Backlight module, display module and display device thereof

Abstract

The embodiment of the utility model provides a backlight module, a display module and a display device thereof. The backlight module comprises a back plate, a light-emitting substrate, a circuit board and a first heat dissipation layer, the back plate comprises a first surface and a second surface which are oppositely arranged, the light-emitting substrate is arranged on the first surface, the circuit board is arranged on the second surface, and the first heat dissipation layer is arranged on the second surface; the orthographic projection of the first heat dissipation layer on the back plate is at least partially overlapped with the orthographic projection of the circuit board on the back plate, and the circuit board is in contact with the first heat dissipation layer. According to the technical scheme, heat dissipation of the light-emitting substrate can be accelerated, the heat dissipation efficiency of the light-emitting substrate is improved, and wrinkling of the diaphragm is reduced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display devices, and in particular to a backlight module, a display module and a display device thereof. Background Art

[0002] With the development of display technology, people have higher and higher requirements for display quality. In the related art, as the resolution or refresh rate of the display device becomes higher and higher, the power consumption of the display device becomes higher and higher, which leads to the serious heating problem of the display device. Utility Model Content

[0003] The embodiments of the present disclosure provide a backlight module, a display module and a display device thereof to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a backlight module, including:

[0005] A back plate, the back plate comprising a first surface and a second surface arranged opposite to each other;

[0006] a light-emitting substrate, wherein the light-emitting substrate is disposed on the first surface;

[0007] A circuit board, wherein the circuit board is arranged on the second surface;

[0008] A first heat dissipation layer is arranged on the second surface, an orthographic projection of the first heat dissipation layer on the back plate at least partially overlaps with an orthographic projection of the circuit board on the back plate, and the circuit board contacts the first heat dissipation layer.

[0009] In some possible implementations, the light-emitting substrate is fixed on the first surface via a thermally conductive adhesive layer.

[0010] In some possible implementations, the first heat dissipation layer is located between the circuit board and the back panel, the first heat dissipation layer includes a first part and a second part, the orthographic projection of the first part on the back panel is located within the orthographic projection of the circuit board on the back panel, and the orthographic projection of the second part on the back panel has no overlap with the orthographic projection of the circuit board on the back panel.

[0011] In some possible implementations, the circuit board has at least one heating element, and the heating element is located on a side of the circuit board facing the first portion and in contact with the first portion.

[0012] In some possible implementations, the first portion is provided with a hollow, and the circuit board and the back plate are connected via an adhesive layer located in the hollow.

[0013] In some possible implementations, the material of the first heat dissipation layer includes graphene.

[0014] As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display module.

[0015] A backlight module, wherein the backlight module is the backlight module described in any embodiment of the present disclosure;

[0016] A display panel, located on the light-emitting side of the light-emitting substrate of the backlight module;

[0017] Packaging tape, the edge of the display panel and the edge of the back side of the backlight module are wrapped by the packaging tape.

[0018] In some possible implementations, a peripheral area is provided at an edge of the display panel, the display panel further includes a control module, the control module is located in the peripheral area, the packaging tape includes a first area located at a display side of the display panel and a second area located at a back side of the backlight module, an orthographic projection of the peripheral area on the display panel is located within an orthographic projection of the first area on the display panel, and a first insulating layer is provided between the control module and the packaging tape;

[0019] The orthographic projection of the circuit board in the backlight module on the backplane in the backlight module is located within the orthographic projection of the second area on the backplane, and a second insulating layer and a second heat dissipation layer are sequentially arranged between the circuit board and the packaging tape.

[0020] In some possible implementations, a peripheral area is provided at an edge of the display panel, the display panel further includes a control module, the control module is located in the peripheral area, the packaging tape includes a first area located at a display side of the display panel and a second area located at a back side of the backlight module, an orthographic projection of the peripheral area on the display panel is located within an orthographic projection of the first area on the display panel, and a first insulating layer is provided between the control module and the packaging tape;

[0021] A second insulating layer and a second heat dissipation layer are sequentially arranged on a side of the circuit board in the backlight module away from the back plate, and the second area is overlapped and connected with a part of the second heat dissipation layer.

[0022] In some possible implementations, the material of the second heat dissipation layer includes graphene.

[0023] As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device, including the backlight module described in any embodiment of the present disclosure, or including the display module described in any embodiment of the present disclosure.

[0024] The technical solution of the embodiment of the present disclosure can achieve the following beneficial effects: the backlight module of the embodiment of the present disclosure can accelerate the heat dissipation of the light-emitting substrate, improve the heat dissipation efficiency of the light-emitting substrate, and reduce the wrinkling of the diaphragm.

