Microphone transmitting chip board convenient to install

Abstract

The utility model provides a microphone emission chip board convenient to install, which comprises an installation frame, a triangular wedge-shaped block and a chip mainboard, the chip mainboard is fixedly installed at the center of the top of the installation frame, threaded holes are arranged at the top of the installation frame and at the periphery of the chip mainboard, and the triangular wedge-shaped block is arranged in the threaded holes. T-shaped limiting rods are fixedly mounted at the two ends of one side, located at the bottom of the threaded hole, in the mounting frame, triangular wedge blocks are movably connected to the positions, in the T-shaped limiting rods, of the mounting frame in a penetrating mode, and telescopic springs are fixedly mounted at the positions, located in the centers of one sides of the tops of the T-shaped limiting rods, of the triangular wedge blocks. A fixing bolt abuts against one side of a triangular wedge block in a T-shaped limiting rod in the descending process, so that the triangular wedge block compresses a telescopic spring in the T-shaped limiting rod, meanwhile, a positioning plate on the triangular wedge block penetrates through a positioning hole in the mounting frame, and the periphery of the mounting frame is fixed through the positioning plate; the S-shaped heat dissipation fins in the heat dissipation cavity are matched with the heat dissipation holes to achieve stable heat dissipation of the chip mainboard, and the heat dissipation area is increased.

Description

Technical Field

[0001] The utility model relates to the technical field related to microphones, in particular to a microphone transmitting chip board which is easy to install. Background Art

[0002] PCB board, or printed circuit board, is the provider of electrical connections for electronic components. It is conducive to mechanized and automated production, improves labor productivity and reduces the cost of electronic equipment. It can be standardized in design, which is conducive to interchangeability. At the same time, its graphics are repeatable (reproducible) and consistent, which reduces wiring and assembly errors and saves equipment maintenance, debugging and inspection. Therefore, it is increasingly used in industrial production.

[0003] At present, the microphone circuit board is still fixed by screws during use. During the installation process, the staff needs to use tools to fix multiple screws, and the fixing steps are relatively cumbersome. If a large number of microphone circuit boards are produced, it will undoubtedly increase the labor intensity of the staff to a certain extent. In the installation process, if the force of rotating the screw is too large, the microphone circuit board may be damaged. If the force of rotation is too small, the microphone circuit board will often be installed loosely, affecting subsequent use. At the same time, the device is not provided with a dehumidification mechanism. During the long-term use of the microphone circuit board, the microphone circuit board may become damp due to the influence of humid air, which shortens the service life of the microphone circuit board to a certain extent. Due to the influence of moisture, rust may appear on the screws and nuts, making subsequent disassembly more difficult. In this regard, the present scheme specially proposes a microphone transmitter chip board that is easy to install to solve the above problems. Utility Model Content

[0004] In order to overcome the defects of the prior art, the utility model provides a microphone transmitting chip board which is easy to install, so as to solve the problems raised in the above background technology.

[0005] To achieve the above object, the technical solution of the utility model is implemented as follows: a microphone transmitting chip board that is easy to install, comprising a mounting frame, a triangular wedge block and a chip main board, the chip main board is fixedly installed at the top center of the mounting frame by screws, threaded holes are opened on the top of the mounting frame around the chip main board, T-shaped limit rods are fixedly installed at both ends of one side of the bottom of the threaded holes in the mounting frame by bolts, the triangular wedge block is movably connected to the T-shaped limit rod on the mounting frame, a telescopic spring is fixedly installed on the triangular wedge block at the center of one side of the top of the T-shaped limit rod by bolts, and the other end of the telescopic spring is fixedly installed on the inner wall of the mounting frame by bolts, a positioning plate is fixedly installed on the triangular wedge block at the inner center of the telescopic spring by screws, and the positioning plate movably penetrates the interior of the telescopic spring, a positioning hole is opened at the bottom of one side of the mounting frame, and the top of the positioning plate movably penetrates the positioning hole.

[0006] Preferably, a heat dissipation cavity is provided in the mounting frame at the center of one side of the bottom of the triangular wedge-shaped block.

[0007] Preferably, a plurality of S-shaped heat dissipation fins are evenly mounted on the mounting frame at the top of the heat dissipation cavity, and a plurality of heat dissipation holes are evenly opened on the S-shaped heat dissipation fins.

[0008] Preferably, limiting holes are provided at both ends of the bottom of the triangular wedge-shaped block, and the T-shaped limiting rod movably passes through the limiting holes.

