Wafer pre-vacuumizing device

Abstract

The utility model provides a wafer pre-vacuumizing device, comprising a cavity used for placing a wafer to be processed; the water vapor detection mechanism comprises a detector and a controller, the detector is coupled to the cavity and used for detecting the water vapor content in the cavity and outputting a detection result, and the controller is used for receiving the detection result of the detector and outputting a control signal when the water vapor content in the cavity exceeds a set threshold value; the driving mechanism comprises a driver and a vacuum pump, the driver is used for driving the vacuum pump to start according to the control signal output by the controller, and the vacuum pump is coupled to the cavity and used for exhausting air in the cavity in a starting state so that the cavity can reach a vacuum state. According to the wafer pre-vacuumizing device, the water vapor detection mechanism and the driving mechanism are connected to the side wall of the cavity of the wafer pre-vacuumizing device, the water vapor detection mechanism detects the water vapor content in the cavity in real time, and when the water vapor content exceeds the set threshold value, the driving mechanism is controlled to exhaust air from the cavity, so that the water vapor content is prevented from exceeding the standard to pollute the wafer to be processed, and the processing efficiency of the wafer to be processed is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a wafer pre-vacuuming device. Background Art

[0002] The robot in the front-end module of the semiconductor equipment will grab the wafer from the wafer transfer box and put it into the wafer pre-vacuum chamber. Close the vacuum valve between the wafer pre-vacuum chamber and the front-end module of the semiconductor equipment to seal it, then turn on the vacuum pump to pump air into the wafer pre-vacuum chamber to a vacuum state (about -5PA). Open the vacuum valve between the wafer pre-vacuum chamber and the main reaction chamber, and the robot in the main reaction chamber will take the wafer out of the wafer pre-vacuum chamber and close the vacuum valve of the wafer pre-vacuum chamber at the same time.

[0003] The load lock is a wafer pre-vacuum chamber. When the vacuum valve is closed, the chamber is in a vacuum state. However, the airtightness of the chamber inside the load lock of some existing machines is poor. Since the vacuum valve on the surface of the vacuum lock chamber is often opened and closed, there is water vapor inside the vacuum lock chamber. The machine fails the leak detection, so that the vacuum lock chamber does not reach a complete vacuum state, which may cause the product to be contaminated during the processing process.

[0004] Therefore, it is necessary to design a new type of wafer pre-vacuum device. Summary of the invention

[0005] The technical problem to be solved by the utility model is to provide a wafer pre-vacuuming device so that the water vapor content inside the cavity is maintained within a specified range, thereby preventing the water vapor content inside the cavity from exceeding the standard and causing the wafer to be processed to be contaminated, thereby affecting the processing efficiency and success rate of the wafer to be processed.

[0006] In order to solve the above problems, the utility model provides a wafer pre-vacuum device, comprising: a cavity, which is used to place wafers to be processed; a water vapor detection mechanism, which comprises a detector and a controller, the detector is coupled to the cavity, and is used to detect the water vapor content in the cavity and output a detection result, the controller is used to receive the detection result of the detector and output a control signal when the water vapor content in the cavity exceeds a set threshold value; a driving mechanism, the driving mechanism comprises a driver and a vacuum pump, the driver is used to drive the vacuum pump to start according to the control signal output by the controller, the vacuum pump is coupled to the cavity, and is used to evacuate the cavity in a started state to make the cavity reach a vacuum state.

[0007] In some embodiments, the water vapor detection mechanism further includes an electronic signal transmitter, and the electronic signal transmitter is used to receive and transmit the control signal output by the controller.

[0008] In some embodiments, a vacuum valve is provided on the surface of the cavity.

[0009] In some embodiments, the water vapor detection mechanism further includes a detection tube, which is connected between the cavity and the detector, and the detector detects the water vapor content in the cavity through the detection tube.

[0010] In some embodiments, the material of the detection tube is alloy.

[0011] In some embodiments, the side wall of the cavity is provided with a through hole for connecting the detection tube.

[0012] In some embodiments, the driving mechanism further includes an exhaust pipe, which is connected between the cavity and the vacuum pump. When the vacuum pump is started, it exhausts air from the cavity through the exhaust pipe.

[0013] In some embodiments, the side wall of the cavity is provided with a through hole for connecting the exhaust pipe.

[0014] In some embodiments, the water vapor detection mechanism and the driving mechanism are respectively disposed on opposite sides of the outside of the cavity.

[0015] In some embodiments, the device further comprises a base plate, and the driver and the vacuum pump are both disposed on the base plate.

