Silicon wafer degumming material frame
By designing the bottom support component of the adjustable silicon wafer degumming frame, the crushing problems caused by untidy arrangement and manual pressing of the silicon wafer during the degumming process are solved, and the efficient and neat silicon wafer degumming process is achieved, improving the quality and degumming efficiency of the silicon wafer.
Patent Information
- Application Number
- CN202420542250.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-19
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-03-19
AI Technical Summary
During the degumming process of existing silicon wafer degumming frames, the friction resistance of the basket cotton is large when the silicon wafer falls, resulting in the uneven arrangement of the silicon wafer when it falls on the bottom rod. Especially when it is used to degummize smaller silicon wafers, the uneven dropping phenomenon is more serious. It is necessary to manually press the silicon wafer neatly, which can easily cause the edges of the silicon wafer to break, affecting the quality and degumming efficiency of the silicon wafer.
A silicon wafer degumming frame is designed, including the frame body and the bottom support assembly. The bottom support assembly is equipped with an adjustable bearing surface. The installation height and position of the horizontal longitudinal rod are adjusted through the adjustment parts to ensure that the silicon wafers are arranged neatly when they fall on the bearing surface.
By adjusting the height and size of the bearing surface, the silicon wafer is neatly placed during the degumming process, avoiding the breakage of the silicon wafer caused by manual pressing, improving the degumming efficiency and the quality of the silicon wafer. At the same time, the structure is simple and easy to be transformed on existing equipment, with good economic benefits and promotion value.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of silicon chip debonding, in particular to a silicon chip debonding material frame. Background Art
[0002] One of the processes in the production and manufacturing of silicon wafers is to cut the silicon rod in a direction perpendicular to the axis to form a number of thin silicon wafers. In the slicing process, the adhesive plate needs to be bonded to the crystal support first, and then one side of the silicon rod is bonded to the adhesive plate, so that the silicon rod is fixed in the cabin of the slicer through the crystal support, and the silicon rod is cut. The silicon wafers formed by cutting are closely arranged together and remain in a state of adhesion with the adhesive plate. Therefore, it is necessary to use a tool such as a degumming frame to degumming the silicon wafers so as to separate the adhesive plate from the silicon wafers. After the silicon wafers and the adhesive plate of the existing degumming frame are separated, the silicon wafers fall to the bottom rod horizontally installed at the bottom of the silicone material frame. The height of the bottom rod cannot be adjusted. During the falling process of some specifications of silicon wafers, the friction resistance of the material basket cotton is large, resulting in uneven arrangement of the silicon wafers when they fall on the bottom rod. Especially when used for degumming smaller silicon wafers, the phenomenon of uneven falling is more serious, and the silicon wafers need to be manually pressed neatly. The pressing process often causes the edges of the silicon wafers to break, affecting the quality of the silicon wafers and the degumming efficiency. Utility Model Content
[0003] In order to solve the above technical problems, the utility model provides a silicon wafer debonding frame, which can be applicable to silicon wafers of different specifications, thereby improving the debonding efficiency and the quality of silicon wafers.
[0004] The technical solution adopted by the utility model is:
[0005] A silicon wafer debonding frame is used to separate silicon wafers from adhesive plates, the debonding frame comprising a frame body and a bottom support assembly; the frame body is provided with a cavity with an opening; the bottom support assembly is arranged in the cavity and connected to the frame body, the bottom support assembly has a bearing surface for bearing silicon wafers, and the position and size of the bearing surface can be adjusted.
[0006] Furthermore, the bottom support assembly includes a fixing member, a horizontal longitudinal rod and an adjusting member; the fixing member is connected to the frame body; and both ends of the horizontal longitudinal rod are respectively fixed to the fixing member through the adjusting member.
[0007] Furthermore, the plurality of horizontal longitudinal rods form the bearing surface, and the size of the bearing surface is adjusted by adjusting the distance between adjacent adjusting members.
