Ultrahigh device integrated circuit board and PCBA circuit board

Abstract

The utility model provides an ultrahigh device integrated circuit board and a PCBA circuit board. The ultra-high device integrated circuit board comprises an integrated circuit board body, an ordinary high device, a low small device, an ultra-high device and insulation paste, and the integrated circuit board body comprises a first surface and a second surface and is provided with a through hole penetrating through the first surface and the second surface; the ordinary device is welded on the first surface; the low and small device is welded on the second surface; the ultra-high device is arranged in the through hole, the body of the ultra-high device is located on the first surface, the pin of the ultra-high device is welded at the position of the bonding pad corresponding to the second surface, and a gap is formed between the through hole of the integrated circuit board body and the ultra-high device body; and the insulation paste is filled in a gap formed by the through hole of the integrated circuit board body and the ultrahigh device body. According to the utility model, the problem that the whole PCBA is too high after an ultrahigh device is welded on one surface of the PCB is solved to a certain extent, the function of shielding electromagnetic interference is realized, the operation is simple and convenient, and the popularization is easy.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to an ultra-high device integrated circuit board and a PCBA circuit board. Background Art

[0002] With the development of electronic technology, the demand for miniaturization of electronic products is gradually increasing. As an important component of electronic products, circuit boards are important carriers of electronic components, and the height of the PCBA composed of circuit boards and electronic components is crucial to the miniaturization of products. Usually, due to the limited thickness of the circuit board, in order to reduce the overall height of the product, we will deliberately choose low-height devices. However, the height of some functional devices cannot be reduced, such as some inductive devices, transformers, baluns, etc. Products using such devices are difficult to meet the requirements of product miniaturization. Existing technologies are optimized in structure, such as simple hole opening methods, which will increase the cost of the product and are not beautiful in appearance.

[0003] Therefore, designing an integrated circuit board to solve the problem of individual ultra-high components on the PCB circuit board causing the overall ultra-high PCBA has become a topic that needs to be studied in the miniaturization of electronic products. Summary of the invention

[0004] In view of the insufficient understanding of the above problems in the prior art, the utility model proposes an ultra-high device integrated circuit board and PCBA circuit board. To address the problem of excessive height of the PCBA circuit board caused by individual ultra-high devices, a new PCB design and assembled circuit board is proposed without increasing the cost of the entire research and development process.

[0005] The technical solution of the utility model is as follows:

[0006] The utility model first provides an ultra-high device integrated circuit board, comprising an integrated circuit board body, ordinary high devices, small devices, ultra-high devices and insulating glue, wherein the integrated circuit board body comprises a first surface and a second surface, the first surface is a main device welding surface, the second surface is a small device welding surface, and is provided with a through hole penetrating the first surface and the second surface; the ordinary high device is welded on the first surface of the integrated circuit board body; the small device is welded on the second surface of the integrated circuit board body; the ultra-high device is arranged in the through hole, the body of the ultra-high device is located on the first surface of the integrated circuit board body, the pins of the ultra-high device are welded on the pad position corresponding to the second surface of the integrated circuit board body, and a gap is formed between the through hole of the integrated circuit board body and the ultra-high device body; the insulating glue is filled in the gap formed by the through hole of the integrated circuit board body and the ultra-high device body.

[0007] In some embodiments, the thickness of the integrated circuit board body is h=2.0 mm.

[0008] In some embodiments, the height hb of the low-profile device is ≤1.0 mm; the height ht of the high-profile device is ≤3.0 mm.

[0009] In some embodiments, the size of the through hole of the integrated circuit board body is:

[0010] w=D-2I+δ

[0011] e=E+δ

[0012] Where: D is the width of the ultra-high device, E is the length of the ultra-high device, I is the length of the pin, δ is the precision tolerance of the mechanical hole digging, then w is the width of the through hole, and e is the length of the through hole.

[0013] In some embodiments, the maximum height of the integrated circuit board after mounting the ultra-high device is:

[0014] H2=hg'+h+hb

[0015] Wherein: hg'=hg-th, hg is the height of the ultra-high device, t is the thickness of the ultra-high device pin, and h is the thickness of the integrated circuit board body.

