Heat conduction device for LED circuit board
By designing heat conduction, pick-up and buffering mechanisms on the LED circuit board, the problems of poor heat dissipation, inconvenient dissipation of LED circuit boards during use are solved, and more efficient heat dissipation, more convenient maintenance and longer service life are achieved.
Patent Information
- Application Number
- CN202421216798.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-30
AI Technical Summary
The existing LED circuit boards have poor heat dissipation effect when used, inconvenient disassembly, and cannot be buffered and protected, resulting in easy damage to components.
A thermal conduction device of an LED circuit board including a thermal conduction mechanism, a pick-up mechanism and a buffer mechanism is designed. The thermal conduction mechanism consists of a heat sink, a heat conduction pipe and a heat sink. The pick-up mechanism consists of a clamping plate, a buckle groove and a lifting block. The buffer mechanism consists of a limit sleeve, a buffer spring and a limit block.
The heat dissipation effect is significantly improved through the design of the thermal conductivity mechanism; the disassembly and maintenance of the device is facilitated through the design of the pick-up mechanism; the design of the buffer mechanism protects the device from damage from impact and vibration, and extends its service life.
Smart Images
Figure CN222547671U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a heat conduction device for an LED circuit board. Background Art
[0002] Circuit boards are important electronic components, supporting bodies for electronic components, and carriers for electrical connections between electronic components. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Existing LED circuit boards are integrated with LED light sources on their surfaces. The LED light sources emit heat when in use, which can easily damage components inside the LED circuit boards. In addition, most LED circuit boards are embedded, and when inspected or replaced, the surface of the LED circuit boards is smooth, making them inconvenient to remove. In addition, the internal space of the LED circuit boards is compact, and they can easily break and be damaged when impacted or vibrated. To solve the above problems, a heat conduction device for LED circuit boards is needed.
[0003] The existing LED circuit board has the problems of poor heat dissipation effect, inconvenient disassembly, and inability to provide buffer protection during operation. Therefore, a heat conduction device for the LED circuit board is urgently needed. Utility Model Content
[0004] Based on this, the purpose of the utility model is to provide a heat conduction device for an LED circuit board to solve the problems of poor heat dissipation, inconvenient disassembly, and inability to perform buffering protection when the existing LED circuit board is in use.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat-conducting device for an LED circuit board, comprising a circuit board body, a heat-conducting mechanism installed at the bottom of the circuit board body, the heat-conducting mechanism comprising a heat sink, a heat pipe and a heat sink, a heat sink installed at the bottom of the circuit board body, a heat pipe installed on the inner wall of the heat sink, and a heat sink installed on the inner wall of the heat pipe.
[0006] The inner wall of the circuit board body is equipped with a taking mechanism.
[0007] A buffer mechanism is installed at the bottom of the circuit board body.
[0008] Preferably, the heat conducting pipes are arranged at equal intervals with the central axis of the heat dissipation plate as the center, and the heat dissipation fins are arranged in a ring array with the central axis of the heat conducting pipe as the center.
[0009] Preferably, the taking mechanism comprises a card plate, a buckle groove and a lifting block, the card plate is installed on the inner wall of the circuit board body, the buckle groove is opened on the inner wall of the circuit board body, and the lifting block is installed on the inner wall of the card plate.
[0010] Preferably, the lifting blocks are distributed in a rectangular array with the central axis of the circuit board body as the center, and the clamping plate is clamped and connected with the lifting blocks.
[0011] Preferably, the buffer mechanism comprises a limiting sleeve, a buffer spring and a limiting block, the limiting sleeve is installed at the bottom of the circuit board body, the buffer spring is installed on the inner wall of the limiting sleeve, and the limiting block is installed at the bottom of the buffer spring.
