Power amplifier with tower structure
Through the tower structure power amplifier design, combined with water-cooled components, radiator and heat dissipation fan base, the problems of limited internal space, poor heat dissipation effect and inconvenient maintenance in the existing technology are solved, and efficient heat dissipation and power output of different levels are achieved, avoiding high-frequency interference.
Patent Information
- Application Number
- CN202421209454.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-05-30
AI Technical Summary
The existing box-type structure power amplifier has limited internal space, poor heat dissipation effect, inconvenient maintenance, and lacks the problem of high-frequency interference.
The power amplifier design adopts a tower structure, including the base, control panel, central column, column and top cover, is equipped with water-cooled components, radiator and cooling fan base, to achieve multi-stage heat dissipation mode, and to achieve different levels of power output through reasonable power amplification combined array to avoid high-frequency interference.
It realizes the free disassembly and assembly of the power amplifier, facilitates replacement of components, has multi-stage heat dissipation mode, improves heat dissipation effect, reduces operating temperature, extends equipment life, and avoids high-frequency interference.
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Figure CN222564229U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of power amplifiers, and more specifically, to a power amplifier with a tower structure. Background Art
[0002] A power amplifier is an amplifier that can generate maximum power output under a given distortion rate. It is widely used in mobile communications, digital television, broadcasting, wireless local area networks, radar, navigation and other fields. A power amplifier generates a large amount of heat when working. If the heat is not discharged in time and is retained in the power amplifier, the components inside the power amplifier will be subjected to very high temperatures, affecting the performance of the power amplifier and reducing the service life of the power amplifier. The existing method usually uses circulating water for cooling and heat dissipation. At present, the cooling equipment of the power amplifier using circulating water cooling is generally in the form of a plug-in, the power amplifier is set in a shielding cover, and the water cooling structure is also set in the shielding cover;
[0003] After searching, the existing patent (publication number: CN216721933U) discloses a high-frequency power amplifier with good heat dissipation effect, which relates to the technical field of power amplifiers. The high-frequency power amplifier with good heat dissipation effect includes a power amplifier, a display screen is arranged on the surface of the power amplifier, a heat dissipation fan is arranged inside the side of the power amplifier away from the display screen, a protective cover is fixedly installed on the surface of the power amplifier, and a knob is rotatably connected to the surface of the power amplifier. In the high-frequency power amplifier with good heat dissipation effect, the card block is inserted into the card slot, and the card block is blocked by the baffle and the rotating rod, so that the card block cannot move, and the knob cannot be rotated, which is convenient for limiting the knob, thereby preventing the knob from being touched by the outside, causing the knob to rotate, affecting the use of the power amplifier, improving the use effect and anti-mistouch effect of the power amplifier, and reducing the time for debugging the power amplifier.
[0004] At present, in order to achieve the working requirements of different power levels, a power combiner and a power divider need to be configured, but the traditional box-type power amplifier has limited internal space, poor heat dissipation effect, and inconvenient maintenance; at the same time, the above-cited patent documents do not propose relevant solutions to solve the above problems;
[0005] Therefore, in order to solve the above problems, a tower-type power amplifier is proposed. Utility Model Content
[0006] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a power amplifier with a tower structure to solve the problems raised in the above-mentioned background technology.
[0007] To achieve the above object, the utility model provides the following technical solution: a power amplifier with a tower structure, comprising a base, a heat dissipation fan seat is plugged into the interior of the base, a control panel is fixed to one end of the base, a middle column is fixed at the middle position of the top of the base, and columns are fixed at the corner positions of the top of the base, and a top cover is installed on the top of the column;
[0008] A water cooling assembly is provided between the upright columns and the middle column, and a radiator is installed between the upright columns. A power amplifier, a power synthesizer and a power distributor are installed on one side of the water cooling assembly, and a power supply is fixed to the other side of the water cooling assembly by bolts.
[0009] Preferably, the top cover is provided with snap-fitting grooves at the corner positions inside, and the snap-fitting grooves are snap-fitted with the tops of the columns.
[0010] Preferably, a mounting frame is fixed inside the top cover, and a water inlet ring pipe is installed at the central position of the bottom of the mounting frame, and a water outlet ring pipe is installed at the edge position of the bottom of the mounting frame. A water inlet and a water outlet are opened on one side of the top cover, the water inlet is connected to the water inlet ring pipe through a hose, and the water outlet is connected to the water outlet ring pipe through a hose, and branch pipes are evenly arranged at the bottom of the water inlet ring pipe and the water outlet ring pipe.
[0011] Preferably, the radiator comprises a group of cooling fins arranged in parallel and connecting rods symmetrically welded to both sides of the cooling fins, grooves are provided on both sides of the column, and the shapes of the connecting rods are consistent with the grooves.
