High-speed laser test board

Abstract

The utility model provides a high-speed laser test board, which comprises a bottom board, a test unit and a power-up unit. The test unit comprises a plurality of test modules, and the test modules are arranged on the bottom plate at intervals and used for testing different functions of the high-speed laser; the power-up unit is arranged on the bottom plate, the power-up unit and the testing unit are arranged at intervals, and the power-up unit is combined with the testing modules and used for testing different functions in different power-up environments. According to the high-rate laser test board provided by the utility model, the plurality of test modules are arranged on the same bottom plate, the bottom plate is also provided with the power-up unit, and the power-up unit can be combined with each test module, so that tests of different functions in different power-up environments can be realized, tests of multiple functions can be realized on one test board, and the test efficiency is improved. The applicability is enhanced, the development and production of the high-speed laser are ensured, the production cost is reduced, and the practicability is good.

Description

Technical Field

[0001] The utility model belongs to the technical field of test boards, and in particular relates to a high-speed laser test board. Background Art

[0002] In 2022, the shipments of 10G PON ports (PON is a typical passive optical network) accounted for 73% of the total shipments of OLT PON ports (OLT refers to the terminal equipment used to connect optical fiber trunks) in the world; in September 2022, ITU-T revised the 50GPON standard, adding symmetrical 50G PON technical specifications, as well as the requirements and specifications for the coexistence of GPON, 10G PON and 50G PON, and 50G PON products will be commercially available around 2024. From this, we can see that high-speed laser technology is developing rapidly, and the demand for high-speed lasers in the international optical communication market is also increasing. High-speed lasers need to be tested before they are put into use to ensure their normal use.

[0003] In the prior art, there are many different types of high-speed laser products, and each product has different power-on methods and temperature control requirements. Therefore, a customized test board is required for each product. The customization cycle of the test board is long and the production cost is high, which affects the development and production of high-speed lasers and has poor practicality. Utility Model Content

[0004] The utility model provides a high-rate laser test board, aiming to solve the problems in the prior art that one test board can only test one high-rate laser, the production cost is high, and the development and production efficiency of the high-rate laser is low.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is: to provide a high-speed laser test board, including:

[0006] Base plate;

[0007] A test unit, comprising a plurality of test modules, each of which is arranged on the bottom plate at intervals and is used to test different functions of the high-speed laser;

[0008] The power-on unit is arranged on the bottom plate and spaced apart from the test unit. The power-on unit is combined with each of the test modules to implement tests of different functions under different power-on environments.

[0009] In a possible implementation, each of the test modules includes:

[0010] A mounting plate, arranged on the bottom plate, wherein a plurality of test holes are provided on the mounting plate for mounting a high-speed laser;

[0011] A plug board is connected to the mounting plate, and a plurality of plug holes are arranged on the plug board, and each of the plug holes is electrically connected to each of the test holes.

[0012] In a possible implementation, each of the test holes is an oblong hole, and auxiliary support plates are provided on both sides of each of the test holes.

[0013] In a possible implementation, the power-on unit includes a TEC power-on module, an EA power-on module, an LD chip power-on module, an MPD power-on module, and a resistor power-on module.

[0014] In a possible implementation, the TEC power-on module, the EA power-on module, the LD chip power-on module, the MPD power-on module, and the resistance power-on module are selectively connectable to each of the test modules.

[0015] In a possible implementation manner, a plug strip is provided on the bottom plate.

[0016] In a possible implementation manner, a handle is provided on the bottom plate.

[0017] The beneficial effect of the high-speed laser test board provided by the utility model is that: compared with the prior art, the test unit includes a plurality of test modules, and each test module is arranged on the bottom plate at intervals, so that different functions of the high-speed laser can be tested. The power-on unit is arranged on the bottom plate, and is arranged at intervals from the test unit. The power-on unit is combined with each test module to realize the test of different functions under different power-on environments. In the present application, multiple test modules are arranged on the same bottom plate, and a power-on unit is also arranged on the bottom plate. The power-on unit can be combined with each test module to realize the test of different functions under different power-on environments. Multiple functions can be tested on one test board, which enhances applicability, ensures the development and production of high-speed lasers, reduces production costs, and has good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a high-speed laser test board provided in an embodiment of the utility model Figure 1 ;

[0019] Figure 2 A schematic diagram of the structure of a high-speed laser test board provided in an embodiment of the utility model Figure 2 ;

[0020] Figure 3 A schematic diagram of the structure of a high-speed laser test board provided in an embodiment of the utility model Figure 3 .

[0021] Description of reference numerals:

[0022] 10. Base plate; 11. Plug strip; 12. Handle; 20. Test unit; 21. Mounting plate; 22. Plug board; 23. Test hole; 24. Auxiliary support plate; 30. Power-on unit; 31. TEC power-on module; 32. EA power-on module; 33. LD chip power-on module; 34. MPD power-on module; 35. Resistor power-on module. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0024] It should be noted that the directions or positional relationships indicated by terms such as “length”, “width”, “height”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “head” and “tail” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present invention.

[0025] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installation", "connection", "fixation", "setting" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In addition, the meaning of "multiple" and "several" is two or more, unless otherwise clearly and specifically defined.

[0027] Please also read Figures 1 to 3Now, the high-speed laser test board provided by the utility model is described. The high-speed laser test board includes a base plate 10, a test unit 20 and a power-on unit 30. The test unit 20 includes a plurality of test modules, each of which is arranged on the base plate 10 at intervals, and is used to test different functions of the high-speed laser. The power-on unit 30 is arranged on the base plate 10, and is arranged at intervals from the test unit 20. The power-on unit 30 is combined with each test module to realize the testing of different functions under different power-on environments.

