Notebook computer radiator with multi-air-duct structure

Abstract

The utility model discloses a notebook radiator with a multi-air-duct structure, which comprises a CPU (central processing unit) packaging part and a radiator, and the radiator comprises a metal heat conduction part, a reinforced metal sleeve, a radiating fin module and a fan module. The metal heat conduction pieces are provided with strip-shaped cavities in the length direction of the metal heat conduction pieces, the strip-shaped cavities are filled with liquid media, and the first ends of the metal heat conduction pieces are connected with the CPU packaging part; the reinforcing metal sleeve is sleeved on the bent section of each metal heat conduction piece and is fixed, an air duct penetrating through two ends is reserved after the reinforcing metal sleeve is fixed, and the air inlet end of the air duct points to the CPU packaging part; the heat dissipation fin module is fixed to the second end of the metal heat conduction piece and provided with a heat dissipation channel, and the first end of the heat dissipation channel extends to the air outlet end of the air duct. The fan module is fixed to the second end of the heat dissipation channel. According to the notebook cooler, the heat conduction technology and the air cooling technology are combined, the heat dissipation capacity is enhanced, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to a notebook computer, in particular to a notebook computer radiator with a multi-air duct structure. Background Art

[0002] The laptop motherboard is one of the important parts of the computer. The laptop motherboard is generally a rectangular circuit board on which the main circuit systems and chips that make up the computer are installed. The chips on the motherboard include the CPU (central processing unit), GPU (graphics processing unit), north bridge chip, south bridge chip, etc. These chips consume energy during operation and generate heat due to the working principle of the internal circuit. In particular, the CPU and GPU are the main heat sources in the computer. They are the core components responsible for processing computing tasks and graphics rendering. They require high-frequency operations and data processing, so they will generate higher energy consumption and heat.

[0003] To ensure the stability and high performance of the laptop during use and to avoid CPU overheating, system crashes, performance degradation, or even hardware damage, a corresponding heat dissipation structure will be set up to ensure that the CPU temperature on the motherboard is within a reasonable range.

[0004] In related technologies, a heat sink or heat pipe is usually placed on the CPU, and the heat is transferred to the cooling fins through the heat sink or heat pipe to increase the heat dissipation area. The heat can be dissipated into the surrounding air more quickly, and finally the hot air is discharged through the guidance of the cooling fan to achieve the heat dissipation effect.

[0005] However, the existing notebook radiator only uses a copper bar + radiator combination, and then uses a cooling fan set in the notebook to achieve the purpose of heat dissipation. Although there is a cooling effect, as the CPU processor continues to be enhanced, the heat generated is also increasing. The traditional heat dissipation structure can no longer meet the heat dissipation needs of today's notebook computers.

[0006] In view of this, the existing notebook radiator needs to be improved. Utility Model Content

[0007] In view of the deficiencies in the prior art, the technical problem to be solved by the utility model is to provide a notebook radiator with a multi-air duct structure. The purpose of designing the notebook radiator is to increase the heat dissipation efficiency of the notebook radiator.

[0008] In order to solve the above technical problems, the utility model is implemented by the following scheme: A notebook radiator with a multi-channel structure of the utility model includes a CPU packaging part and a radiator arranged on the CPU packaging part, and the radiator includes:

[0009] A curved metal heat-conducting piece, wherein the metal heat-conducting piece is provided with a plurality of strips, and a strip-shaped cavity is provided inside the metal heat-conducting piece along the length direction of each metal heat-conducting piece, wherein the strip-shaped cavity is filled with a liquid medium, and a first end of the metal heat-conducting piece is connected to the CPU packaging part;

[0010] A reinforced metal sleeve, which is sleeved on the curved section of each of the metal heat-conducting parts and fixed thereto, and after the reinforced metal sleeve is fixed, an air duct running through both ends is reserved, and the air inlet end of the air duct points to the CPU packaging part;

[0011] A heat dissipation fin module, which is fixed to the second end of the metal heat conductive member and has a heat dissipation channel, wherein the first end of the heat dissipation channel extends to the air outlet end of the air duct;

[0012] A fan module is fixed to the second end of the heat dissipation channel, an air inlet duct of the fan module extends to the air outlet end of the air duct and a plurality of side air inlets are opened on the pipe wall of the air inlet duct.

[0013] Furthermore, the metal heat conducting members are provided with two pieces, both of which are flat structures, and the bending sections thereof are formed by two same-lateral bendings.

[0014] Furthermore, the metal heat conductor is a copper heat conductor.

[0015] Furthermore, the liquid medium is pure water.

[0016] Furthermore, the reinforcing metal sleeve is a copper metal sleeve.

[0017] Furthermore, the heat dissipation fin module is a copper fin module.