[0009] Preferably, the size of the positioning hole matches the size of the positioning plate, and the top of the positioning plate passes through the positioning hole.

[0010] Preferably, a fixing bolt is threadedly connected through the threaded hole in the mounting frame, and the bottom of the fixing bolt movably abuts against one side of the top of the triangular wedge block.

[0011] Preferably, a heat dissipation groove is provided on a top side of the heat dissipation cavity in the mounting frame, and the S-shaped heat dissipation fins all penetrate the heat dissipation groove and are connected to a bottom side of the chip mainboard.

[0012] The beneficial effects of the utility model are embodied in:

[0013] The utility model lowers in the threaded hole of the mounting frame by rotating the fixing bolt, and the fixing bolt resists one side of the triangular wedge block in the T-shaped limit rod during the lowering process, so that the triangular wedge block compresses the telescopic spring in the T-shaped limit rod, and at the same time, the positioning plate on the triangular wedge block passes through the positioning hole in the mounting frame, and the mounting frame is fixed on all sides by the positioning plate. The operation is simple and convenient, and the telescopic spring on one side of the triangular wedge block accumulates force during disassembly, which is convenient for disassembly. The structure is stable, and during use, the S-shaped heat dissipation fins in the heat dissipation cavity of the mounting frame cooperate with the heat dissipation holes to achieve stable heat dissipation of the chip mainboard, increase the heat dissipation area, achieve strong heat conduction and heat dissipation performance, improve the heat dissipation capacity, and have reasonable and ingenious design and strong practical performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In the attached picture:

[0015] Figure 1 It is a schematic three-dimensional diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic front view of the internal structure of the installation connection of the utility model;

[0017] Figure 3 for Figure 1 A schematic enlarged diagram of the structure at center A;

[0018] Figure 4 It is a schematic side view of the internal structure of the mounting frame of the utility model;

[0019] Figure 5 This is the chip mainboard circuit diagram of the utility model.

[0020] Description of reference numerals:

[0021] 1. Mounting frame; 11. Threaded holes; 12. Positioning holes; 13. Heat dissipation cavity; 14. S-shaped heat dissipation fins; 15. Fixing bolts; 16. Heat dissipation slots; 17. Heat dissipation holes; 2. Triangular wedge blocks; 21. T-shaped limit rods; 22. Telescopic springs; 23. Positioning plates; 24. Limiting holes; 3. Chip motherboard. DETAILED DESCRIPTION

[0022] The utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0023] It should be noted that if the utility model embodiments involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0024] In addition, "multiple" means more than two. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to achieve. When the combination of technical solutions is contradictory or cannot be achieved, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0025] Embodiment: According to the embodiment of the utility model, a microphone transmitting chip board that is easy to install includes a mounting frame 1, a triangular wedge block 2 and a chip main board 3. The chip main board 3 is fixedly installed at the top center of the mounting frame 1 by screws. The MCU adopts a 32-bit single-chip microcomputer; HK32F030MF4P6. Threaded holes 11 are opened around the chip main board 3 on the top of the mounting frame 1 to realize thread rotation. A triangular wedge block 2 is movably connected to and penetrated in a T-shaped limit rod 21 on the mounting frame 1, so that the triangular wedge block 2 can move back and forth stably. The triangular wedge block 2 is located on the T-shaped limit rod 2 A telescopic spring 22 is fixedly installed at the center of one side of the top of 1, and the other end of the telescopic spring 22 is fixedly installed on the inner wall of the mounting frame 1, so that the telescopic spring 22 cooperates with the triangular wedge block 2 to achieve back and forth movement. A positioning plate 23 is fixedly installed on the triangular wedge block 2 at the inner center of the telescopic spring 22 by screws, and the positioning plate 23 movably penetrates the inside of the telescopic spring 22, so that the positioning plate 23 cooperates with the telescopic spring 22 to achieve back and forth movement. A positioning hole 12 is opened at the bottom of one side of the mounting frame 1, and the top of the positioning plate 23 movably penetrates the positioning hole 12, and moves through it, and the structure is simple and stable.

[0026] refer to Figure 1 , Figure 2 , Figure 3 and Figure 5A heat dissipation cavity 13 is provided at the center of one side of the bottom of the triangular wedge-shaped block 2 in the mounting frame 1 to dissipate heat for the chip mainboard 3. The T-shaped limit rod 21 movably penetrates the limit hole 24 to realize the limit movement. A fixing bolt 15 is threadedly penetrated and connected in the threaded hole 11 in the mounting frame 1. The bottom of the fixing bolt 15 movably abuts against one side of the top of the triangular wedge-shaped block 2 to push the triangular wedge-shaped block 2 back and forth. The contact area with the air is increased in the heat dissipation cavity 13 through the S-shaped heat dissipation fins, the heat dissipation area is increased, the heat dissipation performance is improved, and the heat dissipation effect is improved through the heat dissipation holes on the S-shaped heat dissipation fins. The structure is ingenious.

