Wafer transmission processing system

Abstract

The utility model belongs to the technical field of semiconductors, and discloses a wafer transmission processing system which comprises a conveying mechanism, a wafer storage box, a wafer centering mechanism and a wafer spin-drying mechanism, the conveying mechanism comprises a multi-axis robot and a clamping jaw mechanism, the tail end of the multi-axis robot is provided with the clamping jaw mechanism, the clamping jaw mechanism is used for grabbing wafers, and the wafer storage box is used for storing the wafers. The multi-axis robot is used for driving the clamping jaw mechanism to drive the wafer to transfer among the storage position, the centering position and the spin-drying position; the wafer storage box is arranged at the storage position, the wafer centering mechanism is arranged at the centering position, and the wafer spin-drying mechanism is arranged at the spin-drying position. According to the wafer transmission processing system provided by the utility model, feeding and discharging of the wafer among the wafer storage box, the wafer centering mechanism and the wafer spin-drying mechanism are realized, and the multi-axis robot is convenient to install and maintain, small in occupied space and high in motion precision.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a wafer transmission and processing system. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits, and its original material is silicon. Before processing, wafers are generally stored in storage boxes to facilitate transfer and prevent the wafers from being damaged during the transfer process. During processing, it is necessary to go through multiple processes such as centering, grinding, and cleaning of the wafer transfer processing system. Specifically, first, the storage box containing the unthinned wafers is placed in the designated position, and then the unthinned wafers are taken out of the storage box through the transmission mechanism and placed on the wafer centering mechanism for centering. Then, after the wafer is centered, it will be transferred to the working disk of the wafer thinning machine for grinding, and then transferred to the wafer drying mechanism for cleaning, and finally the wafer is placed in another storage box through the transmission mechanism.

[0003] In the prior art, the transmission mechanism is generally assembled through a combination of multiple groups of screw rods and linear guides. The screw rods and linear guides have high installation accuracy requirements, there are many parts, and the design is complex, which leads to inconvenient installation. The wafer transmission and processing system occupies a large space, is difficult to maintain, and has poor movement accuracy. Utility Model Content

[0004] The utility model aims to provide a wafer transmission and processing system, which is convenient to install and maintain, occupies a small space and has high movement precision.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A wafer transfer processing system is provided, comprising:

[0007] The conveying mechanism includes a multi-axis robot and a gripper mechanism, wherein the gripper mechanism is disposed at the end of the multi-axis robot, the gripper mechanism is used to grab the wafer, and the multi-axis robot is used to drive the gripper mechanism to drive the wafer to transfer between the storage position, the centering position and the drying position;

[0008] A wafer storage box is arranged at the storage position;

[0009] A wafer centering mechanism, arranged at the centering position;

[0010] The wafer drying mechanism is arranged at the drying position.

[0011] Optionally, the multi-axis robot comprises:

[0012] Pedestal;

[0013] A first rotating arm is arranged on the base to rotate around a vertical direction;

[0014] The second rotating arm is arranged on the first rotating arm so as to rotate around a vertical direction, and the clamping mechanism is arranged at the end of the second rotating arm.

[0015] Optionally, the multi-axis robot further includes at least one third rotating arm, and the third rotating arm is arranged between the first rotating arm and the second rotating arm.

[0016] Optionally, the second rotating arm includes a fixed seat and a telescopic rod, the fixed seat is rotatably arranged on the first rotating arm, the telescopic rod is connected to the clamping claw mechanism, and the telescopic rod can be telescopically moved relative to the fixed seat.

[0017] Optionally, the multi-axis robot further comprises a lifting arm disposed on the base, the lifting arm being capable of telescopic movement in a vertical direction relative to the base, and the first rotating arm being rotatably disposed on the lifting arm.

[0018] Optionally, the gripper mechanism axis is rotatably disposed at the end of the multi-axis robot.

[0019] Optionally, the conveying mechanism further includes a linear module, the multi-axis robot is arranged on the linear module, and the linear module can drive the multi-axis robot to move in a horizontal direction.

[0020] Optionally, the storage position, the centering position and the drying position are arranged at intervals around the conveying mechanism.

[0021] Optionally, the storage position, the centering position and the drying position are arranged at intervals in the horizontal direction.

[0022] Optionally, the wafer storage box includes a first storage box and a second storage box, and the first storage box and the second storage box are arranged side by side at the storage position.

