Manifold uniform-temperature cooling device

Abstract

The utility model relates to the technical field of heat exchangers, and provides a manifold uniform-temperature cooling device which comprises a manifold fin body, the manifold fin body is composed of a uniform-temperature plate bottom cover, a uniform-temperature plate upper cover with fins, a manifold channel and a liquid side sealing shell, and the uniform-temperature plate bottom cover and the uniform-temperature plate upper cover with the fins are welded in a sealing mode. The working medium in the bottom cover of the vapor chamber is changed into gas through phase change heat absorption, the heat dissipation efficiency is high, the heat flux density is large, the surface temperature of a heat source can be more uniform, hot spots are reduced, the stability of equipment is improved, and the service life of the equipment is prolonged; the fins are additionally arranged on the upper cover with the fins of the vapor chamber, so that the heat dissipation area is increased, and the heat dissipation speed is increased; the liquid cooling liquid has the characteristics of high thermal conductivity and high heat capacity, and can quickly absorb heat on the fins and transfer the heat to the environment; the manifold channels are combined with the fins, so that the uniformity of flow distribution in the heat sink can be effectively improved, the pressure loss is reduced, and the heat exchange efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat exchangers, and in particular to a manifold temperature-averaging cooling device. Background Art

[0002] As my country moves forward in the process of digitalization, the development of technologies such as cloud computing, big data analysis and artificial intelligence will be strongly supported, and data centers will play an increasingly important role in the process of digitalization. However, a large number of large computing devices and high-density servers in data centers will generate a lot of heat during operation. If reasonable and effective thermal management technology is not adopted for large computing devices and high-density servers, the corresponding equipment may experience performance degradation, failure or even damage due to overheating, thus affecting the normal operation of the data center. It can be seen that thermal management and heat dissipation technology has become an important part of data center construction and operation and maintenance.

[0003] With the enhancement of global environmental awareness, "energy saving and environmental protection" will become the new vane of the data center industry. PUE (power usage efficiency), as one of the key indicators for measuring the energy efficiency of data centers, will also become an important factor restricting the development of data centers. In the process of data center construction, the use of reasonable thermal management and heat dissipation technology can not only improve the stability and reliability of data centers, but also reduce PUE and reduce operating costs. Therefore, in order to increase the efficiency and reduce the consumption of thermal management and heat dissipation technology in data centers, this patent proposes a manifold uniform temperature cooling device, which uses cooling fluid to efficiently remove the heat of the chip and reduce the energy consumption of the data center. Utility Model Content

[0004] In view of the shortcomings of the prior art, the utility model provides a manifold temperature uniform cooling device to solve the problem of poor heat dissipation effect of the equipment in the prior art.

[0005] The technical solution of the utility model is as follows: a manifold temperature equalizing cooling device, comprising a manifold fin body, wherein the manifold fin body is composed of a temperature equalizing plate bottom cover, a temperature equalizing plate with fins upper cover, a manifold channel, and a liquid side sealing shell, wherein the temperature equalizing plate bottom cover and the temperature equalizing plate with fins upper cover are sealed and welded, the temperature equalizing plate with fins upper cover is welded to the manifold channel, and the temperature equalizing plate with fins upper cover is sealed and welded to the liquid side sealing shell.

[0006] Preferably, the temperature equalizing plate with finned upper cover is composed of an upper cover and fins, and an integrated forming process is adopted between the upper cover and the fins. The fins can be integrally formed on the top of the upper cover by shoveling out or wire cutting, and a liquid absorption core is provided at the bottom of the upper cover.

[0007] Preferably, the internal cavity of the bottom cover of the temperature equalizing plate is in a negative pressure vacuum state and is equipped with a liquid wick and filled with a phase change heat transfer medium.

[0008] Preferably, coolant flows in the cavity between the liquid-side sealed shell, the temperature-averaging plate with finned upper cover, and the manifold channel, and the coolant includes but is not limited to water-based coolant, oil coolant, and low-boiling-point coolant.

