Bicrystal conductor lead frame

Abstract

The utility model relates to the technical field of lead frames, and discloses a bicrystal conductor lead frame, which comprises a base and bonding pads, and the pad bodies of the bonding pads are arranged in the same way and are symmetrically arranged at the upper end of the base. A chip is placed at the upper ends of the bonding pads, the chip is arranged in the middle of the base, first convex welding spots are arranged at two ends of one side, close to the chip, of one bonding pad, and a second convex welding spot is arranged at one end of one side, close to the chip, of the other bonding pad; according to the novel lead frame applied to the bicrystal type conductor, through the arrangement of the first convex welding spots and the second convex welding spots, the connection stability of welding is improved, heat dissipation materials can be increased, the heat dissipation efficiency can be improved, the service life of an LED is prolonged, and the durability of the lighting effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frames, in particular to a double crystal conductor lead frame. Background Art

[0002] Lead frame is the basic material for semiconductor IC and device molded packaging. It mainly consists of two parts: chip pad and pin. The chip pad provides mechanical support for the chip during the packaging process, while the pin is the electrical and thermal path connecting the chip to the outside of the package.

[0003] However, the solder joints of traditional solder pads are located on the surface, which may cause the solder joints to fall off during the use of the LED. The reason is that the contact area of ​​the soldering is too small, and a stable and firm connection cannot be made, which in turn causes an unstable connection and a short service life. In addition, the traditional heat dissipation effect is poor, which affects the service life of the LED.

[0004] In order to solve the above problems, the present application proposes a dual crystal conductor lead frame. Utility Model Content

[0005] In view of the deficiencies of the prior art, the utility model provides a dual crystal conductor lead frame to at least solve one of the problems raised by the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a dual-crystal conductor lead frame, comprising a base and a solder pad, wherein the pad bodies of the solder pads are arranged identically and symmetrically at the upper end of the base; a chip is placed at the upper end of the solder pad, and the chip is arranged in the middle of the base, wherein one of the solder pads is provided with first convex solder joints at both ends of a side close to the chip, and wherein the other solder pad is provided with a second convex solder joint at one end of a side close to the chip.

[0007] A further technical improvement of the utility model is that an insulating cup body is arranged at the upper end edge of the base, a reflecting surface is provided at the inner end edge of the insulating cup body, and the reflecting surface is arranged at an incline.

[0008] A further technical improvement of the utility model is that protruding sharp-angled arc surfaces are arranged at the four corners of the pad, and the protruding sharp-angled arc surfaces are arranged tangent to the inner edge of the base.

[0009] A further technical improvement of the utility model is that grooves are provided on both sides of the long sides of the pad, the grooves are arranged in a trapezoidal shape, and the trapezoidal long sides of the grooves are arranged on the outside, and the grooves are symmetrically provided.

[0010] A further technical improvement of the utility model is that the reflecting surfaces are symmetrically and evenly distributed on both sides of the middle of the base, and the welding pads are also symmetrically distributed in the middle of the base.

[0011] A further technical improvement of the utility model is that the four corners of the base are all rounded.

[0012] A further technical improvement of the present invention is that the space between the two pads is centrally arranged and is arranged in an "S" shape.

[0013] Compared with the above-mentioned background technology, the dual-crystal conductor lead frame provided by the present application includes a lead frame with very mature technology today, and a first convex solder joint, a second convex solder joint, a protruding sharp arc surface, a groove, and an insulating cup body as core components. Its principle relies on achieving a stable connection relationship by increasing the contact area, while being able to increase heat dissipation efficiency and extend service life.

[0014] The embodiment of the utility model provides a dual crystal conductor lead frame, which has the following beneficial effects:

[0015] This new type is applied to the dual-crystal conductor lead frame. By setting the first convex solder joint and the second convex solder joint, the connection stability of the welding is improved, and the heat dissipation material can be increased to improve the heat dissipation efficiency, thereby extending the service life of the LED and the durability of the light effect.

[0016] This new type of application in dual-crystal conductor lead frames improves light transmission by providing an insulating cup and a reflective surface, and reduces thermal resistance by reducing the reflective surface, thereby maintaining stability in use, reducing material costs and lightening product weight.