[0008] Furthermore, the adjusting member has a first end and a second end relative to each other, the first end is provided with a first hole, a plurality of the first holes are dispersedly arranged in a direction perpendicular to the bearing surface, and the horizontal longitudinal rod is selectively fixed to the first hole; the second end is provided with a slot, and the fixing member is embedded in the slot.
[0009] Furthermore, the fixing member is attached to the inner wall of the slot.
[0010] Furthermore, a second hole is provided on the side wall of the card slot, a card member is provided in the second hole, and the card member abuts against the fixing member.
[0011] Furthermore, the spacing between the first holes is set according to the specifications of the silicon wafer.
[0012] Furthermore, the end surface where the first hole is located is recessed inward to form a groove.
[0013] Furthermore, it also includes auxiliary supports parallel to the horizontal longitudinal rod, and the auxiliary supports are arranged on the frame body on both sides of the length direction of the horizontal longitudinal rod, and are used for installing the material basket cotton.
[0014] The advantages and positive effects of the utility model are as follows: by setting an adjusting piece to adjust the installation height and position of the horizontal longitudinal rod, the height and size of the bearing surface can be adjusted, so that the silicon wafers are arranged neatly when they fall on the horizontal longitudinal rod, eliminating the manual pressing operation of the degumming worker, improving the degumming efficiency, and effectively reducing the probability of crushing the silicon wafers and causing damage by falling, thereby ensuring the quality of the silicon wafers; at the same time, the structure is simple and easy to be modified on the basis of existing equipment, with good economic benefits and promotion value. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural schematic diagram of a specific embodiment of the utility model;
[0016] Figure 2 It is a top view of a specific embodiment of the utility model;
[0017] Figure 3 It is a front view of a specific embodiment of the utility model;
[0018] Figure 4 It is a schematic diagram of the structure of an adjusting member of a specific embodiment of the utility model;
[0019] In the figure:
[0020] 1. Frame body 2. Bottom support assembly 21. Fixing parts
[0021] 22, adjusting member 221, first end portion 222, first hole
[0022] 223, second end 224, slot 225, second hole
[0023] 226, clamp 23, horizontal longitudinal rod 3, auxiliary support
[0024] 4. Silicon wafer DETAILED DESCRIPTION
[0025] The embodiments of the present utility model are described below in conjunction with the accompanying drawings.
[0026] First of all, it should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0027] The drawings of this specification are schematic diagrams, which assist in explaining the concept of the utility model and schematically show the shapes of various parts and their mutual relationships. Please note that in order to clearly show the structure of various components of the embodiments of the utility model, the drawings are not drawn according to the same scale. The same reference numerals are used to represent the same parts.
[0028] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0029] In addition, the descriptions of "first", "second", etc. in the application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.
[0030] Reference Figure 1-Figure 4 The utility model provides a silicon wafer debonding material frame, which can be used to carry the debonded silicon wafer 4. The debonding material frame includes a frame body 1 and a bottom support component 2; the frame body 1 is provided with a cavity with an opening, the bottom support component 2 is arranged in the cavity and connected to the frame body 1, and has a bearing surface for carrying the silicon wafer 4, and the position and size of the bearing surface can be adjusted.
[0031] Specifically, the cavity of the debonding frame is a rectangular parallelepiped, and its length and width are both larger than the combination of the silicon wafer 4 and the adhesive board, wherein the adhesive board is in the shape of strips, and the silicon wafer 4 is a uniformly arranged thin slice formed by slicing a square silicon rod, and one side of the silicon wafer 4 is bonded to the adhesive board; the combination of the silicon wafer 4 and the adhesive board enters the cavity through the opening, and the bonding force between the silicon wafer 4 and the adhesive board is eliminated in the debonding frame, so that the silicon wafer 4 is separated from the adhesive board, and falls on the bearing surface of the bottom support assembly 2 under the action of its own gravity, and the silicon wafer 4 is in a perpendicular state to the bearing surface, and multiple silicon wafers 4 are evenly arranged on the bearing surface.
[0032] By adjusting the position of the carrying surface, the falling distance of the silicon wafer 4 can be shortened to prevent uneven falling of the wafers; by adjusting the size of the carrying surface, it can be better adapted to silicon wafers 4 of different specifications.