[0018] Furthermore, the heat dissipation fin module is composed of a plurality of fin-shaped heat dissipation fins arranged at equal intervals and fixed to the metal heat conductive member.

[0019] Furthermore, a nano-carbon layer is sprayed on an outward side of the CPU packaging part.

[0020] Furthermore, the CPU packaging part has a stainless steel plate with three mounting strips extending out of the edge of the stainless steel plate.

[0021] Compared with the prior art, the beneficial effects of the utility model are:

[0022] 1. The notebook radiator of the utility model utilizes a combination of heat conduction technology and air cooling technology to enhance heat dissipation capacity and improve heat dissipation efficiency.

[0023] 2. The notebook radiator of the utility model is provided with multiple air ducts to improve the heat dissipation efficiency of the radiator and meet the heat dissipation requirements of the current CPU. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 The utility model is a schematic diagram of the structure of the notebook radiator.

[0025] Figure 2 The figure is a side structural diagram of the notebook radiator of the utility model.

[0026] Figure 3 This is a structural diagram of the heat dissipation channel of the heat dissipation fin module of the utility model.

[0027] Figure 4 This is a schematic diagram of the fan module structure of the utility model.

[0028] Figure 5 It is a structural schematic diagram of the reinforced metal sleeve of the utility model.

[0029] Markings in the attached drawings: heat sink fin module 1, reinforced metal sleeve 2, metal heat conductor 3, CPU packaging part 4, thermal paste 5, CPU 6, heat dissipation channel 7, fan module 8, air duct 21, air inlet pipe 81, side air inlet 82. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model, so that the advantages and features of the utility model can be more easily understood by those skilled in the art, thereby making a clearer and more explicit definition of the protection scope of the utility model. Obviously, the embodiments described in the utility model are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0031] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0032] Embodiment 1, the specific structure of the utility model is as follows:

[0033] Please refer to the attached Figure 1-5 The utility model is a notebook radiator with a multi-channel structure, comprising a CPU packaging part 4 and a radiator arranged on the CPU packaging part 4, wherein the CPU packaging part 4 is used to fix one end of the radiator on a circuit board and to package the CPU 6. A nano-carbon layer is sprayed on the outward side of the CPU packaging part 4, and the function of the nano-carbon layer is to prevent oxidation.

[0034] The heat sink comprises a curved metal heat conductor 3 , a reinforced metal sleeve 2 , a heat dissipation fin module 1 and a fan module 8 .

[0035] The metal heat conductor 3 is provided with a plurality of strips, and preferably, two strips are provided with the metal heat conductor 3. Both metal heat conductors 3 are flat structures, and their curved sections are formed by two lateral bends. Since copper has a strong thermal conductivity, the metal heat conductor 3 is a copper heat conductor.

[0036] Along the length direction of each metal heat conductor 3, a strip cavity is arranged inside the metal heat conductor 3, and the strip cavity is also a curved structure. The strip cavity is filled with a liquid medium, and the liquid medium is pure water. Pure water has a weak conductivity, and even if the metal heat conductor 3 is broken, the pure water will not short-circuit the circuit board. The pure water is not full, that is, a space is reserved in the strip cavity for the pure water to vaporize.

[0037] The first end of the metal heat conductor 3 is connected to the CPU packaging part 4; the first end of the metal heat conductor 3 is coated with thermal conductive paste 5 and then attached to the CPU 6. The CPU packaging part 4 has a stainless steel plate with three mounting strips extending from the edge of the stainless steel plate. The CPU packaging part 4 is fixed to the circuit board by three mounting strips and screws to encapsulate the CPU 6.

[0038] The reinforcing metal sleeve 2 is sleeved on the curved section of each of the metal heat conducting parts 3 and fixed, and after the reinforcing metal sleeve 2 is fixed, an air duct 21 passing through both ends is reserved, and the air inlet end of the air duct 21 points to the CPU packaging part 4. Since copper has a strong thermal conductivity, the reinforcing metal sleeve 2 is a copper metal sleeve. Figure 5 In the embodiment, the reinforced metal sleeve 2 is an integrated structure, which is sleeved on the curved sections of the two metal heat conducting members 3 and fixed by welding. The air inlet end of the reinforced metal sleeve 2 is a V-shaped opening structure. The V-shaped opening structure has a V-shaped angle of 90 degrees, which is just suitable for a corner of the CPU packaging part 4.