[0012] Preferably, the limiting sleeve is movably connected to the limiting block, and the limiting block forms a telescopic structure with the limiting sleeve via a buffer spring.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] 1. The utility model has a heat conduction mechanism, wherein the heat conduction pipes are arranged at equal intervals with the central axis of the heat dissipation plate as the center, and the heat dissipation fins are arranged in a circular array with the central axis of the heat conduction pipe as the center. When the device is used, the heat conduction pipe is hollow inside, and the air will conduct heat when passing through the inside of the heat conduction pipe, and the setting of the heat dissipation fins increases the contact area between the heat conduction pipe and the air. The coordinated use of the heat dissipation plate, the heat conduction pipe and the heat dissipation fins greatly increases the heat conduction effect of the device;
[0015] 2. The utility model has a taking mechanism, and the lifting block and the card board are connected by a snap fit. When the device is used, due to the limited internal space when the circuit board body is installed, when the circuit board body is stationary, the lifting block shrinks into the inside of the circuit board body due to gravity, and the top of the lifting block is horizontally aligned with the top of the circuit board body. The structure is compact and does not take up space. When the circuit board body needs to be taken out, the finger is inserted into the buckle groove to lift the lifting block, and the lifting block drives the card board to lift the circuit board body, which is convenient for later maintenance and replacement, and increases the practicality of the device;
[0016] 3. The utility model provides a buffer mechanism, in which the limit block forms a telescopic structure through a buffer spring and a limit sleeve. When the device is in use, when the circuit board body is hit or violently vibrated, it is easy to cause damage to the internal components. The setting of the limit block can absorb the external force through the buffer spring, thereby avoiding the breakage of the circuit board body or damage to the internal components and extending the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the structure of the utility model from the front;
[0018] Figure 2 It is a schematic diagram of the structure of the utility model from the side;
[0019] Figure 3 It is a structural schematic diagram of the heat conduction mechanism of the utility model;
[0020] Figure 4 It is a structural schematic diagram of the taking mechanism of the utility model;
[0021] Figure 5 It is a schematic structural diagram of a cross-section of the buffer mechanism of the utility model.
[0022] In the figure: 1. circuit board body; 2. heat conduction mechanism; 201. heat sink; 202. heat conduction pipe; 203. heat sink; 3. taking mechanism; 301. clamping plate; 302. buckle groove; 303. lifting block; 4. buffer mechanism; 401. limit sleeve; 402. buffer spring; 403. limit block. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.
[0024] The following describes an embodiment of the utility model based on its overall structure.
[0025] See also Figure 1-5 A heat conduction device for an LED circuit board comprises a circuit board body 1, a heat conduction mechanism 2 is installed at the bottom of the circuit board body 1, the heat conduction mechanism 2 comprises a heat sink 201, a heat pipe 202 and a heat sink 203, a heat sink 201 is installed at the bottom of the circuit board body 1, a heat pipe 202 is installed on the inner wall of the heat sink 201, a heat sink 203 is installed on the inner wall of the heat pipe 202, the heat pipe 202 is arranged at equal intervals with the central axis of the heat sink 201 as the center, and the heat sink 203 is arranged in a ring array with the central axis of the heat pipe 202 as the center The heat conducting mechanism 2 is arranged in a row distribution. The heat conducting pipes 202 are arranged in an equidistant distribution with the central axis of the heat dissipating plate 201 as the center. The heat dissipating fins 203 are arranged in a ring array with the central axis of the heat conducting pipe 202 as the center. When the device is used, the heat conducting pipe 202 is arranged hollow inside. When air passes through the heat conducting pipe 202, heat is discharged. The arrangement of the heat dissipating fins 203 increases the contact area between the heat conducting pipe 202 and the air. The coordinated use of the heat dissipating plate 201, the heat conducting pipe 202 and the heat dissipating fins 203 greatly increases the heat conduction effect of the device.
[0026] See also Figure 1-5A heat conduction device for an LED circuit board, wherein a pick-up mechanism 3 is installed on the inner wall of a circuit board body 1, and the pick-up mechanism 3 comprises a card board 301, a buckle groove 302 and a lifting block 303. A card board 301 is installed on the inner wall of the circuit board body 1, and a buckle groove 302 is opened on the inner wall of the circuit board body 1. A lifting block 303 is installed on the inner wall of the card board 301, and the lifting blocks 303 are arranged in a rectangular array with the central axis of the circuit board body 1 as the center. The card board 301 is engaged with the lifting blocks 303, and the lifting blocks 303 are connected with the card board through the set pick-up mechanism 3. 301 is a snap-fit connection. When the device is in use, due to the limited internal space when the circuit board body 1 is installed, when the circuit board body 1 is stationary, the lifting block 303 shrinks into the inside of the circuit board body 1 due to gravity, and the top of the lifting block 303 is horizontally aligned with the top of the circuit board body 1. The structure is compact and does not take up space. When the circuit board body 1 needs to be taken out, the finger is inserted into the buckle groove 302 to lift the lifting block 303. The lifting block 303 drives the card board 301 to lift the circuit board body 1, which is convenient for later maintenance and replacement, and increases the practicality of the device.
