PCB layout structure of permanent magnet synchronous traction type control device

Abstract

The utility model relates to the technical field of circuit board technology, in particular to a PCB layout structure of a permanent magnet synchronous traction type control device. Heat dissipation structures are arranged at pin welding positions of parts of elements or chips which can emit heat during working in the PCB, and the pin welding positions are in heat conduction connection with the heat dissipation structures; the heat dissipation structure is used for heat dissipation and can conduct heat between the front face and the back face of the PCB at the same time. Equivalently splitting a high-capacity element welding position in the PCB into a plurality of low-capacity element welding positions; the size of the device is smaller, and meanwhile the heat dissipation efficiency is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board technology, in particular to a PCB layout structure of a permanent magnet synchronous traction control device. Background Art

[0002] The invention and use of elevators have a history of nearly a hundred years. The door control system of the elevator is a relatively important part. It controls the opening and closing of the door. Since the system is a moving part, it has a very important impact on the reliability of the entire elevator. According to statistics from internal industry data, 60% or more of the failures of an elevator are caused by this system. The original elevator door control system consists of independent "inverters", "asynchronous motors", "deceleration devices", "elevator door motion devices", "door opening deceleration, door opening position switch", "door closing deceleration, door closing position switch". These components constitute a complete system. The system often has a series of fault problems, which are solved by the Chinese patent with application number 2019107678032: a permanent magnet synchronous traction elevator door integrated control device.

[0003] The PCB electronic control board in the permanent magnet synchronous traction control device is often wrapped in plastic and fixed in a predetermined position of the shell by the plastic seal, so that the magnetic induction encoder in the PCB board can be magnetically sensed by the mechanical rotating part located on the rear side of the shell cover to collect data such as the speed and direction of the mechanical rotating part.

[0004] Therefore, in this plastic-sealed environment, the heat generated by the front and rear panels of the PCB board cannot be transmitted to each other, and the heat is confined to the space enclosed by the panel and the shell, and cannot be dissipated quickly and in time. Therefore, the internal space of the shell is usually expanded to provide more space (such as the side of the PCB board) for heat dissipation, which causes the electric control shell to be too large, occupying more space of the permanent magnet synchronous traction control device, resulting in the permanent magnet synchronous traction control device being too large. Utility Model Content

[0005] In view of the above-mentioned defects, the purpose of the present invention is to propose a PCB layout structure of a permanent magnet synchronous traction control device, so that the device can be smaller in size and have higher heat dissipation efficiency.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A PCB layout structure of a permanent magnet synchronous traction control device, wherein a heat dissipation structure is provided at the pin welding position of some components or chips that generate heat during operation in the PCB board, and the pin welding position and the heat dissipation structure are connected by thermal conduction; the heat dissipation structure is used to dissipate heat and conduct heat between the front plate surface and the rear plate surface of the PCB board;

[0008] The large-capacity component welding position in the PCB board is equivalently divided into a plurality of small-capacity component welding positions.

[0009] Furthermore, the heat dissipation structure includes a heat dissipation copper foil layer and at least one heat-conducting structure; the heat dissipation copper foil layer is connected to the pin welding position, the heat dissipation copper foil layer is provided with a plurality of copper foil layer windows, the heat-conducting structure is heat-conductingly connected to the front and back of the PCB board, and the heat-conducting structure is heat-conductingly connected to the plurality of copper foil layer windows.

[0010] Furthermore, the heat-conducting structure includes a heat-conducting groove and a heat-conducting filler; the heat-conducting groove spans across a plurality of copper foil layer openings and passes through the front and rear surfaces of the PCB board;

[0011] The thermal conductive filler is filled in the thermal conductive groove.

[0012] Furthermore, the groove wall of the heat-conducting groove is coated with copper material; and the heat-conducting filler is solder.

[0013] Furthermore, the small-capacity component welding position is a capacitor welding position.