[0028] The high-speed laser test board provided by the embodiment of the utility model, compared with the prior art, the test unit 20 includes a plurality of test modules, and each test module is arranged at intervals on the base plate 10, so that different functions of the high-speed laser can be tested. The power-on unit 30 is arranged on the base plate 10, and is arranged at intervals from the test unit 20. The power-on unit 30 is combined with each test module to realize the test of different functions under different power-on environments. In the present application, multiple test modules are arranged on the same base plate 10, and the base plate 10 is also provided with a power-on unit 30. The power-on unit 30 can be combined with each test module to realize the test of different functions under different power-on environments. Multiple functions can be tested on one test board, which enhances applicability, ensures the development and production of high-speed lasers, reduces production costs, and has good practicality.

[0029] Preferably, different high-speed devices have different numbers and arrangements of pins (PINs), and three test modules can be provided. The three test modules are respectively suitable for 5PIN, 7PIN and 8PIN test requirements, which basically meet the existing high-speed test requirements.

[0030] In some embodiments, see Figures 1 to 3 , each test module includes a mounting plate 21 and a plug-in board 22. The mounting plate 21 is arranged on the base plate 10, and a plurality of test holes 23 are provided on the mounting plate 21 for installation of a high-rate laser. The plug-in board 22 is connected to the mounting plate 21, and a plurality of plug-in holes are provided on the plug-in board 22, and each plug-in hole is electrically connected to each test hole 23. In this embodiment, a plurality of test holes 23 are provided on the mounting plate 21, and each test hole 23 is used for installation of a high-rate laser, so that a plurality of high-rate lasers can be tested simultaneously. The plug-in board 22 is connected to the mounting plate 21, and a plurality of plug-in holes are provided on the plug-in board 22, and each plug-in hole is electrically connected to each test hole 23, so that the power-on unit 30 is plugged into the plug-in board 22 to test each high-rate laser, and the operation is convenient.

[0031] In some embodiments, see Figures 1 to 3 Each test hole 23 is an oblong hole, and auxiliary support plates 24 are provided on both sides of each test hole 23. In this embodiment, auxiliary support plates 24 are provided on both sides of the test hole 23, thereby ensuring the installation effect of the high-speed laser.

[0032] In some embodiments, see Figures 1 to 3 The power-on unit 30 includes a TEC power-on module 31, an EA power-on module 32, an LD chip power-on module 33, an MPD power-on module 34, and a resistor power-on module 35. Specifically, the TEC power-on module 31 is a semiconductor refrigerator power-on module; the EA power-on module 32 is an electric absorption regulator power-on module; the LD power-on module is a laser diode power-on module; and the MPD power-on module 34 is a monitoring optical power detector power-on module. In this embodiment, by setting different power-on modules such as an EC power-on module, an EA power-on module 32, an LD chip power-on module 33, an MPD power-on module 34, and a resistor power-on module 35, each power-on module can be connected to each test module combination to realize the testing of different functions under different power-on environments.

[0033] In some embodiments, see Figures 1 to 3 TEC power-on module 31, EA power-on module 32, LD chip power-on module 33, MPD power-on module 34 and resistor power-on module 35 can be selectively connected to each test module. In this embodiment, when different power-on modules are connected to different test modules, different functions can be tested under different power-on environments, which has good applicability.

[0034] In some embodiments, see Figures 1 to 3 A plug-in bar 11 is provided on the bottom plate 10, and each power-on module is powered by the plug-in bar 11.

[0035] In some embodiments, see Figures 1 to 3 A handle 12 is provided on the bottom plate 10, which is convenient for grasping when taking or putting the bottom plate 10, and prevents the bottom plate 10 from being overcooled or overheated when taking and causing damage to the hands. At the same time, it can also prevent slipping, increase the convenience of operation, and have good practicality.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. High-speed laser test board, characterized in that: include: Base plate; A test unit, comprising a plurality of test modules, each of which is arranged on the bottom plate at intervals and is used to test different functions of the high-speed laser; The power-on unit is arranged on the bottom plate and spaced apart from the test unit. The power-on unit is combined with each of the test modules to implement tests of different functions under different power-on environments.

2. The high-speed laser test board according to claim 1, characterized in that: Each of the test modules comprises: A mounting plate, arranged on the bottom plate, wherein a plurality of test holes are provided on the mounting plate for mounting a high-speed laser; A plug board is connected to the mounting plate, and a plurality of plug holes are arranged on the plug board, and each of the plug holes is electrically connected to each of the test holes.

3. The high-speed laser test board as claimed in claim 2, characterized in that: Each of the test holes is an oblong hole, and auxiliary support plates are provided on both sides of each of the test holes.

4. The high-speed laser test board according to claim 1, characterized in that: The power-on unit includes a TEC power-on module, an EA power-on module, an LD chip power-on module, an MPD power-on module and a resistor power-on module.

5. The high-speed laser test board as claimed in claim 4, characterized in that: The TEC power-on module, the EA power-on module, the LD chip power-on module, the MPD power-on module and the resistance power-on module can be selectively connected to each of the test modules.

6. The high-speed laser test board according to claim 1, characterized in that: The bottom plate is provided with a plug-in strip.

7. The high-speed laser test board according to claim 1, characterized in that: A handle is provided on the bottom plate.

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