[0023] Beneficial effects of the utility model:

[0024] The utility model provides a wafer transmission and processing system in which the conveying mechanism replaces the traditional combination of a lead screw and a linear guide rail with a multi-axis robot, and drives the wafer to transfer between the storage position, the centering position and the drying position through a clamping mechanism, thereby realizing the loading and unloading of wafers between the wafer storage box, the wafer centering mechanism and the wafer drying mechanism. The multi-axis robot is easy to install and maintain, occupies a small space and has high movement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the layout structure of the wafer transmission and processing system provided by the utility model;

[0026] Figure 2It is a structural schematic diagram of the conveying mechanism provided by the utility model;

[0027] Figure 3 It is a perspective schematic diagram of a partial structure of a wafer transfer processing system provided by the utility model;

[0028] Figure 4 It is a schematic diagram from another perspective of a partial structure of the wafer transmission and processing system provided by the utility model.

[0029] In the figure:

[0030] 100, conveying mechanism; 110, multi-axis robot; 111, base; 112, first rotating arm; 113, second rotating arm; 114, third rotating arm; 115, lifting arm; 120, clamping mechanism; 130, linear module;

[0031] 210, wafer storage box; 211, first storage box; 212, second storage box; 220, wafer centering mechanism; 230, wafer drying mechanism. DETAILED DESCRIPTION

[0032] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0033] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0035] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0036] Reference Figures 1 to 4 As shown, this embodiment provides a wafer transfer processing system, which includes a conveying mechanism 100 , a wafer storage box 210 , a wafer centering mechanism 220 and a wafer spin-drying mechanism 230 .

[0037] Specifically, the conveying mechanism 100 includes a multi-axis robot 110 and a gripper mechanism 120. The gripper mechanism 120 is disposed at the end of the multi-axis robot 110. The gripper mechanism 120 is used to grab wafers. The multi-axis robot 110 is used to drive the gripper mechanism 120 to drive the wafers to transfer between the storage position, the centering position, and the drying position. The wafer storage box 210 is disposed at the storage position, the wafer centering mechanism 220 is disposed at the centering position, and the wafer drying mechanism 230 is disposed at the drying position. The specific structures of the wafer storage box 210, the wafer centering mechanism 220, and the wafer drying mechanism 230 are prior art and are not the focus of this application, and will not be described in detail.

[0038] In this embodiment, the conveying mechanism 100 replaces the traditional combination of a screw and a linear guide with a multi-axis robot 110, and drives the wafer to transfer between the storage position, the centering position and the drying position through the clamping mechanism 120, thereby realizing the loading and unloading of wafers between the wafer storage box 210, the wafer centering mechanism 220 and the wafer drying mechanism 230. The multi-axis robot 110 is easy to install and maintain, occupies a small space, has high movement accuracy, reduces the processing cost of the conveying mechanism 100, and improves assembly efficiency.

[0039] Furthermore, the wafer transport processing system also includes a wafer thinning machine (not shown), which is arranged between the centering position and the drying position. In this embodiment, the unthinned wafer is first transferred to the wafer centering mechanism 220 for centering by the conveying mechanism 100, and then the wafer is transferred to the working disk of the wafer thinning machine for grinding and thinning, and finally the wafer is transferred to the wafer drying mechanism 230 for cleaning, and finally the wafer is taken out and transferred from the wafer drying mechanism 230 by the conveying mechanism 100. Among them, the specific structure of the wafer thinning machine is the prior art and is not the focus of this application, and will not be repeated here.

[0040] Furthermore, the wafer storage box 210 includes a first storage box 211 and a second storage box 212, and the first storage box 211 and the second storage box 212 are arranged side by side at the storage position. In this embodiment, the unthinned wafers in the first storage box 211 can be taken out through the conveying mechanism 100 and transferred to the centering mechanism for centering, and the thinned wafers can also be taken out from the wafer drying mechanism 230 and transferred to the second storage box 212 for storage through the conveying mechanism 100. The first storage box 211 and the second storage box 212 are arranged side by side at the storage position, so that the structure of the wafer transmission and processing system can be compact, and the replenishment of the first storage box 211 when it is short of material and the removal of the second storage box 212 when it is full of material are both carried out at the storage position, so as to facilitate the planning of the material transportation route.