[0014] Furthermore, the heat dissipation copper foil layer avoids other welding positions and wire settings in the PCB board except the pin welding positions.

[0015] Furthermore, the copper foil layer windows are evenly distributed throughout the heat dissipation copper foil layer; and the copper foil layer windows are arranged in front of and / or behind the heat dissipation copper foil layer.

[0016] Furthermore, the heat-conducting groove is in the shape of an elongated strip.

[0017] Furthermore, the small-capacity component welding position is arranged along the edge of the PCB board.

[0018] Furthermore, the PCB board is provided with a plurality of plastic sealing through holes along the welding positions of the small-capacity components.

[0019] The technical solution provided by the utility model can include the following beneficial effects: a heat dissipation structure is set at the pin welding position of some components or chips that generate relatively serious heat during operation in the PCB board for heat dissipation, and heat conduction can be performed between the front and back of the PCB board, so that the heat of the front plastic sealing space and the rear plastic sealing space can be conducted to each other, and the heat is conducted to the shell or the heat dissipation component for heat dissipation, thereby improving the heat dissipation efficiency; at the same time, the pin welding position and the heat dissipation structure are connected by thermal conduction, so that the components or chips that generate relatively serious heat can conduct the heat to the heat dissipation structure through the pin welding position, and the heat is dissipated through the heat dissipation structure, thereby reducing the volume of the permanent magnet synchronous traction control device while improving the heat dissipation efficiency.

[0020] More importantly, large-capacity components (such as large-capacity capacitors) in PCB boards usually generate more heat. Therefore, large-capacity components are equivalently divided into multiple small-capacity components. For example, multiple small-capacity capacitors are connected in parallel to achieve the effect of large-capacity capacitors. This is reflected in the PCB board by dividing the original large-capacity component welding position into multiple small-capacity component welding positions, thereby reducing the height space occupied by the original large-capacity components welded on the PCB board. For example, large capacitors are usually relatively high, and only one component occupies a lot of height space, resulting in a large volume of the permanent magnet synchronous traction control device. Furthermore, the original heat dissipation by only one point of large-capacity components can be changed to multi-point heat dissipation by small-capacity components. The total heat dissipation area is much larger than that of a single component, which is more conducive to rapid heat conduction, and ultimately further reducing the volume of the permanent magnet synchronous traction control device and improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic layout diagram of a PCB layout structure of a permanent magnet synchronous traction control device in one embodiment of the utility model.

[0022] Figure 2 Yes Figure 1 The structural schematic diagram of the heat dissipation structure shown.

[0023] Figure 3 Yes Figure 1 An enlarged schematic diagram of point A is shown.

[0024] Among them: pin welding position 1, heat dissipation structure 2, small capacity component welding position 3, heat dissipation copper foil layer 23, heat conduction structure 22, copper foil layer window 21, heat conduction groove 221, heat conduction filler 222, plastic sealing through hole 4. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the embodiments of the present invention, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0028] Combine the following Figures 1 to 3 , describing the PCB layout structure of a permanent magnet synchronous traction control device of an embodiment of the utility model.

[0029] A PCB layout structure of a permanent magnet synchronous traction control device, wherein a heat dissipation structure 2 is provided at a pin welding position 1 of a component or chip that generates heat during operation in a PCB board, and the pin welding position 1 and the heat dissipation structure 2 are connected by thermal conduction; the heat dissipation structure 2 is used for heat dissipation and heat conduction between a front plate surface and a rear plate surface of the PCB board;

[0030] The large-capacity component soldering position in the PCB board is equivalently divided into a plurality of small-capacity component soldering positions 3.