[0009] Preferably, a water inlet and a water outlet are respectively provided on the side of the liquid-side sealing shell, the water inlet is used to pass the liquid coolant and allow the liquid coolant to flow into the fin gap through the manifold channel, and the water outlet is used to allow the liquid coolant to flow out of the manifold fins, thereby transferring the heat of the heat-generating element to the external environment.

[0010] Preferably, the materials of the temperature averaging plate bottom cover, the temperature averaging plate finned top cover, the manifold channel, and the liquid side sealing shell include but are not limited to copper, aluminum, and stainless steel.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] 1. The working fluid in the bottom cover of the temperature equalizing plate of the utility model absorbs heat through phase change and becomes gas. The heat is taken out through phase change, with high heat dissipation efficiency and large heat flux density. It can also make the surface temperature of the heat source more uniform, reduce the generation of hot spots, and help improve the stability of the equipment and extend its service life.

[0013] 2. The utility model adds fins to the upper cover of the temperature equalizing plate with fins, which can increase the heat dissipation area and thus accelerate the heat dissipation speed.

[0014] 3. The liquid coolant in the utility model has the characteristics of high thermal conductivity and high heat capacity, and can quickly absorb the heat on the fins and transfer it to the environment.

[0015] 4. The utility model can effectively improve the uniformity of flow distribution in the heat sink, reduce pressure loss and improve heat exchange efficiency through the combination of the manifold channel and the fins. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure proposed by the utility model;

[0018] Figure 2 This is a schematic diagram of the decomposed structure proposed by the utility model;

[0019] Figure 3 The utility model proposed Figure 2 Schematic diagram of the structure viewed from above;

[0020] Figure 4 The utility model proposed Figure 2 A schematic diagram of a top view structure;

[0021] Figure 5 This is a schematic diagram of the liquid flow direction proposed by the utility model.

[0022] In the figure: 1. bottom cover of temperature equalizing plate; 2. upper cover of temperature equalizing plate with fins; 21. upper cover; 22. fins; 3. manifold channel; 4. liquid side sealing shell; 5. water outlet; 6. water inlet. DETAILED DESCRIPTION

[0023] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Manifold fins can be used as a part for fluid piping systems. Their main function is to control the flow direction, speed and pressure of the fluid. In the piping system, the manifold uses liquid cooling and a temperature plate to achieve rapid heat dissipation.

[0025] Data center thermal management is the key to ensuring the normal operation of equipment. With the development of technologies such as cloud computing, big data analysis and artificial intelligence, data centers need to handle more and more high-performance computing tasks. These tasks have extremely high requirements for related components and generate a lot of heat when processing large amounts of data. If this heat is not effectively managed and controlled, the equipment may experience performance degradation, failure or even damage due to overheating, which will affect the normal operation of the data center. Figure 1-Figure 5 An embodiment provides a manifold fin, including a manifold fin body, which is composed of a temperature averaging plate bottom cover 1, a temperature averaging plate with fins upper cover 2, a manifold channel 3, and a liquid side sealing shell 4, wherein the temperature averaging plate bottom cover 1 and the temperature averaging plate with fins upper cover 2 are sealed and welded, the temperature averaging plate with fins upper cover 2 is welded to the manifold channel 3, and the temperature averaging plate with fins upper cover 2 is sealed and welded to the liquid side sealing shell 4.

[0026] The temperature equalizing plate bottom cover 1, the temperature equalizing plate finned upper cover 2, the manifold channel 3, and the liquid side sealing shell 4 are all made of, but not limited to, metal materials such as copper, aluminum, stainless steel, and some non-metallic materials, and have good corrosion resistance to ensure long-term use under different environmental conditions; have good thermal conductivity to effectively transfer or disperse heat, which is beneficial to the temperature equalization effect; have high strength to withstand a certain amount of pressure and force to ensure the stability and safety of the equipment.

