same thickness of the housing 4 on both sides of the first channel 402 according to the strength requirement, thereby facilitating the lightweight design of the housing 4.

[0147] Please refer to Fig. 6A , Fig. 7A and Figure 7B , Fig. 7A yes Fig. 6A The schematic structural diagram of the housing 4 in some embodiments is provided with a first bonding member 7; Figure 7B yes Fig. 7A The shown structure is a schematic diagram of the shell 4 installed with the second enclosure 6 in some embodiments.

[0148] In some embodiments, the first bonding member 7 bonds the shell 4 and the second enclosure 6 .

[0149] In this embodiment, the first adhesive member 7 is provided so that the second enclosure member 6 can be stably fixed to the shell 4 to cover the side of the first through hole 401 close to the second groove 404, thereby improving the sealing between the second enclosure member 6 and the shell 4.

[0150] Exemplarily, the first adhesive member 7 may be filled in the fourth groove 408 .

[0151] In this embodiment, by setting the fourth groove 408, the stability of the setting of the first adhesive member 7 can be improved, thereby improving the stability of the first adhesive member 7 bonding the shell 4 and the second enclosure 6, thereby improving the sealing between the second enclosure 6 and the shell 4.

[0152] In this embodiment, since the width of the fourth groove 408 can be greater than 0.6 mm and the depth of the fourth groove 408 can be greater than 0.1 mm, the fourth groove 408 can accommodate a sufficient amount of the first adhesive 7, which is beneficial to improve the strength of the first adhesive 7 bonding the shell 4 and the second enclosure 6, thereby improving the bonding stability.

[0153] The thickness of the first adhesive member 7 may be greater than 0.1 mm, so that the first adhesive member 7 can have a sufficient amount and sufficient strength, which is beneficial to improving the stability of the first adhesive member 7 bonding the shell 4 and the second enclosure 6 .

[0154] The first bonding member 7 may be adhesive or foam adhesive, or may be formed by dispensing and curing. The adhesive and foam need to be activated to ensure the stability of the bonding shell 4 and the second enclosure 6.

[0155] Please refer to Fig. 6A , Figure 7C and Fig.7D , Figure 7C yes Figure 7B The schematic structural diagram of the housing 4 in some embodiments is provided with a second bonding member 8; Fig.7D yes Figure 7C The schematic diagram of the structure of the housing 4 shown is not equipped with the second enclosure 6.

[0156] In some embodiments, the second enclosure 6 may include a first portion 6a and a second portion 6b connected to each other. The first portion 6a of the second enclosure 6 is bonded to the first adhesive member 7. The second portion 6b of the second enclosure 6 is disposed corresponding to the first surface 4051.

[0157] In this embodiment, the second enclosure 6 is designed to be two parts. The first part 6a of the second enclosure 6 is arranged corresponding to the first adhesive component 7, and the second part 6b of the second enclosure 6 is arranged corresponding to the first surface 4051, so that the second enclosure 6 can realize a contour design of part of the structure of the shell 4 to improve the fitting effect between the shell 4 and the second enclosure 6.

[0158] Specifically, the first bonding member 7 is disposed in the fourth groove 408. Since the third groove 407 is disposed on the groove bottom wall of the second groove 404, and the fourth groove 408 is disposed on the groove bottom wall of the third groove 407, the top surface of the first bonding member 7 and the groove bottom wall of the second groove 404 can be disposed in parallel, so that the angle between the top surface of the first bonding member 7 and the first surface 4051 is consistent with the angle between the groove bottom wall of the second groove 404 and the first surface 4051, that is, Figure 6B Correspondingly, the first portion 6a and the second portion of the second enclosure 6 are arranged at the same angle α, so that the second enclosure 6 can better fit the shell 4, thereby improving the bonding effect between the second enclosure 6 and the shell 4.

[0159] Illustratively, the third groove 407 can accommodate the first portion 6 a of the second enclosure 6 .

[0160] In this embodiment, the first part 6a of the second enclosure 6 is accommodated by the third groove 407, which is beneficial for forming a limiting installation for the first part 6a of the second enclosure 6 through the side wall of the third groove 407, thereby improving the convenience and stability of the installation of the second enclosure 6.

[0161] Exemplarily, the electronic device 100 may further include a second adhesive member 8 . The second adhesive member 8 may be bonded between the second portion 6 b of the second enclosure 6 and the first surface 4051 .

[0162] In this embodiment, by providing a second adhesive 8 to bond the second part 6b of the second enclosure 6 to the first surface 4051, the bonding effect between the second enclosure 6 and the shell 4 can be further improved, thereby further improving the sealing effect between the second enclosure 6 and the shell 4.

[0163] The second adhesive member 8 can be formed by dispensing glue between the second portion 6b of the second enclosure 6 and the first surface 4051 and then curing.

