Stainless steel photoetching adhesive tape applied to PCB (Printed Circuit Board)

Abstract

The utility model relates to the technical field of photoetching adhesive tapes, in particular to a stainless steel photoetching adhesive tape applied to a PCB (printed circuit board), which comprises a photoetching adhesive tape main body, the photoetching adhesive tape main body comprises a stainless steel foil and an adhesive layer coated at the bottom of the stainless steel foil, a glue storage groove is arranged in the stainless steel foil, and photoresist is filled in the glue storage groove. A closed layer is arranged at the top of the photoresist, and a shading layer is arranged at the top of the closed layer. According to the utility model, the glue storage groove is formed in the top of the stainless steel foil, the photoresist is coated in the glue storage groove, and the closing layer which is easy to separate is adhered to the top of the glue storage groove, so that the closing layer is torn off only when photoetching is needed, and the photoresist at the bottom can be protected after the closing layer seals the glue storage groove; therefore, the problem that the photoresist is hardened due to solvent volatilization when exposed in the air for a long time is avoided, and meanwhile, the arrangement of the shading layer can prevent light from generating adverse effects on the photoresist.

Description

Technical Field

[0001] This utility model relates to the field of photoresist tape technology, and in particular to a stainless steel photoresist tape applied to PCB boards. Background Technology

[0002] Stainless steel photoresist tape uses stainless steel as the base material, with photoresist coated on one side and adhesive coated on the other side. The stainless steel photoresist tape is then attached to the PCB board using the adhesive, and circuits can be photolithographically etched onto the stainless steel photoresist tape using equipment such as a photolithography machine.

[0003] The patent specification with announcement number CN217936110U discloses a stainless steel photoresist tape for use on PCB boards, comprising a stainless steel substrate, a photoresist layer on one side of the stainless steel substrate, and an adhesive layer on the other side of the stainless steel substrate. This tape has a simple structure, and after being applied to a PCB board, the use of photoresist simplifies the product manufacturing process.

[0004] However, in implementing the relevant technology, it was found that the stainless steel photoresist tape applied to PCB boards has the following problems: the photoresist layer is directly coated on the stainless steel substrate, and the top layer of the photoresist layer is not covered by other protective layers. This causes the photoresist layer to harden due to solvent evaporation when left for a long time, thereby affecting the manufacturing quality of the PCB board. In view of this, a stainless steel photoresist tape applied to PCB boards is provided to overcome the above defects. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a stainless steel photoresist tape for use on PCB boards.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a stainless steel photoresist tape for use on a PCB board, comprising a photoresist tape body, the photoresist tape body comprising a stainless steel foil and an adhesive layer coated on the bottom of the stainless steel foil, the adhesive layer allowing the stainless steel foil to be adhered to the PCB board, the stainless steel foil having a reservoir inside, the reservoir being filled with photoresist, the top of the photoresist having a closing layer, and the top of the closing layer having a light-shielding layer, the photoresist being filled after the reservoir is opened on the top of the stainless steel foil, and the easily detachable closing layer being adhered on the top of the photoresist, the closing layer being removed only when photolithography is required, thus protecting the photoresist at the bottom and preventing the photoresist from hardening due to solvent evaporation when exposed to air for a long time.

[0007] As a further description of the above technical solution: an adhesive area is provided at the connection between the closing layer and the stainless steel foil. The adhesive area sticks the closing layer and the stainless steel foil together, so that the closing layer can seal the glue storage tank.

[0008] As a further description of the above technical solution: the closing layer is made of silicon dioxide and covers the photoresist. Since the adhesion between silicon dioxide and photoresist is low, it can prevent the photoresist from completely adhering to the closing layer after the closing layer is peeled off.

[0009] As a further description of the above technical solution: the closing layer is movably connected to the stainless steel foil through the adhesive area. The adhesive area surrounds the adhesive storage tank. The adhesive area facilitates the connection between the stainless steel foil and the closing layer. Furthermore, since the area of ​​the adhesive area is small, the bonding area between the stainless steel foil and the closing layer is small, making it easy to tear off the closing layer later.

[0010] As a further description of the above technical solution: the cross-section of the photoresist reservoir is a U-shaped structure, and the closing layer is sealed to the photoresist reservoir. The closing layer seals the photoresist inside the photoresist reservoir, and the photoresist fills the photoresist reservoir. The closing layer can only be peeled off to expose the photoresist inside when in use.

[0011] As a further description of the above technical solution: the light-shielding layer is made of PET material. The black PET film has a certain light-shielding property, thereby protecting the photoresist in the storage tank and preventing the photoresist from being exposed to the air for a long time.

[0012] As a further description of the above technical solution: the surface of the photoresist tape body is provided with a plurality of cutting holes at equal intervals, the cutting holes penetrating the entire photoresist tape body, thereby facilitating the cutting and segmentation of the photoresist tape body.

[0013] This utility model has the following beneficial effects:

[0014] This invention relates to a stainless steel photoresist tape for use on PCB boards. A storage tank is created on the top of a stainless steel foil, photoresist is coated inside the tank, and an easily removable sealing layer is attached to the top of the tank. This sealing layer is only removed when photolithography is required. The sealing layer protects the photoresist at the bottom of the tank, preventing it from hardening due to solvent evaporation from prolonged exposure to air. Simultaneously, the light-shielding layer prevents light from adversely affecting the photoresist. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of the stainless steel foil of this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the closed layer of this utility model;

[0018] Figure 4 for Figure 1 Enlarged view of point A in the middle.