[0025] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0027] Figure 1 A schematic structural diagram of a backlight module according to an embodiment of the present disclosure;

[0028] Figure 2 is a plan view schematic diagram of a backlight module according to an embodiment of the present disclosure;

[0029] Figure 3 It is a plan view of a circuit board and a first heat dissipation layer according to an embodiment of the present disclosure;

[0030] Figure 4 is a schematic diagram of a display module according to an embodiment of the present disclosure;

[0031] Figure 5 is a schematic diagram of a display module according to another embodiment of the present disclosure;

[0032] Figure 6 It is a plan view of the packaging tape and the second heat dissipation layer of the display module of the embodiment of the present disclosure;

[0033] Figure 7 is a schematic diagram of a display module according to yet another embodiment of the present disclosure;

[0034] Figure 8 It is a plan view of the packaging tape and the second heat dissipation layer of the display module of the embodiment of the present disclosure. DETAILED DESCRIPTION

[0035] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0036] With the rapid development of the display Internet of Things, the performance requirements for display devices are getting higher and higher. For example, display devices require high contrast, high refresh rate, high color gamut, and high brightness. With the improvement of people's requirements for the display effect of display products, the backlight technology using micro light-emitting diodes (Mini-LED) has emerged, which can meet the needs of high contrast, high color gamut and high brightness. However, the display device using Mini-LED as the backlight has the problem of high power consumption, and the heat will rise sharply when the display device is working, causing the problem of diaphragm wrinkles in the backlight. In order to maintain the long-term operation of high-performance display devices, an effective heat dissipation solution for the display device has become an urgent problem to be solved.

[0037] In the related art, the display device includes a backlight module and a display panel located on the light-emitting side of the backlight module. The backlight module includes a backplane, a light-emitting substrate and a circuit board. The display panel includes a driver chip (Source IC) located in the peripheral area of ​​the display panel and used to drive the display panel. There are three main sources of heat in the display device. One is the heat generated by some components of the circuit board, such as inductors, driver chips (LED Driver) and timing controllers (T-con); the second is the heat generated by the working circuit of the light-emitting substrate; and the third is the heat generated by the driver chip (Source IC) that provides signals to the display panel.

[0038] The display device assembles a light-emitting substrate with a backplane, an optical film and other structures into a backlight module. Due to the brightness requirements of the display device, the light-emitting units of the light-emitting substrate of the backlight module are increased, and the overall power consumption of the backlight module is increased. The light-emitting substrate is a heat source for the temperature increase of the module. If the light-emitting substrate cannot quickly dissipate its own heat through the backplane, it will cause its heat to accumulate and cause the film to wrinkle. However, since the heat dissipation solution of the backlight module in the related art is generally solved by using thermal conductive composite copper foil as the material of the backplane and the material of the packaging tape (Cell tape). At present, the use of copper foil material for the backplane cannot solve the problem of excessive temperature caused by heat generated by the display device. For example, the use of copper foil material on a display device with an overload or a refresh rate higher than 240Hz still causes serious heat generation.

[0039] Moreover, the accumulation of heat over a long period of time will cause the diaphragm to wrinkle and the display panel to overheat, which may cause the pixels of the display panel to fail and affect the display quality of the display device. Specifically, in order to achieve partitioned control of the light-emitting substrate, the circuit board needs to work at a high refresh rate. The operating voltage of the circuit board and the power consumption of the components increase, causing the circuit board to heat up seriously. If the circuit board cannot quickly disperse its own heat to the entire backplane for heat dissipation, it will cause its heat to accumulate locally, and will continue to transfer heat from the circuit board to each diaphragm, causing the diaphragm to wrinkle, resulting in poor product display and affecting the customer experience.

[0040] In order to solve the problem of poor heat dissipation of a backlight module of a display device in the related art, an embodiment of the present disclosure provides a backlight module. The technical solution of the present disclosure is described in detail below through embodiments.

[0041] Figure 1 FIG. 1 is a schematic diagram of the structure of a backlight module according to an embodiment of the present disclosure. Figure 1 As shown, a backlight module 10 provided in an embodiment of the present disclosure includes a backplane 100, a light-emitting substrate 200, a circuit board 300, and a first heat dissipation layer 400. The backplane 100 includes a first surface 100a and a second surface 100b that are arranged opposite to each other. The light-emitting substrate 200 is arranged on the first surface 100a. The circuit board 300 is arranged on the second surface 100b. The first heat dissipation layer 400 is arranged on the second surface 100b, and the orthographic projection of the first heat dissipation layer 400 on the backplane 100 at least partially overlaps with the orthographic projection of the circuit board 300 on the backplane 100, and the circuit board 300 is in contact with the first heat dissipation layer 400.