[0033] In the prior art, the silicon wafer 4 is separated from the adhesive plate by the debonding liquid in the debonding material frame, which will not be described in detail here.
[0034] In a specific embodiment, the opening is located at the top of the frame body 1, and the bottom support assembly 2 is located at the bottom opposite thereto.
[0035] Furthermore, the bottom support assembly 2 includes a fixing member 21, a horizontal longitudinal rod 23 and an adjusting member 22; the fixing member 21 is connected to the frame body 1; both ends of the horizontal longitudinal rod 23 are respectively fixed to the fixing member 21 through the adjusting members 22, wherein the upper end of the horizontal longitudinal rod 23 contacts the silicon wafer 4 to form a bearing surface for bearing the silicon wafer 4.
[0036] Preferably, if Figure 1-Figure 3 As shown, the horizontal longitudinal rod 23 is arranged along the length direction of the frame body 1, the fixing member 21 is a through-length member arranged perpendicular to the horizontal longitudinal rod 23, and the two ends of the fixing member 21 are connected to the two sides of the width direction of the frame body 1 and are arranged at the two ends of the length direction of the frame body 1; the adjusting member 22 is detachably connected to the fixing member 21 and is connected to the horizontal longitudinal rod 23; by selectively installing the adjusting member 22 at different positions of the fixing member 21, the installation position of the horizontal longitudinal rod 23 and the distance between adjacent horizontal longitudinal rods 23 can be adjusted; specifically, when the debonding material frame is used for larger specifications When the silicon wafer 4 is large, the bearing surface of the horizontal longitudinal rod 23 can be increased by adjusting the installation position of the adjusting member 22. It can be understood that the horizontal longitudinal rod 23 is located at the bottom of the silicon wafer 4 to support the silicon wafer 4. In order to balance the force on various parts of the silicon wafer 4, the position of the adjusting member 22 should be set so that the bearing surface formed by the horizontal longitudinal rod 23 is supported on the middle part of the bottom of the silicon wafer 4; correspondingly, when the debonding material frame is used for silicon wafers 4 of smaller specifications, the bearing surface of the horizontal longitudinal rod 23 can be reduced by adjusting the installation position of the adjusting member 22 to match the bottom size of the silicon wafer 4.
[0037] In other embodiments of the present invention, the fixing member 21 is arranged at the bottom of the frame body 1, and can be a through-length member or multiple dispersed structures, both of which can realize the function of supporting and positioning the horizontal longitudinal rod 23, and can be set according to different conditions of the silicone material frame.
[0038] Specifically, when the fixing member 21 is a full-length member arranged at the bottom of the frame body 1, it is arranged along the width direction of the frame body 1 and at both ends of the length direction of the bottom of the frame body 1. The adjusting member 22 is installed at different positions of the fixing member 21. The horizontal longitudinal rod 23 is connected to the adjusting member 22 and is perpendicular to the fixing member 21. By selectively installing the adjusting member 22 at different positions of the fixing member 21, the installation position of the horizontal longitudinal rod 23 and the distance between adjacent horizontal longitudinal rods 23 can be adjusted to support silicon wafers 4 of different sizes.
[0039] When the fixing parts 21 are multiple dispersed components set at the bottom of the frame body 1, the fixing parts 21 are dispersedly arranged along the width direction of the frame body 1 and are set at both ends of the length direction of the bottom of the frame body 1. The adjusting parts 22 are installed on different fixing parts 21, and the horizontal longitudinal rods 23 are connected to the adjusting parts 22 and are parallel to the length direction of the frame body 1. By selectively installing the adjusting parts 22 on different fixing parts 21, the installation position of the horizontal longitudinal rods 23 and the distance between adjacent horizontal longitudinal rods 23 can be adjusted to support silicon wafers 4 of different sizes.