[0019] Legend:

[0020] 1. Photoresist tape body; 2. Cutting hole; 3. Light-shielding layer; 4. Closure layer; 5. Stainless steel foil; 6. Adhesive layer; 7. Photoresist; 8. Resin reservoir; 9. Adhesive area. Detailed Implementation

[0021] Reference Figure 1-4 This utility model provides a stainless steel photoresist tape for use on PCB boards: it includes a photoresist tape body 1, which includes a stainless steel foil 5 and an adhesive layer 6 coated on the bottom of the stainless steel foil 5. The adhesive layer 6 allows the stainless steel foil 5 to be adhered to the PCB board. The stainless steel foil 5 has a glue storage tank 8 inside, and the glue storage tank 8 is filled with photoresist 7. A closing layer 4 is provided on the top of the photoresist 7, and a light-shielding layer 3 is provided on the top of the closing layer 4. After the glue storage tank 8 is opened on the top of the stainless steel foil 5, the photoresist 7 is filled, and the easily removable closing layer 4 is attached to the top of the photoresist 7. The closing layer 4 is only peeled off when photolithography is required, which can protect the photoresist 7 at the bottom and avoid the problem of the photoresist 7 hardening due to solvent evaporation when exposed to air for a long time.

[0022] As a further implementation of the above technical solution: an adhesive area 9 is provided at the connection between the closing layer 4 and the stainless steel foil 5. The adhesive area 9 sticks the closing layer 4 and the stainless steel foil 5 together, so that the closing layer 4 can seal the adhesive storage tank 8.

[0023] As a further implementation of the above technical solution: the closing layer 4 is made of silicon dioxide and covers the photoresist 7. Since the adhesion between silicon dioxide and photoresist 7 is low, it can prevent the photoresist 7 from completely adhering to the closing layer 4 after the closing layer 4 is peeled off.

[0024] As a further implementation of the above technical solution: the closing layer 4 is movably connected to the stainless steel foil 5 through the adhesive area 9. The adhesive area 9 surrounds the adhesive storage tank 8. The adhesive area 9 facilitates the connection between the stainless steel foil 5 and the closing layer 4. Furthermore, since the area of ​​the adhesive area 9 is small, the bonding area between the stainless steel foil 5 and the closing layer 4 is small, making it easy to tear off the closing layer 4 later.

[0025] As a further implementation of the above technical solution: the cross-section of the photoresist reservoir 8 is a U-shaped structure, and the closing layer 4 is sealed to the photoresist reservoir 8. The closing layer 4 seals the photoresist 7 inside the photoresist reservoir 8. The photoresist 7 is filled inside the photoresist reservoir 8. The closing layer 4 can only be peeled off to expose the photoresist 7 inside when in use.

[0026] As a further implementation of the above technical solution: the light-shielding layer 3 is made of PET material. The black PET film has a certain light-shielding property, thereby protecting the photoresist 7 in the photoresist storage tank 8 and preventing the photoresist 7 from being exposed to the air for a long time.

[0027] As a further implementation of the above technical solution: a plurality of cutting holes 2 are evenly spaced on the surface of the photoresist tape body 1, and the cutting holes 2 penetrate the entire photoresist tape body 1, thereby facilitating the cutting and segmentation of the photoresist tape body 1.

[0028] In practice, a photoresist reservoir 8 is opened on the top of the stainless steel foil 5. The depth of the reservoir 8 is adjusted according to actual needs. After the photoresist 7 is filled into the reservoir 8, an easily separable sealing layer 4 is pasted on the top of the reservoir 8. The sealing layer 4 is pasted on the top of the stainless steel foil 5 through the adhesive area 9. The top of the sealing layer 4 is then coated with a film to form a black light-shielding layer 3. An adhesive layer 6 is coated on the bottom of the stainless steel foil 5 to be used to attach the PCB board. After the photoresist tape body 1 is made, holes are opened between the two sets of reservoirs 8 to form continuous cutting holes 2, which facilitates the cutting of the photoresist tape body 1. The sealing layer 4 is only peeled off when photolithography is required. After sealing the reservoir 8, the sealing layer 4 can protect the photoresist 7 at the bottom, thereby avoiding the problem of the photoresist 7 hardening due to solvent evaporation when exposed to air for a long time. At the same time, the setting of the light-shielding layer 3 can prevent light from having an adverse effect on the photoresist 7.

[0029] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A stainless steel photoresist tape applied to a PCB board, comprising a photoresist tape body (1), wherein the photoresist tape body (1) comprises a stainless steel foil (5), and an adhesive layer (6) coated on the bottom of the stainless steel foil (5), characterized in that: A glue storage tank (8) is provided inside the stainless steel foil (5), and the inside of the glue storage tank (8) is filled with photoresist (7), a closed layer (4) is provided on the top of the photoresist (7), and a light shielding layer (3) is provided on the top of the closed layer (4).

2. The stainless steel photoresist tape applied to a PCB board according to claim 1, characterized in that: An adhesive area (9) is provided at the connection between the closing layer (4) and the stainless steel foil (5).

3. The stainless steel photoresist tape applied to a PCB board according to claim 2, characterized in that: The closing layer (4) is made of silicon dioxide, and the closing layer (4) covers the photoresist (7).

4. The stainless steel photoresist tape applied to a PCB board according to claim 3, characterized in that: The closing layer (4) is movably connected to the stainless steel foil (5) via the adhesive area (9).

5. The stainless steel photoresist tape applied to a PCB board according to claim 4, characterized in that: The cross section of the glue storage tank (8) is a U-shaped structure, and the closing layer (4) and the glue storage tank (8) are sealed with each other.

6. The stainless steel photoresist tape applied to a PCB board according to claim 1, characterized in that: The light shielding layer (3) is made of PET material.

7. The stainless steel photoresist tape applied to a PCB board according to claim 1, characterized in that: The surface of the photoresist tape body (1) is evenly and equidistantly provided with a plurality of cutting holes (2).

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