[0027] See also Figure 1-5 , a heat conduction device for an LED circuit board, a buffer mechanism 4 is installed at the bottom of a circuit board body 1, the buffer mechanism 4 includes a limit sleeve 401, a buffer spring 402 and a limit block 403, a limit sleeve 401 is installed at the bottom of the circuit board body 1, a buffer spring 402 is installed on the inner wall of the limit sleeve 401, a limit block 403 is installed at the bottom of the buffer spring 402, the limit sleeve 401 is movably connected with the limit block 403, the limit block 403 forms a telescopic structure with the limit sleeve 401 through the buffer spring 402, through the buffer mechanism 4, the limit block 403 forms a telescopic structure with the limit sleeve 401 through the buffer spring 402, when the device is used, when the circuit board body 1 is hit or violently vibrated, it is easy to cause damage to the internal components, and the setting of the limit block 403 can absorb the external force through the buffer spring 402, so as to avoid the circuit board body 1 from breaking or the internal components from being damaged, and extend the service life of the device.
[0028] Working principle: When in use, first move the device to the desired position, and then when the LED light source on the surface of the circuit board body 1 lights up, heat is generated, which can easily damage the internal components of the circuit board body 1. The heat pipe 202 is hollow inside, and the air will conduct heat when passing through the inside of the heat pipe 202. The setting of the heat sink 203 increases the contact area between the heat pipe 202 and the air. The coordinated use of the heat sink 201, the heat pipe 202 and the heat sink 203 greatly increases the thermal conductivity of the device. In addition, since the internal space of the circuit board body 1 is limited when the circuit board body 1 is installed, when the circuit board body 1 is stationary, the lifting block 303 shrinks to the inside of the circuit board body 1 due to gravity, and the top of the lifting block 303 is aligned with the top of the circuit board body 1. It is horizontally aligned, has a compact structure, and does not take up space. When the circuit board body 1 needs to be taken out, insert a finger into the buckle groove 302 to lift the lifting block 303. The lifting block 303 drives the card plate 301 to lift the circuit board body 1, which is convenient for later maintenance and replacement and increases the practicality of the device. Finally, when the circuit board body 1 is easily impacted or violently vibrated during installation or use, causing damage to internal components, the setting of the limit block 403 can absorb the external force through the buffer spring 402, avoiding the circuit board body 1 from breaking or internal components from being damaged, and extending the service life of the device. In this way, the use process of the device is completed. The content not described in detail in this manual belongs to the existing technology known to professional and technical personnel in this field.
[0029] The directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the protection content of the present invention.
[0030] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A heat conduction device for an LED circuit board, comprising a circuit board body (1), characterized in that: A heat conduction mechanism (2) is installed at the bottom of the circuit board body (1), the heat conduction mechanism (2) comprising a heat dissipation plate (201), a heat conduction pipe (202) and a heat sink (203); a heat dissipation plate (201) is installed at the bottom of the circuit board body (1), a heat conduction pipe (202) is installed on the inner wall of the heat dissipation plate (201), and a heat sink (203) is installed on the inner wall of the heat conduction pipe (202); The inner wall of the circuit board body (1) is provided with a taking mechanism (3); A buffer mechanism (4) is installed at the bottom of the circuit board body (1).
2. A heat conduction device for an LED circuit board according to claim 1, characterized in that: The heat conducting pipes (202) are arranged in an equidistant distribution with the central axis of the heat dissipation plate (201) as the center, and the heat dissipation fins (203) are arranged in an annular array with the central axis of the heat conducting pipe (202) as the center.
3. The heat conduction device for an LED circuit board according to claim 1, characterized in that: The picking mechanism (3) comprises a card plate (301), a buckle groove (302) and a lifting block (303); the card plate (301) is installed on the inner wall of the circuit board body (1); the buckle groove (302) is opened on the inner wall of the circuit board body (1); and the lifting block (303) is installed on the inner wall of the card plate (301).
4. A heat conduction device for an LED circuit board according to claim 3, characterized in that: The lifting blocks (303) are arranged in a rectangular array with the central axis of the circuit board body (1) as the center, and the clamping plate (301) is clamped and connected with the lifting blocks (303).
5. The heat conduction device for an LED circuit board according to claim 1, characterized in that: The buffer mechanism (4) comprises a limiting sleeve (401), a buffer spring (402) and a limiting block (403); the limiting sleeve (401) is installed at the bottom of the circuit board body (1); the buffer spring (402) is installed on the inner wall of the limiting sleeve (401); and the limiting block (403) is installed at the bottom of the buffer spring (402).
6. A heat conduction device for an LED circuit board according to claim 5, characterized in that: The limiting sleeve (401) is movably connected to the limiting block (403), and the limiting block (403) forms a telescopic structure with the limiting sleeve (401) via a buffer spring (402).