[0016] In some embodiments, the maximum height increase of the integrated circuit board after mounting the ultra-high device is:

[0017] △H'=H2–H0

[0018] Where: H0 is the maximum height of the integrated circuit board.

[0019] In some embodiments, the pins of the ultra-tall device are close to the middle of the ultra-tall device body, and the height of the ultra-tall device passing through the second surface of the integrated circuit board body does not exceed the height of the small device on the second surface.

[0020] In some embodiments, the ultra-high device is a transformer, an optocoupler, a relay or an isolated power supply.

[0021] The utility model also provides a PCBA circuit board, which adopts the above-mentioned integrated circuit board.

[0022] The beneficial effects of the utility model compared to the prior art are as follows: the utility model proposes an ultra-high device integrated circuit board and PCBA circuit board. The integrated circuit board is designed by opening a hole on the PCB circuit board, placing the body and pins of the ultra-high device on both sides of the circuit board respectively, and then welding the pins to the corresponding pads. This solves the problem of the overall height of the PCBA being too high after the ultra-high device is welded on one side of the PCB circuit board to a certain extent. The integrated circuit board of the utility model does not increase the cost of the entire research and development process, and achieves the function of shielding electromagnetic interference. It is simple, convenient and easy to promote. It should be understood that the realization of any embodiment of the utility model does not mean that multiple or all of the above beneficial effects must be possessed or achieved at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0024] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0025] Figure 1 A schematic cross-sectional view of an ultra-high device integrated circuit board according to an embodiment of the utility model;

[0026] Figure 2 This is a schematic diagram of the location of the insulating glue of an ultra-high device integrated circuit board according to an embodiment of the utility model;

[0027] Figure 3 This is a schematic diagram of the cross section of a PCBA circuit board without ultra-high components;

[0028] Figure 4 A physical diagram of a commonly used transformer in one embodiment of the utility model;

[0029] Figure 5 A schematic diagram of the appearance and dimensions of a commonly used transformer in one embodiment of the utility model;

[0030] Figure 6 A schematic diagram of a PCB pad design for an embodiment of the utility model;

[0031] Figure 7 The present invention is a schematic diagram of an ultra-high device pin design according to an embodiment of the present invention.

[0032] Markings in the figure:

[0033] 1. First side; 2. Second side; 10. General high-end devices; 20. Low-end devices; 30. Ultra-high-end devices; 4. Pads.

[0034] The same or corresponding symbols in the drawings indicate the same or corresponding parts. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical scheme and advantages of the embodiment of the utility model more clear, the embodiment of the utility model is further described in detail below in combination with the embodiment and the drawings. Here, the illustrative embodiment of the utility model and its description are used to explain the utility model, but are not used as a limitation of the utility model.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] It should be understood that the terms "include / comprise", "consist of..." or any other variations are intended to cover non-exclusive inclusion, so that a product, device, process or method that includes a series of elements includes not only those elements, but also may include other elements not explicitly listed when necessary, or also includes elements inherent to such product, device, process or method. In the absence of more restrictions, the elements defined by the sentence "include / comprise...", "consist of..." do not exclude the presence of other identical elements in the product, device, process or method that includes the elements.

[0038] It is also necessary to understand that terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device, component or structure referred to must have a specific direction, be constructed or operate in a specific direction, and cannot be understood as a limitation on the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] The implementation of the present invention is described in detail below in conjunction with preferred implementation modes.

[0041] The utility model proposes an ultra-high device integrated circuit board, see Figure 1 , Figure 2 As shown, it mainly includes an integrated circuit board body, a general high device 10, a low-profile device 20 and an ultra-high device 30, and an insulating glue ( Figure 2 The green part in the figure shows the

[0042] The integrated circuit board body includes a first surface 1 and a second surface 2, wherein the first surface 1 is a welding surface for main components, and the second surface 2 is a welding surface for small components 20, and a through hole is provided which penetrates the first surface 1 and the second surface 2. The ordinary high component 10 is welded on the first surface 1 of the integrated circuit board body; the small component 20 is welded on the second surface 2 of the integrated circuit board body; the super-high component 30 is provided in the through hole, the body of the super-high component 30 is located on the first surface 1 of the integrated circuit board body, the pins of the super-high component 30 are welded on the pad position corresponding to the second surface 2 of the integrated circuit board body, and connected with the pad, a gap is formed between the through hole of the integrated circuit board body and the super-high component body, and the insulating glue is filled in the gap formed by the through hole of the integrated circuit board body and the super-high component body. The integrated circuit board of the utility model solves the problem that the overall height of the PCBA is too high after the super-high component is welded on one side of the PCB circuit board to a certain extent, does not increase the cost in the entire research and development process, and realizes the function of shielding electromagnetic interference, is simple and convenient to operate, and is easy to promote.

