Temperature measuring carrier plate and reflow soldering temperature measuring device

Abstract

The utility model provides a temperature measuring carrier plate and a reflow soldering temperature measuring device, and relates to the technical field of circuit board manufacturing equipment. The temperature measurement carrier plate comprises a plate body, the plate body is provided with a supporting installation part and a heat dissipation structure, the supporting installation part comprises a supporting face and an installation hole, the supporting face is used for supporting a temperature measurement element, the installation hole is used for being detachably connected with a pressing structure, the pressing structure presses the temperature measurement element on the supporting face, and the supporting installation part is correspondingly provided with the heat dissipation structure. According to the utility model, the temperature measuring element is supported by the support surface of the support installation part, the installation hole of the support installation part is connected with the pressing structure, and the temperature measuring element is pressed on the support surface by the pressing structure, so that reliable installation of the temperature measuring element on the support installation part can be realized through a small number of parts; and the heat dissipation structure such as a hollow structure can increase the contact area between the plate body and the air at the supporting and mounting part, and the heat dissipation and heat conduction performance of the plate body in heat exchange with the air at the supporting and mounting part is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board manufacturing equipment, in particular to a temperature measuring carrier board and a reflow soldering temperature measuring device. Background Art

[0002] PCBA (Printed Circuit Board Assembly) is a core technology that has been widely used in the manufacturing process of many electronic products. It usually includes printing, patch and welding processes. In the printing process, the printer prints solder on the pads on the circuit board substrate. In the patch process, the patch machine attaches electronic components such as capacitors and resistors to the circuit board substrate so that the electronic components are in contact with the solder. In the welding process, the reflow oven provides a stable and controllable heating environment to melt the solder pre-allocated by the printer on the circuit board substrate, so that the surface mount components and the pads of the circuit board substrate are reliably combined together through the solder.

[0003] At present, a temperature measuring device is usually made of a complete PCBA product and the temperature of the reflow soldering furnace is monitored regularly, for example, every 12 hours. The monitoring data of the temperature measuring device is used to determine whether the furnace temperature (that is, the temperature curve) of the reflow soldering furnace meets the use requirements. Specifically, a PCBA product after surface mounting is used, and a soldering iron is used to solder the thermocouple to the solder pad of the circuit board substrate, and then the reflow soldering furnace is put into the reflow soldering furnace for furnace temperature monitoring. In this case, the structure of the temperature measuring device is relatively complex, and there are problems of heat concentration and poor heat dissipation and thermal conductivity. The temperature reflected by the monitoring data of the thermocouple has a certain hysteresis, and it is difficult to accurately reflect the furnace temperature of the reflow soldering furnace. In particular, when the temperature measuring device is transferred between temperature zones with different set temperatures in the reflow soldering furnace, the inaccuracy of the monitoring data caused by this hysteresis is particularly prominent. In addition, components on the temperature measuring device, such as thermocouples, are easily damaged due to heat concentration, and the difficulty of secondary welding is relatively large, and the manufacturing and use costs are relatively high. Utility Model Content

[0004] The utility model aims to solve the problem of how to improve the performance of the temperature measuring device to a certain extent.

[0005] In order to solve at least one aspect of the above-mentioned problems to at least a certain extent, in a first aspect, the utility model provides a temperature measuring carrier plate, including a plate body, the plate body is provided with a support mounting portion and a heat dissipation structure, the support mounting portion includes a support surface and a mounting hole, the support surface is used to support a temperature measuring element, the mounting hole is used to be detachably connected to a clamping structure, the clamping structure presses the temperature measuring element onto the support surface, and the support mounting portion is correspondingly provided with the heat dissipation structure.

[0006] Optionally, the clamping structure includes a threaded connector, which passes through the temperature measuring element and is connected to the mounting hole.

[0007] Optionally, the heat dissipation structure includes at least one of a hollow structure and a fin structure.

[0008] Optionally, the hollow structure includes at least one of a first sink and a first through hole.

[0009] Optionally, the support mounting portion is correspondingly provided with a plurality of the hollow structures, and the plurality of the hollow structures are distributed sequentially in the circumferential direction of the corresponding support mounting portion.