[0164] In this embodiment, the second adhesive member 8 is formed by dispensing, which can improve the bonding effect between the second portion 6b of the second enclosure 6 and the first surface 4051. Since the second adhesive member 8 is in a fluid state before being cured, the second adhesive member 8 can flow between the second portion 6b of the second enclosure 6 and the first surface 4051 before being cured, thereby fully filling the gap between the second portion 6b of the second enclosure 6 and the first surface 4051 to absorb the structural size tolerance of the second enclosure 6 and the assembly tolerance after the second enclosure 6 is bonded to the first adhesive member 7, thereby improving the fitting effect between the second enclosure 6 and the shell 4, and then improving the sealing effect between the second enclosure 6 and the shell 4.

[0165] In this embodiment, since the first surface 4051 is provided with a rubber stopper 406, when the second adhesive member 8 flows between the second portion 6b of the second enclosure 6 and the first surface 4051 before solidification, the second adhesive member 8 in a fluid state will be blocked by the rubber stopper 406 to prevent the second adhesive member 8 in a fluid state from flowing into the first through hole 401, thereby preventing the second adhesive member 8 from leaking into the sound transmission channel 1011 and affecting the sound transmission effect of the sound transmission channel 1011. Therefore, when the second adhesive member 8 is solidified to form a thick layer, the second adhesive member 8 can be arranged around the rubber stopper 406.

[0166] In this embodiment, since the glue storage groove 409 can be recessed in the bottom wall of the second groove 404 and connect the third groove 407 and the fourth groove 408, the glue storage groove 409 can be located at both ends of the third groove 407, and the first surface 4051 located on both sides of the glue blocking block 406 can extend into the glue storage groove 409, so that the second adhesive member 8 in a fluid state can flow through the gap between the second portion 6b of the second enclosure 6 and the first surface 4051, and bypass the glue blocking block 406 to flow to both sides of the glue blocking block 406 to the storage groove 409. The glue groove 409 allows the second enclosure 6 in a fluid state to flow into the third groove 407 through the glue storage groove 409, so that the second adhesive member 8 in a fluid state can contact the first adhesive member 7, and then after the second adhesive member 8 is solidified, the second adhesive member 8 can be connected to the first adhesive member 7, which is conducive to providing adhesives everywhere between the second enclosure 6 and the shell 4 to improve the bonding effect between the second enclosure 6 and the shell 4, thereby improving the sealing effect between the second enclosure 6 and the shell 4.

[0167] It should be noted that the second adhesive member 8 in a fluid state means that the second adhesive member 8 can flow before solidification, and the fluid state may be a liquid state or a solid-liquid mixed state.

[0168] The area of ​​the surface of the second portion 6b of the second enclosure 6 facing the first surface 4051 may be greater than 1 mm 2, to ensure that a sufficient amount of second adhesive member 8 can be arranged between the second part 6b of the second enclosure 6 and the first surface 4051, so as to improve the bonding effect between the second enclosure 6 and the shell 4.

[0169] In some other embodiments, the second adhesive member 8 can also be adhesive backing, or foam adhesive, etc., and the second adhesive member 8 can be directly set between the second part 6b of the second enclosure 6 and the first surface 4051 to bond the second part 6b of the second enclosure 6 to the first surface 4051.

[0170] Please refer to Figure 7C and Fig. 8A , Fig. 8A yes Figure 7C The housing 4 is shown installed Fig. 8A The structural diagram of the seal 9 is shown. It should be noted that, Fig. 8A for Figure 7C The structure shown is a schematic diagram of a top view after the seal 9 is installed.

[0171] In some embodiments, the sealing member 9 may be bonded to the second enclosure 6 , and along the Z direction, the orthographic projection of the sealing member 9 on the second enclosure 6 falls within the second enclosure 6 .

[0172] In this embodiment, the sealing member 9 is smaller than the second enclosure 6 and its orthographic projection along the Z direction falls within the second enclosure 6, which facilitates the installation of the sealing member 9.

[0173] Exemplarily, along the Z direction, the distance between the edge of the positive projection of the sealing member 9 on the second enclosure member 6 and the edge of the second enclosure member 6 (see Figure 8B The L5 in the figure is less than 0.1 mm. For example, the value of L5 may be, but is not limited to, 0.09 mm, 0.08 mm, 0.05 mm, or other values ​​less than 0.1 mm. In other words, the first portion 6a of the second enclosure 6 is larger than 0.1 mm in size compared to the outer expansion of the sealing member 9.

[0174] In this embodiment, by setting the second enclosure 6 to expand at least 0.1 mm compared to the size of the sealing member 9, it is possible to prevent the sealing member 9 from being inverted and having a poor sealing effect after being offset on the second enclosure 6.

