COB lamp strip with box dam structure

Abstract

The utility model provides a COB lamp strip with a box dam structure. The COB lamp strip comprises a substrate and LED chips. The LED chips are installed on the substrate, and a part of the LED chips are provided with dispensing layers. The glue-pulling packaging layer is arranged on the outer side of the LED chip and the dispensing layer; dam glue is also arranged on the outer side of the glue-pulling packaging layer, and the dam glue is positioned on the two sides of the LED chip. According to the LED packaging structure, the box dam glue is arranged, light can be prevented from diffusing towards the two sides, the packaging glue can be effectively prevented from flowing out, meanwhile, the LED chip can be protected against external physical damage, in addition, the box dam glue can play a role in fixing the LED chip, the position of the LED chip is stable in the packaging process, and the reliability of a product can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of COB light strips, in particular to a COB light strip with a dam structure. Background Art

[0002] A light strip refers to an LED light that is welded to a copper wire or a strip of flexible circuit boards using a special processing technique and then connected to a power source to emit light. It is named a light strip because its shape when it emits light is like a light strip.

[0003] Light strips have been widely used in buildings, bridges, roads, gardens, courtyards, floors, ceilings, furniture, cars, ponds, underwater, advertisements, signs, logos and other fields for decoration or lighting. There are many types of LED chips, such as blue LED, green LED, red LED, etc. Different LED chips will emit different colors of light.

[0004] The existing patent number is CN103681643B, and the patent name is an invention patent of an LED packaging method and an LED packaging device. The patent records that the LED packaging method includes combining two or more LED chips arranged on the same substrate into a group; along the arrangement trajectory of the LED chips combined into a group, the surface of the LED chips combined into a group is continuously injected with glue in a moving manner, and after curing, a connected packaging layer is formed. The present invention solves the problems that the traditional LED packaging method requires the use of a bracket, has low packaging efficiency and poor mixing light effect through the above technical solution.

[0005] When the COB light strip recorded in the above patent is used, it uses glue to directly package the chips on the COB light strip. After packaging in this way, the entire COB light strip presents one color, which cannot meet people's requirements for light strips of multiple colors and has low applicability. In addition, during the packaging process, the packaging glue is easy to spread to both sides, which can easily cause loopholes in the protection of the LED chips in some areas, and does not meet people's usage requirements. Utility Model Content

[0006] In order to overcome the existing problems, the embodiment of the present application provides a COB light strip with a dam structure. By providing a dam glue, light can be prevented from diverging to both sides, and the packaging colloid can be effectively prevented from flowing out. At the same time, the LED chip can also be protected from external physical damage. In addition, the dam glue can also fix the LED chip, so that its position is stable during the packaging process, which is beneficial to improving the reliability of the product.

[0007] The technical solution adopted by the embodiment of the present application to solve the technical problem is:

[0008] A COB light strip with a dam structure, comprising a substrate and an LED chip;

[0009] substrate;

[0010] LED chip, wherein the LED chip is mounted on a substrate;

[0011] Glue dispensing layer: a glue dispensing layer is provided on the upper part of some LED chips;

[0012] A strip-shaped glue encapsulation layer, wherein the strip-shaped glue encapsulation layer covers the glue dispensing layer and the remaining portion of the LED chip on which the glue dispensing layer is not provided;

[0013] The dam glue is arranged on the outer side of the LED chip (2).

[0014] Some chips are selected inside the COB light strip, and the outer surface of the LED chips is first treated with glue, and then with glue pulling, so that the light of this part of the LED chips passing through the glue packaging layer and the glue dispensing layer is different from that of other LED chips, so that the COB light strip can emit light of different brightness, thereby improving the applicability of the COB light strip and having a good prospect for use.

[0015] Preferably, the LED chips provided with the glue layer are spaced apart from the LED chips not provided with the glue layer.

[0016] The glue layer can be set on the LED chips at odd positions or even positions, or it can be set in two groups at intervals, as long as there is a certain pattern between the LED chips with glue layers and the LED chips without glue layers after setting.

[0017] Preferably, the substrate is any one of a copper substrate body or an aluminum substrate body.

[0018] Preferably, the inside of the glue-dotting layer and the glue-pulling packaging layer is doped with fluorescent powders of different colors, so as to change the color of the light passing through the glue-dotting layer and the glue-pulling packaging layer.

[0019] Preferably, the dam structure comprises two groups of dam rubber strips arranged in parallel, the dam rubber strips are fixedly mounted on the substrate, and the LED chip is located between the two groups of dam rubber strips.