[0010] Optionally, the plurality of hollow structures are evenly distributed in the circumference of the corresponding support mounting portion;

[0011] And / or, along the circumference of the support and mounting portion, a portion of the plate body located between each two adjacent hollow structures forms a heat-conducting bridge, and the heat-conducting bridge is a long strip structure extending in a direction away from the support and mounting portion.

[0012] Optionally, the side walls of the plurality of hollow structures close to one end of the mounting hole are located on a cylindrical surface of a cylinder coaxial with the mounting hole;

[0013] Alternatively, the side walls of the plurality of hollow structures close to one end of the mounting hole are respectively located on a plurality of side surfaces of a regular polygonal column with the axis of the mounting hole as the center line.

[0014] Optionally, when the temperature measuring element is installed on the support and mounting portion, the projection of the hollow structure corresponding to the support and mounting portion on a set plane falls outside the coverage range of the projection of the temperature sensing part of the temperature measuring element corresponding to the support and mounting portion on the set plane, and the set plane is perpendicular to the thickness direction of the plate body;

[0015] And / or, the distance from one end of the hollow structure close to the mounting hole to the center of the mounting hole is a first distance, the first distance is greater than or equal to 8 mm, and the first distance is less than or equal to 16 mm.

[0016] Optionally, the plate body is further provided with a weight-reducing structure, and the distance from one end of the weight-reducing structure close to the mounting hole to the center of the mounting hole is greater than the distance from one end of the heat dissipation structure close to the mounting hole to the center of the mounting hole.

[0017] Optionally, the weight-reducing structure includes at least one of a second sink and a second through hole.

[0018] In a second aspect, the utility model provides a reflow soldering temperature measuring device, comprising a temperature measuring element, a clamping structure and a temperature measuring carrier as described in the first aspect above, wherein the clamping structure is detachably connected to the mounting hole of the support mounting portion of the temperature measuring carrier so as to press the temperature measuring element against the supporting surface of the support mounting portion.

[0019] In a third aspect, the utility model provides a reflow soldering temperature measuring device, comprising the reflow soldering temperature measuring device as described in the second aspect above.

[0020] Compared with the related prior art, in the temperature measuring carrier and the reflow soldering temperature measuring device of the present invention, a support mounting portion and a heat dissipation structure are provided on the board body of the temperature measuring carrier, the temperature measuring element is supported by the support surface of the support mounting portion, and is connected to the clamping structure through the mounting hole of the support mounting portion, and the temperature measuring element is clamped on the support surface by the clamping structure, and the temperature measuring element can be reliably installed on the support mounting portion with a small number of components. When the temperature measuring carrier is used for the reflow soldering temperature measuring device, the number of components of the reflow soldering temperature measuring device is small, and when the temperature measuring element needs to be maintained, the temperature measuring element can be quickly disassembled by disassembling the clamping structure, the structure is simple, the manufacturing and use costs are low, and maintenance is convenient; at the same time, the support mounting portion is correspondingly provided with a heat dissipation structure , using heat dissipation structures such as hollow structures or fin structures, etc., the contact area between the board body and the air at the support and mounting part can be increased, so that compared with other positions, the heat dissipation and thermal conductivity of the board body at the support and mounting part for heat exchange with the air can be enhanced, thereby improving the accuracy of the monitoring data of the temperature measuring element. In particular, when the temperature measuring element on the temperature measuring carrier is driven by the conveying mechanism of the reflow soldering furnace from one temperature zone of the reflow soldering furnace to another temperature zone with a different temperature, the board body can quickly exchange heat with the air in the current temperature zone at the support and mounting part, and the temperature of the support and mounting part is quickly converted to the temperature in the current temperature zone, thereby the monitoring data of the temperature measuring element is more accurate and reliable. Specifically, the monitoring data can better reflect the actual temperature of the temperature zone. In general, the utility model can improve the temperature measurement accuracy of the temperature measuring device, and can reduce the manufacturing and use costs to a certain extent, and improve the use performance of the temperature measuring device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the structure of the temperature measuring carrier plate in the first embodiment of the present utility model;

[0022] Figure 2 for Figure 1 The schematic diagram of the structure of the connection between the temperature measuring carrier plate and the temperature measuring element shown;

[0023] Figure 3 This is a schematic diagram of the structure of the temperature measuring carrier plate in the second embodiment of the present utility model;

[0024] Figure 4 for Figure 3 A partial enlarged view of the middle A;

[0025] Figure 5 for Figure 3 Another structural schematic diagram of the temperature measuring carrier shown;

[0026] Figure 6 It is a structural schematic diagram of a temperature measuring carrier plate in a third embodiment of the present utility model;

[0027] Figure 7 for Figure 6 A partial enlarged view of point B in the middle;

[0028] Figure 8 Schematic diagram of the structure of the temperature measuring carrier in the fourth embodiment of the present utility model.

