Wafer clamp

Abstract

The utility model provides a wafer clamp comprising a housing, the top of which is clamped with a support plate, and the support plate is provided with chutes arranged in a circumferential array; the fixing unit comprises a sliding block and a rotating disc rotationally connected into the shell, an inclined groove corresponding to the sliding groove is formed in the rotating disc, and a supporting rod matched with the sliding block is arranged in the sliding groove; one side of the sliding block is connected into the sliding groove in a sliding mode, and a suction cup is arranged on the other side of the sliding block. And the transmission unit is arranged on one side of the shell. According to the wafer clamp provided by the utility model, the fixing unit is utilized, and the rotating shaft is utilized to control the rotating disc to rotate in the shell, so that the supporting rod is linked with the sliding block to slide outwards or inwards, the distance between the sucking discs is adjusted according to wafers of different sizes, and the sucking discs are utilized to support the wafers from the bottom surface; and the pressure generated by the wafer is uniformly distributed, and meanwhile, the fixing effect of the wafer is also improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a wafer clamp. Background Art

[0002] Wafers are made of high-purity silicon and are used to make silicon semiconductor integrated circuits. The process includes multiple steps such as wafer growth, cutting, polishing, cleaning, photolithography, etching, and electroplating. Pre-cutting the wafer is to cut the crystal into wafers, which are clamped with a fixture for polishing and cleaning, thereby reducing defects and contamination on the surface of the wafer for subsequent processes. In the prior art, wafers are often polished by clamping them on both sides. Since the wafers are thin, the clamping point is small, and they are prone to tilting during polishing, which affects the polishing effect and easily damages the surface of the wafer. Utility Model Content

[0003] The utility model aims to solve the above problems in the prior art and to solve the problem that the wafer is clamped at both sides and the clamping points are small and difficult to polish.

[0004] In order to achieve the above-mentioned purpose, the utility model can be implemented through the following technical solutions: a wafer clamp, comprising:

[0005] A housing, the top of which is clamped with a support plate, and the support plate is provided with sliding grooves in a circumferential array;

[0006] A fixing unit, comprising a slider and a turntable rotatably connected to the housing, the turntable being provided with an inclined groove corresponding to the slide groove, and a support rod matched with the slider being provided in the slide groove;

[0007] One side of the slider is slidably connected to the slide groove, and a suction cup is provided on the other side thereof;

[0008] The transmission unit is arranged on one side of the shell, and the transmission unit comprises a rotating shaft matched with the rotating disk.

[0009] In the embodiment of the utility model, a support frame is arranged on the shell, and the transmission unit is fixed on the support frame.

[0010] In the embodiment of the utility model, the transmission unit comprises a cover fixed on the support frame, a driving wheel and a driven wheel meshing with each other are rotatably arranged in the cover, and a motor is clamped on the driven wheel.

[0011] In the embodiment of the utility model, the number of teeth of the driving wheel is smaller than the number of teeth of the driven wheel.

[0012] In the embodiment of the utility model, an L-shaped tube connected to the suction cup is clamped on the sliding block, a vacuum tube is arranged on the L-shaped tube, and a limiting sleeve for fixing the L-shaped tube is arranged on the supporting plate.

[0013] In the embodiment of the utility model, the turntable is clamped in the clamping slot.

[0014] In the embodiment of the utility model, at least three suction cups are provided.

[0015] Compared with the prior art, the advantages of the present application are: a fixing unit is utilized, and a rotating shaft is used to control the rotation of a turntable located inside the shell, so that the support rod links the slider to slide outward or inward, so that the suction cup can adjust the spacing according to wafers of different sizes, and the suction cup is used to support the wafer from the bottom, which evenly distributes the pressure generated by the wafer and also improves the fixing effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure;

[0017] Figure 2 It is a schematic diagram of the structure of the internal parts of the shell in half section;

[0018] Figure 3 It is a partial enlarged view A;

[0019] Figure 4 It is an exploded diagram of the transmission unit.

[0020] Description of reference numerals:

[0021] 1. Transmission unit; 11. Motor; 12. Cover plate; 13. Cover; 14. Driven wheel; 15. Driving wheel; 16. Rotating shaft; 161. Slot; 2. Shell; 3. Support plate; 31. Limit sleeve; 4. Fixing unit; 41. Turntable; 411. Inclined groove; 42. L-shaped tube; 43. Suction cup; 44. Bolt; 45. Slider; 46. Support rod; 5. Support frame; 7. Vacuum tube. DETAILED DESCRIPTION

[0022] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention.

[0023] like Figure 1-4 As shown, a wafer clamp comprises:

[0024] The housing 2 has a support plate 3 clamped on the top thereof, and the support plate 3 is provided with sliding grooves in a circular array;

[0025] The fixing unit 4 includes a slider 45 and a turntable 41 rotatably connected to the housing 2, the turntable 41 is provided with an inclined groove 411 corresponding to the slide groove, and a support rod 46 matched with the slider 45 is provided in the slide groove;

[0026] One side of the slider 45 is slidably connected in the slide groove, and a suction cup 43 is provided on the other side thereof;

[0027] The transmission unit 1 is disposed on one side of the housing 2 , and includes a rotating shaft 16 matched with the rotating disk 41 .