[0017] This new type is applied to the dual-crystal conductor lead frame. By setting a protruding sharp-angle arc surface and a groove, the sharp angle design of the protruding sharp-angle arc surface can increase the mechanical contact area and improve stability. The groove can improve the heat dissipation efficiency, reduce the operating temperature, extend the service life, and improve the packaging sealing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention.

[0019] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a plan view schematic diagram of the chip, the first convex solder joint and the second convex solder joint of the utility model;

[0021] Figure 3 It is a plan view of the base, the protruding sharp-angle arc surface and the groove of the utility model.

[0022] In the figure: 1, base; 2, pad; 3, chip; 4, reflection surface; 5, first convex solder joint; 6, second convex solder joint; 7, protruding sharp arc surface; 8, groove; 9, insulating cup body. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-3 The utility model provides a technical solution: a dual crystal conductor lead frame, comprising a base 1 and a pad 2, the pad bodies of the pads 2 are arranged in the same manner and symmetrically arranged at the upper end of the base 1; a chip 3 is placed at the upper end of the pad 2, the chip 3 is arranged in the middle of the base 1, one of the pads 2 is arranged with first convex solder joints 5 at both ends of a side close to the chip 3, and another pad 2 is arranged with a second convex solder joint 6 at one end of a side close to the chip 3; pads 2 are arranged on the base 1, the pads 2 are symmetrically distributed on both sides, a chip 3 is placed on the pads 2, the chip 3 is placed in the center of the base 1, one of the pads 2 is arranged with first convex solder joints 5 at both ends of the outer side of the position close to the chip 3, and another pad 2 is arranged with a second convex solder joint 6 at one end of the side close to the chip 3; pads 2 are arranged on the base 1, the pads 2 are symmetrically distributed on both sides, a chip 3 is placed on the pads 2, and the chip 3 is placed in the center of the base 1, one of the pads 2 is arranged with first convex solder joints 5 at both ends of the outer side of the position close to the chip 3, and another A second convex solder joint 6 is provided at one end of the outer side of the soldering pad 2 near the chip 3; the first convex solder joint 5 and the second convex solder joint 6 can increase the surface area of ​​the soldering, thereby improving the mechanical strength of the soldering and the reliability of the electrical connection, especially for applications that need to withstand higher mechanical stress or thermal cycles, effectively reducing the risk of soldering falling off or breaking. At the same time, the reserved space between the first convex solder joint 5 and the second convex solder joint 6 and the soldering pad 2 can be used to connect a heat sink or a thermally conductive material, which helps to conduct heat away from the LED chip 3 more effectively, which is especially important for high-power LEDs, thereby increasing the good heat dissipation effect, extending the service life of the LED and maintaining its lighting effect for a longer time.

[0025] like Figure 2As shown, an insulating cup body 9 is provided at the upper edge of the base 1, and a reflecting surface 4 is provided at the inner edge of the insulating cup body 9, and the reflecting surface 4 is inclined. The insulating cup body 9 is fixed on the base 1, and an inclined reflecting surface 4 is provided at the inner end of the insulating cup body 9, thereby reducing the thickness of the insulating cup body 9 through the reflecting surface 4, and the reduced thickness can reduce the absorption and scattering of light before it is transmitted out of the package, so that more light can be effectively scattered from the LED chip 3, and the reflecting surface 4 is set as an inclined surface to optimize the reflection path of the light, guide the light to be output in the desired direction more efficiently, reduce the loss caused by total internal reflection, and thus improve the overall Light extraction efficiency and brightness of the light source; at the same time, reducing the thickness of the insulating cup body 9 can reduce thermal resistance and improve the heat conduction efficiency from the LED chip 3 to the external heat dissipation structure; this is especially important for high-power LEDs, and good heat dissipation can effectively extend the service life of the LED and maintain its stable performance; and reducing the amount of plastic in some areas can reduce the weight of the product to a certain extent, and may also reduce material costs; in some LED packaging applications with limited space or special design requirements, such a design can better adapt to complex environments, such as in the design of compact lamps, while ensuring the effective use of light, it also provides solutions for thermal management.