[0016] The above technical solution connects a water vapor detection mechanism and a driving mechanism to the side wall of the cavity of the wafer pre-vacuum device. The water vapor detection mechanism can detect the water vapor content inside the cavity of the device in real time, and can promptly control the driving mechanism to evacuate the cavity when the water vapor content inside the cavity of the device exceeds a set threshold, thereby preventing the water vapor content inside the cavity from exceeding the standard and contaminating the wafers to be processed located inside the cavity, thereby greatly improving the processing efficiency and success rate of the wafers to be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the specific implementation of the utility model, the following is a brief introduction to the drawings required for the description of the specific implementation. Obviously, the drawings described below are only some specific implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1It is a schematic diagram of a wafer pre-vacuuming device provided by an embodiment of the utility model;

[0019] Figure 2 It is a schematic diagram of a water vapor detection mechanism of a wafer pre-vacuuming device provided by an embodiment of the utility model;

[0020] Figure 3 It is a schematic diagram of a driving mechanism of a wafer pre-vacuuming device provided in one embodiment of the utility model. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the specific implementation of the utility model to clearly and completely describe the technical solutions in the specific implementation of the utility model. Obviously, the specific implementation described is only a part of the specific implementation of the utility model, not all of the specific implementation. Based on the specific implementation of the utility model, all other specific implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Please also read Figure 1 to Figure 3 ,in, Figure 1 is a schematic diagram of a wafer pre-vacuuming device provided by an embodiment of the utility model, Figure 2 is a schematic diagram of the water vapor detection mechanism of the wafer pre-vacuum device. Figure 3 Schematic diagram of a vacuum pump of the wafer pre-vacuum device.

[0023] like Figure 1 As shown, the wafer pre-vacuuming device comprises: a cavity 11, a water vapor detection mechanism 12 and a driving mechanism 13. The cavity 11 is used to place the wafer to be processed.

[0024] like Figure 1 , Figure 2 As shown, the water vapor detection mechanism 12 includes a detector 121 and a controller 122. The detector 121 is coupled to the cavity 11, and the detector 121 is used to detect the water vapor content in the cavity 11 and output a detection result. The controller 122 is used to receive the detection result of the detector 121, and output a control signal when the water vapor content in the cavity 11 exceeds a set threshold.

[0025] like Figure 1 , Figure 3 As shown, the driving mechanism 13 includes a driver 131 and a vacuum pump 132. The driver 131 is used to drive the vacuum pump 132 to start according to the control signal output by the controller 122. The vacuum pump 132 is coupled to the cavity 11, and the vacuum pump 132 is used to evacuate the cavity 11 in the start-up state so that the cavity 11 reaches a vacuum state.

[0026] In this embodiment, the cavity 11 is cylindrical and has a diameter greater than a diameter of the wafer to be processed, so that the cavity 11 can completely accommodate the wafer to be processed.

[0027] In this embodiment, a vacuum valve is provided on the surface of the cavity 11. When the vacuum valve is opened, the robot in the front-end module of the semiconductor device grabs the wafer to be processed from the wafer transfer box and places it in the cavity 11. The vacuum valve between the cavity 11 and the front-end module of the semiconductor device is closed for sealing, and then the vacuum pump 132 is opened to evacuate air and the cavity 11 is evacuated to a vacuum state (approximately -5PA). The detector 121 of the water vapor detection mechanism 12 detects whether the water vapor content inside the cavity 11 exceeds the set threshold value. If the water vapor content inside the cavity 11 exceeds the set threshold value, the detector 121 outputs a detection result; the controller 122 receives the detection result from the detector 121 and outputs a control signal; the driver 131 of the driving structure 13 drives the start of the vacuum pump 132 according to the control signal output by the controller 122; the vacuum pump 132 further evacuates the cavity 11 to reduce the water vapor content of the gas inside the cavity 11, so that the cavity 11 reaches a vacuum state to prevent contamination of the wafer to be processed. Afterwards, the vacuum valve between the cavity 11 and the main reaction chamber is opened, and the robot in the main reaction chamber takes the wafer to be processed out of the cavity 11, and closes the vacuum valve of the cavity 11 at the same time; the detector 121 of the water vapor detection mechanism 12 can further detect whether the water vapor content inside the cavity 11 exceeds the set threshold value to determine whether it is necessary to open the vacuum pump 132 again for exhaust.

[0028] In this embodiment, the water vapor detection mechanism 12 and the driving mechanism 13 are respectively arranged on opposite sides of the outside of the cavity 11. In other embodiments, the water vapor detection mechanism 12 and the driving mechanism 13 can also be respectively arranged at different positions of the side wall of the cavity 11.

[0029] In this embodiment, the side wall of the cavity 11 is also provided with a connection port 14 for connecting a pipeline. The connection port 14 is used to facilitate the subsequent photolithography, epitaxy, and etching processes.

[0030] Please continue reading below Figure 2In the present embodiment, the water vapor detection mechanism 12 further includes a detection tube 21, and the detection tube 21 is connected between the cavity 11 and the detector 121, and the detector 121 detects the water vapor content in the cavity 11 through the detection tube 21. The material of the detection tube 21 is an alloy, such as a nickel alloy, a titanium alloy, etc. In other embodiments, the detection tube 21 can also be other materials resistant to water vapor erosion. The side wall of the cavity 11 is provided with a through hole (not shown) for connecting the detection tube 21. The detector 121 is also provided with a display interface to display the water vapor content inside the cavity 11 in real time, so that the staff can observe the water vapor content inside the cavity 11 at any time.