[0027] When processing a large amount of data, the chip will generate a large amount of heat. If the heat is not effectively managed and controlled, the equipment may experience performance degradation, malfunction or even damage due to overheating, thereby affecting the normal operation of the data center. In order to efficiently remove the heat of the chip through the cooling medium and reduce the energy consumption of the data center, the following settings are made. The middle position of the temperature-averaging plate bottom cover 1 is directly in contact with the heat source. The heat generated by the heat source is first transferred to the bottom of the temperature-averaging plate bottom cover 1, and the temperature is quickly averaged by the liquid wick on the inner surface of the temperature-averaging plate bottom cover 1, so that the working medium adsorbed on the liquid wick absorbs heat and changes into gas, and rises to the upper cover 21, and the upper cover The outer wall of 21 exchanges heat with the cooling medium, so that the outer wall of the upper cover 21 maintains a low temperature state, and conducts heat to the inner wall of the upper cover 21 with the liquid wick. At this time, when the steam rises to the inner wall of the upper cover 21, the steam and the inner wall of the upper cover 21 undergo phase change heat exchange, and are quickly cooled under the action of the liquid wick, and the working medium inside the bottom cover 1 of the temperature equalizing plate is cooled from gas to liquid, and flows back to the heat source end of the bottom cover 1 of the temperature equalizing plate under the action of gravity, and the cycle is repeated. Heat is extracted through phase change, the heat dissipation efficiency is high, the heat flux density is large, and the surface temperature of the heat source can be made more uniform, reducing the generation of hot spots, which helps to improve the stability of the equipment and extend its service life.

[0028] The temperature-averaging plate with finned upper cover 2 is composed of an upper cover 21 and fins 22. The upper cover 21 and the fins 22 are formed by an integrated forming process. The fins 22 can be integrally formed on the top of the upper cover 21 by scooping out or wire cutting. A liquid absorption core is provided at the bottom of the upper cover 2. The fins 22 are processed by methods including but not limited to wire cutting and scooping teeth. Adding the fins 22 can increase the heat dissipation area, enhance the liquid flow disturbance, and thus accelerate the heat dissipation speed.

[0029] The internal cavity of the temperature homogenizing plate bottom cover 1 is in a negative pressure vacuum state and is equipped with a liquid wick and filled with a phase change heat transfer medium. It is made by machining, stamping, casting and other processing methods.

[0030] The manifold channel 3 has the function of changing the flow direction of the liquid, so that the liquid entering the liquid-side sealing shell 4 is redistributed to the corresponding flow channel direction, increasing the liquid flow process and making the internal temperature more uniform. The combination of the manifold channel 3 and the fins 22 can effectively improve the uniformity of the flow distribution in the heat sink, reduce pressure loss, and improve heat exchange efficiency.

[0031] Liquid coolant flows in the cavity between the liquid-side sealing shell 4, the temperature-averaging plate with fin cover 2, and the manifold channel 3. The coolant includes but is not limited to water-based coolant, oil coolant and low-boiling point special liquid. The liquid coolant has the characteristics of high thermal conductivity and high heat capacity, and can quickly absorb the heat on the fins 22 and transfer it to the environment.

[0032] A water inlet 6 and a water outlet 5 are respectively provided on the side of the liquid side sealing shell 4. The water inlet 6 is used to pass the liquid coolant and allow the liquid coolant to flow into the gap between the fins 22 through the manifold channel 3. The water outlet 5 is used to allow the liquid coolant to flow out of the manifold 3 fins 22, thereby transferring the heat of the heat generating element to the external environment. The liquid coolant is passed through the water inlet 6 of the liquid side sealing shell 4, and the liquid coolant flows into the gap between the fins 22 through the manifold channel 3. Specifically, water flows into the gap between the fins 22 from one side of the manifold channel 3 and then flows out of the fins 22 from the other side of the manifold channel 3. The liquid coolant transfers the heat to the external environment through the water outlet 5 of the liquid side sealing shell 4, and the whole process is continuously circulated.