[0020] Before the glue pulling process, a dam structure is made on the outside of the LED chip. Forming a dam around the LED chip can effectively prevent the packaging colloid from flowing out, and at the same time fix the LED chip to stabilize its position during the packaging process, thereby improving the LED packaging efficiency. The dam structure can protect the LED chip and the glue pulling packaging layer from external physical damage, which is beneficial to improving the reliability and service life of the product.

[0021] The advantages of the embodiments of the present application are:

[0022] 1. The utility model records a COB light strip with a dam structure. Some LED chips are selected inside the light strip, and glue is first applied to the outer surface of the LED chips, and then glue is applied, so that the light of this part of the LED chips passing through the glue encapsulation layer and the glue application layer is different from that of other LED chips, so that the COB light strip can emit light of different brightness and different colors, thereby improving the applicability of the COB light strip and having a good prospect of use;

[0023] 2. The utility model records a COB light strip with a dam structure. Before the glue drawing process, a dam structure is made on the outside of the LED chip to form a dam around the LED chip, which can effectively prevent the packaging colloid from flowing out and fix the LED chip to stabilize its position during the packaging process, thereby improving the LED packaging efficiency. In addition, the dam structure can protect the LED chip and the glue drawing packaging layer from external physical damage, which is conducive to improving the reliability and service life of the product;

[0024] 3. The utility model records a COB light strip with a dam structure. The light strip substrate is made of aluminum and copper substrates, both of which have good heat dissipation performance and excellent mechanical strength. It can withstand greater pressure and vibration and is suitable for various harsh environments. In addition, the copper substrate also has good electromagnetic shielding performance and packaging capabilities, which can effectively reduce electromagnetic interference and provide good protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0026] Figure 1 This is a schematic diagram of the overall structure of the COB light strip with a dam structure of the utility model;

[0027] Figure 2 It is a schematic cross-sectional structure diagram of the COB light strip with a dam structure without a glue dispensing layer in the utility model;

[0028] Figure 3 It is a schematic cross-sectional structure diagram of a COB light strip with a dam structure according to the present invention, in which a glue layer is arranged.

[0029] Description of main reference numerals:

[0030] 1. Substrate; 2. LED chip; 3. Glue dispensing layer; 4. Glue encapsulation layer; 5. Dam rubber strip. DETAILED DESCRIPTION

[0031] The embodiments of the present application provide a COB light strip with a dam structure to solve the problem in the prior art that when the COB light strip is in use, the chips on the COB light strip are directly packaged by pulling glue. After packaging in this way, the entire COB light strip presents one color, which cannot meet people's requirements for light strips of various colors and has low applicability. In addition, during the packaging process, the packaging glue is easy to spread to both sides, which can easily lead to loopholes in the protection of LED chips in some areas.

[0032] The technical solution in the embodiment of the present application is to solve the above problems, and the overall idea is as follows:

[0033] Embodiment 1:

[0034] This embodiment provides a specific structure of a COB light strip with a dam structure, such as Figure 1-3 As shown, it includes a substrate 1 and an LED chip 2;

[0035] The LED chip 2 is mounted on the substrate 1, and a glue layer 3 is provided on part of the LED chip 2; a strip-shaped glue encapsulation layer 4 is used to encapsulate the entire COB light strip, and the glue encapsulation layer 4 is arranged on the outside of the LED chip 2 or the glue layer 3; a dam glue 5 is also provided on the outside of the glue encapsulation layer 4;

[0036] The dam structure includes two groups of dam rubber strips 5 arranged in parallel. The dam rubber strips 5 are fixedly mounted on the substrate 1 . The dam rubber strips are located on both sides of the LED chip 2 .

[0037] The utility model records a COB light strip with a dam structure. Before the glue pulling process, a dam structure is made on the outside of the LED chip to form a dam around the LED chip, which can effectively prevent the packaging colloid from flowing out, and at the same time play a role in fixing the LED chip, so that its position is stable during the packaging process, thereby improving the LED packaging efficiency, and the dam structure can protect the LED chip and the glue pulling packaging layer from external physical damage, which is conducive to improving the reliability and service life of the product. Then, a part of the LED chips 2 are selected inside the COB light strip, and the outer surface of the LED chip 2 is firstly subjected to glue dispensing treatment, and then the glue pulling process is performed, so that the light of this part of the LED chips 2 is different from that of other LED chips 2, so that the COB light strip can emit light of different brightness, improve the applicability of the COB light strip, and have a good prospect of use.