[0042] The backlight module of the embodiment of the present disclosure is provided with the light-emitting substrate 200 on the first surface 100a of the back plate 100, the circuit board 300 on the second surface 100b, the first heat dissipation layer 400 on the second surface 100b, the orthographic projection of the first heat dissipation layer 400 on the back plate 100 and the orthographic projection of the circuit board 300 on the back plate 100 at least partially overlap, and the circuit board 300 contacts the first heat dissipation layer 400. Thus, the heat generated by the circuit board 300 when working can be quickly dissipated through the first heat dissipation layer 400, and the heat accumulation of the circuit board 300 for a long time is avoided to cause the local high temperature of the backlight module 10 and thus the wrinkling of the diaphragm, and the surface temperature of the backlight module 10 is avoided to be too high when the backlight module 10 is applied to the display device, thereby reducing product defects and improving display quality.

[0043] Reference Figure 1 As shown, in one embodiment, the light-emitting substrate 200 includes a base substrate 210 and a plurality of light-emitting units 220 disposed on the base substrate 210. The light-emitting unit 220 can be used to provide a light source, and a plurality of light-emitting units 220 arranged in an array can be disposed on the base substrate 210. The circuit board 300 can be used to connect the light-emitting substrate 200 to control the light-emitting units 220 in the light-emitting substrate 200. Exemplarily, the light-emitting unit 220 may include a light-emitting diode, which is a sub-millimeter light-emitting diode or a micro light-emitting diode with a size below hundreds of microns. The base substrate 210 may be made of glass, quartz, plastic, etc. The light-emitting unit 220 may also include a protective structure, which is disposed on the light-emitting side of the light-emitting unit 220, and the material of the protective structure may be transparent silicone, etc.

[0044] Exemplarily, the shapes of the back plate 100 and the light-emitting substrate 200 can be rectangular, rounded rectangular, circular or elliptical, etc. The shapes of the back plate 100 and the light-emitting substrate 200 are not limited here and can be set according to actual use requirements. The number of light-emitting substrates 200 of the backlight module can be one or more, and the embodiment of the present disclosure does not specifically limit the number of light-emitting substrates 200 of the backlight module.

[0045] In one embodiment, the back plate 100 may be made of a material with good thermal conductivity. For example, the material of the back plate 100 may be aluminum, aluminum alloy, copper or copper alloy, etc., so that the back plate 100 has good thermal conductivity and heat dissipation performance.

[0046] In a specific embodiment, the light emitting unit 220 may be a submillimeter light emitting diode (Mini Light Emitting Diode, Mini LED). For example, the backlight module 10 uses a large number of ultra-small Mini LED light emitting units to achieve the backlight effect. The size and pitch of Mini LED are small, so the backlight module 10 can achieve a high dynamic range and present a high contrast effect, and can also shorten the optical distance to reduce the thickness of the display device to achieve the demand for thinness.

[0047] In a specific embodiment, the light emitting unit 220 may also be a micro light emitting diode (Micro Light Emitting Diode, Micro LED). Micro LED is smaller in size than Mini LED, and can further increase the number of dimming partitions and improve the contrast of the liquid crystal display.

[0048] Reference Figure 1 As shown, exemplarily, the orthographic projection of the first heat dissipation layer 400 on the back plate 100 at least partially overlaps with the orthographic projection of the circuit board 300 on the back plate 100, the first heat dissipation layer 400 is attached to the second surface 100b, and the overlapping portion of the first heat dissipation layer 400 and the circuit board 300 is located between the circuit board 300 and the second surface 100b of the back plate. For example, the orthographic projection area of ​​the first heat dissipation layer 400 on the back plate 100 is set to be larger than the orthographic projection area of ​​the circuit board 300 on the back plate 100, and the orthographic projection of the circuit board 300 on the back plate 100 is located within the orthographic projection of the first heat dissipation layer 400 on the back plate 100, so that it can be ensured that the entire circuit board 300 can be cooled by the first heat dissipation layer 400 to avoid local overheating.

[0049] It should be noted that a first heat dissipation layer 400 of a preset area is attached to the back of the back plate 100. The preset area of ​​the first heat dissipation layer 400 is not limited here, and the preset area can be set according to actual use requirements. For example, when the backlight module is applied to a display device, the preset area can be matched according to factors such as the overall weight of the display device and the specific size of the back plate.

[0050] In one embodiment, the back panel 100 is used to support and carry the light-emitting substrate 200 and other light film devices. The light-emitting substrate 200 can be adhered to the back panel 100 through an adhesive layer. The adhesive layer can be a strip or glue. The light-emitting substrate 200 can be connected to the back panel 100 by gluing.