[0033] In this embodiment, if Figure 5 As shown, the middle position of the bottom cover 1 of the temperature equalizer is directly in contact with the heat source, and the heat generated by the heat source is first transferred to the bottom of the bottom cover 1 of the temperature equalizer, and the temperature is quickly equalized by the liquid wick on the inner surface of the bottom cover 1 of the temperature equalizer. The working medium adsorbed on the liquid wick absorbs heat and changes into gas through the liquid wick on the inner surface of the bottom cover 1 of the temperature equalizer, and rises to the upper cover, while the outer wall of the upper cover 21 exchanges heat with the cooling working medium, so that the outer wall of the upper cover 21 maintains a low temperature state, and is heat-conducted to the inner wall of the upper cover 21 with the liquid wick. At this time, when the steam rises to the inner wall of the upper cover 21 When the steam exchanges phase-change heat with the inner wall of the upper cover 21, the outer wall of the upper cover 21 exchanges heat with the cooling medium, the internal medium changes from gas to liquid and flows back to the heat source end of the bottom cover 1 of the temperature equalizing plate, and the cycle is repeated. The liquid coolant passes through the water inlet 6 of the liquid-side sealed shell 4, and the liquid coolant flows into the gap between the fins 22 through the manifold channel 3 (water flows into the gap between the fins 22 from one side of the manifold channel 3 and then flows out of the fins 22 from the other side of the manifold channel 3). The liquid coolant transfers heat to the external environment from the water outlet 5 of the liquid-side sealed shell 4, and the whole process is continuously circulated.

[0034] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A manifold temperature-averaging cooling device, comprising a manifold fin body, characterized in that: The manifold fin body is composed of a temperature equalizing plate bottom cover (1), a temperature equalizing plate with fins top cover (2), a manifold channel (3), and a liquid side sealing shell (4), wherein the temperature equalizing plate bottom cover (1) and the temperature equalizing plate with fins top cover (2) are sealed and welded, the temperature equalizing plate with fins top cover (2) and the manifold channel (3) are welded, and the temperature equalizing plate with fins top cover (2) and the liquid side sealing shell (4) are sealed and welded.

2. The manifold temperature uniform cooling device according to claim 1, characterized in that: The temperature-averaging plate with finned upper cover (2) is composed of an upper cover (21) and fins (22). The upper cover (21) and the fins (22) are formed by an integrated forming process. The fins (22) can be formed integrally on the top of the upper cover (21) by means of shoveling or wire cutting. A liquid absorption core is provided at the bottom of the upper cover (21).

3. The manifold temperature uniform cooling device according to claim 1, characterized in that: The internal cavity of the temperature equalizing plate bottom cover (1) is in a negative pressure vacuum state and is equipped with a liquid wick and filled with a phase change heat transfer medium.

4. The manifold temperature uniform cooling device according to claim 1, characterized in that: Cooling liquid flows in the cavity between the liquid-side sealed shell (4), the temperature-equalizing plate with finned upper cover (2), and the manifold channel (3), and the cooling liquid includes but is not limited to water-based cooling liquid, oil cooling liquid, and low-boiling-point cooling liquid.

5. The manifold temperature uniform cooling device according to claim 1, characterized in that: The side surfaces of the liquid-side sealing shell (4) are respectively provided with a water inlet (6) and a water outlet (5); the water inlet (6) is used to allow liquid coolant to pass through the manifold channel (3) and flow into the gaps between the fins (22); the water outlet (5) is used to allow the liquid coolant to flow out of the manifold fins, thereby transferring the heat of the heat generating element to the external environment.

6. The manifold temperature uniform cooling device according to claim 1, characterized in that: The materials of the temperature balancing plate bottom cover (1), the temperature balancing plate finned top cover (2), the manifold channel (3), and the liquid side sealing shell (4) include, but are not limited to, copper, aluminum, and stainless steel.

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