[0012] Preferably, the water cooling assembly includes a mounting plate and a heat conducting plate, and a groove is opened in the mounting plate. The heat conducting plate is connected to the mounting plate by bolts, and a sealing rubber ring is provided at the connection between the heat conducting plate and the mounting plate. The heat conducting plate covers the groove to form a cooling water flow channel with the groove.
[0013] Preferably, slots are evenly provided on the outer wall of the center column, and plug-in slots are provided on the side of the column close to the center column, the slots correspond to the plug-in slots one by one, and insertion strips are provided on both sides of the mounting plate, and the insertion strips are adapted to the slots and the plug-in slots.
[0014] Preferably, the power amplifier is electrically connected to the power supply in a one-to-one correspondence, and the power combiner and the power divider are electrically connected to the power amplifier respectively, and the power combiner, the power divider and the power amplifier are all connected to the heat conducting plate via bolts.
[0015] Preferably, a water inlet pipe and a water outlet pipe are respectively provided at both ends of the top of the mounting plate, and the tops of the water inlet pipe and the water outlet pipe are connected to the upper branch pipe of the device through threaded connecting pipes.
[0016] Technical effects and advantages of the utility model:
[0017] 1. Compared with the prior art, the various parts of the power amplifier of the tower structure can be freely disassembled and assembled, and the maintenance is relatively convenient. The power amplifier and the power supply are simple to replace, easy to operate, and convenient to maintain. The water-cooling components, radiator and heat dissipation fan base are arranged, so that the device has a multi-level heat dissipation mode when in use, and the heat dissipation effect can be improved step by step according to the needs of use. The primary stage is the heat dissipation of the radiator, the intermediate stage is the heat dissipation of the heat dissipation fan in conjunction with the radiator, and the advanced stage is the radiator, the heat dissipation fan and the water-cooling components operate together to achieve efficient heat dissipation.
[0018] 2. Compared with the prior art, the tower-structured power amplifier is a hexagonal prism tower-shaped structure as a whole. Six water-cooling components are distributed in a circular array inside the tower. Each water-cooling component is integrated with a group of power amplifiers, power supply power synthesizers, power synthesizers and power distributors. Through the reasonably set power amplifier combination array, different levels of power output can be achieved, high-power level output can be completed, and high-frequency interference can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the structure of the utility model.
[0020] Figure 2 It is a schematic diagram of the split structure of the utility model.
[0021] Figure 3 This is a schematic diagram of the base structure of the utility model.
[0022] Figure 4 This is a schematic diagram of the structure of the water cooling component of the utility model.
[0023] Figure 5 It is a schematic diagram of the top cover structure of the utility model.
[0024] The accompanying drawings are marked as follows: 1. top cover; 101. snap-on slot; 2. column; 201. groove; 202. plug-in slot; 3. radiator; 301. cooling fins; 302. connecting rod; 4. base; 5. control panel; 6. power amplifier; 7. power supply; 8. water cooling assembly; 801. water inlet pipe; 802. water outlet pipe; 803. insert strip; 804. groove; 805. mounting plate; 806. heat conducting plate; 9. center column; 901. slot; 10. cooling fan base; 11. water inlet ring pipe; 12. mounting frame; 13. water inlet; 14. water outlet; 15. water outlet ring pipe; 16. branch pipe; 17. power combiner; 18. power distributor. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] Embodiment 1
[0027] As attached Figure 1 and Figure 2 A tower-type power amplifier is shown, comprising a base 4, a heat dissipation fan base 10 is plugged into the base 4, a control panel 5 is fixed to one end of the base 4, a center column 9 is fixed to the middle position of the top of the base 4, and columns 2 are fixed to the corner positions of the top of the base 4, and a top cover 1 is installed on the top of the column 2;
[0028] A water cooling assembly 8 is provided between the upright column 2 and the middle column 9, and a radiator 3 is installed between the upright columns 2. A power amplifier 6, a power synthesizer 17 and a power distributor 18 are installed on one side of the water cooling assembly 8, and a power supply 7 is fixed to the other side of the water cooling assembly 8 by bolts.
[0029] Among them: the device has a multi-level heat dissipation mode, which can gradually improve the heat dissipation effect according to the needs of use. The primary level is the heat dissipation of the radiator 3, the intermediate level is the heat dissipation of the heat dissipation fan in the heat dissipation fan base 10 in cooperation with the radiator 3, and the advanced level is the radiator 3, the heat dissipation fan and the water cooling component 8 running together to achieve efficient heat dissipation.