[0038] Embodiment 2:

[0039] On the basis of Example 1, Figure 1-3 As shown, this patent also records the following structure:

[0040] The inside of the glue dispensing layer 3 and the glue encapsulation layer 4 is doped with fluorescent powders of different colors, which are used to change the color of the light passing through the glue dispensing layer 3 and the glue encapsulation layer 4.

[0041] Phosphor is a substance that can convert light of a specific wavelength into light of another wavelength. In LED lighting, phosphor is mainly used to convert the blue light emitted by the LED chip into other colors. There are many types of phosphors, the most common ones are rare earth element phosphors, silicate phosphors, etc. The choice of phosphor will affect the color temperature and brightness of LED lighting.

[0042] The colors of the fluorescent powder in the glue dispensing layer 3 and the glue encapsulation layer 4 are different, so the light emitted by the LED chip 2 has different colors after passing through the glue dispensing layer 3 and the glue encapsulation layer 4. Therefore, the COB light strip can emit light of different brightness and different colors, thereby improving the applicability of the COB light strip and having good usage prospects.

[0043] Embodiment 3:

[0044] On the basis of Example 2, Figure 1-3 As shown, this patent also records the following structure:

[0045] The LED chips 2 provided with the glue layer 3 are spaced apart from the LED chips 2 not provided with the glue layer 3. The specific selection of the LED chips for glue dispensing can be determined according to the product requirements, for example: selecting odd or even numbers for glue dispensing or dispensing at intervals of 1 / 3 of the total number of LED chips, and selecting glue dispensing.

[0046] The glue layer 3 can be set on the LED chips 2 at odd positions or even positions, or two groups can be set at intervals. After setting, there is a certain pattern between the LED chips 2 with the glue layer 3 and the LED chips 2 without the glue layer 3.

[0047] The main purpose of presenting a certain regularity is to make the light emitted by the LED chip 2 more coordinated.

[0048] Embodiment 4:

[0049] On the basis of Example 4, Figure 1-3 As shown, this patent also records the following structure:

[0050] The substrate 1 is either a copper substrate body or an aluminum substrate body.

[0051] The substrate 1 is made of aluminum and copper substrates, both of which have good heat dissipation performance and can effectively conduct away the heat generated when the light strip is working, thereby ensuring the normal operation of the light strip and extending its service life.

[0052] The substrate 1 is made of aluminum and copper substrate and has excellent mechanical strength, can withstand greater pressure and vibration, and is suitable for various harsh environments. In addition, the copper substrate also has good electromagnetic shielding performance and packaging capabilities, which can effectively reduce electromagnetic interference and provide good protection.

[0053] Working principle: Select some LED chips 2 inside the COB light strip, first do a glue dispensing process on the outer surface of the LED chips 2, and then do a glue pulling process, so that the light of this part of the LED chips 2 is different from that of other LED chips 2, so that the COB light strip can emit light of different brightness and different colors.

[0054] Before the glue pulling process, a dam structure is made on the outside of the LED chip. A dam is formed around the LED chip, which can effectively prevent the packaging colloid from flowing out and fix the LED chip to stabilize its position during the packaging process, thereby improving the LED packaging efficiency. The dam structure can protect the LED chip and the glue pulling packaging layer from external physical damage, which is beneficial to improving the reliability and service life of the product.

[0055] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A COB light strip with a dam structure, characterized in that: include: base(1); An LED chip (2), wherein the LED chip (2) is mounted on the substrate (1); A glue dispensing layer (3), wherein a glue dispensing layer (3) is disposed on the upper part of a portion of the LED chip; A strip-shaped glue encapsulation layer (4), wherein the strip-shaped glue encapsulation layer (4) covers the glue dispensing layer (3) and the remaining portion of the LED chip on which the glue dispensing layer (3) is not provided; The dam glue is arranged on the outer side of the LED chip (2).

2. The COB light strip with a dam structure according to claim 1, characterized in that: The inside of the glue-dotting layer (3) and the glue-pulling encapsulation layer (4) is doped with fluorescent powders of different colors, which are used to change the color of the light passing through the glue-dotting layer (3) and the glue-pulling encapsulation layer (4).

3. The COB light strip with a dam structure according to claim 1, characterized in that: The LED chip (2) provided with the glue layer (3) and the LED chip (2) not provided with the glue layer (3) are arranged at intervals.

4. The COB light strip with a dam structure according to claim 1, characterized in that: The substrate (1) is any one of a copper substrate body and an aluminum substrate body.

5. The COB light strip with a dam structure according to claim 1, characterized in that: The dam structure comprises two groups of dam rubber strips (5) arranged in parallel, the dam rubber strips (5) are fixedly mounted on the substrate (1), and the LED chip (2) is located between the two groups of dam rubber strips (5).

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