[0175] A limiting structure 602 may be provided on the surface of the second enclosure 6 facing the sealing member 9 , and the sealing member 9 may be installed in the limiting structure 602 .

[0176] In this embodiment, by setting the limiting structure 602, it is possible to provide installation guidance for the seal 9 to improve the installation accuracy of the seal 9, and it is also possible to provide limiting support for the seal 9 after the seal 9 is installed to prevent the seal 9 from deviating or falling off after installation, thereby improving the sealing installation effect of the seal 9.

[0177] It should be noted that the limiting structure 602 may be a groove, a notch, a protrusion or the like provided on the surface of the second enclosure 6 facing the sealing member 9. For example, laser engraving may be used to process a line on the surface of the second enclosure 6 facing the sealing member 9 to form the limiting structure 602. It is understandable that Figure 8B The limiting structure 602 shown in the embodiment is for illustration only. In some other embodiments, the limiting structure 602 may also be disposed at other locations.

[0178] Please refer to Figure 4B , Figure 8B and Fig. 9 , Figure 8B yes Figure 4A A schematic diagram of the structure of the sealing member 9 in the installation structure of the microphone 3 in some embodiments; Fig. 9 yes Figure 8B The housing 4 shown is a schematic structural diagram of mounting a circuit board 10 in some embodiments.

[0179] In some embodiments, the sealing member 9 may be bonded between the second enclosure 6 and the circuit board 10, and the microphone 3 may be mounted on the circuit board 10. The sealing member 9 may have a second through hole 903, and the circuit board 10 may have a third through hole 1001. The third through hole 1001 and the second through hole 903 may be connected to the connecting hole 601 along the Z direction, and the microphone 3 is arranged to cover the end of the third through hole 1001 away from the second enclosure 6.

[0180] In this embodiment, a sealing member 9 is provided to bond the second enclosure 6 and the circuit board 10 so as to seal the circuit board 10 and the second enclosure 6, thereby improving the sealing between the connecting hole 601, the second through hole 903 and the third through hole 1001, which is beneficial to improving the sound transmission effect of the sound transmission channel 1011, thereby improving the use effect of the microphone 3.

[0181] Exemplarily, the seal 9 can be located in the third groove 407, so that the third groove 407 can reduce the size of the seal 9 in the Z direction, which is conducive to the thinning of the housing 4 after the microphone 3 is installed. In addition, the inner side wall of the third groove 407 can also form a limit for the seal 9, which is conducive to the positioning and installation of the seal 9 and the stability after installation.

[0182] Exemplarily, the circuit board 10 can abut against the surface of the sealing member 9 facing away from the second enclosure 6 and be fixedly connected to the bottom wall of the second groove 404. The sealing member 9 is in a compressed state.

[0183] In this embodiment, by the circuit board 10 abutting the sealing member 9 and putting the sealing member 9 in a compressed state, the gap between the circuit board 10 and the sealing member 9, and the gap between the sealing member 9 and the second enclosure 6 can be eliminated, and the sealing performance between the circuit board 10 and the second enclosure 6 is further improved, so as to improve the sealing performance between the connecting hole 601, the second through hole 903 and the third through hole 1001, which is beneficial to improve the sound transmission effect of the sound transmission channel 1011, thereby improving the use effect of the microphone 3. In addition, by fixing the circuit board 10 to the bottom wall of the second groove 404, it is beneficial to ensure that the circuit board 10 fully compresses the sealing member 9 through the fixed connection between the bottom wall of the second groove 404 and the circuit board 10, thereby improving the sealing performance between the circuit board 10 and the second enclosure 6.

[0184] It should be noted that the fixed connection between the circuit board 10 and the bottom wall of the second slot 404 may be, but is not limited to, snap-fitting, bolting, bonding, etc.

[0185] The sealing member 9 may include a sealing portion 901 and a bonding portion 902 stacked in parallel to the Z direction, and the bonding portion 902 may be bonded between the second enclosure 6 and the sealing portion 901. The side of the sealing portion 901 facing away from the second enclosure 6 abuts against the circuit board 10, and the sealing portion 901 may be in a compressed state.

[0186] In this embodiment, the second enclosure 6 can be adhered by the adhesive portion 902 and compressed by the sealing portion 901 to improve the sealing performance between the circuit board 10 and the second enclosure 6 .

[0187] The compression amount of the sealing portion 901 may be in the range of 50% to 70%, so that the circuit board 10 and the sealing portion 901 can be in full contact with each other, thereby improving the sealing performance between the circuit board 10 and the second enclosure 6. For example, the compression amount of the sealing portion 901 may be, but is not limited to, 50%, 55%, 60%, 65%, 70%, or other values ​​between 50% and 70%.

