Evaporation pot

Abstract

The evaporation pot comprises a plating pot body, clamping rings and cover plates, the plating pot body comprises a plurality of ring carrying holes evenly and fixedly formed and a plurality of fixing columns on the two sides of the outer circumferences of the ring carrying holes, the clamping rings are attached and fixed in the ring carrying holes, the cover plates are connected with the clamping rings in a one-to-one correspondence and covering mode, and the clamping rings comprise outer rings and inner rings. The outer wall of the inner ring is in contact connection with the inner wall of the outer ring, a pair of first fixing lugs are arranged on the two sides of the outer ring in the direction close to the circumferential wall, a first flat edge part is arranged at the lower end of the inner ring, the cover plate comprises an outer cover and an inner ring, the outer cover is fixedly connected with the inner ring, a pair of second fixing lugs are arranged on the two sides of the outer cover in the direction close to the circumferential wall, and a second flat edge part is arranged at the end of the inner ring; according to the utility model, the first fixing lug and the second fixing lug are fixed on the fixing column, so that the cover plate and a wafer placed below the cover plate can be easily removed, the operation process is simple and convenient, and the arrangement of a spring structure and the cost expenditure are reduced while the fixing requirement is met.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor auxiliary process, in particular to a vapor deposition pot. Background Art

[0002] Ion plating is to place the wafer on a retaining ring and then cover the wafer with a cover plate to avoid the risk of the wafer front being evaporated when the wafer is back-plated on the retaining ring. At present, in order to improve uniformity, the plating pot (DOME) needs to rotate at high speed during the evaporation process. In order to prevent the cover plate from being thrown off, a retaining ring is usually used to fix the wafer cover plate.

[0003] The disadvantage of using a snap ring to fix the cover is that it requires an extra manual action, and the number of plated pots is large, which takes a long time, resulting in increased labor costs. The snap ring is a spring tension device. Because the vapor deposition is carried out at high temperature (120-150℃), it is easy for the spring to lose its elasticity and deform. Frequent replacement of the snap ring spring will also increase production costs. Utility Model Content

[0004] In view of the above situation, it is necessary to provide a vapor deposition pot to solve the problem that the process of fixing the cover plate in the prior art is complicated and the maintenance cost is high.

[0005] A vapor deposition pot comprises a plating pot, a clamping ring and a cover plate, wherein the plating pot comprises a plurality of uniformly fixed carrier ring holes and a plurality of fixing posts on both sides of the outer circumference of the carrier ring holes, the clamping ring is fitted and fixed in the carrier ring hole, the cover plate is fitted and connected with the clamping ring in a one-to-one corresponding manner, the clamping ring comprises an outer ring and an inner ring, the outer wall of the inner ring is in contact with the inner wall of the outer ring, a pair of first fixing ears are provided on both sides of the outer ring close to the circumferential wall, a first flat edge is provided at the lower end of the inner ring, the cover plate comprises an outer cover and an inner ring, the outer cover is fixedly connected to the inner ring, the diameter of the outer cover is larger than the diameter of the inner ring, a pair of second fixing ears are provided on both sides of the outer cover close to the circumferential wall, a second flat edge is provided at the end of the inner ring, the inner ring is adapted to the inner ring, the fixing posts are adapted to the first fixing ears and the second fixing ears respectively, and the first flat edge is fitted to the second flat edge.

[0006] In the utility model, the clamping ring is fixed in the carrier ring hole of the plating pot by cooperating with the fixing column, and the wafer is placed. Then, the outer wall of the second flat edge of the cover plate is fitted with the inner wall of the first flat edge of the clamping ring, and the inner ring is placed in the inner ring. The second fixing ear is located on the first fixing ear in the vertical direction and is fixed with the fixing column. In this way, the clamping ring and the cover plate are both fixed above the plating pot. After the vapor deposition is completed, the cover plate and the wafer placed under the cover plate can be easily removed. The operation process is simple and convenient. While meeting the fixing requirements, the setting of the spring structure is reduced, and the expenditure of production costs is reduced.

[0007] Furthermore, in the vapor deposition pot, the height of the fixing column is higher than the overlapping height of the cover plate covering the clamping ring, and the first flat edge faces the outer circumference.

[0008] In the utility model, the first fixing ear passes through the fixing column to fix the clamping ring at a specified position and direction, so that the first flat edge portion is fixed in a direction, which greatly facilitates the subsequent alignment of the cover plate and the operation of replacing the wafer.

[0009] Furthermore, in the vapor deposition pot, the first fixing ear is provided with a first fixing hole, and a S-pole fixing block is provided on a side of the first fixing hole away from the first fixing ear.

