Internet of Things integrated case structure
By designing a cleaned heat dissipation mechanism in the integrated IoT chassis, including air intake grooves, dustproof insert plates and quick dissipation mechanisms, the problems of reduced ventilation and insufficient heat dissipation performance of the dustproof net in the prior art are solved, and more efficient heat dissipation effect and convenient cleaning process are achieved.
Patent Information
- Application Number
- CN202421231917.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-31
AI Technical Summary
During the heat dissipation process of existing IoT integrated chassis, the ventilation of the dustproof net will deteriorate as the dust accumulates, affecting the heat dissipation effect, and the heat dissipation performance of a single cooling fan is relatively average.
An integrated IoT chassis structure is designed, and a cleaning-free heat dissipation mechanism is adopted, including air intake slots, air intake ports, dustproof inserts, flow blocks and quick dissipation mechanisms. It can quickly disassemble and install dustproof inserts, which are easy to clean, and improve heat dissipation efficiency through multi-channel and multi-directional heat dissipation methods.
It achieves more efficient heat dissipation effect, and the dustproof plug-in cleaning is convenient, avoiding the problem of reduced ventilation of the dustproof net and improving the overall heat dissipation performance of the chassis.
Smart Images
Figure CN222547787U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of an integrated chassis for the Internet of Things, in particular to an integrated chassis structure for the Internet of Things. Background Art
[0002] The Internet of Things refers to the use of various information sensors, radio frequency identification technology, global positioning system, infrared sensors, laser scanners and other devices and technologies to collect any objects or processes that need to be monitored, connected, and interacted in real time, and collect various required information such as sound, light, heat, electricity, mechanics, chemistry, biology, location, etc. Through various possible network access, it realizes ubiquitous connection between objects and objects, objects and people, and realizes intelligent perception, identification and management of objects and processes. The Internet of Things is an information carrier based on the Internet, traditional telecommunications networks, etc. It allows all ordinary physical objects that can be independently addressed to form an interconnected network. The IoT integrated network chassis is one of the basic hardware of the Internet of Things system. The existing IoT integrated chassis usually has a variety of IoT terminals inside, including single-chip microcomputers, signal transceivers and converters. Data is received and sent through the signal transceivers and converters. The IoT terminals in the IoT integrated chassis often emit a lot of heat when working. Traditional IoT integrated chassis mostly dissipate heat by setting fans in the chassis. The heat dissipation performance of a single cooling fan is relatively general. While dissipating heat, it will adsorb dust particles in the air on the surface of the dustproof net. The dustproof net is mostly installed on the same by bolts, which is not easy to clean. If it is like this for a long time, the ventilation of the dustproof net will deteriorate, affecting the heat dissipation effect. For this reason, we propose an IoT integrated chassis structure. Utility Model Content
[0003] The technical problem to be solved by the utility model is to overcome the existing defects and provide an Internet of Things integrated chassis structure, which can quickly disassemble and install dustproof plug-in boards, facilitate the cleaning of dustproof plug-in boards, and can also accurately perform heat dissipation in multiple channels and directions with higher heat dissipation efficiency, which can effectively solve the problems in the background technology.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an IoT integrated chassis structure, comprising a chassis body and a cleanable heat dissipation mechanism;
[0005] Box body: The rear side wall is provided with a mounting plate, the front end of the box body is hinged with a box door through the left hinge, a handle is provided in the middle of the right side of the front end of the box door, a mounting block is provided in the middle of the lower end of the box body, and the bottom wall of the box body is provided with evenly distributed air outlets;
[0006] Cleanable heat dissipation mechanism: it is arranged at the lower end of the inner part of the box;
[0007] Among them: it also includes a single-chip microcomputer, a signal transceiver and a converter. The single-chip microcomputer is arranged at the upper right end of the front side of the mounting plate, the signal transceiver is arranged at the upper left end of the front side of the mounting plate, and the converter is arranged at the middle left end of the front side of the mounting plate. The input end of the single-chip microcomputer is electrically connected to an external power supply. The single-chip microcomputer, the signal transceiver and the converter are all installed in coordination, and the dustproof plug-in plate can be quickly disassembled and installed, which is convenient for cleaning the dustproof plug-in plate. The heat dissipation work can also be carried out accurately in multiple channels and directions, and the heat dissipation efficiency is higher.
[0008] Furthermore, the cleanable heat dissipation mechanism includes an air inlet groove, an air inlet port and a dustproof plug plate. The air inlet groove is respectively opened in the middle of the left and right side walls of the box body, and the air inlet port is evenly opened at the lower ends of the left and right side walls of the box body. The dustproof plug plates are all plugged into the inside of the air inlet groove to facilitate air intake and dust prevention.