[0041] In this embodiment, continue to refer to Figures 1 to 4 As shown, the multi-axis robot 110 includes a base 111, a first rotating arm 112 and a second rotating arm 113. The first rotating arm 112 is arranged on the base 111 to rotate around the vertical direction; the second rotating arm 113 is arranged on the first rotating arm 112 to rotate around the vertical direction, and a clamping mechanism 120 is arranged at the end of the second rotating arm 113. In this embodiment, through the rotation setting of the first rotating arm 112 and the second rotating arm 113, the clamping mechanism 120 can clamp the wafer in the horizontal plane to reach the required workstation, which is convenient for control, has high movement accuracy, high space utilization, and optimizes the layout of the wafer transmission and processing system. The b direction in the figure is the vertical direction, and the plane perpendicular to the b direction is the horizontal plane.

[0042] Specifically, a first end of the first rotating arm 112 is rotatably connected to the base 111 , a second end of the first rotating arm 112 is rotatably connected to a first end of the second rotating arm 113 , and a second end of the second rotating arm 113 is connected to the clamping mechanism 120 .

[0043] In a feasible implementation, the clamp mechanism 120 is rotatably disposed at the end of the multi-axis robot 110, and the clamp mechanism 120 can flip the wafer. Even if the wafer is placed upside down in the first storage box 211, the wafer can be flipped and adjusted by rotating the clamp mechanism 120. In this embodiment, the clamp mechanism 120 is rotatably disposed at the end of the second rotating arm 113, that is, the second end of the second rotating arm 113 is rotatably connected to the clamp mechanism 120.

[0044] In a possible implementation, Figures 1 to 4As shown, the multi-axis robot 110 also includes at least one third rotating arm 114, and the third rotating arm 114 is arranged between the first rotating arm 112 and the second rotating arm 113. Through the design of the third rotating arm 114, the clamping mechanism 120 can have a larger range of motion, and the clamping mechanism 120 can take and place wafers in a more suitable direction, so that the installation position and installation orientation of the wafer storage box 210, the wafer centering mechanism 220 and the wafer drying mechanism 230 can have a wider range, which can optimize the layout of the wafer transmission and processing system and flexibly adjust the layout of the wafer transmission and processing system.

[0045] Exemplarily, when one third rotating arm 114 is provided, the first end of the third rotating arm 114 is rotationally connected to the second end of the first rotating arm 112 around the vertical direction, and the second end of the third rotating arm 114 is rotationally connected to the first end of the second rotating arm 113 around the vertical direction.

[0046] Exemplarily, when there are multiple third rotating arms 114, adjacent third rotating arms 114 are connected in rotation, the third rotating arm 114 at the head end is connected in rotation with the second end of the first rotating arm 112 around the vertical direction, and the third rotating arm 114 at the end end is connected in rotation with the first end of the second rotating arm 113 around the vertical direction. The rotation axis direction between adjacent third rotating arms 114 can be horizontal or vertical, which is not limited in this application. The direction perpendicular to the b direction in the figure is the horizontal direction.

[0047] In a feasible embodiment, at least one of the first rotating arm 112, the second rotating arm 113 and the third rotating arm 114 can be set to a telescopic structure to further expand the movement range of the clamping mechanism 120, so that the installation position range of the wafer storage box 210, the wafer centering mechanism 220 and the wafer drying mechanism 230 is wider, which can optimize the layout of the wafer transfer and processing system and flexibly adjust the layout of the wafer transfer and processing system.

[0048] Exemplarily, the second rotating arm 113 includes a fixed seat (not shown) and a telescopic rod (not shown), the fixed seat is rotatably disposed on the first rotating arm 112, the telescopic rod is connected to the clamping mechanism 120, and the telescopic rod can be telescopically moved relative to the fixed seat.

[0049] In a feasible embodiment, the multi-axis robot 110 also includes a lifting arm 115 arranged on the base 111. The lifting arm 115 can be telescopically moved in the vertical direction relative to the base 111. The first rotating arm 112 is rotatably arranged on the lifting arm 115. Through the setting of the lifting arm 115, the clamping mechanism 120 can be adjusted in the vertical direction. It can be suitable for wafer storage boxes 210 of various heights, wafer centering mechanisms 220 and wafer drying mechanisms 230, thereby improving applicability.

[0050] In a possible implementation, Figures 1 to 4 As shown, the conveying mechanism 100 further includes a linear module 130, on which the multi-axis robot 110 is disposed, and the linear module 130 can drive the multi-axis robot 110 to move in the horizontal direction, so that the installation positions of the wafer storage box 210, the wafer centering mechanism 220, and the wafer drying mechanism 230 are more extensive. For example, the linear module 130 includes but is not limited to a lead screw linear module 130 and a synchronous belt linear module 130, which is convenient for installation and maintenance.