[0040] Preferably, in order to make the fixation of the silicon wafer 4 more stable, a plurality of horizontal longitudinal rods 23 are arranged in parallel to form a bearing surface. Specifically, the number of the horizontal longitudinal rods 23 is two or more. In the present embodiment, the number of the horizontal longitudinal rods 23 is two, and the size of the bearing surface is adjusted by adjusting the distance between adjacent adjusting members 22.
[0041] Furthermore, if Figure 4 As shown, the adjusting member 22 has a first end 221 and a second end 223 opposite to each other. The first end 221 is provided with a first hole 222. A plurality of first holes 222 are dispersedly arranged in a direction perpendicular to the bearing surface. The horizontal longitudinal rod 23 is selectively fixed to the first hole 222. The second end is provided with a slot 224, and the fixing member 21 is embedded in the slot 224. Specifically, the end of the horizontal longitudinal rod 23 passes through the first hole 222 and is fixed by a fastener. When the horizontal longitudinal rod 23 passes through different first holes 222, the distance between the bearing surface of the horizontal longitudinal rod 23 and the opening is different, and it can be set and adjusted according to the bearing requirements of silicon wafers 4 of different sizes. By embedding the fixing member 21 in the slot 224, it is convenient to install and disassemble the adjusting member 22, and the installation position of the horizontal longitudinal rod 23 can be better adjusted to meet the bearing requirements of silicon wafers 4 of different sizes.
[0042] In this embodiment, by setting the adjustment member 22, the horizontal longitudinal rod 23 can be adjusted in the horizontal direction and the vertical direction, so as to better meet the needs of silicon wafers 4 of different specifications and sizes, so that the silicon wafers 4 can be arranged neatly when they fall onto the horizontal longitudinal rod 23, thereby avoiding damage to the silicon wafers caused by manual pressing, affecting the silicon wafer forming rate and degumming efficiency; at the same time, for silicon wafers 4 with smaller specifications, by adjusting the installation height of the horizontal longitudinal rod 23, the falling distance of the silicon wafer 4 is shortened, and the impact of the falling silicon wafer 4 with the horizontal longitudinal rod 23 is reduced, which helps to ensure the integrity of the silicon wafer 4.
[0043] Preferably, the fixing member 21 fits against the inner wall of the slot 224, so that the adjusting member 22 can be stably fixed to the fixing member 21; in the present embodiment, the fixing member 21 is a member with a square cross-section, and the slot 224 is a directional slot with an opening, and matches the size of the fixing member 12, so that the fixing member 21 can be easily embedded in the slot 224 and fit against the inner wall of the slot 224; the weight of the silicon wafer 4 is transferred downward to the horizontal longitudinal rod 23, and the horizontal longitudinal rod 23 transfers the pressure to the adjusting member 22, and even under high pressure, the adjusting member 22 will not deviate to the sides of the fixing member 21.
[0044] In some other embodiments of the utility model, the shape of the fixing member 21 is circular or any other shape, and a part of the fixing member 21 is embedded in the card slot 224. The side wall of the card slot 224 is provided with a second hole 225. A clamping member 226 is provided in the second hole 225. The clamping member 226 abuts against the fixing member 21 to achieve the goal of firmly fixing the adjusting member 22 to the fixing member 21.
[0045] In other embodiments of the utility model, the shape of the fixing member 21 is circular or any other shape, and the fixing member 21 is completely embedded in the slot 224, that is, the adjusting member 22 is sleeved on the outside of the fixing member 21; the side wall of the slot 224 is provided with a second hole 225, and the second hole 225 is provided with a clamping member 226, which abuts against the fixing member 21 to achieve the adjustment member 22 being firmly fixed to the fixing member 21.
[0046] Preferably, in order to achieve precise adjustment for silicon wafers 4 of different sizes, the spacing between the first holes 222 is set according to the specifications of the silicon wafer 4; specifically, when the horizontal longitudinal rod 23 is connected to different first holes 222, it can effectively support the silicon wafer 4 of a certain size to achieve the best clamping effect, prevent the silicon wafer 4 from falling and being damaged during the clamping process, and ensure the quality of the silicon wafer 4.