[0030] Embodiment 2
[0031] Based on the first embodiment, the solution in the first embodiment is further detailed in combination with the following specific working methods. Figures 1 to 5 As shown, see the following description for details:
[0032] As a preferred embodiment, snap-in grooves 101 are provided at the corner positions inside the top cover 1, and the snap-in grooves 101 are snap-fitted to the tops of the columns 2; further, the snap-in design is very convenient for assembly and disassembly, which is convenient for inspection and maintenance of the device.
[0033] As a preferred embodiment, a mounting frame 12 is fixed inside the top cover 1, and a water inlet ring pipe 11 is installed at the central position of the bottom of the mounting frame 12, and a water outlet ring pipe 15 is installed at the edge position of the bottom of the mounting frame 12. A water inlet 13 and a water outlet 14 are opened on one side of the top cover 1. The water inlet 13 is connected to the water inlet ring pipe 11 through a hose, and the water outlet 14 is connected to the water outlet ring pipe 15 through a hose. Branch pipes 16 are evenly arranged at the bottom of the water inlet ring pipe 11 and the water outlet ring pipe 15; further, in the water cooling mode, an external circulating water pump is connected, and cooling water enters the water inlet ring pipe 11 from the water inlet 13, and is introduced into the water cooling component 8 below through the branch pipe 16 to water-cool the functional components installed thereon, and the cooling water enters the water outlet ring pipe 15 from the water outlet pipe 802 of the water cooling component 8, and is then discharged from the water outlet 14, completing a water cooling cycle, and the cooling effect is better.
[0034] As a preferred embodiment, the radiator 3 includes a group of parallelly arranged cooling fins 301 and connecting rods 302 symmetrically welded on both sides of the cooling fins 301. Grooves 201 are provided on both sides of the column 2, and the shapes of the connecting rods 302 are consistent with the grooves 201. Furthermore, the cooling fins 301 are in contact with the side walls of the power amplifier 6, which can enhance the heat dissipation performance of the power amplifier 6. The radiator 3 is connected to the column 2 through the connecting rod 302, and is very convenient to disassemble and assemble, thereby facilitating cleaning and maintenance.
[0035] As a preferred embodiment, the water cooling assembly 8 includes a mounting plate 805 and a heat conducting plate 806, and a groove 804 is opened in the mounting plate 805, the heat conducting plate 806 is connected to the mounting plate 805 by bolts, and a sealing rubber ring is provided at the connection between the heat conducting plate 806 and the mounting plate 805, the heat conducting plate 806 covers the groove 804, and forms a cooling water flow channel with the groove 804; further, the cooling water flow channel has a continuous S-shaped bend design, which has a better cooling effect.
[0036] As a preferred embodiment, slots 901 are evenly provided on the outer wall of the middle column 9, and plug-in slots 202 are provided on the side of the column 2 close to the middle column 9, the slots 901 correspond to the plug-in slots 202 one by one, and plug-in strips 803 are provided on both sides of the mounting plate 805, and the plug-in strips 803 are adapted to the slots 901 and the plug-in slots 202; further, the mounting plate 805 is plugged with the column 2 and the middle column 9 through the plug-in strips 803, and disassembly and assembly are very convenient. At the same time, this design makes the water-cooling components 8 distributed in a ring array, and each water-cooling component 8 is integrated with a group of power amplifiers 6, power supply power synthesizers 7, power synthesizers 17 and power distributors 18, which perform one-to-one heat dissipation, have better heat dissipation effect, and can avoid high-frequency interference.
[0037] As a preferred embodiment, the power amplifier 6 is electrically connected to the power supply 7 in a one-to-one correspondence, and the power synthesizer 17 and the power divider 18 are electrically connected to the power amplifier 6 respectively, and the power synthesizer 17, the power divider 18 and the power amplifier 6 are all connected to the heat conducting plate 806 by bolts; further, through a reasonably set power amplifier 17 combination array, different levels of power output can be achieved, high-power level output can be completed, and high-frequency interference can be avoided.
[0038] As a preferred embodiment, an inlet pipe 801 and an outlet pipe 802 are respectively provided at both ends of the top of the mounting plate 805, and the tops of the inlet pipe 801 and the outlet pipe 802 are connected to the branch pipe 16 above the device through threaded connecting pipes; further, the threaded connection through the threaded pipe has better sealing, is not easy to leak, is easy to disassemble and assemble, and has a more reasonable design.