[0188] It should be noted that the compression amount of the sealing portion 901 refers to the percentage by which the dimension of the sealing portion 901 along the Z direction after the circuit board 10 is installed is reduced compared to the dimension of the sealing portion 901 along the Z direction when no external force is applied.

[0189] The bonding part 902 may include a first bonding layer 9021 , a waterproof layer 9022 and a second bonding layer 9023 which are stacked in sequence. The first bonding layer 9021 is bonded to the second enclosure 6 , and the second bonding layer 9023 is bonded to the sealing part 901 .

[0190] In this embodiment, by providing a waterproof layer 9022 in the bonding portion 902, the seal 9 can also play the role of preventing water beads and water vapor, and can prevent external water flow or water vapor from invading the sound transmission channel 1011. It can not only protect the microphone 3, but also prevent water drops or water vapor from invading and affecting the sound transmission effect of the sound transmission channel 1011, thereby improving the use effect of the microphone 3.

[0191] The thickness of the first adhesive layer 9021 is greater than the thickness of the second adhesive layer 9023 .

[0192] In this embodiment, since the second enclosure 6 can be a rigid part and the sealing part 901 can be a flexible part, by setting the thickness of the first adhesive layer 9021 to be greater than the thickness of the second adhesive layer 9023, it can meet the bonding requirement of the second enclosure 6 being greater than the bonding requirement of the sealing part 901. The second enclosure 6 and the sealing part 901 can be effectively bonded and the glue thickness can be reduced, thus avoiding thickening caused by setting an extra glue layer.

[0193] For example, the thickness of each layer structure in the sealing member 9 may be 0.1 mm thick first adhesive layer 9021 + 0.01 mm thick waterproof layer 9022 + 0.05 mm thick second adhesive layer 9023 + 0.15 mm thick sealing portion 901. The first adhesive layer 9021 and the second adhesive layer 9023 may be adhesive, tape, or foam adhesive, etc., the waterproof layer 9022 may be a waterproof film, and the sealing portion 901 may be foam, silicone, or rubber, etc.

[0194] It should be noted that the thickness of each layer structure in the sealing member 9 is only for illustration. It is understandable that the thickness of each layer structure in the sealing member 9 can also be other values. For example, the first adhesive layer 9021 can also be 0.15 mm thick, the waterproof layer 9022 can also be 0.02 mm thick, the second adhesive layer 9023 can also be 0.12 mm thick, the sealing portion 901 can also be 0.2 mm thick, etc. The thickness of each layer structure in the sealing member 9 is not listed here one by one.

[0195] Please refer to Figure 6C , Fig. 10A and Fig. 10B , Fig. 10A yes Figure 6C The schematic diagram of the structure of the housing 4 in some embodiments is shown as a third bonding member 11; Fig. 10B yes Fig. 10AThe shown structure is a schematic diagram of the shell 4 installed with the first enclosure 5 in some embodiments.

[0196] In some embodiments, the third adhesive member 11 may be located in the fifth groove 410 , and the third adhesive member 11 bonds the shell 4 and the first enclosure 5 .

[0197] In this embodiment, by setting the fifth groove 410, the stability of the setting of the third adhesive 11 can be improved, thereby improving the stability of the third adhesive 11 bonding the shell 4 and the first enclosure 5, thereby improving the sealing between the first enclosure 5 and the shell 4.

[0198] In this embodiment, since the width of the fifth groove 410 can be greater than 0.6 mm and the depth of the fifth groove 410 can be greater than 0.1 mm, the fifth groove 410 can accommodate a sufficient amount of the third adhesive 11, which is beneficial to improve the strength of the third adhesive 11 bonding the shell 4 and the first enclosure 5, thereby improving the bonding stability.

[0199] Exemplarily, the thickness of the third adhesive member 11 may be greater than 0.1 mm, so that the third adhesive member 11 can have a sufficient amount and sufficient strength, which is beneficial to improve the stability of the third adhesive member 11 bonding the shell 4 and the first enclosure 5.

[0200] The third bonding member 11 may be adhesive or foam adhesive, or may be formed by dispensing and curing. The adhesive and foam adhesive need to be activated to ensure the stability of bonding the shell 4 and the first enclosure 5 .

[0201] Exemplarily, the depth of the fifth groove 410 may be greater than the thickness of the third adhesive member 11 , and the first enclosure member 5 may be received in the fifth groove 410 .

[0202] In this embodiment, the depth of the fifth groove 410 is set to be greater than the thickness of the third adhesive 11 so that the first enclosure 5 can be at least partially accommodated in the fifth groove 410. The inner side wall of the fifth groove 410 can be used as a positioning device for the first enclosure 5 during installation and can also be used as a limiter for the first enclosure 5 after installation to improve the installation stability of the first enclosure 5.