[0010] In the utility model, the clamping ring is fixed on the plating pot by being fixedly connected to the fixing columns through the first fixing holes respectively, and the S-pole fixing block and the N-pole fixing block are arranged in positions corresponding to each other to generate magnetic attraction, thereby preventing the cover plate and the wafer from being thrown out during the high-speed rotation (25 to 30 rpm) of the plating pot.

[0011] Furthermore, in the vapor deposition pot, a plurality of evenly distributed bearing blocks are provided on the circumferential edge of the inner ring, and the bearing blocks are fixedly connected to the inner ring.

[0012] In the utility model, the carrying block is used for carrying the wafer.

[0013] Furthermore, in the vapor deposition pot, the second fixing ear is provided with a second fixing hole, and a side of the second fixing hole away from the second fixing ear is provided with an N-pole fixing block.

[0014] In the utility model, the cover plate is fixed on the plating pot by being fixedly connected to the fixing columns through the second fixing holes respectively, and the S-pole fixing block and the N-pole fixing block are arranged at positions corresponding to each other to generate magnetic attraction, thereby preventing the cover plate and the wafer from being thrown out during the high-speed rotation (25 to 30 rpm) of the plating pot.

[0015] Furthermore, in the vapor deposition pot, a lifting cap is provided at the middle of the upper end of the cover plate, and the lifting cap is provided with a through hole from top to bottom.

[0016] In the utility model, a through hole is provided from top to bottom through the lifting cap, so that the cover plate can be taken out conveniently. Meanwhile, the through hole ensures the air flow, and a negative pressure state is not formed, and the wafer is not easily taken out when the cover plate is taken out.

[0017] Furthermore, the evaporation pot, the clamping ring and the cover plate are made of 304 stainless steel.

[0018] In the utility model, the clamp ring and the cover plate are made of stainless steel 304, which has good corrosion resistance, heat resistance, low temperature strength and mechanical properties and can meet the use requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view of the snap ring in the first embodiment of the utility model.

[0020] Figure 2 It is a top view of the snap ring in the first embodiment of the utility model.

[0021] Figure 3 It is a front view of the cover plate in the first embodiment of the utility model.

[0022] Figure 4 It is a top view of the cover plate in the first embodiment of the utility model.

[0023] Figure 5 It is a top view of the plating pot in the first embodiment of the utility model.

[0024] Reference numerals:

[0025] 1. Snap ring; 2. Cover plate; 3. Plating pot; 11. Outer ring; 12. Inner ring; 31. Carrier ring hole; 32. Fixing column; 111. First fixing ear; 112. First fixing hole; 113. S-pole fixing block; 121. Carrier block; 122. First flat edge; 211. Second fixing ear; 212. Second fixing hole; 213. N-pole fixing block; 214. Lifting cap; 221. Second flat edge; 2141. Through hole. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The drawings provide embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing this embodiment is to make the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items. In addition, the various embodiments of the present invention, the features in the embodiments, and the features of the embodiments can be freely combined without obvious conflicts or contradictions.

[0029] like Figure 1 and Figure 2 As shown, the retaining ring 1 includes an outer ring 11 and an inner ring 12, the outer wall of the inner ring 12 is in contact with the inner wall of the outer ring 11, the upper and lower circular end faces of the outer ring 11 and the inner ring 12 are connected to each other and are open, a pair of first fixing ears 111 are provided on both sides of the outer ring 11 close to the circumferential wall, the first fixing ears are respectively provided with first fixing holes 112, the first fixing holes 112 are respectively provided with S-pole fixing blocks 113 on the side away from the first fixing ears, a plurality of evenly distributed bearing blocks 121 are provided on the circumferential edge of the inner ring, the bearing blocks 121 are fixedly connected to the inner ring 12, and a first flat edge portion 122 is provided at the lower end of the inner ring.

[0030] like Figure 3 and Figure 4 As shown, the cover plate 2 includes an outer cover 21 and an inner ring 22, the outer cover 21 is fixedly connected to the outer circumferential edge of the inner ring 22, the diameter of the outer cover 21 is larger than the diameter of the inner ring 22, a pair of second fixing ears 211 are provided on both sides of the outer cover 21 close to the circumferential wall, the second fixing ears 211 are respectively provided with second fixing holes 212, and the second fixing holes 212 are respectively provided with N-pole fixing blocks 213 on the side away from the second fixing ears, a lifting cap 214 is provided in the middle of the upper end of the cover plate, the lifting cap 214 is provided with a through hole 2141 from top to bottom, and the inner ring end is provided with a second flat edge 221.