[0043] It should be noted that the first side 1 of the integrated circuit board body is usually referred to as the T side in the industry, that is, the top of the integrated circuit board body, and the second side 2 is usually referred to as the B side, that is, the bottom of the integrated circuit board body. For the convenience of introduction, the following description uses the T side instead of the first side 1 and the B side instead of the second side 2.

[0044] See also Figure 3When the integrated circuit board does not include ultra-high devices 30, the devices can be mounted in a conventional manner. The B side and the T side are the opposite sides of the integrated circuit board body. The B side is the low-profile device welding side, which is used to weld low-profile devices 20, usually, that is, welding functional devices with a height hb≤1.0mm; the T side is used to weld ordinary high devices 10, that is, ordinary height devices, usually, that is, welding functional devices with a height ht≤3.0mm. The T side is the main device side of the integrated circuit board, integrating most of the functional devices.

[0045] Typically, the thickness of the integrated circuit board body is h=2.0 mm.

[0046] Continue to see Figure 3 , except for ultra-high devices, the maximum height of the integrated circuit board is recorded as H0:

[0047] H0=ht+h+hb=3.0+2.0+1.0=6.0mm

[0048] That is to say, the maximum height of the PCBA after soldering the electronic components is equal to the sum of the height ht of the highest component on the T surface, the thickness h of the integrated circuit board body, and the height hb of the highest component on the B surface.

[0049] It is easy to understand that the welding methods of the devices are the same, and all use conventional welding methods, including the following steps:

[0050] (1) Apply solder paste to the pads of the integrated circuit board through the steel mesh.

[0051] (2) Place the device at the corresponding pad position.

[0052] (3) Place the pins of the device on the solder paste.

[0053] (4) Melt the solder paste at high temperature and solder the pins of the device to the integrated circuit board.

[0054] Specifically, the solder paste stored at low temperature must first be warmed up, stirred and set aside, then the integrated circuit board must be fixed, the lead mesh holes must be aligned with the PCB pad positions, and then the solder paste must be applied to the steel mesh with tools so that the solder paste is evenly printed on the PCB pads through the steel mesh. Next, the pins of the device to be soldered must be placed on the solder paste (that is, the corresponding pad positions), and finally the PCB must be placed on the heating table and the temperature must be adjusted for soldering.

[0055] When the integrated circuit board includes the ultra-high device 30, if the ultra-high device 30 is mounted in the conventional manner as described above, the maximum height and the maximum height increase value of the integrated circuit board after mounting are calculated.

[0056] like Figure 5As shown (each data in the figure represents the corresponding size, the following data are all selected below the horizontal line, unit mm), the height of the transformer hg = 5.97mm, the body width d = 7.11mm, the device width D = 9.53mm, and the body length E = 12.7mm.

[0057] If you follow Figure 3 The conventional method shown is used for mounting, that is, directly soldering and mounting on the T surface of the integrated circuit board body, and the actual maximum height of the integrated circuit board using the transformer is recorded as H1:

[0058] H1=hg+h+hb=5.97+2.0+1.0=8.97mm

[0059] It can be seen that the mounting of the transformer will cause the maximum height of the PCBA to increase, which is recorded as △H:

[0060] △H=H1–H0=8.97–6.0=2.97mm

[0061] Due to the addition of a transformer on the circuit board, the height of the PCBA is 2.97mm higher than before the transformer is welded, which is nearly 50% higher than the original H0.

[0062] If the height of the ultra-high device is further increased, the height of the PCBA will be further increased, or even doubled, which undoubtedly does not meet the needs of product miniaturization. Therefore, an integrated circuit board designed with the following mounting method that can reduce the overall height is required.