[0051] In one embodiment, the backlight module 10 also includes an optical film layer 600, which is located on the light-emitting side of the light-emitting substrate 200. Exemplarily, the optical film layer 600 may include a diffusion film layer, a brightness enhancement film layer, a prism film layer, a uniform light film layer, a transflective film layer, and the like. The diffusion film layer can be used to evenly distribute the light emitted by the light-emitting substrate. The brightness enhancement film layer can be used to refract the light emitted from the diffusion plate, improve the viewing angle distribution of the light, concentrate the light on the positive viewing angle, increase the luminous flux at the positive viewing angle, and improve the light utilization rate. The prism film layer may include a lower prism sheet and an upper prism sheet. The number of diffusion film layers, the number of brightness enhancement film layers, and the number of prism film layers can all be set according to actual usage requirements. The backlight module of the disclosed embodiment can accelerate the heat dissipation of the light-emitting substrate, improve the heat dissipation efficiency of the light-emitting substrate, and reduce the wrinkling of the optical film layer.

[0052] Reference Figure 1 As shown, in one embodiment, the light-emitting substrate 200 is fixed on the first surface 100a by a thermally conductive adhesive layer 500. Exemplarily, the thermally conductive adhesive layer 500 can be a thermally conductive insulating tape. For example, the thermally conductive adhesive layer 500 can be an insulating double-sided adhesive tape. The thermally conductive adhesive layer 500 can not only form an insulating isolation layer between the light-emitting substrate 200 and the back plate 100, but also transfer the heat generated by the light-emitting unit of the light-emitting substrate 200 from the back plate 100, that is, the backlight module 10 can have better heat dissipation performance through the thermally conductive adhesive layer 500.

[0053] The backlight module of the disclosed embodiment connects the light-emitting substrate 200 and the back panel 100 via a thermally conductive adhesive layer 500, which can reduce the heat transfer of the light-emitting substrate 200 to the optical film layer above. The thermally conductive adhesive layer 500 can not only fix the light-emitting substrate 200 on the back panel 100, but also transfer the heat of the light-emitting substrate 200 to the back panel 100 through the thermally conductive adhesive layer 500, thereby further accelerating the heat dissipation of the light-emitting substrate 200, improving the heat dissipation efficiency of the light-emitting substrate, and reducing wrinkling of the optical film layer.

[0054] Figure 2 is a plan view of a backlight module according to an embodiment of the present disclosure, Figure 3 FIG. 1 is a schematic plan view of a circuit board and a first heat dissipation layer according to an embodiment of the present disclosure. Figure 1 , Figure 2 as well as Figure 3 In one embodiment, the first heat dissipation layer 400 is located between the circuit board 300 and the back plate 100. The first heat dissipation layer 400 includes a first portion 410 and a second portion 420, wherein the orthographic projection of the first portion 410 on the back plate 100 is located within the orthographic projection of the circuit board 300 on the back plate 100, and the orthographic projection of the second portion 420 on the back plate 100 does not overlap with the orthographic projection of the circuit board 300 on the back plate 100.

[0055] Reference Figures 1 to 3 As shown, the first part 410 is clamped between the back plate 100 and the circuit board 300, the orthographic projection of the first part 410 on the back plate 100 is located within the orthographic projection of the circuit board 300 on the back plate 100, and the second part 420 is located in the area outside the first part 410. The first part 410 can absorb heat from the light-emitting substrate 200 and the circuit board 300, and quickly dissipate it through the second part 420, thereby improving the heat dissipation efficiency of the backlight module 10.

[0056] Reference Figure 2 and Figure 3 As shown, in one embodiment, the circuit board 300 can be connected to the light-emitting substrate 200 through a flexible circuit board 320, and the circuit board 300 has at least one heating element 310, which is located on the side of the circuit board 300 facing the first part 410 and contacts the first part 410. Exemplarily, the heating element 310 can be an inductor, a driver chip (LED Driver), and a timing controller (T-con). The heating element 310 can be set according to actual application requirements, which is not limited here.

[0057] Exemplarily, the circuit board 300 can be connected to the light-emitting substrate 200 through a plurality of flexible circuit boards 320. The shape of the circuit board 300 is roughly rectangular, and the edge of the circuit board 300 can also be provided with a groove portion. The edge portions of the circuit board 300 on both sides in the length direction extend outward from the first heat dissipation layer 400, and the edge portions of the circuit board 300 are bonded and fixed to the back plate 100 through the bonding layer 412, so that the bonding effect of the edge portions of the circuit board 300 can be ensured. For example, the sizes of the edge portions on both sides can be the same or different, and the edge portions on both sides are bonded to the back plate through the bonding layer 412 respectively.