[0031] like Figure 5 As shown, the plating pot 3 includes a plurality of evenly fixed carrier ring holes 31 and a plurality of fixing columns 32 on both sides of the outer circumference of the carrier ring holes 31. The clamping ring 1 is fitted and fixed in the carrier ring hole 31. The height of the fixing column 32 is higher than the overlapping height of the cover plate 2 covering the clamping ring 1. Passing the first fixing ear 111 through the fixing column 32 can make the first flat edge portion 122 face the outer circumference.

[0032] In the utility model, the first fixing hole 112 cooperates with the fixing column 31 to fix the clamping ring 1 in the carrier ring hole 31 of the plating pot 3, so that the clamping ring 1 is fixed in the specified position and direction, so that the first flat edge portion 122 is also fixed in a fixed direction, which is convenient for the subsequent alignment of the cover plate 2 and the operation of replacing the wafer, and then the wafer is placed on the carrier block 121, and the outer wall of the second flat edge portion 221 of the cover plate 2 is fitted with the inner wall of the first flat edge portion 122 of the clamping ring 1, and the inner ring 22 is placed in the inner ring 12, and the second fixing ear 211 is located on the first fixing ear 111 in the vertical direction and is fixed with the fixing column 31 through the second fixing hole 212, and the S pole fixing block 113 and the N pole fixing block 213 are set at positions corresponding to each other, generating magnetic attraction, thereby preventing the plating pot from rotating at high speed (25-30 rpm), the cover plate 2 and the wafer are thrown out. The above-mentioned fixing method is to provide a through hole 2141 from top to bottom through the lifting cap 214 on the cover plate 2, which is convenient for taking out the cover plate 2. At the same time, the through hole ensures the flow of air flow and does not form a negative pressure state. It is not easy to bring out the wafer when taking out the cover plate 2. In this way, the retaining ring 1 and the cover plate 2 are fixed above the plating pot 3. After the evaporation is completed, the cover plate 2 and the wafer placed under the cover plate can be easily removed directly from the plating pot 3. The operation process is simple and convenient. While meeting the fixing requirements, it reduces the setting and replacement of the spring structure and reduces the expenditure of production costs. In addition, the retaining ring 1 and the cover plate 2 are made of stainless steel 304. Stainless steel 304 has good corrosion resistance, heat resistance, low-temperature strength and mechanical properties, which can meet the use requirements.

[0033] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0034] The above-mentioned embodiments only express the implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A vapor deposition pot, characterized in that: It includes a plating pot, a clamping ring and a cover plate, the plating pot includes a plurality of uniformly fixed carrier ring holes and a plurality of fixing columns on both sides of the outer circumference of the carrier ring holes, the clamping ring is fit and fixed in the carrier ring hole, the cover plate is cover-connected with the clamping ring in a one-to-one correspondence, the clamping ring includes an outer ring and an inner ring, the outer wall of the inner ring is in contact with the inner wall of the outer ring, a pair of first fixing ears are provided on both sides of the outer ring close to the circumferential wall, a first flat edge is provided at the lower end of the inner ring, the cover plate includes an outer cover and an inner ring, the outer cover is fixedly connected to the inner ring, the diameter of the outer cover is larger than the diameter of the inner ring, a pair of second fixing ears are provided on both sides of the outer cover close to the circumferential wall, a second flat edge is provided at the end of the inner ring, the inner ring is adapted to the inner ring, the fixing columns are adapted to the first fixing ears and the second fixing ears respectively, and the first flat edge is fitted to the second flat edge.

2. The evaporation pot according to claim 1, characterized in that: The height of the fixing column is higher than the overlapping height of the cover plate covering the clamping ring, and the first flat edge portion faces the outer circumference.

3. The evaporation pot according to claim 1, characterized in that: The first fixing ear is provided with a first fixing hole, and a S-pole fixing block is provided on a side of the first fixing hole away from the first fixing ear.

4. The evaporation pot according to claim 1, characterized in that: A plurality of evenly distributed bearing blocks are arranged on the circumferential edge of the inner ring, and the bearing blocks are fixedly connected to the inner ring.

5. The evaporation pot according to claim 1, characterized in that: The second fixing ear is provided with a second fixing hole, and a side of the second fixing hole away from the second fixing ear is provided with an N-pole fixing block.

6. The evaporation pot according to claim 1, characterized in that: A lifting cap is provided at the middle part of the upper end of the cover plate, and the lifting cap is provided with a through hole from top to bottom.

7. The evaporation pot according to claim 1, characterized in that: The clamping ring and the cover plate are made of 304 stainless steel.

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