[0029] Description of reference numerals:

[0030] 1-board body; 11-support and mounting portion; 111-support surface; 112-mounting hole; 12-heat dissipation structure; 121-first through hole; 13-weight reduction structure; 131-second through hole; 14-recessed portion; 15-thermal bridge; 2-temperature measuring element; 21-temperature sensing portion. DETAILED DESCRIPTION

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the description of this specification, the description with reference to the terms "embodiment", "one embodiment", "some embodiments", "exemplarily" and "one embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or embodiment are included in at least one embodiment or embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or embodiments in a suitable manner.

[0034] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0035] In the accompanying drawings, the Z axis represents the vertical direction, that is, the up and down position, and the positive direction of the Z axis (that is, the direction of the arrow of the Z axis) represents the up, and the negative direction of the Z axis represents the down; the X axis in the accompanying drawings represents the front and back position, and the positive direction of the X axis (that is, the direction of the arrow of the X axis) represents the front side, and the negative direction of the X axis represents the back side; the Y axis in the accompanying drawings represents the horizontal direction and is designated as the left and right position, and the positive direction of the Y axis (that is, the direction of the arrow of the Y axis) represents the right side, and the negative direction of the Y axis represents the left side; it should be noted that the aforementioned Z axis, Y axis and X axis are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0036] like Figures 1 to 8 As shown, an embodiment of the utility model provides a temperature measuring carrier plate, including a plate body 1, the plate body 1 is provided with a support mounting portion 11 and a heat dissipation structure 12, the support mounting portion 11 includes a support surface 111 and a mounting hole 112, the support surface 111 is used to support the temperature measuring element 2, the mounting hole 112 is used to be detachably connected to the clamping structure, the clamping structure presses the temperature measuring element 2 on the support surface 111, and the support mounting portion 11 is correspondingly provided with the heat dissipation structure 12.

[0037] The number of the support and installation parts 11 is usually set to be multiple, and multiple temperature measuring elements 2 can be installed through multiple support and installation parts 11. The position distribution of the multiple support and installation parts 11 on the plate body 1 is not limited, and it can be set according to actual needs. The support and installation part 11 is attached to the temperature measuring element 2 through the support surface 111, and the clamping structure is detachably installed through the mounting hole 112, and the temperature measuring element 2 is clamped by the clamping structure. On this basis, the specific structure of the clamping structure is not limited.

[0038] The support surface 111 may be formed on a surface of the board body 1 , for example, formed on an upper surface of the board body 1 , which is not intended to be limiting.

[0039] The support and mounting portion 11 is correspondingly provided with a heat dissipation structure 12, and the heat dissipation structure 12 can enhance the heat dissipation capacity of the support and mounting portion 11, so that the heat dissipation and thermal conductivity of the support and mounting portion 11 is stronger than that of other portions set as a flat plate. When the air temperature in the reflow soldering furnace changes, for example, when the temperature measuring element 2 on the temperature measuring carrier is driven by the conveying mechanism of the reflow soldering furnace from one temperature zone of the reflow soldering furnace to another temperature zone with a different temperature, the setting of the heat dissipation structure 12 can enhance the heat exchange capacity of the board body 1 with the air at the support and mounting portion 11, so that the support and mounting portion 11 can quickly exchange heat with the air, so that the temperature of the support and mounting portion 11 is quickly converted to the temperature in the current temperature zone, so that the monitoring data of the temperature measuring element 2 is more accurate and reliable.