[0031] The utility model proposes a preferred embodiment of a PCB layout structure of a permanent magnet synchronous traction control device, such as Figures 1 to 3 As shown, some components or chips in the PCB board, such as transformers, capacitors, magnetic induction encoder chips, etc., will generate heat when the PCB is working. Because the components or chips are respectively arranged at the front and back of the PCB board, when the PCB board is in order to make the permanent magnet synchronous traction control device powered, the control board housing is as small as possible, and the PCB board mounting groove of the middle cover of the housing is designed just according to the outline of the PCB board. After the PCB board is placed in the mounting groove for plastic sealing, the front of the PCB board and the housing are surrounded to form a front plastic sealing space, and the back of the PCB board and the housing are surrounded to form a rear plastic sealing space. After the front plastic sealing space and the rear plastic sealing space are plastic sealed with plastic sealing glue, the PCB board is fixed in the housing and can also play To fix the position and to prevent water and dust; therefore, a heat dissipation structure 2 is set at the pin welding position 1 of some components or chips that generate more heat during operation in the PCB board for heat dissipation, and heat conduction can be performed between the front and back of the PCB board, so that the heat of the front plastic sealing space and the rear plastic sealing space can be conducted to each other, and the heat is conducted to the shell or the heat dissipation component for heat dissipation, thereby improving the heat dissipation efficiency; at the same time, the pin welding position 1 and the heat dissipation structure 2 are connected by thermal conduction, so that the components or chips that generate more heat can conduct the heat to the heat dissipation structure 2 through the pin welding position 1, and the heat is dissipated through the heat dissipation structure 2, thereby reducing the volume of the permanent magnet synchronous traction control device while improving the heat dissipation efficiency.

[0032] More importantly, large-capacity components (such as large-capacity capacitors) in PCB boards usually generate more heat. Therefore, large-capacity components are equivalently divided into multiple small-capacity components. For example, multiple small-capacity capacitors are connected in parallel to achieve the effect of large-capacity capacitors. In the PCB board, the original large-capacity component welding position is divided into multiple small-capacity component welding positions 3, thereby reducing the height space occupied by the original large-capacity components welded on the PCB board. For example, it can solve the problem that large capacitors are usually high in height, and only one component occupies a lot of height space, resulting in the problem that the size of the permanent magnet synchronous traction control device is too large. Furthermore, the original heat dissipation by only one point of large-capacity components can be changed to heat dissipation by multiple points of small-capacity components. The total heat dissipation area is much larger than that of a single component, which is more conducive to rapid heat conduction, and finally the size of the permanent magnet synchronous traction control device is further reduced and the heat dissipation efficiency is improved.

[0033] Furthermore, the heat dissipation structure 2 includes a heat dissipation copper foil layer 23 and at least one thermal conductive structure 22; the heat dissipation copper foil layer 23 is connected to the pin welding position 1, the heat dissipation copper foil layer 23 is provided with a plurality of copper foil layer windows 21, the thermal conductive structure 22 is thermally connected to the front and back of the PCB board, and the thermal conductive structure 22 is thermally connected to the plurality of copper foil layer windows 21.

[0034] In this embodiment, the pin welding position 1 is originally only connected to the copper circuit at the copper foil layer of the PCB board. In order to achieve rapid heat dissipation of the component or chip welded at the pin welding position 1, a heat dissipation copper foil layer 23 for heat dissipation is added to the copper foil layer of the PCB board to connect with the pin welding position 1, and then a plurality of copper foil layer windows 21 are opened in the heat dissipation copper foil layer 23, that is, no green oil layer is laid for insulation and isolation, so that the heating component or chip quickly conducts heat to the entire heat dissipation copper foil layer 23 through the pin welding position 1, and finally conducts heat out quickly from the plurality of copper foil layer windows 21, greatly shortening the thermal resistance from the pin to the air, improving the heat dissipation efficiency, reducing the temperature rise of the component or chip, and greatly improving the working reliability of the component or chip.

[0035] In order to achieve heat conduction between the front plastic sealing space and the rear plastic sealing space of the PCB board, at least one heat-conducting structure 22 is provided in the PCB board for heat-conductingly connecting the front and rear sides of the PCB board, so that the heat of the front plastic sealing space and the rear plastic sealing space is conducted through the heat-conducting structure 22; at the same time, the heat-conducting structure 22 is heat-conductingly connected to the plurality of copper foil layer openings 21, so that the heat conducted by them can be quickly dissipated by using the heat dissipating copper foil layer 23 and the copper foil layer openings 21.