[0203] The housing 4 may further include a sixth groove 412 . The sixth groove 412 may be disposed at the groove bottom of the first groove 403 , and the sixth groove 412 may be disposed around the fifth groove 410 .

[0204] In this embodiment, since the depth of the fifth groove 410 is greater than the thickness of the third adhesive 11, that is, the shell 4 is provided with sufficient thickness at the location where the fifth groove 410 is provided, the sixth groove 412 can be provided to thin the area around the fifth groove 410, which is beneficial to the overall thinning design of the shell 4.

[0205] Please refer to Figure 4B and Fig.11 , Fig.11 yes Figure 4B The schematic diagram of the structure of the microphone 3 installation structure in another viewing angle is shown. Fig.11 yes Figure 4B A schematic diagram of a cross-sectional view of the mounting structure of the microphone 3 from a front view perspective is shown.

[0206] In some embodiments, the thickness of the second enclosure 6 may be greater than the thickness of the first enclosure 5 .

[0207] In this embodiment, since the second enclosure 6 needs to carry the seal 9, the circuit board 10 and the microphone 3, the first enclosure 5 does not need to carry other components, so that the second enclosure 6 has a higher strength requirement. Therefore, by setting the thickness of the second enclosure 6 to be greater than the thickness of the first enclosure 5, it is beneficial to ensure the supporting strength of the second enclosure 6, and it is beneficial to achieve a thinning design at the first enclosure 5, which is beneficial to reducing the overall thickness of the shell 4 after the microphone 3 is installed.

[0208] Exemplarily, the thickness of the first enclosure 5 is in the range of 0 to 0.3 mm. For example, the thickness of the first enclosure 5 can be 0.05 mm, or 0.1 mm, or 0.15 mm, or 0.2 mm, or 0.25 mm, or 0.3 mm, or other values ​​between 0 and 0.3 mm.

[0209] The first enclosure 5 may be made of metal, polyethylene glycol terephthalate (PET), or the like.

[0210] Exemplarily, the thickness of the second enclosure 6 is in the range of 0 to 0.3 mm. For example, the thickness of the first enclosure 5 can be 0.05 mm, or 0.1 mm, or 0.15 mm, or 0.2 mm, or 0.25 mm, or 0.3 mm, or other values ​​between 0 and 0.3 mm.

[0211] The material of the second enclosure 6 can be metal, PET or the like.

[0212] In some embodiments, the volume of the first channel 402 may be greater than the volume of the second channel 1012 .

[0213] In this embodiment, by setting the volume of the first channel 402 to be larger than the volume of the second channel 1012 , the resonance frequency of the microphone 3 can be increased, thereby improving the use effect of the microphone 3 .

[0214] For example, the inner diameter of the first channel 402 (see Fig.11D1) in the figure may be greater than or equal to 0.8 mm, which is beneficial to improving the resonance frequency of the microphone 3. For example, the inner diameter of the first channel 402 may be, but is not limited to, 0.8 mm, 0.9 mm, 1 mm, or other values ​​greater than 0.8 mm.

[0215] Exemplarily, the dimension of the second channel 1012 along the Z direction (see Fig.11 H3 in the figure may be smaller than the dimension of the second channel 1012 along the X direction (see Fig.11 W3 in the figure is helpful to reduce the size of the housing 4 along the Z direction at the microphone 3 after the microphone 3 is installed, thereby facilitating a lightweight design of the overall structure.

[0216] The dimension of the second channel 1012 along the Z direction may be greater than 0.6 mm, and the dimension of the second channel 1012 along the X direction may be greater than 1 mm, which is conducive to achieving a short channel dimension and a large channel inner diameter at the second channel 1012, thereby increasing the resonance frequency of the microphone 3 and improving the use effect of the microphone 3. For example, the dimension of the second channel 1012 along the Z direction may be 0.61 mm, or 0.62 mm, or 0.63 mm, or 0.64 mm, or 0.65 mm, or other values ​​greater than 0.6 mm. The dimension of the second channel 1012 along the X direction may be 1.1 mm, or 1.2 mm, or 1.3 mm, or 1.4 mm, or 1.5 mm, or other values ​​greater than 1 mm.

[0217] It should be noted that the dimension of the second channel 1012 along the Z direction is the distance between the top surface of the first enclosure 5 and the bottom surface of the second enclosure 6 , and the dimension of the second channel 1012 along the X direction is the inner diameter of the first through hole 401 .

[0218] See also Fig.12 , Fig.12 yes Figure 4A The illustrated schematic diagram is a schematic diagram of the assembly process of the mounting structure of the microphone 3 in some embodiments.