[0040] Thus, the temperature measuring carrier board of the present embodiment is provided with a support and mounting portion 11 and a heat dissipation structure 12 on its board body 1, the temperature measuring element 2 is supported by the support surface 111 of the support and mounting portion 11, and is connected to the clamping structure through the mounting hole 112 of the support and mounting portion 11, and the temperature measuring element 2 is clamped on the support surface 111 by the clamping structure, and the temperature measuring element 2 can be reliably installed on the support and mounting portion 11 by a small number of components. When the temperature measuring carrier board is used for a reflow soldering temperature measuring device, the number of components of the reflow soldering temperature measuring device is small, and when the temperature measuring element 2 needs to be maintained, the temperature measuring element 2 can be quickly disassembled by disassembling the clamping structure, the structure is simple, the manufacturing and use costs are low, and it is easy to maintain; at the same time, the support and mounting portion 11 is correspondingly provided with a heat dissipation structure 12, and the heat dissipation structure 12 is used to The structure 12, such as a hollow structure or a fin structure, can increase the contact area between the board body 1 and the air at the support and mounting portion 11, thereby enhancing the heat dissipation and thermal conductivity of the board body 1 in heat exchange with the air at the support and mounting portion 11 compared to other positions, thereby improving the accuracy of the monitoring data of the temperature measuring element 2. In particular, when the temperature measuring element 2 on the temperature measuring carrier is driven by the conveying mechanism of the reflow soldering furnace from one temperature zone of the reflow soldering furnace to another temperature zone with a different temperature, the board body 1 can quickly exchange heat with the air in the current temperature zone at the support and mounting portion 11, and the temperature of the support and mounting portion 11 is quickly converted to the temperature in the current temperature zone, thereby the monitoring data of the temperature measuring element 2 is more accurate and reliable, and specifically, the monitoring data can better reflect the actual temperature of the temperature zone. In general, the utility model can improve the temperature measurement accuracy of the temperature measuring device, and can reduce the manufacturing and use costs to a certain extent, and improve the use performance of the temperature measuring device.

[0041] Optionally, the clamping structure includes a threaded connector, which passes through the temperature measuring element 2 and is connected to the mounting hole 112 .

[0042] Exemplarily, the threaded connector passes through the temperature measuring element 2 and is threadedly connected to the mounting hole 112 , and the temperature sensing portion 21 of the temperature measuring element 2 , such as a thermocouple, fits with the support surface 111 of the support mounting portion 11 .

[0043] In this way, the pressing structure is simple in structure and can achieve reliable fixation of the temperature measuring element 2 on the supporting mounting portion 11 .

[0044] It should be understood that in other embodiments, the clamping structure may include a snap-fit ​​connector, which passes through the through hole on the temperature measuring element 2 and the above-mentioned mounting hole 112 and then snaps into the plate body 1 at the edge of the mounting hole 112, thereby fixing the temperature measuring element 2 in the support mounting portion 11.

[0045] In the above embodiment, optionally, the heat dissipation structure 12 includes at least one of a hollow structure and a fin structure.

[0046] Specifically, the heat dissipation structure 12 may only include a fin structure, and the function of the fin structure is to expand the heat exchange area and improve the efficiency of heat transfer. The fin structure can be regarded as an extension and expansion of the outer surface of the support and mounting portion 11, and the flow boundary layer and the thermal boundary layer of the air are broken and reorganized, thereby strengthening the heat exchange. The fin structure can also improve the local strength of the plate body 1 at the support and mounting portion 11, and enhance the local anti-deformation ability of the plate body 1 at the support and mounting portion 11, thereby ensuring the fitting performance of the temperature sensing part 21 of the temperature measuring element 21 and the support surface 111 of the support and mounting portion 11, and can reduce the possibility of the temperature measuring element 2 being damaged due to the local stress transmitted by the support surface 111.

[0047] Specifically, the heat dissipation structure 12 may only include a hollow structure, which expands the heat exchange area by hollowing out the plate body 1 inwardly, thereby improving the heat transfer efficiency of the plate body 1 at the support mounting portion 11 .

[0048] Of course, the heat dissipation structure 12 may include both a fin structure and a hollow structure, which will not be described in detail here.

[0049] In this way, the surface area per unit volume of the plate body 1 at the support and mounting portion 11 can be increased through the fin structure or the hollow structure, thereby enhancing the thermal conductivity of the plate body 1 at the support and mounting portion 11, so that the monitoring data of the temperature measuring element 2 has high accuracy and sensitivity.