[0036] Furthermore, the heat-conducting structure 22 includes a heat-conducting slot 221 and a heat-conducting filler 222; the heat-conducting slot 221 spans across a plurality of copper foil layer openings 21 and passes through the front and rear surfaces of the PCB board;

[0037] The thermal conductive filler 222 is filled in the thermal conductive groove 221 .

[0038] In this embodiment, in order to realize the heat conduction function of the heat conductive structure 22, a heat conductive groove 221 is used to span multiple copper foil layer openings 21 and penetrate the front and rear surfaces of the PCB board to establish a heat conductive channel, and then a heat conductive filler 222 is used to fill the heat conductive groove 221 as a heat conductive medium.

[0039] Furthermore, the groove wall of the heat-conducting groove 221 is coated with copper material; and the heat-conducting filler 222 is solder.

[0040] In this embodiment, in order to make the heat conduction effect of the heat-conducting structure 22 better, the groove wall of the heat-conducting groove 221 is coated with copper material with excellent thermal conductivity, which can quickly conduct the heat between the front plastic sealing space and the rear plastic sealing space of the PCB board to each other, and quickly conduct it to the copper foil layer window 21 for heat dissipation; finally, solder with good thermal conductivity and simple filling is used as the thermal conductive filler 222 to fill the heat-conducting groove 221, which can isolate the front plastic sealing space and the rear plastic sealing space of the PCB board while maintaining heat conduction.

[0041] Furthermore, the small-capacity component welding position 3 is a capacitor welding position.

[0042] In this embodiment, many large capacitors are usually used in the electric control board of the permanent magnet synchronous traction control device, so it is preferred to split the large capacitor welding position in the PCB board into multiple small capacitor welding positions, and the two welding pins of each small capacitor are connected to the copper foil of the top layer and the bottom layer. The heat of the tube core is quickly conducted to the copper foil through the copper pins, which greatly reduces the temperature rise of the capacitor, and can minimize the volume of the permanent magnet synchronous traction control device while improving the heat dissipation efficiency. More importantly, the parallel internal resistance of the dispersed capacitor is greatly reduced, and the current filtering effect is significantly improved with the same capacity, ensuring the reliable operation of the whole machine.

[0043] Furthermore, the heat dissipation copper foil layer 23 avoids other welding positions and wires in the PCB board except the pin welding position 1.

[0044] In this embodiment, the larger the setting area of ​​the heat dissipation copper foil layer 23 is, the better the heat dissipation effect is. Therefore, the heat dissipation copper foil layer 23 often occupies more PCB board space, so it is necessary to avoid other welding positions and wires on the PCB board (such as copper circuits arranged on the PCB board) to prevent short circuits. For example, there are usually no welding positions and wires at the belly projection of the components or chips in the PCB board.

[0045] Furthermore, the copper foil layer windows 21 are evenly distributed all over the heat dissipating copper foil layer 23 ; the copper foil layer windows 21 are arranged in front of and / or behind the heat dissipating copper foil layer 23 .

[0046] In this embodiment, in order to maximize the heat dissipation efficiency of the heat-conducting structure 22, the copper foil layer windows 21 can be evenly distributed throughout the heat dissipating copper foil layer 23; at the same time, according to the direction of the optimal heat dissipation position, the copper foil layer windows 21 can be set in front of and / or behind the heat dissipating copper foil layer 23, that is, on one or both of the front and back sides, to further improve the heat dissipation efficiency.

[0047] Furthermore, the heat conducting groove 221 is in a long strip shape.

[0048] In this embodiment, the heat-conducting grooves 221 are configured in a long strip shape, which can span more copper foil layer windows 21 and achieve better heat dissipation efficiency.