[0058] The backlight module of the disclosed embodiment can bring the corresponding position of the heating element 310 with higher heat generation corresponding to the circuit board 300 into contact with the first part 410 of the first heat dissipation layer 400, thereby reducing the temperature of the local heating element 310 and achieving a strong heat dissipation effect for the heating element 310 on the circuit board 300.

[0059] Reference Figure 3 As shown, in one embodiment, the first part 410 is provided with a hollow 411, and the circuit board 300 is connected to the back plate 100 through an adhesive layer 412 located in the hollow 411. Exemplarily, the first part 410 is provided with a plurality of hollows 411, and an adhesive layer 412 is provided in the corresponding area of ​​the hollow 411. The adhesive layer 412 is used to bond and fix the circuit board 300 to the back of the back plate 100. The adhesive layer 412 can avoid the first heat dissipation layer 400 through the hollow 411, so that the circuit board 300 can be fixed to the back plate 100. Exemplarily, the adhesive layer 412 can be a double-sided adhesive, and the adhesive layer 412 can be rectangular or circular, and the adhesive layer 412 can be distributed according to actual setting needs.

[0060] Exemplarily, the edge portions on both sides of the circuit board 300 do not overlap with the first part 410, and the edge portions on both sides of the circuit board 300 are respectively connected to the back plate through the adhesive layer 412. The first part 410 is provided with two hollows 411, and the adhesive layer 412 is located in the hollows 411 and the adhesive layer 412 is not bonded to the first heat dissipation layer 400. The number of hollows 411 can be set according to actual use requirements and is not limited here.

[0061] In some embodiments, the material of the first heat dissipation layer 400 includes graphene. For example, the first heat dissipation layer 400 can be formed into a thinner layer structure by spraying, screen printing, etc. At the same time, due to the good thermal conductivity of the graphene material, the heat generated by the light-emitting substrate 200 during operation can be quickly conducted to the periphery and then diffused to the entire backplane 100, thereby improving the heat dissipation effect and avoiding product defects such as film wrinkles and poor light efficiency caused by heat concentration. In addition, the use of graphene materials to form a thinner first heat dissipation layer 400 by spraying, screen printing, etc. is simple in process.

[0062] Figure 4 Schematic diagram of a display module of an embodiment of the present disclosure. The present disclosure also provides a display module, referring to Figure 4 As shown, the display module includes a backlight module 10, a display panel 20 and a packaging tape 30. The backlight module 10 is the backlight module of any embodiment of the present disclosure. The display panel 20 is located on the light-emitting side of the light-emitting substrate 200 of the backlight module 10. The edge of the display panel 20 and the edge of the back side of the backlight module 10 are wrapped and fixed by the packaging tape 30.

[0063] In some embodiments, the display module may be a display module using any display principle, for example, a liquid crystal display module (LCD), an organic light emitting diode (OLED) display module, etc. Exemplarily, the display module may be a liquid crystal display module. The display panel 20 is a liquid crystal display panel, in which the liquid crystal molecules themselves do not emit light, and the backlight module 10 is arranged on the back of the liquid crystal display panel, and the light emitted by the backlight module 10 is transmitted through the liquid crystal analysis to realize light emission, so as to display an image.

[0064] In some embodiments, the display panel 20 may include a first substrate 22 and a second substrate 23 that are arranged opposite to each other, and the first substrate 22 is closer to the backlight module 10 than the second substrate 23. A polarizing layer is arranged on the side of the first substrate 23 facing the backlight module 10, and a polarizing layer is arranged on the side of the second substrate 23 away from the backlight module 10. The first substrate 22 and the second substrate 23 may be array substrates or color filter substrates. Exemplarily, the first substrate 22 may be an array substrate, and the second substrate 23 may be a color filter substrate.

[0065] Reference Figure 4 As shown, the display panel 20 may further include a first polarizer 24 and a second polarizer 25 , wherein the first polarizer 24 is located on a side of the second substrate 23 away from the first substrate 22 , and the second polarizer 25 is located on a side of the first substrate 22 away from the second substrate 23 .

[0066] Reference Figure 4 As shown, in some embodiments, the display module may further include a plastic frame 70, which is disposed in the peripheral area of ​​the display panel 20, and the plastic frame 70 is located between the backlight module 10 and the display panel 20. For example, the plastic frame 70 includes a first plastic frame portion 71 and a second plastic frame portion 72 which are integrally formed, the first plastic frame portion 71 is sandwiched between the first substrate 22 and the light-emitting substrate 200, and the second plastic frame portion 72 is sandwiched between the first substrate 22 and the back plate 100. It should be noted that the specific structure of the plastic frame 70 is not limited here, and can be set according to actual use requirements.