[0028] Specifically, the wafer is relatively thin, and 6 inches, 8 inches and 12 inches are the most common on the market. The housing 2 is clamped with a support plate 3 on the top, and a slide groove is provided on the support plate 3 in a circular array. The fixing unit 4 includes a slider 45 and a turntable 41 rotatably connected to the housing 2. The turntable 41 is provided with an inclined groove 411 corresponding to the slide groove. A support rod 46 matching the slider 45 is provided in the slide groove. The support rod 46 is fixed to the slider 45 by a bolt 44. One side of the slider 45 is slidably connected to the slide groove, and a suction cup 43 is provided on the other side thereof. The driving unit 1 is arranged on one side of the shell 2, and the transmission unit 1 includes a rotating shaft 16 that cooperates with the turntable 41. A support frame 5 is arranged on the shell 2, and the transmission unit 1 is fixed on the support frame 5. The support frame 5 plays a role of connecting the upper and lower parts, which is fixed to the bottom of the shell 2, and the transmission unit 1 is fixedly connected to the bottom of the support frame 5. When the rotating shaft 16 rotates, it drives the turntable 41 in the shell 2 to rotate, and then the slider 45 slides in the slide groove, thereby adjusting the distance between the suction cups 43, so that the suction cups 43 can better support the wafer, and further adapt to wafers of different specifications.

[0029] As an embodiment further provided by the present invention, the transmission unit 1 includes a cover 13 fixed on the support frame 5, and a cover plate 12 is arranged on the cover 13. The cover plate 12 can be removed after long-term operation to maintain the driving wheel 15 and the driven wheel 14. The cover 13 is provided with a driving wheel 15 and a driven wheel 14 that mesh with each other. A motor 11 is clamped on the driven wheel 14. The motor 11 is used as a power source to drive the active meshing driven wheel 14 to rotate, and then the turntable 41 is driven to rotate through the driven wheel 14.

[0030] As an embodiment further provided by the present invention, the number of teeth of the driving wheel 15 is smaller than the number of teeth of the driven wheel 14 , which has a deceleration effect when the motor 11 is running, so that the sliding block 45 slides more smoothly.

[0031] As an embodiment further provided by the present invention, an L-shaped tube 42 connected to the suction cup 43 is clamped on the slider 45, and a vacuum tube 7 is arranged on the L-shaped tube 42. A limiting sleeve 31 for fixing the L-shaped tube 42 is arranged on the support plate 3. The L-shaped tube 42 has a steering effect, so that the vacuum tube 7 is flush with the upper plane of the support plate 3 when it is clamped on the L-shaped tube 42, and the number of the limiting sleeves 31 is the same as the number of the vacuum tubes 7, which has a limiting effect on the vacuum tube 7.

[0032] As an embodiment further provided by the present invention, a slot 161 is provided at one end of the rotating shaft 16, and the turntable 41 is engaged in the slot 161. One end of the rotating shaft 16 cooperates with the driven wheel 14, and the other end has a slot 161 engaged with the turntable 41. The turntable 41 is driven to rotate inside the shell 2 by the rotating shaft 16.

[0033] As an embodiment further provided by the present invention, at least three suction cups 43 are provided. As the suction cups 43 increase accordingly, the number of relative inclined grooves 411 and sliders 45 also increases accordingly. The more suction cups 43 there are, the larger the supporting area for the wafer will be, and the better the supporting effect will be.

[0034] Working principle: First, according to the size of the wafer, the motor 11 is used to drive the active wheel 15 to drive the driven wheel 14 to rotate, and the shaft 16 drives the turntable 41 located in the shell 2 to rotate as the driven wheel 14 drives the turntable 41 to rotate, so that the support rod 46 drives the slider 45 to slide along the inclined groove 411, that is, to adjust the distance between the suction cups 43, so that it can better support the wafer and be more stable when the wafer is polished.

[0035] The technical solution of the above utility model provides a solution that is significantly different from the prior art to address the technical problem that the prior art solution is too single. The parts not involved in the technical solution of this application are the same as the prior art or can be implemented by using the prior art and will not be described in detail.

[0036] The technical solutions in the above embodiments have clearly and completely described the contents of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

Claims

1. A wafer clamp, characterized in that: include: A housing, the top of which is clamped with a support plate, and the support plate is provided with sliding grooves in a circumferential array; A fixing unit, comprising a slider and a turntable rotatably connected to the housing, the turntable being provided with an inclined groove corresponding to the slide groove, and a support rod matched with the slider being provided in the slide groove; One side of the slider is slidably connected to the slide groove, and a suction cup is provided on the other side thereof; The transmission unit is arranged on one side of the shell, and the transmission unit comprises a rotating shaft matched with the rotating disk.

2. A wafer clamp according to claim 1, characterized in that: A support frame is arranged on the shell, and the transmission unit is fixed on the support frame.

3. A wafer clamp according to claim 2, characterized in that: The transmission unit comprises a cover fixed on the support frame, a driving wheel and a driven wheel meshing with each other are rotatably arranged in the cover, and a motor is clamped on the driven wheel.

4. A wafer clamp according to claim 3, characterized in that: The number of teeth of the driving wheel is smaller than the number of teeth of the driven wheel.

5. The wafer clamp according to claim 1, characterized in that: An L-shaped tube connected to the suction cup is clamped on the sliding block, a vacuum tube is arranged on the L-shaped tube, and a limiting sleeve for fixing the L-shaped tube is arranged on the supporting plate.

6. The wafer clamp according to claim 1, characterized in that: A slot is provided at one end of the rotating shaft, and the rotating disk is clamped in the slot.

7. The wafer clamp according to claim 1, characterized in that: At least three suction cups are provided.

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