[0063] The following uses a transformer (a common ultra-high device) as an example to introduce an ultra-high device integrated circuit board of the utility model and how to reduce the height of the PCBA integrated circuit board.

[0064] like Figure 4 As shown, the transformer is a common ultra-high device on an integrated circuit board. Due to its high height, generally greater than 3 mm, directly welding on the T-side of the integrated circuit will increase the overall height of the PCBA and cannot meet the needs of product miniaturization. Therefore, it is necessary to open a through hole on the integrated circuit board body, place the ultra-high device 30 in the hole, and weld the ultra-high device 30.

[0065] It should be noted that the opening size of the through hole can be calculated based on the size of the ultra-high device and the length of the pin of the ultra-high device.

[0066] Depend on Figure 5 It can be seen that the thickness of the transformer pin is t = 0.1 mm, the length of the pin is I = 0.76-0.89 mm, and there are two symmetrical groups of pins on both sides of the transformer body. Figure 1, when the transformer is placed inside the through hole, that is, the pins of the transformer are welded on the B side and the body is placed on the T side. The transformer body passes through the through hole. At this time, the opening width w and the opening length e can be calculated by the following formula:

[0067] w=D–2I+δ

[0068] e=E+δ

[0069] Where: the total width of the transformer is D; the length of the transformer is E; the length of the pin is I; δ is the machine opening accuracy tolerance, which is 0.1mm.

[0070] It is easy to understand that due to the error of the machine opening, the precision tolerance δ is designed here. Adding the precision tolerance δ to the absolute size can avoid the situation where the error causes the opening to be slightly smaller and the transformer cannot be placed in.

[0071] Take the length of the pin I = 0.76, substitute the data into the calculation, and we can get:

[0072] w=D–2I+δ=9.53-0.76*2+0.1=8.11mm

[0073] e=E+δ=12.7+0.1=12.8mm

[0074] At this time, the opening size was obtained by calculation, and the opening width was 8.11 mm and the opening length was 12.8 mm.

[0075] After obtaining the hole size, the mounting method of the utility model is as follows: according to the calculated hole size, use a milling cutter to mill a through hole at the hole position. Place the transformer in the through hole, where the transformer body is located on the T surface of the integrated circuit board body, and the transformer pins are located on the B surface of the integrated circuit board body. Solder the pins of the ultra-high device to the pad 4 position corresponding to the B surface of the integrated circuit board body, such as Figure 6 The welding method is solder paste welding or soldering iron welding.

[0076] It is easy to understand that, using the above mounting method, the actual maximum height of the PCBA using this transformer is recorded as H2:

[0077] H2=hg'+h+hb

[0078] Where: hg'=hg-th, hg is the height of the transformer, and t is the thickness of the transformer pin.

[0079] From this we can get:

[0080] H2=hg'+h+hb=hg-t-h+h+hb=hg-t+hb=hg-t+hb=5.97-0.1+1=6.87mm.

[0081] By mounting ultra-high components using this mounting method, the height increase of the PCBA is recorded as △H':

[0082] △H'=H2–H0=6.87–6.0=0.87mm

[0083] The height of PCBA has only increased by 0.87mm, which is only 15% higher than the original H0. Compared with the traditional single-sided mounting method, Figure 3 The mounting method shown increases the height by 2.97mm. With a 50% increase in height, the height of the PCBA has been greatly reduced, which can meet the needs of miniaturization.

[0084] See also Figure 7 When the height of the PCBA needs to be further reduced, the pins of the ultra-high device 30 are close to the middle part of the ultra-high device 30 body, and the height of the ultra-high device 30 passing through the B surface of the integrated circuit board body does not exceed the height of the small device on the B surface.

[0085] It should be noted here that when the height of the integrated circuit board still cannot meet the requirements, the height of the PCBA can be further reduced by the following methods: appropriately adjust the position of the transformer pin, that is, lower the position of the transformer pin in the through hole to make it close to the middle part of the ultra-high device body, but after the transformer is placed in the through hole, the lower edge of the body should not exceed the height of the small device 20 on the B side of the circuit board, that is, in this embodiment, the height of the transformer body sunk into the B side should not exceed 1 mm, otherwise it will not be able to further reduce the height of the PCBA.