[0027] refer to Figure 1 , Figure 2 and Figure 4 The heat dissipation groove increases the connection stability of the S-shaped heat dissipation fins to dissipate heat for the chip motherboard 3. The size of the positioning hole 12 matches the size of the positioning plate 23. The top of the positioning plate 23 passes through the positioning hole 12. The structure is stable and the installation is simple and convenient.

[0028] When in use, the mounting bracket is lowered in the threaded hole of the mounting bracket by rotating the fixing bolt. During the lowering process, the fixing bolt resists one side of the triangular wedge block in the T-shaped limit rod, so that the triangular wedge block compresses the telescopic spring in the T-shaped limit rod. At the same time, the positioning plate on the triangular wedge block passes through the positioning hole in the mounting bracket, and the mounting bracket is fixed on all sides by the positioning plate. The operation is simple and convenient. During disassembly, the telescopic spring on one side of the triangular wedge block accumulates force for easy disassembly. The structure is stable. During use, the S-shaped heat dissipation fins in the heat dissipation cavity of the mounting bracket cooperate with the heat dissipation holes to achieve stable heat dissipation of the chip mainboard, increase the heat dissipation area, achieve strong heat conduction and heat dissipation performance, improve the heat dissipation capacity, and have a reasonable and ingenious design and strong practical performance.

[0029] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0030] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A microphone transmitter chip board that is easy to install, comprising a mounting frame (1), a triangular wedge block (2) and a chip main board (3), characterized in that: The chip mainboard (3) is fixedly mounted at the center of the top of the mounting frame (1) by means of screws. Threaded holes (11) are provided on the top of the mounting frame (1) around the chip mainboard (3). T-shaped limit rods (21) are fixedly mounted on the mounting frame (1) at both ends of one side at the bottom of the threaded holes (11) by means of bolts. The triangular wedge block (2) is movably connected to and penetrates the T-shaped limit rod (21) on the mounting frame (1). The triangular wedge block (2) is located at the top of the T-shaped limit rod (21). A telescopic spring (22) is fixedly mounted at the center of the side by bolts, and the other end of the telescopic spring (22) is fixedly mounted on the inner wall of the mounting frame (1) by bolts, a positioning plate (23) is fixedly mounted on the triangular wedge block (2) at the inner center of the telescopic spring (22) by screws, and the positioning plate (23) movably penetrates the interior of the telescopic spring (22), a positioning hole (12) is opened at the bottom of one side of the mounting frame (1), and the top of the positioning plate (23) movably penetrates the positioning hole (12).

2. The microphone transmitter chip board that is easy to install according to claim 1, characterized in that: A heat dissipation cavity (13) is provided in the mounting frame (1) at the center of one side of the bottom of the triangular wedge-shaped block (2).

3. The microphone transmitter chip board that is easy to install according to claim 2, characterized in that: A plurality of S-shaped heat dissipation fins (14) are evenly mounted on the mounting frame (1) at the top end of the heat dissipation cavity (13), and a plurality of heat dissipation holes (17) are evenly opened on the S-shaped heat dissipation fins (14).

4. The microphone transmitter chip board that is easy to install according to claim 1, characterized in that: Limiting holes (24) are provided at both ends of the bottom of the triangular wedge-shaped block (2), and the T-shaped limiting rod (21) movably passes through the limiting holes (24).

5. The microphone transmitter chip board that is easy to install according to claim 1, characterized in that: The size of the positioning hole (12) matches the size of the positioning plate (23), and the top of the positioning plate (23) passes through the positioning hole (12).

6. The microphone transmitter chip board that is easy to install according to claim 1, characterized in that: A fixing bolt (15) is threadedly connected through the threaded hole (11) in the mounting frame (1), and the bottom of the fixing bolt (15) is movably abutted against one side of the top of the triangular wedge block (2).

7. The microphone transmitter chip board that is easy to install according to claim 3, characterized in that: A heat dissipation groove (16) is provided on one side of the top of the heat dissipation cavity (13) in the mounting frame (1), and the S-shaped heat dissipation fins (14) all pass through the heat dissipation groove (16) and are connected to one side of the bottom of the chip mainboard (3).

Images