[0219] In some embodiments, the assembly process of the installation structure of the microphone 3 may include steps S10, S20, S30 and S40, wherein the order of steps S10, S20 and S30 is not limited.

[0220] S10, installing the first enclosure 5 on the shell 4.

[0221] Specifically, step S10 may include S11, S12 and S13, which may be combined with reference to Figure 6C , Fig. 10A and Fig. 10B .

[0222] S11, a third adhesive member 11 is arranged in the fifth groove 410. Figure 6C and Fig. 10A .

[0223] S12, installing the first enclosure 5 to fit the third adhesive member 11. Fig. 10A and Fig. 10B .

[0224] S13, bonding the first enclosure member 5 and the third bonding member 11.

[0225] The third adhesive member 11 may be adhesive backing, or foam adhesive, or may be formed by a dispensing process.

[0226] In some examples, the third adhesive member 11 may be adhesive backing or foam adhesive. In step S11, the adhesive backing or foam adhesive is adhered to the bottom wall of the fifth groove 410. In step S13, the third adhesive member 11 needs to be pressed to ensure that the adhesive backing or foam adhesive is activated to prevent air leakage.

[0227] In other examples, the third adhesive member 11 can be formed by using a dispensing process. In step S11, fluid glue is set in the fifth groove 410 by using a dispensing process. In step S13, the fluid glue is cured to bond the first enclosure 5 to the third adhesive member 11.

[0228] S20, installing the second enclosure 6 on the shell 4.

[0229] Specifically, step S20 may include S21, S22, S23, S24 and S25, which may be combined with reference to Fig. 6A , FIG. 7A to FIG. 7C , Fig. 8A .

[0230] S21, a first bonding member 7 is arranged in the fourth groove 408. Fig. 6A and Fig. 7A .

[0231] S22, installing the second enclosure 6 so that the first portion 6a of the second enclosure 6 is attached to the first adhesive member 7. Fig. 7A and Figure 7B .

[0232] S23, bonding the first part 6a of the second enclosure 6 and the first bonding member 7.

[0233] S24, dispensing glue between the second portion 6b of the second enclosure 6 and the first surface 4051 and curing to form a second bonding member 8. FIG. 7B to FIG. 7D .

[0234] S25, installing the sealing member 9 to the second enclosure member 6. Figure 7C and Fig. 8A .

[0235] The first adhesive member 7 may be adhesive backing, or foam adhesive, or may be formed by a dispensing process.

[0236] In some examples, the first adhesive member 7 may be adhesive backing or foam adhesive. In step S21, the adhesive backing or foam adhesive is adhered to the bottom wall of the fourth groove 408. In step S23, the first adhesive member 7 needs to be pressed to ensure that the adhesive backing or foam adhesive is activated to prevent air leakage.

[0237] In other examples, the first adhesive member 7 can be formed by a dispensing process. In step S21, the fluid glue is set in the fourth groove 408 by the dispensing process. In step S23, the fluid glue is cured to make the first part 6a of the second enclosure 6 bonded to the first adhesive member 7.

[0238] Among them, step S24 forms the second adhesive 8 by dispensing, which can improve the bonding effect between the second part 6b of the second enclosure 6 and the first surface 4051. Since the second adhesive 8 is in a fluid state before curing, the second adhesive 8 can flow between the second part 6b of the second enclosure 6 and the first surface 4051 before curing, thereby fully filling the gap between the second part 6b of the second enclosure 6 and the first surface 4051 to absorb the structural size tolerance of the second enclosure 6 and the assembly tolerance after the second enclosure 6 is bonded to the first adhesive 7, thereby improving the fitting effect between the second enclosure 6 and the shell 4, and then improving the sealing effect between the second enclosure 6 and the shell 4.

[0239] S30 , mounting the microphone 3 on the circuit board 10 .

[0240] The microphone 3 can be mounted on the circuit board 10 by welding.

[0241] S40, installing the circuit board 10 on the housing 4 to seal the sound transmission channel 1011. Figure 8B , Figure 4A and Figure 4B .

[0242] Among them, by the circuit board 10 abutting the sealing member 9 and putting the sealing member 9 in a compressed state, the gap between the circuit board 10 and the sealing member 9, and the gap between the sealing member 9 and the second enclosure 6 can be eliminated, and the sealing performance between the circuit board 10 and the second enclosure 6 is further improved, so as to improve the sealing performance between the connecting hole 601, the second through hole 903 and the third through hole 1001, which is beneficial to improve the sound transmission effect of the sound transmission channel 1011, thereby improving the use effect of the microphone 3. In addition, by fixing the circuit board 10 to the bottom wall of the second groove 404, it is beneficial to ensure that the circuit board 10 fully compresses the sealing member 9 through the fixed connection between the bottom wall of the second groove 404 and the circuit board 10, thereby improving the sealing performance between the circuit board 10 and the second enclosure 6.