[0050] In an optional solution of the hollow structure, the hollow structure includes a first sink.

[0051] Specifically, the provision of the first sink groove can increase the surface area per unit volume of the board body 1 at the support mounting portion 11 , and can reduce the weight of the board body 1 to a certain extent.

[0052] like Figures 1 to 8 As shown, in an optional solution of the hollow structure, the hollow structure includes a first through hole 121 .

[0053] In this embodiment, the first through hole 121 is provided through the board body 1 along the thickness direction of the board body 1 .

[0054] In this way, on the one hand, the setting of the first through hole 121 can increase the surface area per unit volume of the board body 1 at the support mounting portion 11, and on the other hand, the guest air on both sides of the board body 1 can be quickly convected through the first through hole 121, ensuring the temperature uniformity of the air in the reflow oven at the support mounting portion 11, thereby improving the accuracy of the monitoring data of the temperature measuring element 2.

[0055] In an optional solution of the hollow structure, the hollow structure includes a first through hole 121 and a first sink. Figure 3 and Figure 4 The second embodiment shown in the figure shows that the hollow structure only includes the first through hole 121. At this time, the thickness of the board body 1 at the first through hole 121 is consistent with the thickness of the main part of the board body 1. Figure 6 and Figure 7 In the third embodiment shown, it is shown that the hollow structure includes a first through hole 121 and a first sink. At this time, the first through hole 121 is connected to the first sink, so that the thickness of the plate body 1 at the first through hole 121 is less than the thickness of the main part of the plate body 1.

[0056] like Figures 1 to 8 As shown, in an optional solution of the hollow structure, the support mounting portion 11 is correspondingly provided with a plurality of hollow structures, and the plurality of hollow structures are sequentially distributed in the circumferential direction of the support mounting portion 11 .

[0057] Specifically, the circumferential direction of the support and mounting portion 11 can be understood as the direction surrounding the support and mounting portion 11 in the XY plane in the figure, that is, the direction surrounding the mounting hole 112.

[0058] In this way, multiple hollow structures are sequentially distributed in the circumferential direction of the support and mounting portion 11, which can enhance the thermal conductivity of the corresponding support and mounting portion 11 while avoiding the situation where a single hollow structure covers too large a range and affects the heat dissipation stability of the hollow structure. At this time, the hollow structure can also improve the local strength of the board body 1 at the support and mounting portion 11 to a certain extent, and enhance the local anti-deformation ability of the board body 1 at the support and mounting portion 11, thereby ensuring the fit between the temperature sensing portion 21 of the temperature measuring element 21 and the support surface 111 of the support and mounting portion 11, and reducing the possibility of the temperature measuring element 2 being damaged due to the local stress transmitted by the support surface 111.

[0059] like Figures 1 to 8 As shown, optionally, a plurality of hollow structures are evenly distributed in the circumference of the corresponding support mounting portion 11 .

[0060] The number of hollow structures corresponding to the same support and mounting portion 11 is not limited. For the same support and mounting portion 11, two to six hollow structures are evenly distributed along the circumference of the support and mounting portion 11. Figures 1 to 8 As shown, it shows that the four first through holes 121 are evenly distributed in the circumferential direction of the support mounting portion 11.

[0061] In this way, the hollow structure evenly distributed in the circumference of the support and mounting portion 11 makes the heat conduction and heat dissipation performance of the support and mounting portion 11 at various positions in the circumference relatively consistent, thereby ensuring that the actual temperature of each point on the temperature sensing portion 21 of the temperature measuring element 2 that is in contact with the support surface 111 is consistent, and the monitoring data of the temperature measuring element 2 is highly accurate. In addition, the temperature non-uniformity of each position point on the support and mounting portion 11 can be reduced to a certain extent, the possibility of deformation of the support and mounting portion 11 due to uneven heating can be reduced, the reliability of the temperature measuring carrier can be improved, and the performance of the temperature measuring carrier can be ensured. In addition, the fitting performance between the temperature sensing portion 21 of the temperature measuring element 21 and the support surface 111 of the support and mounting portion 11 can be further improved, and the possibility of damage to the temperature measuring element 2 due to local stress transmitted by the support surface 111 can be further reduced.