[0047] Preferably, Figure 4 As shown, the end of the horizontal longitudinal rod 23 passes through the first hole 222 and is fixed by a fastener. In order to prevent the fastener from protruding outward and causing obstacles to human operation and other components, the end surface where the first hole 222 is located is recessed inward to form a groove.
[0048] In a specific embodiment, the distance between the centers of the first holes 222 at both ends is 15 mm, that is, the installation height of the horizontal longitudinal rod 23 can be adjusted within a range of 15 mm; this range can be set according to the specifications of common silicon wafers 4 and usage requirements.
[0049] Furthermore, the degumming material frame also includes an auxiliary support 24 parallel to the horizontal longitudinal rod 23. The auxiliary support 24 is arranged on the frame body 1 on both sides of the length direction of the horizontal longitudinal rod 23, and is used to install the material basket cotton. The accommodating space formed by the material frame cotton and the horizontal longitudinal rod 23 is used to place the silicon wafer 4.
[0050] A specific embodiment and comparative example are listed below to further illustrate the technical content of this application.
[0051] Example 1
[0052] like Figure 1-Figure 4 As shown, a silicon wafer debonding frame is used to separate a silicon wafer 4 from an adhesive plate (not shown), and the debonding frame includes a frame body 1, a bottom support assembly 2 and an auxiliary support 3; the frame body 1 is provided with a cavity with an opening, and the overall cavity is a rectangular parallelepiped, the opening is located at the top of the frame body 1, and the bottom support assembly 2 is located at the bottom opposite thereto.
[0053] The bottom support assembly 2 includes a fixing member 21, a horizontal longitudinal rod 23 and an adjusting member 22; the fixing member 21 is a through-length member arranged at the bottom of the frame body 1, has a square cross section, is arranged along the width direction of the frame body 1, and is arranged at both ends of the length direction of the bottom of the frame body 1;
[0054] The adjusting member 22 has a first end 221 and a second end 223 opposite to each other. The first end 221 is provided with a first hole 222. The plurality of first holes 222 are dispersedly arranged in a direction perpendicular to the bearing surface, and the spacing between the first holes 222 is set according to the specifications of the silicon wafer 4. The end surface where the first hole 222 is located is recessed inward to form a groove. The end of the horizontal longitudinal rod 23 passes through the first hole 222 and is fixed by a fastener. The second end is provided with a slot 224. The side wall of the slot 224 is provided with a second hole 225. A clamping member 226 is provided in the second hole 225. The clamping member 226 abuts against the fixing member 21 to achieve the adjustment member 22 being firmly fixed to the fixing member 21.
[0055] There are two horizontal longitudinal rods 23 , and both ends of the horizontal longitudinal rods 23 are connected to fixing members 21 arranged at both ends of the bottom of the frame body 1 in the length direction through adjusting members 22 to form a bearing surface for bearing the silicon wafer 4 .
[0056] The auxiliary supports 24 are arranged on the frame body 1 on both sides of the horizontal longitudinal rod 23 in the length direction, and are used to install the material basket cotton. The accommodating space formed by the material frame cotton and the horizontal longitudinal rod 23 is used to place the silicon wafer 4.
[0057] When the horizontal longitudinal rod 23 passes through different first holes 222, the distance between the bearing surface of the horizontal longitudinal rod 23 and the opening is different, and can be set and adjusted according to the bearing requirements of silicon wafers 4 of different specifications and sizes; at the same time, the size of the bearing surface is adjusted by adjusting the distance between adjacent adjusting parts 22 to adapt to the bearing requirements of silicon wafers 4 of different specifications and sizes.
[0058] In this embodiment, the degumming frame is used to degumming silicon wafers 4 with specifications of 182.2mm×183.75mm and 210mm×210.15mm. By adjusting the installation height of the horizontal longitudinal rod 23 and the installation position of the adjusting member 22, the height and size of the bearing surface can be adjusted, so that the silicon wafers 4 are arranged neatly when they fall on the horizontal longitudinal rod 23, eliminating the manual pressing operation of the degumming worker, reducing the work intensity of the degumming workers, and reducing the waste of working hours caused by pressing the wafers. On average, each cut of silicon material can save 1 minute of working time, and each shift can reduce 80 minutes of working hours. At the same time, the probability of breaking the silicon wafers and causing damage by falling is greatly reduced, thereby ensuring the wafer success rate.