[0243] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of the present application. In other words, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0244] It should be noted that all the above drawings are illustrative illustrations of the present application and do not represent the actual size of the product. Moreover, the size ratio relationship between the components in the drawings is not intended to limit the actual product of the present application.

[0245] The above are only some embodiments and implementation methods of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the technical scope disclosed in the present application can easily think of changes or substitutions, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. An electronic device (100), characterized in that: include: A shell (4) having a first through hole (401) and a first channel (402), wherein the first through hole (401) penetrates the shell (4) along a first direction, and the first channel (402) extends along a second direction, the second direction intersects with the first direction, one end of the first channel (402) is exposed from the shell (4), and the other end of the first channel (402) is connected to the first through hole (401); A first enclosure (5) fixed to one side of the housing (4) and covering an opening on one side of the first through hole (401); a second enclosure (6), fixed to the other side of the housing (4) and covering the other side opening of the first through hole (401), the second enclosure (6) being provided with a communicating hole (601); and, A microphone (3), wherein the microphone (3) is fixed to a side of the second enclosure (6) facing away from the first through hole (401), and the microphone (3) is connected to the first through hole (401) via the connecting hole (601).

2. The electronic device (100) according to claim 1, characterized in that: The housing (4) has a first groove (403) and a second groove (404) arranged opposite to each other along the first direction, and the first through hole (401) penetrates the groove bottom wall of the first groove (403) and the groove bottom wall of the second groove (404); The first groove (403) accommodates the first enclosure (5), and the second groove (404) accommodates at least a portion of the second enclosure (6) and the microphone (3).

3. The electronic device (100) according to claim 2, characterized in that: Along the first direction, the groove depth of the second groove (404) is greater than the groove depth of the first groove (403); And / or, a surface of the microphone (3) facing away from the bottom wall of the first groove (403) is located in the second groove (404).

4. The electronic device (100) according to claim 2, characterized in that: Along the first direction, the first channel (402) is biased toward a side close to the microphone (3) relative to the first through hole (401).

5. The electronic device (100) according to claim 4, characterized in that: The first enclosure (5) and the second enclosure (6) enclose the first through hole (401) to form a second channel (1012), and the volume of the first channel (402) is greater than the volume of the second channel (1012).

6. The electronic device (100) according to claim 4, characterized in that: The inner diameter of the first channel (402) is greater than or equal to 0.8 mm; And / or, the first enclosure (5) and the second enclosure (6) enclose the first through hole (401) to form a second channel (1012), the size of the second channel (1012) along the first direction is greater than 0.6 mm, and the size of the second channel (1012) along the second direction is greater than 1 mm.

7. The electronic device (100) according to any one of claims 4 to 6, characterized in that: The first through hole (401) comprises a first portion (401a) and a second portion (401b) which are connected to each other, one end of the second portion (401b) of the first through hole (401) is connected to the first channel (402), and the other end of the second portion (401b) of the first through hole (401) is connected to the first portion (401a) of the first through hole (401); The first portion (401a) of the first through hole (401) passes through the bottom wall of the first groove (403) and the bottom wall of the second groove (404), the second portion (401b) of the first through hole (401) passes through the bottom wall of the first groove (403), and the side wall of the second groove (404) close to the first channel (402) blocks a portion of the second portion (401b) of the first through hole (401) that is away from the first groove (403).

8. The electronic device (100) according to claim 7, characterized in that: The housing (4) further comprises a fourth groove (408), wherein the fourth groove (408) is recessed in the groove bottom wall of the second groove (404), and the fourth groove (408) is arranged around the first portion (401a) of the first through hole (401); The electronic device (100) further comprises a first adhesive component (7), the first adhesive component (7) being filled in the fourth groove (408), and the first adhesive component (7) bonding the housing (4) and the second enclosure (6).

9. The electronic device (100) according to claim 8, characterized in that: The width of the fourth groove (408) is greater than 0.6 mm, and the depth of the fourth groove (408) is greater than 0.1 mm.

10. The electronic device (100) according to claim 8, characterized in that: The second groove (404) has a first surface (4051), the first surface (4051) is located in the second groove (404) and is arranged close to the first channel (402), and the angle between the first surface (4051) and the bottom wall of the second groove (404) is in the range of 0° to 90°; The second enclosure (6) comprises a first part (6a) and a second part (6b) connected to each other, and the first part (6a) of the second enclosure (6) is bonded to the first bonding part (7); The electronic device (100) further comprises a second adhesive member (8), wherein the second adhesive member (8) is bonded between the second portion (6b) of the second enclosure (6) and the first surface (4051).