[0009] Furthermore, the cleanable heat dissipation mechanism also includes a baffle, a connecting inner cavity is opened in the middle of the rear side wall of the box body, and the baffles are evenly arranged inside the connecting inner cavity to slow down the air flow rate and improve the heat dissipation efficiency.
[0010] Furthermore, the cleanable heat dissipation mechanism also includes a quick-release mechanism, which includes a fixing frame and a spring. A sliding groove is provided inside the mounting block, and the fixing frames are slidably connected to the inside of the sliding groove. The outer end of the fixing frame is cooperated with the lower end of the dustproof plug plate and installed. A spring is provided between the middle part of the fixing frame and the inner wall of the sliding groove, providing a basis for the disassembly and installation of the dustproof plug plate.
[0011] Furthermore, the quick-release mechanism also includes a rotating shaft, a cam and a knob. The rotating shaft is rotatably connected to the middle of the inner part of the slide groove. The cam is arranged at the upper end of the outer surface of the rotating shaft. The outer edge of the cam is installed in cooperation with the inner end of the fixing frame. The knob is arranged at the lower end of the rotating shaft, and the dustproof plug plate can be quickly installed and removed.
[0012] Furthermore, the cleanable heat dissipation mechanism also includes a heat dissipation fan, which is arranged at the upper end of the interior of the box body. The input end of the heat dissipation fan is electrically connected to the output end of the single-chip microcomputer, so that heat dissipation can be performed quickly.
[0013] Furthermore, it also includes a temperature sensor, which is arranged in the middle of the front end of the mounting plate. The temperature sensor is bidirectionally electrically connected to the single-chip microcomputer, and can quickly sense the temperature inside the body and perform heat dissipation in time.
[0014] Compared with the prior art, the beneficial effects of the utility model are: the integrated chassis structure of the Internet of Things has the following advantages:
[0015] 1. The single-chip microcomputer controls the operation of the cooling fan, which inhales cold air from the outside and then discharges it from the air outlet. At this time, as the cooling fan rotates, the cold air passes through the air inlet and the dustproof plug plate into the air inlet slot. The dustproof plug plate blocks the dust particles in the air. After the cold air enters the air inlet slot, as the cooling fan continues to rotate, the cold air enters the connecting inner cavity. The evenly distributed baffles continuously block the flow of cold air, taking away the heat emitted from the rear side wall of the box, and then bringing it into the box through the cooling fan, taking away the heat emitted by the IoT terminal and discharging it from the air outlet. The heat dissipation work is performed accurately in multiple channels and directions, and the heat dissipation efficiency is higher.
[0016] 2. Turn the knob, the shaft will rotate accordingly, and the cam will deflect. At this time, the inner end of the fixing frame is not subjected to force, the spring is not subjected to force expansion, and the fixing frame is driven to move inward. The outer end of the fixing frame leaves the lower end of the dustproof plug plate. At this time, the dustproof plug plate loses its restriction and can be quickly pulled out. After cleaning the dustproof plug plate, insert the dustproof plug plate back to its original position, and then turn the knob again. The cam returns to its original position, driving the fixing frame to move outward. The spring is compressed by force, and the fixing frame returns to its original position. The dustproof plug plate is restricted, and the dustproof plug plate can be quickly disassembled and installed, which is convenient for cleaning the dustproof plug plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the structure of the utility model;
[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of the cleanable heat dissipation mechanism of the utility model;
[0019] Figure 3 This is a schematic diagram of the cross-sectional structure of the spoiler of the utility model;
[0020] Figure 4 It is a schematic diagram of the structure of the quick-release mechanism of the utility model.
[0021] In the figure: 1 box body, 2 mounting plate, 3 box door, 4 handle, 5 mounting block, 6 cleanable heat dissipation mechanism, 61 air inlet slot, 62 air inlet, 63 dustproof plug plate, 64 spoiler, 65 quick release mechanism, 651 fixing frame, 652 spring, 653 rotating shaft, 654 cam, 655 knob, 66 cooling fan, 7 air outlet, 8 single chip microcomputer, 9 signal transceiver, 10 converter, 11 temperature sensor. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] See also Figure 1-4 ,This embodiment provides a technical solution: an IoT integrated chassis structure, including a chassis 1 and a cleanable heat dissipation mechanism 6;
[0024] Box body 1: A mounting plate 2 is provided on the rear side wall thereof to facilitate the installation of the equipment. The front end of the box body 1 is hinged with a box door 3 through a left hinge. A handle 4 is provided in the middle of the right side of the front end of the box door 3. A mounting block 5 is provided in the middle of the lower end of the box body 1. The bottom wall of the box body 1 is provided with evenly distributed air outlets 7. The box body 1 also includes a temperature sensor 11. The temperature sensor 11 is provided in the middle of the front end of the mounting plate 2. The temperature sensor 11 is bidirectionally electrically connected to the single-chip microcomputer 8, which can quickly sense the temperature inside the body and perform heat dissipation work in time.