[0051] In some embodiments, Figure 1 As shown, the storage position, the centering position and the drying position are arranged at intervals around the conveying mechanism 100, so that the structure of the wafer transmission and processing system is more compact, and the multi-axis robot 110 can transfer the wafers between the storage position, the centering position and the drying position without the linear module 130 of the conveying mechanism 100. For example, the second storage box 212, the first storage box 211, the wafer centering mechanism 220 and the wafer drying mechanism 230 are arranged at intervals around the conveying mechanism 100, which can shorten the stroke of the clamping mechanism 120 and improve the efficiency of transferring wafers.

[0052] In other embodiments, the storage position, the centering position and the drying position are arranged at intervals in the horizontal direction. In this embodiment, the extension direction of the linear module 130 is the same as the arrangement direction of the storage position, the centering position and the drying position, that is, the direction a in the figure. By setting the linear module 130, the length of the mechanical arm of the multi-axis robot 110 is reduced, the stability of the multi-axis robot 110 is effectively improved, and the high movement accuracy is ensured. Exemplarily, the second storage box 212, the first storage box 211, the wafer centering mechanism 220 and the wafer drying mechanism 230 are arranged in sequence along the extension direction of the linear module 130, and the second storage box 212, the first storage box 211, the wafer centering mechanism 220 and the wafer drying mechanism 230 are arranged on the same side of the linear module 130.

[0053] Of course, the first storage box 211, the second storage box 212, the wafer centering mechanism 220 and the wafer drying mechanism 230 may also be arranged in other orientations, and this application does not make specific limitations.

[0054] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A wafer transfer processing system, characterized in that: include: The conveying mechanism (100) comprises a multi-axis robot (110) and a gripper mechanism (120), wherein the gripper mechanism (120) is arranged at the end of the multi-axis robot (110), the gripper mechanism (120) is used to grasp a wafer, and the multi-axis robot (110) is used to drive the gripper mechanism (120) to drive the wafer to transfer between a storage position, a centering position and a drying position; A wafer storage box (210), arranged at the storage position; A wafer centering mechanism (220) is arranged at the centering position; The wafer drying mechanism (230) is arranged at the drying position.

2. The wafer transfer processing system according to claim 1, characterized in that: The multi-axis robot (110) comprises: Base (111); A first rotating arm (112) is arranged on the base (111) to rotate in a vertical direction; The second rotating arm (113) is arranged on the first rotating arm (112) so as to rotate in a vertical direction, and the clamping claw mechanism (120) is arranged at the end of the second rotating arm (113).

3. The wafer transfer processing system according to claim 2, characterized in that: The multi-axis robot (110) further comprises at least one third rotating arm (114), wherein the third rotating arm (114) is arranged between the first rotating arm (112) and the second rotating arm (113).

4. The wafer transfer processing system according to claim 2, characterized in that: The second rotating arm (113) comprises a fixed seat and a telescopic rod, the fixed seat is rotatably arranged on the first rotating arm (112), the telescopic rod is connected to the clamping claw mechanism (120), and the telescopic rod can be telescopically moved relative to the fixed seat.

5. The wafer transfer processing system according to claim 2, characterized in that: The multi-axis robot (110) further comprises a lifting arm (115) arranged on the base (111), wherein the lifting arm (115) can be telescopically moved in a vertical direction relative to the base (111), and the first rotating arm (112) is rotatably arranged on the lifting arm (115).

6. The wafer transfer processing system according to claim 1, characterized in that: The clamping mechanism (120) is axially rotatably arranged at the end of the multi-axis robot (110).

7. The wafer transport processing system according to claim 1, characterized in that: The conveying mechanism (100) further comprises a linear module (130), the multi-axis robot (110) is arranged on the linear module (130), and the linear module (130) can drive the multi-axis robot (110) to move in a horizontal direction.

8. The wafer transport processing system according to claim 1, characterized in that: The storage position, the centering position and the drying position are arranged at intervals around the conveying mechanism (100).

9. The wafer transport processing system according to claim 1, characterized in that: The storage position, the centering position and the drying position are arranged at intervals in the horizontal direction.

10. The wafer transport processing system according to claim 1, characterized in that: The wafer storage box (210) comprises a first storage box (211) and a second storage box (212), wherein the first storage box (211) and the second storage box (212) are arranged side by side at the storage position.

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