[0062] Optionally, the projection of the hollow structure on the set plane may be substantially circular, rectangular or fan-shaped.

[0063] like Figures 1 to 7 It is shown that the projection of the first through hole 121 on the set plane is generally fan-shaped. Figure 8 The projection of the first through hole 121 on the setting plane is substantially rectangular. The setting plane is perpendicular to the thickness direction of the plate body 1 .

[0064] like Figure 4 As shown, optionally, along the circumference of the support and mounting portion 11 , the portion of the plate body 1 between each two adjacent hollow structures forms a heat-conducting bridge 15 , and the heat-conducting bridge 15 is a long strip structure extending in a direction away from the support and mounting portion 11 .

[0065] Exemplarily, the cross-section of the main portion of the long strip structure is rectangular, and the cross-section of the long strip structure is perpendicular to the extension direction of the long strip structure.

[0066] The size of the cross section of the main part of the long strip structure is determined according to specific needs. For example, the width of the cross section of the main part of the long strip structure in the XY plane is the first length, and the size in the Z-axis direction is the second length. The first length is 3.5-4.5 mm, for example, 3.8-4.2 mm, for example, 4 mm. When the hollow structure only includes the first through hole 121, the second length corresponding to the long strip structure formed by the first through hole 121 is, for example, 3-5 mm, for example, 4 mm. When the hollow structure only includes the first sink, the first length can be 3-4 mm, for example, 3.5 mm, and the second length can be 1-4 mm, for example, 2-3 mm, for example, 2.5 mm. The thickness of the main part of the plate body 1 is determined according to actual conditions, usually 3-8 mm, for example, 3.5-6 mm, for example, 4 mm.

[0067] like Figures 1 to 7 As shown, optionally, the side walls of the multiple hollow structures close to one end of the mounting hole 112 are located on the cylindrical surface of a cylinder coaxial with the mounting hole 112 .

[0068] In this way, the contact area between the board body 1 and the air at the support and mounting portion 11 can be increased, and the distances from each hollow structure to the axis of the mounting hole 112 are consistent, so that the support and mounting portion 11 has better uniformity in dissipating heat to the outside through multiple hollow structures.

[0069] like Figure 8 As shown, of course, in other solutions, the side walls of the multiple hollow structures close to one end of the mounting hole 112 are respectively located on multiple side surfaces of a regular polygonal column with the axis of the mounting hole 112 as the center line.

[0070] At this time, the contact surface area between the board body 1 and the air at the support and mounting portion 11 can also be increased, and the distances from each hollow structure to the axis of the mounting hole 112 are almost consistent, so the support and mounting portion 11 has better uniformity in dissipating heat to the outside through multiple hollow structures.

[0071] like Figure 2 As shown, optionally, when the temperature measuring element 2 is installed on the supporting mounting portion 11, the projection of the hollow structure corresponding to the supporting mounting portion 11 on the set plane falls outside the coverage range of the projection of the temperature sensing part 21 of the temperature measuring element 2 corresponding to the supporting mounting portion 11 on the set plane, and the set plane is perpendicular to the thickness direction of the plate body 1.

[0072] In this way, it can be ensured that the supporting surface 111 of the supporting and mounting portion 11 is large enough so that it can fit well with the temperature sensing part 21 of the temperature measuring element 2, thereby avoiding affecting the contact thermal conductivity between the temperature sensing part 21 of the temperature measuring element 2 and the supporting and mounting portion 11 due to the provision of a hollow structure, thereby affecting the accuracy of the monitoring data of the temperature measuring element 2.

[0073] Optionally, a distance from one end of the hollow structure close to the mounting hole 112 to the center of the mounting hole 112 is a first distance, the first distance is greater than or equal to 8 mm, and the first distance is less than or equal to 16 mm.

[0074] Exemplarily, the first distance is greater than or equal to 10 mm, and the first distance is less than or equal to 14 mm. For example, the first distance is 10 mm, 11 mm, or 12 mm, which is set according to specific needs.

[0075] In this way, it is possible to avoid the distance between the hollow structure and the mounting hole 112 being too small, which would affect the structural performance of the support mounting part 11, such as the anti-deformation performance. It is also possible to avoid the distance between the hollow structure and the mounting hole 112 being too large, which would have limited improvement on the heat dissipation and thermal conductivity of the support mounting part 11.