11. The electronic device (100) according to claim 10, characterized in that: The housing (4) further comprises a rubber stopper (406), the rubber stopper (406) being convexly arranged on the first surface (4051), the rubber stopper (406) extending along a third direction, and along the third direction, the size of the rubber stopper (406) is greater than the size of the first through hole (401), and the third direction is perpendicular to the first direction and intersects with the second direction; The second bonding member (8) is arranged around the rubber blocking block (406).

12. The electronic device (100) according to claim 11, characterized in that: The first bonding member (7) is connected to the second bonding member (8).

13. The electronic device (100) according to claim 12, characterized in that: The housing (4) further comprises a third groove (407), the third groove (407) being recessed in the groove bottom wall of the second groove (404), the third groove (407) being arranged around the first portion (401a) of the first through hole (401), the fourth groove (408) being recessed in the groove bottom wall of the third groove (407), and the third groove (407) accommodating the first portion (6a) of the second enclosure (6); The shell (4) further comprises a glue storage groove (409), wherein the glue storage groove (409) is recessed in the bottom wall of the second groove (404) and is connected to the third groove (407) and the fourth groove (408). The glue storage groove (409) is located at both ends of the third groove (407), and the first surface (4051) is located on both sides of the glue blocking block (406) and extends into the glue storage groove (409).

14. The electronic device (100) according to any one of claims 8 to 13, characterized in that: The electronic device (100) further comprises a sealing member (9) and a circuit board (10), the microphone (3) being mounted on the circuit board (10), and the sealing member (9) being bonded between the second enclosure member (6) and the circuit board (10); The sealing member (9) has a second through hole (903), the circuit board (10) has a third through hole (1001), the third through hole (1001) and the second through hole (903) are connected to the connecting hole (601) along the first direction, and the microphone (3) is arranged to cover the end of the third through hole (1001) away from the second enclosure (6).

15. The electronic device (100) according to claim 14, characterized in that: Along the first direction, the distance between the edge of the orthographic projection of the sealing member (9) on the second enclosure member (6) and the edge of the second enclosure member (6) is less than 0.1 mm.

16. The electronic device (100) according to claim 14, characterized in that: The surface of the second enclosure (6) facing the sealing member (9) has a limiting structure (602), and the sealing member (9) is installed in the limiting structure (602).

17. The electronic device (100) according to claim 14, characterized in that: The housing (4) further comprises a third groove (407), the third groove (407) being recessed in the groove bottom wall of the second groove (404), the third groove (407) being arranged around the first portion (401a) of the first through hole (401), the fourth groove (408) being recessed in the groove bottom wall of the third groove (407), and the third groove (407) accommodating a portion of the second enclosure (6); The sealing member (9) is located in the third groove (407), the circuit board (10) abuts against the surface of the sealing member (9) facing away from the second enclosure (6), and is fixedly connected to the bottom wall of the second groove (404), and the sealing member (9) is in a compressed state.

18. The electronic device (100) according to claim 17, characterized in that: The sealing member (9) comprises a sealing portion (901) and a bonding portion (902) which are stacked in parallel with the first direction, the bonding portion (902) bonding the second enclosure (6) and the sealing portion (901), the side of the sealing portion (901) facing away from the second enclosure (6) abuts against the circuit board (10), and the compression amount of the sealing portion (901) is in the range of 50% to 70%.

19. The electronic device (100) according to any one of claims 2 to 6, 8 to 13, and 15 to 18, characterized in that: The housing (4) further comprises a fifth groove (410), wherein the fifth groove (410) is recessed in the groove bottom wall of the first groove (403), and the fifth groove (410) is arranged around the first through hole (401); The shell (4) further comprises a third bonding member (11), wherein the third bonding member (11) is located in the fifth groove (410), and the third bonding member (11) bonds the shell (4) and the first enclosure (5).

20. The electronic device (100) according to claim 19, characterized in that The width of the fifth groove (410) is greater than 0.6 mm, and the depth of the fifth groove (410) is greater than 0.1 mm.

21. The electronic device (100) according to any one of claims 1 to 6, 8 to 13, 15 to 18, and 20, characterized in that: The thickness of the second enclosure (6) is greater than the thickness of the first enclosure (5).

22. The electronic device (100) according to claim 21, characterized in that The thickness of the first enclosure (5) is in the range of 0 to 0.3 mm; And / or, the thickness of the second enclosure (6) is in the range of 0 to 0.3 mm.

23. The electronic device (100) according to any one of claims 1 to 6, 8 to 13, 15 to 18, 20, and 22, characterized in that: The housing (4) further comprises a first end surface (411), wherein the first end surface (411) is arranged facing away from the microphone (3); The first channel (402) is exposed through the first end surface (411), and an opening of the first channel (402) located on the first end surface (411) is located at the center of the first end surface (411) in the first direction.

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