[0059] Comparative Example 1
[0060] A silicon wafer debonding frame in the prior art is used to separate silicon wafers from adhesive plates. The debonding frame includes a frame body and a bottom support assembly. The frame body is provided with a cavity with an opening. The overall cavity is a rectangular parallelepiped. The opening is located at the top of the frame body, and the bottom support assembly is located at the bottom opposite to it.
[0061] The difference from Example 1 is that the bottom support assembly includes a fixing member and an adjusting member, the fixing member is a through-length member arranged at the bottom of the frame body, has a square cross section, is arranged along the width direction of the frame body, and is arranged at both ends of the length direction of the bottom of the frame body;
[0062] There are two horizontal longitudinal bars, and both ends of the horizontal longitudinal bars are vertically connected to the fixing pieces respectively.
[0063] Compared with comparative example 1, the silicon wafer degumming frame proposed by the utility model adjusts the installation height and position of the horizontal longitudinal rod by setting an adjusting piece, thereby realizing the adjustment of the height and size of the bearing surface, so that the silicon wafers are arranged neatly when they fall on the horizontal longitudinal rod, eliminating the manual pressing operation of the degumming worker, improving the degumming efficiency, effectively reducing the probability of crushing the silicon wafers and causing damage by falling, and ensuring the quality of the silicon wafers; at the same time, the structure is simple, easy to be modified on the basis of existing equipment, and has good economic benefits and promotion value.
[0064] The above is a detailed description of the embodiments of the utility model, but the contents are only preferred embodiments of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.
Claims
1. A silicon wafer debonding frame, used to carry debonded silicon wafers, characterized by: The debonding material frame includes a frame body and a bottom support assembly; the frame body is provided with a cavity with an opening; the bottom support assembly is arranged in the cavity and connected to the frame body, and the bottom support assembly has a bearing surface for bearing a silicon wafer, and the position and size of the bearing surface can be adjusted.
2. The silicon wafer debonding frame according to claim 1, characterized in that: The bottom support assembly comprises a fixing member, a horizontal longitudinal rod and an adjusting member; the fixing member is connected to the frame body; and both ends of the horizontal longitudinal rod are respectively fixed to the fixing member through the adjusting member.
3. The silicon wafer debonding frame according to claim 2, characterized in that: A plurality of the horizontal longitudinal bars form the bearing surface, and the size of the bearing surface is adjusted by adjusting the distance between adjacent adjusting members.
4. The silicon wafer debonding frame according to claim 3, characterized in that: The adjusting member has a first end and a second end relative to each other, the first end is provided with a first hole, a plurality of the first holes are dispersedly arranged in a direction perpendicular to the bearing surface, and the horizontal longitudinal rod is selectively fixed to the first hole; the second end is provided with a slot, and the fixing member is embedded in the slot.
5. The silicon wafer debonding frame according to claim 4, characterized in that: The fixing member is attached to the inner wall of the slot.
6. The silicon wafer debonding frame according to claim 4, characterized in that: A second hole is arranged on the side wall of the card slot, a card member is arranged in the second hole, and the card member abuts against the fixing member.
7. The silicon wafer debonding frame according to any one of claims 4 to 6, characterized in that: The intervals between the first holes are set according to the specifications of the silicon wafer.
8. The silicon wafer debonding frame according to claim 7, characterized in that: The end surface where the first hole is located is recessed inward to form a groove.
9. The silicon wafer debonding frame according to claim 2 or 8, characterized in that: It also includes auxiliary supports parallel to the horizontal longitudinal rod, and the auxiliary supports are arranged on the frame body on both sides of the length direction of the horizontal longitudinal rod and are used for installing the material basket cotton.