[0025] The cleanable heat dissipation mechanism 6 is arranged at the lower end of the interior of the box body 1. The cleanable heat dissipation mechanism 6 includes an air inlet groove 61, an air inlet port 62 and a dustproof plug plate 63. The air inlet groove 61 is respectively opened in the middle of the left and right side walls of the box body 1, and the air inlet port 62 is evenly opened at the lower end of the left and right side walls of the box body 1. The dustproof plug plate 63 is plugged into the interior of the air inlet groove 61 to facilitate air intake and dust prevention. The cleanable heat dissipation mechanism 6 also includes a baffle 64. A connecting inner cavity is opened in the middle of the rear side wall of the box body 1. The baffle 64 is evenly arranged inside the connecting inner cavity to slow down the air flow rate and improve the heat dissipation efficiency. The cleanable heat dissipation mechanism 6 also includes a quick-release mechanism 65. The quick-release mechanism 65 includes a fixing frame 651 and a spring 652. A slide groove is opened inside the mounting block 5, and the fixing frame 651 is slidably connected to the inside of the slide groove. The outer end of the fixing frame 651 is installed in cooperation with the lower end of the dustproof plug plate 63. A spring 652 is provided between the middle part of the fixing frame 651 and the inner wall of the slide slot, which provides a basis for the removal and installation of the dustproof plug plate 63. The quick release mechanism 65 also includes a shaft 653, a cam 654 and a knob 655. The shaft 653 is rotatably connected to the middle of the inner part of the slide slot. The cam 654 is arranged at the upper end of the outer surface of the shaft 653. The outer edge of the cam 654 is installed in cooperation with the inner end of the fixing frame 651. The knob 655 is arranged at the lower end of the shaft 653, so that the dustproof plug plate 63 can be quickly installed and removed. The cleanable heat dissipation mechanism 6 also includes a heat dissipation fan 66. The heat dissipation fan 66 is arranged at the upper end of the inner part of the box body 1. The input end of the heat dissipation fan 66 is electrically connected to the output end of the single-chip computer 8, so that heat dissipation can be quickly performed.
[0026] Wherein: it also includes a single-chip microcomputer 8, a signal transceiver 9 and a converter 10, the single-chip microcomputer 8 is arranged at the upper right end of the front side of the mounting plate 2, the signal transceiver 9 is arranged at the upper left end of the front side of the mounting plate 2, and the converter 10 is arranged at the middle left end of the front side of the mounting plate 2. The input end of the single-chip microcomputer 8 is electrically connected to the external power supply. The single-chip microcomputer 8, the signal transceiver 9 and the converter 10 are all installed in coordination. The output end of the single-chip microcomputer 8 is electrically connected to the input end of the signal transceiver 9, and the input end of the converter 10 is electrically connected to the output end of the signal transceiver 9. The single-chip microcomputer 8 and the converter 10 are bidirectionally electrically connected, and the dustproof plug board can be quickly disassembled and installed, which is convenient for cleaning the dustproof plug board, and the heat dissipation work can be accurately performed in multiple channels and directions, and the heat dissipation efficiency is higher.
[0027] The working principle of an IoT integrated chassis structure provided by the utility model is as follows: When the IoT integrated chassis is working, the device is installed on the upper end of the mounting plate 2, the device data is sent to the single chip microcomputer 8, the single chip microcomputer 8 controls the signal transceiver 9 and the converter 10 to work, the single chip microcomputer 8 converts the electrical signal into a network signal through the converter 10, and the network signal is sent to the Ethernet through the signal transceiver 9. As the IoT terminal inside the box 1 continues to work, the temperature inside the box rises sharply, especially the temperature of the rear side wall of the box 1. The single chip microcomputer 8 controls the temperature sensor 1 1 works, the temperature sensor 11 converts the temperature into an electrical signal and then sends it to the single chip computer 8, the single chip computer 8 controls the cooling fan 66 to work, the cooling fan 66 sucks in the outside cold air, and then discharges it from the air outlet 7. At this time, with the rotation of the cooling fan 66, the cold air passes through the air inlet 62 and the dustproof plug plate 63 and enters the inside of the air inlet slot 61. The dustproof plug plate 63 blocks the dust particles in the air. After the cold air enters the inside of the air inlet slot 61, with the continuous rotation of the cooling fan 66, the cold air enters the inside of the connecting cavity, and the evenly distributed baffles 64 do not The cooling fan 66 then brings the heat from the IoT terminal into the box 1, and then discharges the heat from the IoT terminal through the air outlet 7. After working for a long time, a large amount of dust adheres to the surface of the dustproof plug plate 63, and the dustproof plug plate 63 needs to be removed and cleaned. The knob 655 is turned, and the shaft 653 also turns, and the cam 654 deflects. At this time, the inner side end of the fixing frame 651 is not subjected to force, and the spring 652 is not subjected to force expansion, driving the fixing frame 651 to move inward, and the fixing frame 651 is The outer end leaves the lower end of the dustproof plug plate 63. At this time, the dustproof plug plate 63 is free from restriction and can be quickly pulled out. After cleaning the dustproof plug plate 63, insert the dustproof plug plate 63 back to its original position, and then turn the knob 655 again. The cam 654 returns to its original position, driving the fixing frame 651 to move outward. The spring 652 is compressed by force, and the fixing frame 651 returns to its original position. The dustproof plug plate 63 is restricted, and the dustproof plug plate can be quickly disassembled and installed, which is convenient for cleaning the dustproof plug plate. The heat dissipation work can also be carried out accurately in multiple channels and directions, and the heat dissipation efficiency is higher.