[0026] like Figure 3 As shown, the four corners of the pad 2 are provided with protruding sharp-angled arc surfaces 7, which are tangent to the inner edge of the base 1; the sharp-angled design of the protruding sharp-angled arc surfaces 7 can increase the contact area between the pad 2 and the plastic, especially on the side, which can improve the mechanical bite force between the two, prevent displacement or desoldering when subjected to thermal stress or mechanical stress, and increase the reliability of the package.

[0027] like Figure 3 As shown, grooves 8 are provided on both sides of the long sides of the pad 2, the grooves 8 are arranged in a trapezoidal shape, and the long sides of the trapezoidal shape of the grooves 8 are arranged on the outside, and the grooves 8 are symmetrically arranged; the design of the grooves 8 can form an additional heat flow channel, which helps to transfer heat from the pad 2 to the surrounding plastic matrix faster, thereby improving the heat conduction efficiency, helping to dissipate heat of the LED chip 3, reducing the operating temperature, and extending the service life; the design of the grooves 8 can also promote the flow and filling of the adhesive or sealant during the potting process, ensuring that no bubbles remain, and improving the sealing and protection level of the package, which is particularly important for applications outdoors or in harsh environments.

[0028] like Figure 2 As shown, the reflective surface 4 is symmetrically and evenly distributed on both sides of the middle of the base 1, and the pad 2 is also symmetrically distributed in the middle of the base 1; the centrally set reflective surface 4 can effectively improve the light output, reduce the light board, shadow or uneven brightness caused by improper position of the lead frame, and improve the overall lighting effect and light extraction efficiency.

[0029] like Figure 1 As shown, the four corners of the base 1 are all rounded, which can prevent the corners of the base 1 from being damaged during operation and installation.

[0030] like Figure 2 As shown, the space between the two pads 2 is centered and arranged in an "S" shape; the centered design ensures that the S-shaped lead frame is symmetrically arranged inside the package, which helps to distribute stress more evenly and reduce local stress concentration under various installation conditions, such as thermal expansion and mechanical vibration, and further protect the LED chip 3 and the packaging material from damage; especially in LED applications that require high-density installation (such as display screens, lighting panels, etc.), this not only saves space, but also helps to improve the integration and aesthetics of the overall system.

[0031] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A dual crystal conductor lead frame, comprising a base (1) and a pad (2), characterized in that: The pad bodies of the welding pads (2) are arranged identically and symmetrically on the upper end of the base (1); A chip (3) is placed on the upper end of the solder pad (2), and the chip (3) is arranged in the middle of the base (1), and first convex solder joints (5) are arranged at both ends of one side of the solder pad (2) close to the chip (3), and a second convex solder joint (6) is arranged at one end of the other side of the solder pad (2) close to the chip (3).

2. A dual crystal conductor lead frame according to claim 1, characterized in that: An insulating cup body (9) is arranged at the upper end edge of the base (1), and a reflecting surface (4) is provided at the inner end edge of the insulating cup body (9), and the reflecting surface (4) is arranged at an inclination.

3. A dual crystal conductor lead frame according to claim 1, characterized in that: The four corners of the pad (2) are provided with protruding sharp-angled arc surfaces (7), and the protruding sharp-angled arc surfaces (7) are tangent to the inner edge of the base (1).

4. The dual crystal conductor lead frame according to claim 1, characterized in that: Grooves (8) are provided on both sides of the long sides of the pad (2); the grooves (8) are arranged in a trapezoidal shape, and the trapezoidal long sides of the grooves (8) are arranged on the outside; the grooves (8) are symmetrically arranged.

5. The dual crystal conductor lead frame according to claim 2, characterized in that: The reflection surfaces (4) are located in the middle of the base (1) and are evenly distributed on both sides, and the soldering pads (2) are also located in the middle of the base (1) and are evenly distributed.

6. The dual crystal conductor lead frame according to claim 1, characterized in that: The four corners of the base (1) are all rounded.

7. The dual crystal conductor lead frame according to claim 1, characterized in that: The space between the two pads (2) is centrally arranged and is arranged in an "S" shape.

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