[0086] Continue to see Figure 2 , place the ultra-high device 30 in the through hole, with the body located on the T side, and after the pins are soldered on the B side, a gap will inevitably form between the ultra-high device body and the through hole. To ensure the safety of PCBA and the appearance of the PCBA, it is necessary to fill the gap with insulating glue to seal and fix it. Here, epoxy resin can be used to fill the gap between the ultra-high device and the PCB circuit board with a proper amount of glue, and then irradiate with ultraviolet light after standing to solidify and increase the stability of the ultra-high device.

[0087] The above only uses the transformer as an example for explanation. Ultra-high devices include not only transformers, but also optocouplers, relays, isolated power supplies, etc., which can all be mounted in the same way to reduce the height of the PCBA.

[0088] It should also be noted that ultra-high devices are generally inductive devices. The circuit requires that there should be no conductors under the inductive devices, and opening through holes can avoid such situations. At the same time, the opening method can also prevent electromagnetic interference. Since there are coils in the body of the ultra-high device, if there are conductors under the body, the electromagnetic generated by the coils will couple to the conductors, thereby affecting the electromagnetic environment of the entire PCBA. Because of these reasons, the ultra-high device itself also occupies this part of the area on the PCBA, and opening through holes does not actually increase the area of ​​the PCBA. Therefore, it does not significantly increase the production cost of the PCBA.

[0089] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

[0090] Although several specific implementation details are included in the above discussion, these should not be interpreted as limiting the scope of the present invention. Certain features described in the context of a separate embodiment may also be implemented in a single implementation in combination. On the contrary, the various features described in the context of a single implementation may also be implemented in multiple implementations individually or in any suitable sub-combination.

Claims

1. An ultra-high device integrated circuit board, characterized in that: It includes an integrated circuit board body, ordinary high devices, small devices, ultra-high devices and insulating glue, wherein the integrated circuit board body includes a first surface and a second surface, the first surface is the welding surface of the main device, the second surface is the welding surface of the small devices, and is provided with through holes running through the first surface and the second surface; the ordinary high devices are welded on the first surface of the integrated circuit board body; the small devices are welded on the second surface of the integrated circuit board body; the ultra-high devices are arranged in the through holes, the body of the ultra-high devices is located on the first surface of the integrated circuit board body, the pins of the ultra-high devices are welded on the pad positions corresponding to the second surface of the integrated circuit board body, and a gap is formed between the through holes of the integrated circuit board body and the body of the ultra-high devices; the insulating glue is filled in the gap formed by the through holes of the integrated circuit board body and the body of the ultra-high devices.

2. The integrated circuit board according to claim 1, characterized in that: The thickness of the integrated circuit board body is h=2.0 mm.

3. The integrated circuit board according to claim 2, characterized in that: The height of the low-profile device hb≤1.0mm; the height of the ordinary-profile device ht≤3.0mm.

4. The integrated circuit board according to claim 1, characterized in that: The size of the through hole of the integrated circuit board body is: w=D-2I+δ e=E+δ Where: D is the width of the ultra-high device, E is the length of the ultra-high device, I is the length of the pin, δ is the precision tolerance of the mechanical hole digging, then w is the width of the through hole, and e is the length of the through hole.

5. The integrated circuit board according to claim 3, characterized in that: The maximum height of the integrated circuit board after mounting the ultra-high device is: H2=hg'+h+hb Wherein: hg'=hg-th, hg is the height of the ultra-high device, t is the thickness of the ultra-high device pin, and h is the thickness of the integrated circuit board body.

6. The integrated circuit board according to claim 5, characterized in that: The maximum height increase of the integrated circuit board after mounting the ultra-high device is: △H'=H2–H0 Where: H0 is the maximum height of the integrated circuit board.

7. The integrated circuit board according to claim 1, characterized in that: The pins of the ultra-high device are close to the middle part of the ultra-high device body, and the height of the ultra-high device passing through the second surface of the integrated circuit board body does not exceed the height of the small device on the second surface.

8. The integrated circuit board according to any one of claims 1 to 7, characterized in that: The ultra-high device is a transformer, an optical coupler, a relay or an isolated power supply.

9. A PCBA circuit board, characterized in that: An integrated circuit board as claimed in any one of claims 1 to 8 is used.

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