[0067] Reference Figure 4As shown, in some embodiments, the backlight module 10 of the display module further includes an optical film layer 600, and the optical film layer 600 is located on the light-emitting side of the light-emitting substrate 200. Exemplarily, the optical film layer 600 includes a uniform light film layer 610, a BLT film layer 620, a QD film layer 630, a uniform light film layer 640, a prism film layer 650, and a diffusion film layer 660, which are sequentially stacked on the light-emitting side of the light-emitting substrate 200. The uniform light film layer 610 and the uniform light film layer 640 can play a role in scattering light, the BLT (Blue Light Transmission) film layer 620 can reduce the scattering and reflection loss of red and green light, and play a role in brightening, the QD (Quantum Dot) film layer 630 can be excited by the light incident from the light-emitting substrate to emit light different from the light-emitting substrate, the prism film layer 650 mainly plays a role in focusing light, and the diffusion film layer 650 can be used to make the light emitted by the light-emitting substrate evenly distributed. There may be a plurality of light-evening film layers 640 , for example, four light-evening film layers 640 may be provided, and the four light-evening film layers 640 are stacked in sequence.

[0068] The display module of the disclosed embodiment includes the backlight module 10 of any embodiment of the first aspect, which can quickly dissipate the heat generated by the circuit board 300 during operation through the first heat dissipation layer 400, thereby avoiding long-term heat accumulation of the circuit board 300 causing local high temperature of the backlight module 10 and thus causing diaphragm wrinkles, avoiding excessive surface temperature of the display module, reducing product defects, and improving display quality.

[0069] Reference Figure 4 As shown, the back plate 100 includes a bottom wall and a side wall, and the bottom wall and the side wall enclose a receiving cavity, and the light-emitting substrate 200 is located in the receiving cavity. The light-emitting substrate 200 includes a first area and a second area located on the periphery of the first area. The size of the first area in a direction perpendicular to the light-emitting substrate 200 is larger than the size of the second area in a direction perpendicular to the light-emitting substrate 200. The light-emitting substrate 200 is fixed to the bottom wall of the back plate 100 through a thermal conductive adhesive layer 500. The optical film layer 600 is supported on the side of the first area away from the back plate 100, and the optical film layer 600 partially extends to the second area. The optical film layer 600 includes a uniform light film layer 610, a BLT film layer 620, a QD film layer 630, a uniform light film layer 640, a prism film layer 650 and a diffusion film layer 660, which are sequentially stacked on the light-emitting side of the light-emitting substrate 200. The first frame portion 71 of the frame 70 is located on the side of the second region away from the back plate 100, and the first frame portion 71 and the portion of the optical film layer 600 located in the second region are bonded to the second region by adhesive tape TP1. The second frame portion 72 is bonded to the bottom wall of the back plate 100 by frame fixing adhesive TP2. The side of the frame 70 away from the back plate is bonded and fixed to the first substrate 22 by thermal conductive adhesive TP3. The second polarizer 25 is located on the side of the optical film layer 600 away from the light-emitting substrate.

[0070] Figure 5 is a schematic diagram of a display module according to an embodiment of the present disclosure, Figure 6 FIG. 1 is a plan view of the packaging tape and the second heat dissipation layer of the display module of the embodiment of the present disclosure. Figure 5 and Figure 6 As shown, in some embodiments, the surface of the display panel 20 away from the backlight module 10 includes a peripheral area 20a, and the display panel 20 also includes a control module 21, and the control module 21 is located in the peripheral area 20a. The packaging tape 30 includes a first area 31 located on the display side of the display panel 20 and a second area 32 located on the back side of the backlight module 10, the orthographic projection of the peripheral area 20a on the display panel 20 is located within the orthographic projection of the first area 31 on the display panel 20, and a first insulating layer 40 is arranged between the control module 21 and the packaging tape 30. The orthographic projection of the circuit board 300 in the backlight module 10 on the back plate 100 in the backlight module 10 is located within the orthographic projection of the second area 32 on the back plate 100, and a second insulating layer 60 and a second heat dissipation layer 50 are arranged in sequence between the circuit board 300 and the packaging tape 30.