[0049] Furthermore, the small capacity component welding position 3 is arranged along the edge of the PCB board.

[0050] In this embodiment, the small-capacity component welding position 3 is arranged along the edge of the PCB board to effectively avoid other components or chips to prevent them from being affected by heat. At the same time, it is closer to the shell and the heat dissipation speed is faster.

[0051] Furthermore, a plurality of plastic sealing through holes 4 are provided along the small capacity component welding position 3 on the PCB board.

[0052] In this embodiment, when the small-capacity component welding position 3 is arranged along the edge of the PCB board, a plurality of plastic sealing through holes 4 are opened along the small-capacity component welding position 3 of the PCB board to provide a channel for pouring plastic sealing glue on the front or back of the PCB board, which can effectively avoid the core circuit and prevent the groove from affecting the circuit; at the same time, the plurality of small-capacity components can also use the plastic sealing through holes 4 and the plastic sealing glue to conduct heat in the plastic sealing space in the front and back of the PCB board, thereby quickly dissipating the heat of the small-capacity components.

[0053] Other components and operations of the PCB layout structure of a permanent magnet synchronous traction control device according to an embodiment of the utility model are known to ordinary technicians in the field and will not be described in detail here.

[0054] In the description of this specification, the description with reference to the terms "embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0055] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A PCB layout structure of a permanent magnet synchronous traction control device, characterized in that: A heat dissipation structure is provided at the pin welding position of some components or chips in the PCB board that generate heat during operation, and the pin welding position and the heat dissipation structure are connected by thermal conduction; the heat dissipation structure is used to dissipate heat and conduct heat between the front panel surface and the rear panel surface of the PCB board; The large-capacity component welding position in the PCB board is equivalently divided into a plurality of small-capacity component welding positions.

2. The PCB layout structure of a permanent magnet synchronous traction control device according to claim 1, characterized in that: The heat dissipation structure includes a heat dissipation copper foil layer and at least one heat-conducting structure; the heat dissipation copper foil layer is connected to the pin welding position, the heat dissipation copper foil layer is provided with a plurality of copper foil layer windows, the heat-conducting structure is heat-conductingly connected to the front and back of the PCB board, and the heat-conducting structure is heat-conductingly connected to the plurality of copper foil layer windows.

3. The PCB layout structure of a permanent magnet synchronous traction control device according to claim 2, characterized in that: The heat-conducting structure includes a heat-conducting groove and a heat-conducting filler; the heat-conducting groove spans across a plurality of copper foil layer openings and passes through the front and rear surfaces of the PCB board; The thermal conductive filler is filled in the thermal conductive groove.

4. The PCB layout structure of a permanent magnet synchronous traction control device according to claim 3 is characterized in that: The groove wall of the heat-conducting groove is covered with copper material; the heat-conducting filler is solder.

5. The PCB layout structure of a permanent magnet synchronous traction control device according to claim 1, characterized in that: The small-capacity component welding position is a capacitor welding position.

6. The PCB layout structure of a permanent magnet synchronous traction control device according to claim 2, characterized in that: The heat dissipation copper foil layer avoids other welding positions and wire arrangements in the PCB board except the pin welding positions.

7. The PCB layout structure of a permanent magnet synchronous traction control device according to claim 3, characterized in that: The copper foil layer windows are evenly distributed over the heat dissipation copper foil layer; the copper foil layer windows are arranged in front of and / or behind the heat dissipation copper foil layer.

8. The PCB layout structure of a permanent magnet synchronous traction control device according to claim 3, characterized in that: The heat-conducting groove is in the shape of an elongated strip.

9. The PCB layout structure of a permanent magnet synchronous traction control device according to claim 1, characterized in that: The small-capacity component welding position is arranged along the edge of the PCB board.

10. The PCB layout structure of a permanent magnet synchronous traction control device according to claim 8, characterized in that: The PCB board is provided with a plurality of plastic sealing through holes along the welding position of the small-capacity component.

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