[0076] Optionally, the distance from one end of the hollow structure close to the mounting hole 112 to the center of the mounting hole 112 is a second distance, the second distance is greater than or equal to 20 mm, and the first distance is less than or equal to 40 mm.

[0077] Exemplarily, the second distance is greater than or equal to 25 mm, and the first distance is less than or equal to 35 mm. For example, the first distance is 28 mm, 30 mm, or 32 mm, which is set according to specific needs.

[0078] like Figures 3 to 7 As shown, optionally, the board body 1 is further provided with a weight reduction structure 13 , and the distance from one end of the weight reduction structure 13 close to the mounting hole 112 to the center of the mounting hole 112 is greater than the distance from one end of the heat dissipation structure 12 close to the mounting hole 112 to the center of the mounting hole 112 .

[0079] In this embodiment, the weight reduction structure 13 is mainly used to reduce the weight of the temperature measurement carrier plate, thereby making it lightweight and saving costs.

[0080] Further, the weight reduction structure 13 may include at least one of a second sink groove and a second through hole 131 .

[0081] The number and position of the second sinks and the second through holes 131 can be set according to the specific layout of the temperature measuring carrier, which will not be described in detail here.

[0082] At this time, the second sink can be connected to the air, and the second through hole 131 can be connected to the air, which is convenient for manufacturing and molding, and can increase the contact area between the temperature measuring carrier and the air to a certain extent, and enhance the heat dissipation and thermal conductivity of the temperature measuring carrier. It will not be described in detail here.

[0083] In the above embodiment, the plate body 1 is optionally made of aluminum alloy. Aluminum alloy has good thermal conductivity and mechanical properties, and can more accurately reflect temperature changes while preventing warping and deformation.

[0084] Optionally, the plate body 1 is subjected to hard anodizing treatment, thereby improving the corrosion resistance, wear resistance, insulation and other properties of the plate body 1 .

[0085] Of course, it should be understood that the clamping structure may also be made of aluminum alloy, and the clamping structure may also be hard anodized.

[0086] It should be understood that the board body 1 is provided with recessed portions 14 at both ends in a direction within the XY plane, for example, in the Y-axis direction. The recessed portions 14 are provided at the edge positions of the board body 1 along the Y-axis direction, and the recessed portions 14 are respectively connected to the bottom surface and the side surface of the board body 1. The recessed portions 14 form positioning steps for connecting with the conveying mechanism of the reflow soldering furnace, thereby realizing the relative position positioning of the temperature measuring carrier and the reflow soldering furnace in the width direction of the reflow soldering furnace, so that the movement stability of the temperature measuring carrier is high when it circulates in the reflow soldering furnace.

[0087] Another embodiment of the utility model provides a reflow soldering temperature measuring device, characterized in that it includes a temperature measuring element 2, a clamping structure and a temperature measuring carrier as in the above embodiment, wherein the clamping structure is detachably connected to the mounting hole 112 of the support mounting portion 11 of the temperature measuring carrier so as to press the temperature measuring element 2 against the support surface 111 of the support mounting portion 11.

[0088] The reflow soldering temperature measuring device has all the beneficial effects of the temperature measuring carrier board, which will not be described in detail here.

[0089] It should be noted that after the reflow soldering temperature measuring device circulates in the reflow soldering furnace and obtains monitoring data, the monitoring data can be processed using relevant existing technologies, which is not a limitation.

[0090] This embodiment exemplarily introduces a method for monitoring the temperature of a reflow oven using a reflow temperature measuring device as follows:

[0091] 1. Set each temperature zone of the reflow oven to fixed parameters (can be named as a dedicated test program).

[0092] 2. Use a reflow soldering temperature measuring device to test the temperature of the reflow soldering furnace. Test it multiple times in a row, for example three times, and keep the temperature curve.

[0093] 3. Take the average of multiple tests and set this group of curves as the standard furnace temperature curve.

[0094] 4. Compare the subsequent test results every 12 hours with the standard furnace temperature curve.

[0095] 5. The data amplitude of each comparison shall not exceed the range of ±5℃, which means that daily reflow oven monitoring is completed.