[0071] Exemplarily, the packaging tape 30 includes a metal substrate layer and an adhesive layer. For example, the material of the metal substrate layer can be copper foil. The metal substrate layer can transfer the temperature generated by the control module 21 to the backplane 100. The second insulating layer 60 and the second heat dissipation layer 50 are sequentially arranged between the circuit board 300 and the packaging tape 30. The second heat dissipation layer 50 covers the circuit board, so that the heat accumulated by the heating element with high heat generation on the circuit board 300 can be quickly uniformized and then transferred to the backplane 100. For example, the second heat dissipation layer 50 is graphene, and there is a second insulating layer 60 above the graphene. The second insulating layer 60 can prevent the components of the circuit board 300 from piercing the graphene material, resulting in the particles of the graphene material falling and contacting the components of the circuit board 300 to cause a short circuit. Moreover, the graphene material is located between the second insulating layer 60 and the packaging tape 30, so that the problem of graphene delamination can be effectively avoided.

[0072] In one embodiment, the display module of the embodiment of the present disclosure is a display module with a refresh rate exceeding 240 Hz, so that high refresh rate, high color gamut, and high brightness can be achieved, and the heat problem caused by the high power consumption of the display module can be solved, and the long-term operation of the display module can be maintained.

[0073] Exemplarily, the control module 21 is a source driver chip (Source IC), and the source driver chips are arranged separately. In the related art, the temperature of the source driver chip is increasingly concentrated, resulting in the problem of local overtemperature in the display module. The display module of the embodiment of the present disclosure, by sequentially arranging a second insulating layer 60 and a second heat dissipation layer 50 between the circuit board 300 and the packaging tape 30, can transfer heat through the packaging tape 30 and dissipate heat through the second heat dissipation layer 50, and can effectively evenly process the heat accumulated at the position of the control module 21 through the second heat dissipation layer 50.

[0074] In the display module of the disclosed embodiment, the packaging tape 30 includes a first area 31 located on the display side of the display panel 20 and a second area 32 located on the back side of the backlight module 10, and a first insulating layer 40 is arranged between the control module 21 and the packaging tape 30. The orthographic projection of the circuit board 300 in the backlight module 10 on the back plate 100 in the backlight module 10 is located within the orthographic projection of the second area 32 on the back plate 100, and a second insulating layer 60 and a second heat dissipation layer 50 are sequentially arranged between the circuit board 300 and the packaging tape 30. Therefore, the problem of heat accumulation caused by the heat generated by the light-emitting substrate of the display module, the heat generated by the circuit board, and the heat generated by the control module 21 can be solved by cooperating with the first heat dissipation layer, the second heat dissipation layer, the thermal conductive adhesive layer 500, and the packaging tape 30, and the heat source of the display module is dissipated to achieve a cooling effect, effectively avoiding the problem of excessive display panel temperature and film wrinkling generated by the display module in the overload mode.

[0075] Figure 7 is a schematic diagram of a display module according to an embodiment of the present disclosure, Figure 8 FIG. 1 is a plan view of the packaging tape and the second heat dissipation layer of the display module of the embodiment of the present disclosure. Figure 7 and Figure 8 As shown, in some embodiments, a peripheral area 20a is provided at the edge of the display panel 20, and the display panel 20a further includes a control module 21, and the control module 21 is located in the peripheral area 20a. The packaging tape 30 includes a first area 31 located on the display side of the display panel 20 and a second area 32 located on the back side of the backlight module 10, and the orthographic projection of the peripheral area 20a on the display panel 20 is located within the orthographic projection of the first area 31 on the display panel 10. A first insulating layer 40 is provided between the control module 21 and the packaging tape 30. A second insulating layer 60 and a second heat dissipation layer 50 are sequentially provided on the side of the circuit board 300 in the backlight module 10 away from the back plate 100, and the second area 32 is overlapped and connected with a part of the second heat dissipation layer 50.

[0076] In the display module of the disclosed embodiment, the material of the second heat dissipation layer 50 can be graphite, so that the second region 32 is overlapped and connected with a portion of the second heat dissipation layer 50, so that the second heat dissipation layer 50 can be exposed to the environment, that is, the graphene is exposed to the environment, further improving the heat dissipation effect of the second heat dissipation layer 50.

[0077] In some embodiments, the material of the second heat dissipation layer 50 includes graphene. For example, the second heat dissipation layer 50 can be formed into a thinner layer structure by spraying, screen printing, etc. At the same time, due to the good thermal conductivity of the graphene material, the heat generated by the circuit board during operation can be quickly conducted to the periphery and then diffused to the back plate 100, thereby improving the heat dissipation effect and avoiding product defects such as film wrinkles and poor light efficiency caused by heat concentration. In addition, the use of graphene material to form a thinner second heat dissipation layer 50 by spraying, screen printing, etc. is simple in process.