[0028] It is worth noting that the single chip microcomputer 8 disclosed in the above embodiment is an S7-200 single chip microcomputer, the signal transceiver 9 is a DMX512 signal transceiver, the converter 10 is a VC1280 converter, and the temperature sensor 11 is a DS18B20 temperature sensor. The single chip microcomputer 8 controls the signal transceiver 9, the converter 10 and the temperature sensor 11 to work using methods commonly used in the prior art.
[0029] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. An IoT integrated chassis structure, characterized in that: It comprises a box body (1) and a cleanable heat dissipation mechanism (6); Box body (1): a mounting plate (2) is provided on the rear side wall thereof; a box door (3) is hingedly connected to the front end of the box body (1) through a left hinge; a handle (4) is provided in the middle of the right side of the front end of the box door (3); a mounting block (5) is provided in the middle of the lower end of the box body (1); and evenly distributed air outlets (7) are provided on the bottom wall of the box body (1); A cleanable heat dissipation mechanism (6) is arranged at the lower end of the interior of the box body (1); The device further comprises a single chip microcomputer (8), a signal transceiver (9) and a converter (10), wherein the single chip microcomputer (8) is arranged at the upper right end of the front side of the mounting plate (2), the signal transceiver (9) is arranged at the upper left end of the front side of the mounting plate (2), and the converter (10) is arranged at the middle left end of the front side of the mounting plate (2). The input end of the single chip microcomputer (8) is electrically connected to an external power supply, and the single chip microcomputer (8), the signal transceiver (9) and the converter (10) are all installed in coordination.
2. The IoT integrated chassis structure according to claim 1, characterized in that: The cleanable heat dissipation mechanism (6) comprises an air inlet groove (61), an air inlet port (62) and a dustproof plug plate (63); the air inlet groove (61) is respectively opened in the middle of the left and right side walls of the box body (1); the air inlet port (62) is evenly opened at the lower ends of the left and right side walls of the box body (1); and the dustproof plug plates (63) are all plugged into the inside of the air inlet groove (61).
3. The IoT integrated chassis structure according to claim 1, characterized in that: The cleanable heat dissipation mechanism (6) further comprises a baffle (64); a connecting inner cavity is provided in the middle of the rear side wall of the box body (1); and the baffle (64) is evenly arranged inside the connecting inner cavity.
4. The IoT integrated chassis structure according to claim 2, characterized in that: The cleanable heat dissipation mechanism (6) further comprises a quick-release mechanism (65), wherein the quick-release mechanism (65) comprises a fixing frame (651) and a spring (652), wherein a slide groove is provided inside the mounting block (5), the fixing frame (651) is slidably connected to the inside of the slide groove, the outer end of the fixing frame (651) is matched with the lower end of the dustproof plug plate (63), and a spring (652) is provided between the middle part of the fixing frame (651) and the inner wall of the slide groove.
5. The IoT integrated chassis structure according to claim 4, characterized in that: The quick release mechanism (65) further comprises a rotating shaft (653), a cam (654) and a knob (655); the rotating shaft (653) is rotatably connected to the inner middle of the slide slot; the cam (654) is arranged at the upper end of the outer surface of the rotating shaft (653); the outer edge of the cam (654) is mounted in cooperation with the inner end of the fixing frame (651); and the knob (655) is arranged at the lower end of the rotating shaft (653).
6. The IoT integrated chassis structure according to claim 1, characterized in that: The cleanable heat dissipation mechanism (6) further comprises a heat dissipation fan (66), wherein the heat dissipation fan (66) is arranged at the upper end of the interior of the housing (1), and the input end of the heat dissipation fan (66) is electrically connected to the output end of the single-chip computer (8).
7. The IoT integrated chassis structure according to claim 6, characterized in that: It also comprises a temperature sensor (11), wherein the temperature sensor (11) is arranged at the middle of the front end of the mounting plate (2), and the temperature sensor (11) is bidirectionally electrically connected to the single-chip computer (8).