[0096] The test results are recorded each time, and the CPK data of the furnace temperature is calculated when 32 sets of data are met. When CPK>1.33, it means that the reflow oven is running stably. When 1.33>CPK>1, it means that the reflow oven needs to be closely observed. When CPK<1, it needs to be shut down for maintenance. Among them, CPK (Process Capability Index) is a statistical indicator used to evaluate the stability and capability of a production process.

[0097] Although the utility model is disclosed as above, the protection scope of the utility model is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the protection scope of the utility model.

Claims

1. A temperature measuring carrier, characterized in that: The invention comprises a plate body (1), wherein the plate body (1) is provided with a support mounting portion (11) and a heat dissipation structure (12), wherein the support mounting portion (11) comprises a support surface (111) and a mounting hole (112), wherein the support surface (111) is used to support a temperature measuring element (2), and the mounting hole (112) is used to be detachably connected to a clamping structure, wherein the clamping structure clamps the temperature measuring element (2) onto the support surface (111), and the heat dissipation structure (12) is correspondingly provided on the support mounting portion (11).

2. The temperature measuring carrier according to claim 1, characterized in that: The clamping structure comprises a threaded connection piece, which passes through the temperature measuring element (2) and is connected to the mounting hole (112).

3. The temperature measuring carrier according to claim 1, characterized in that: The heat dissipation structure (12) comprises at least one of a hollow structure and a fin structure.

4. The temperature measuring carrier according to claim 3, characterized in that: The hollow structure comprises at least one of a first sink groove and a first through hole (121).

5. The temperature measuring carrier according to claim 4, characterized in that: The support installation portion (11) is correspondingly provided with a plurality of the hollow structures, and the plurality of the hollow structures are sequentially distributed in the circumferential direction of the corresponding support installation portion (11).

6. The temperature measuring carrier according to claim 5, characterized in that: The plurality of hollow structures are evenly distributed in the circumferential direction of the corresponding support mounting portion (11); And / or, along the circumference of the support and mounting portion (11), a portion of the plate body (1) located between each two adjacent hollow structures forms a heat-conducting bridge (15), and the heat-conducting bridge (15) is a long strip structure extending in a direction away from the support and mounting portion (11).

7. The temperature measuring carrier according to claim 5 or 6, characterized in that: The side walls of the plurality of hollow structures close to one end of the mounting hole (112) are located on a cylindrical surface of a cylinder coaxial with the mounting hole (112); Alternatively, the side walls of the plurality of hollow structures close to one end of the mounting hole (112) are respectively located on a plurality of side surfaces of a regular polygonal column with the axis of the mounting hole (112) as the center line.

8. The temperature measuring carrier according to any one of claims 3 to 6, characterized in that: When the temperature measuring element (2) is mounted on the support and mounting portion (11), the projection of the hollow structure corresponding to the support and mounting portion (11) on a set plane falls outside the coverage range of the projection of the temperature sensing portion (21) of the temperature measuring element (2) corresponding to the support and mounting portion (11) on the set plane, and the set plane is perpendicular to the thickness direction of the plate body (1); And / or, the distance from one end of the hollow structure close to the mounting hole (112) to the center of the mounting hole (112) is a first distance, the first distance is greater than or equal to 8 mm, and the first distance is less than or equal to 16 mm.

9. The temperature measuring carrier according to any one of claims 1 to 6, characterized in that: The plate body (1) is also provided with a weight-reducing structure (13), and the distance from one end of the weight-reducing structure (13) close to the mounting hole (112) to the center of the mounting hole (112) is greater than the distance from one end of the heat dissipation structure (12) close to the mounting hole (112) to the center of the mounting hole (112).

10. The temperature measuring carrier according to claim 9, characterized in that: The weight-reducing structure (13) comprises at least one of a second sink and a second through hole (131).

11. A reflow soldering temperature measuring device, characterized in that: It comprises a temperature measuring element (2), a clamping structure and a temperature measuring carrier according to any one of claims 1 to 10, wherein the clamping structure is detachably connected to a mounting hole (112) of a supporting mounting portion (11) of the temperature measuring carrier so as to clamp the temperature measuring element (2) against a supporting surface (111) of the supporting mounting portion (11).

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