[0078] Figure 5 The display module shown can effectively evenly distribute the heat accumulated at the position of the control module 21 through the second heat dissipation layer 50 by sequentially arranging a second insulating layer 60 and a second heat dissipation layer 50 made of graphene between the circuit board 300 and the packaging tape 30. The second heat dissipation layer 50 is sandwiched between the second insulating layer 60 and the packaging tape 30, which can avoid graphene stratification when reworking the packaging tape 30. Figure 7 In the display module shown, the second region 32 is overlapped and connected with a portion of the second heat dissipation layer 50 made of graphene, and the second heat dissipation layer 50 can be exposed to the environment. Figure 5 The display module shown has better heat dissipation effect.

[0079] As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device, including the backlight module of any embodiment of the present disclosure, or including the display module of any embodiment of the present disclosure.

[0080] The display device provided in the embodiments of the present disclosure may be any product or component with display and touch functions, such as a smart phone, a wearable smart watch, smart glasses, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a car display, an e-book, a biometric device such as a smart skin device, a soft robot, and a biomedical device.

[0081] The backlight module, display module and other components of the display device in the above-mentioned embodiment may adopt various technical solutions known to ordinary technicians in the field now and in the future, and will not be described in detail here.

[0082] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0083] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0084] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0085] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0086] The disclosure above provides many different embodiments or examples to implement different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0087] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A backlight module, characterized in that: include: A back plate, the back plate comprising a first surface and a second surface arranged opposite to each other; a light-emitting substrate, wherein the light-emitting substrate is disposed on the first surface; A circuit board, wherein the circuit board is arranged on the second surface; A first heat dissipation layer is arranged on the second surface, an orthographic projection of the first heat dissipation layer on the back plate at least partially overlaps with an orthographic projection of the circuit board on the back plate, and the circuit board contacts the first heat dissipation layer.

2. The backlight module according to claim 1, characterized in that: The light-emitting substrate is fixed on the first surface through a thermally conductive adhesive layer.

3. The backlight module according to claim 1, characterized in that: The first heat dissipation layer is located between the circuit board and the back plate, and the first heat dissipation layer includes a first part and a second part. The orthographic projection of the first part on the back plate is located within the orthographic projection of the circuit board on the back plate, and the orthographic projection of the second part on the back plate has no overlap with the orthographic projection of the circuit board on the back plate.

4. The backlight module according to claim 3, characterized in that: The circuit board has at least one heating element, and the heating element is located on a side of the circuit board facing the first portion and in contact with the first portion.

5. The backlight module according to claim 3, characterized in that: The first part is provided with a hollow, and the circuit board is connected to the back plate via an adhesive layer located in the hollow.

6. The backlight module according to any one of claims 1 to 5, characterized in that: The material of the first heat dissipation layer includes graphene.

7. A display module, characterized in that: A backlight module, wherein the backlight module is the backlight module according to any one of claims 1 to 6; A display panel, located on the light-emitting side of the light-emitting substrate of the backlight module; Packaging tape, the edge of the display panel and the edge of the back side of the backlight module are wrapped by the packaging tape.

8. The display module according to claim 7, characterized in that: The edge of the display panel is provided with a peripheral area, the display panel further includes a control module, the control module is located in the peripheral area, the packaging tape includes a first area located on the display side of the display panel and a second area located on the back side of the backlight module, the orthographic projection of the peripheral area on the display panel is located within the orthographic projection of the first area on the display panel, and a first insulating layer is provided between the control module and the packaging tape; The orthographic projection of the circuit board in the backlight module on the backplane in the backlight module is located within the orthographic projection of the second area on the backplane, and a second insulating layer and a second heat dissipation layer are sequentially arranged between the circuit board and the packaging tape.

9. The display module according to claim 7, characterized in that: The edge of the display panel is provided with a peripheral area, the display panel further includes a control module, the control module is located in the peripheral area, the packaging tape includes a first area located on the display side of the display panel and a second area located on the back side of the backlight module, the orthographic projection of the peripheral area on the display panel is located within the orthographic projection of the first area on the display panel, and a first insulating layer is provided between the control module and the packaging tape; A second insulating layer and a second heat dissipation layer are sequentially arranged on a side of the circuit board in the backlight module away from the back plate, and the second area is overlapped and connected with a part of the second heat dissipation layer.

10. The display module according to claim 8 or 9, characterized in that: The material of the second heat dissipation layer includes graphene.

11. A display device, characterized in that: It comprises the backlight module as claimed in any one of claims 1 to 6, or comprises the display module as claimed in any one of claims 7 to 10.

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