[0031] In this embodiment, the water vapor detection mechanism 12 also includes an electronic signal transmitter 22, and the electronic signal transmitter 22 is used to receive the control signal output by the controller 122 and transmit it. When the water vapor content in the cavity 11 exceeds the set threshold, the controller 122 outputs the control signal to the electronic signal transmitter 22; after receiving the control signal from the controller 122, the electronic signal transmitter 22 transmits the control signal outward. After receiving the control signal, the driver 131 of the driving mechanism 13 drives the vacuum pump 132 to start. The driver 131 and the electronic signal transmitter 22 can be connected in communication to send and receive signals.

[0032] Please continue reading below Figure 3 In this embodiment, the driving mechanism 13 further includes an exhaust pipe 31, which is connected between the cavity 11 and the vacuum pump 132. When the vacuum pump 132 is started, it exhausts the cavity 11 through the exhaust pipe 31. The side wall of the cavity 11 is provided with a through hole 32 for connecting the exhaust pipe 31.

[0033] In this embodiment, the device further includes a bottom plate 33, and the driver 131 and the vacuum pump 132 are both disposed on the bottom plate 33. Specifically, the driver 131 may be electrically connected to the bottom plate 33. When the driver 131 receives the control signal, it indicates that the water vapor content in the cavity 11 has exceeded a preset threshold value. At this time, the driver 131 may drive the vacuum pump 132 to start through the bottom plate 33 to extract the water vapor in the cavity 11.

[0034] Research shows that the water vapor content has a great influence on the vacuum degree of the wafer pre-vacuum device. Therefore, this embodiment separately sets up a water vapor detection mechanism. When the water vapor content exceeds the set threshold, the vacuum pump 132 can pump air to reduce the water vapor content in the cavity 11 to within the set threshold, thereby ensuring the vacuum degree in the cavity 11. In the embodiment where the water vapor detection mechanism 12 is provided with a display interface, the display interface can display the water vapor content inside the cavity 11 in real time, so that the staff can observe the water vapor content inside the cavity 11 at any time. In the case of failure to send the control signal or failure of automatic vacuuming, the display interface can be observed externally and the device can be repaired to further ensure the smooth operation of the above device.

[0035] The above technical solution connects a water vapor detection mechanism and a driving mechanism to the side wall of the cavity of the wafer pre-vacuum device. The water vapor detection mechanism can detect the water vapor content inside the cavity of the device in real time, and can promptly control the driving mechanism to evacuate the cavity when the water vapor content inside the cavity of the device exceeds a set threshold, thereby preventing the water vapor content inside the cavity from exceeding the standard and contaminating the wafers to be processed located inside the cavity, thereby greatly improving the processing efficiency and success rate of the wafers to be processed.

[0036] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.

[0037] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.

[0038] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present utility model. In the above-mentioned embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0039] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer pre-vacuum device, characterized in that: include: A cavity, wherein the cavity is used to place a wafer to be processed; A water vapor detection mechanism, the water vapor detection mechanism comprising a detector and a controller, the detector being coupled to the cavity and configured to detect the water vapor content in the cavity and output a detection result, the controller being configured to receive the detection result of the detector and output a control signal when the water vapor content in the cavity exceeds a set threshold value; The driving mechanism includes a driver and a vacuum pump, wherein the driver is used to drive the vacuum pump to start according to the control signal output by the controller, and the vacuum pump is coupled to the cavity and is used to evacuate the cavity in a started state so that the cavity reaches a vacuum state.

2. The device according to claim 1, characterized in that The water vapor detection mechanism also includes an electronic signal transmitter, which is used to receive the control signal output by the controller and transmit it.

3. The device according to claim 1, characterized in that A vacuum valve is arranged on the surface of the cavity.

4. The device according to claim 1, characterized in that The water vapor detection mechanism also includes a detection tube, which is connected between the cavity and the detector. The detector detects the water vapor content in the cavity through the detection tube.

5. The device according to claim 4, characterized in that The material of the detection tube is alloy.

6. The device according to claim 4, characterized in that The side wall of the cavity is provided with a through hole for connecting the detection tube.

7. The device according to claim 1, characterized in that The driving mechanism further comprises an exhaust pipe, wherein the exhaust pipe is connected between the cavity and the vacuum pump, and the vacuum pump exhausts air from the cavity through the exhaust pipe when the vacuum pump is started.

8. The device according to claim 7, characterized in that The side wall of the cavity is provided with a through hole for connecting the air extraction pipe.

9. The device according to claim 1, characterized in that The water vapor detection mechanism and the driving mechanism are respectively arranged on two opposite sides outside the cavity.

10. The device according to claim 1, characterized in that The device further comprises a bottom plate, and the driver and the vacuum pump are both arranged on the bottom plate.

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