[0039] The heat dissipation fin module 1 is fixed to the second end of the metal heat conductive member 3, and has a heat dissipation channel 7, the first end of which extends to the outlet end of the air duct 21. The heat dissipation fin module 1 is a copper fin module. The heat dissipation fin module 1 is composed of a plurality of fin-shaped heat dissipation fins arranged equidistantly and fixed to the metal heat conductive member 3. The heat dissipation fin module 1 is to increase the heat dissipation area and improve the heat dissipation efficiency. Figure 1 It can be seen from the figure that the second end of the metal heat conductor 3 is a straight section, and the heat dissipation fin module 1 is also linearly distributed.

[0040] The fan module 8 is fixed to the second end of the heat dissipation channel 7, and its air inlet duct 81 extends to the air outlet end of the air duct 21 and a plurality of side air inlets 82 are opened on the wall of the air inlet duct 81. The fan of the fan module 8 adopts a turbine fan structure, and its air inlet communicates with the air inlet duct 81.

[0041] When the CPU 6 is working, a large amount of heat will be generated, a small part of which will be absorbed by the circuit board, and most of the heat will be absorbed by the first end of the metal heat conductor 3. The metal heat conductor 3 will conduct the heat to the curved section and pure water. According to the principle of heat conduction from heat to cold, the pure water will conduct the heat to the second end of the metal heat conductor 3, and the curved section will conduct the heat to the second end of the metal heat conductor 3. The second end of the metal heat conductor 3 is provided with a heat dissipation fin module 1 and a fan module 8. The fan on the fan module 8 works to exhaust air outwards. The heat of the heat dissipation fin module 1 enters the air inlet duct 81 from the side air inlet 82 with the air, and then is discharged outwards, taking out the heat. Since the air inlet duct 81 extends to the reinforced metal sleeve 2, and the reinforced metal sleeve 2 is provided with an air duct 21, the air inlet end of the air duct 21 points to the CPU packaging part 4, so multiple air ducts increase the heat dissipation efficiency.

[0042] In summary, the notebook radiator of the utility model uses a combination of heat conduction technology and air cooling technology to enhance the heat dissipation capacity and improve the heat dissipation efficiency. The notebook radiator of the utility model is provided with multiple air ducts to improve the heat dissipation efficiency of the radiator and meet the current CPU heat dissipation requirements.

[0043] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A notebook radiator with a multi-air duct structure, comprising a CPU packaging part (4) and a radiator arranged on the CPU packaging part (4), characterized in that: The radiator comprises: A curved metal heat conducting member (3), the metal heat conducting member (3) being provided with a plurality of strips, a strip-shaped cavity being provided inside the metal heat conducting member (3) along the length direction of each metal heat conducting member (3), the strip-shaped cavity being filled with a liquid medium, and a first end of the metal heat conducting member (3) being connected to the CPU packaging portion (4); A reinforced metal sleeve (2), the reinforced metal sleeve (2) being sleeved on and fixed to the curved section of each of the metal heat conducting members (3), and after the reinforced metal sleeve (2) is fixed, an air duct (21) passing through both ends is reserved, and the air inlet end of the air duct (21) is directed toward the CPU packaging portion (4); A heat dissipation fin module (1), the heat dissipation fin module (1) being fixed to the second end of the metal heat conducting member (3), and having a heat dissipation channel (7), wherein the first end of the heat dissipation channel (7) extends to the air outlet end of the air duct (21); A fan module (8) is fixed to the second end of the heat dissipation channel (7), wherein the air inlet duct (81) extends to the air outlet end of the air duct (21) and a plurality of side air inlets (82) are provided on the pipe wall of the air inlet duct (81).

2. The notebook radiator with a multi-duct structure according to claim 1, characterized in that: The metal heat conducting members (3) are provided with two pieces, both of which are flat structures, and the bent sections thereof are formed by two same-lateral bends.

3. The notebook radiator with a multi-duct structure according to claim 1, characterized in that: The metal heat conducting member (3) is a copper heat conducting member.

4. The notebook radiator with a multi-duct structure according to claim 1, characterized in that: The liquid medium is pure water.

5. The notebook radiator with a multi-duct structure according to claim 1, characterized in that: The reinforced metal sleeve (2) is a copper metal sleeve.

6. The notebook radiator with a multi-duct structure according to claim 1, characterized in that: The heat dissipation fin module (1) is a copper fin module.

7. The notebook radiator with a multi-duct structure according to claim 1, characterized in that: The heat dissipation fin module (1) is composed of a plurality of flaky heat dissipation fins arranged at equal intervals and fixed to the metal heat conducting member (3).

8. The notebook radiator with a multi-channel structure according to claim 1, characterized in that: The outward side of the CPU packaging part (4) is sprayed with a nano carbon layer.

9. The notebook radiator with a multi-duct structure according to claim 1, characterized in that: The CPU packaging part (4) has a stainless steel plate with three mounting strips extending out of the edge of the stainless steel plate.

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