[0039] The working process of the utility model is as follows:
[0040] When in use, the power amplifier 6, the power supply 7, the power synthesizer 17 and the power distributor 18 are fixed to the water-cooling assembly 8 by bolts, and then the water-cooling assembly 8 is inserted between the column 2 and the middle column 9, and then the radiator 3 is inserted between the columns 2, and finally the water inlet pipe 801 and the water outlet pipe 802 on the top of the mounting plate 805 are connected to the branch pipe 16 at the bottom of the water inlet ring pipe 11 and the water outlet ring pipe 15 respectively by using a threaded pipe, and then the water inlet ring pipe 11 and the water outlet ring pipe 15 are connected to the water inlet 13 and the water outlet 14 on the top cover 1 by using a hose, and the top cover 1 is clamped with the column 2. At the same time, the water inlet ring pipe 11 and the water outlet ring pipe 15 can be clamped with the clamping sleeve at the bottom of the mounting frame 12. When in use, the heat dissipation effect is gradually improved according to the needs of use. The primary stage is the heat dissipation of the radiator 3, the intermediate stage is the heat dissipation of the heat fan in the heat dissipation fan base 10 in cooperation with the radiator 3, and the advanced stage is the joint operation of the radiator 3, the heat dissipation fan and the water-cooling assembly 8.
[0041] Finally: The above are only preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.
Claims
1. A tower-type power amplifier, comprising a base (4), characterized in that: A heat dissipation fan seat (10) is plugged into the interior of the base (4), and a control panel (5) is fixed to one end of the base (4); a center column (9) is fixed at the middle position of the top of the base (4), and columns (2) are fixed at the corner positions of the top of the base (4); and a top cover (1) is installed on the top of the column (2); A water cooling assembly (8) is provided between the upright columns (2) and the middle column (9), and a radiator (3) is installed between the upright columns (2). A power amplifier (6), a power synthesizer (17) and a power distributor (18) are installed on one side of the water cooling assembly (8), and a power supply (7) is fixed to the other side of the water cooling assembly (8) by means of bolts.
2. The tower-type power amplifier according to claim 1, characterized in that: The top cover (1) is provided with snap-fitting grooves (101) at the corner positions inside the top cover (1), and the snap-fitting grooves (101) are snap-fitted with the tops of the upright posts (2).
3. The tower-type power amplifier according to claim 1, characterized in that: A mounting frame (12) is fixed inside the top cover (1), and a water inlet ring pipe (11) is mounted at the central position of the bottom of the mounting frame (12), and a water outlet ring pipe (15) is mounted at the edge position of the bottom of the mounting frame (12). A water inlet (13) and a water outlet (14) are provided on one side of the top cover (1), the water inlet (13) is connected to the water inlet ring pipe (11) through a hose, and the water outlet (14) is connected to the water outlet ring pipe (15) through a hose, and branch pipes (16) are evenly arranged at the bottom of the water inlet ring pipe (11) and the water outlet ring pipe (15).
4. The tower-type power amplifier according to claim 1, characterized in that: The radiator (3) comprises a group of parallel heat dissipation fins (301) and connecting rods (302) symmetrically welded to both sides of the heat dissipation fins (301); grooves (201) are provided on both sides of the column (2), and the shape of the connecting rods (302) matches the shape of the grooves (201).
5. The tower-type power amplifier according to claim 3, characterized in that: The water cooling assembly (8) comprises a mounting plate (805) and a heat conducting plate (806), and a groove (804) is provided in the mounting plate (805); the heat conducting plate (806) is connected to the mounting plate (805) by bolts, and a sealing rubber ring is provided at the connection between the heat conducting plate (806) and the mounting plate (805); the heat conducting plate (806) covers the groove (804), and forms a cooling water flow channel with the groove (804).
6. The tower-type power amplifier according to claim 5, characterized in that: Slots (901) are evenly arranged on the outer wall of the middle column (9), and plug-in slots (202) are arranged on the side of the upright column (2) close to the middle column (9), the slots (901) correspond to the plug-in slots (202) one by one, and inserting strips (803) are arranged on both sides of the mounting plate (805), and the inserting strips (803) are adapted to the slots (901) and the plug-in slots (202).
7. The tower-type power amplifier according to claim 5, characterized in that: The power amplifier (6) is electrically connected to the power supply (7) in a one-to-one correspondence, and the power combiner (17) and the power distributor (18) are electrically connected to the power amplifier (6) respectively, and the power combiner (17), the power distributor (18) and the power amplifier (6) are all connected to the heat conducting plate (806) via bolts.
8. The tower-type power amplifier according to claim 5, characterized in that: The two ends of the top of the mounting plate (805) are respectively provided with a water inlet pipe (801) and a water outlet pipe (802), and the tops of the water inlet pipe (801) and the water outlet pipe (802) are connected to the upper branch pipe (16) of the device through threaded connecting pipes.
Citation Information
Patent Citations
High-frequency power amplifier with good heat dissipation effect
CN216721933U