Gas heating device
By designing a gas heating device for reflow soldering furnaces, and using partition partition plates and airflow adjustment plates to adjust the gas flow rate, the problems of slow heating speed and large heat consumption of existing reflow soldering furnaces are solved, the heating speed is improved and the temperature uniformity is achieved, and product quality and production efficiency are improved.
Patent Information
- Application Number
- CN202420580711.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-25
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-03-25
AI Technical Summary
The existing reflow soldering furnaces have slow heating speed and high heat consumption, making it difficult to meet production requirements, resulting in unqualified product quality and low production efficiency.
A gas heating device is designed, including a shell, multiple blow holes, a thick film heating plate with holes, a gas diverter and an axial flow fan. The gas flow rate is adjusted through the partition partition plate and the air flow regulation plate to achieve fast heating speed and uniform temperature.
It achieves the improvement of heating speed and temperature uniformity, avoids energy waste, and improves product quality and production efficiency.
Smart Images
Figure CN222569509U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a welding technology, in particular to a surface mounting technology, specifically to a reflow welding gas heating device for a surface mounting production line. Background Art
[0002] At present, with the increasing requirements of electronic products for high frequency, miniaturization and high reliability, surface mount technology is widely used in the manufacture of electronic products due to its good high frequency characteristics, low solder joint defect rate and high degree of automation. It efficiently assembles circuit boards through fully automated solder paste printing and patch technology. Reflow soldering is one of the main process technologies currently used in the assembly of circuit board components. It provides a heating environment to melt the solder paste, so that the surface mounted components and PCB pads can be reliably combined together through the solder paste. When the existing reflow oven is heated, the gas temperature rises slowly. At the same time, when the gas is heated and blown onto the conveyor belt, heat loss will occur, and the temperature often fails to meet the requirements, which not only wastes too much energy, but also produces products of substandard quality and low production efficiency. Utility Model Content
[0003] The utility model aims to design a gas heating device with fast heating speed and uniform heating surface temperature in view of the problems that the reflow soldering furnace on the existing patch production line has slow heating speed and large heat consumption and is difficult to meet production requirements.
[0004] The technical solution of the utility model is:
[0005] A gas heating device comprises a shell 1, characterized in that: a plurality of blowing holes 2 for blowing heating and welding PCB boards on a production line are evenly arranged on the bottom plate of the shell 1, a thick film heating plate 3 with holes is installed in the shell 1 and on the upper part of the bottom plate, a gas diverter 4 is installed on the upper part of the thick film heating plate 3, a gas bearing groove 5 is installed on the upper part of the gas diverter 4, the gas bearing groove 5 is fixed on an upper cover plate 6, the upper cover plate 6 is fixed on the upper surface of the shell 1, and a mounting hole 13 for mounting an axial flow fan 7 is provided on the upper cover plate 6, the wind generated by the axial flow fan 7 sends gas into the gas bearing groove 5 and guides it into the gas diverter plate 4, the wind diverted by the gas diverter 4 is blown to the thick film heating plate 3 to be heated into hot air and blown out from the blowing holes 2 on the bottom plate of the shell through the thick film heating plate 3 to heat the PCB boards on the patch assembly line.
[0006] The gas diverter 4 forms a plurality of blowing holes through a partition plate 8, an upper wind shield plate 9, and a lower wind shield plate 10, and an airflow adjustment plate 11 is installed on each blowing hole. The area of the blowing hole covered by the airflow adjustment plate 11 is adjusted to thereby adjust the flow rate of the gas blown to the thick film heating plate 3.
[0007] One end of the airflow adjustment plate 11 is fixed to the upper wind shield plate 9 by means of bolts.
[0008] The lower wind shield plate 10 is provided with a vent hole 12 .
[0009] Beneficial effects of the utility model:
[0010] The utility model divides the heating plate into small partitions through vertical partition plates, and then adjusts the flow of each blowing hole through an adjusting plate, each adjusting plate corresponds to a small partition; the outlet temperature of the blowing holes below the heating plate can be adjusted by adjusting the flow of each hole; through comprehensive adjustment, a very high temperature uniformity can be achieved; the change of the total air volume, for each small hole, the relative ratio of the flow is basically the same, so adjusting the air volume will not change the temperature field change, thereby achieving balanced and rapid heating. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a three-dimensional exploded structural schematic diagram of the utility model.
[0012] Figure 2 yes Figure 1 Bottom view of . DETAILED DESCRIPTION
[0013] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0014] like Figure 1-2 shown.
[0015] A gas heating device comprises a housing 1, wherein a plurality of blowing holes 2 (such as Figure 2 ), in the shell 1, a thick film heating plate 3 with holes is installed on the upper part of the bottom plate, a gas diverter 4 is installed on the upper part of the thick film heating plate 3, a gas bearing groove 5 (mainly plays a role of flow diversion and distribution, can be designed according to needs or adopt the same structure as the prior art) is installed on the upper part of the gas diverter 4, the gas bearing groove 5 is fixed on the upper cover plate 6, the upper cover plate 6 is fixed on the upper surface of the shell 1, and the upper cover plate 6 is provided with a mounting hole 13 for mounting the axial flow fan 7, such as Figure 1As shown, the wind generated by the axial flow fan 7 sends gas into the gas bearing groove 5 and guides it into the gas diverter 4. The wind diverted by the gas diverter 4 is blown to the thick film heating plate 3 to be heated into hot air and blown out from the blowing hole 2 on the bottom plate of the shell through the thick film heating plate 3 to heat the PCB board on the patch assembly line. Specifically, the gas diverter 4 forms a plurality of blowing holes through the partition plate 8, the upper wind shield plate 9, and the lower wind shield plate 10. An air flow adjustment plate 11 is installed on each blowing hole. The area of the blowing hole covered by the air flow adjustment plate 11 is adjusted to adjust the flow rate of the gas blown to the thick film heating plate 3. One end of the air flow adjustment plate 11 is fixed to one side of the opening position of the upper wind shield plate 9 on the upper part by bolts. The lower wind shield plate 10 is provided with a vent 12. The change of the total air volume of the fan, for each small partition, the relative ratio of the flow rate is basically the same, so adjusting the air volume will not change the temperature field change, and balanced and rapid heating is achieved.
[0016] The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.
Claims
1. A gas heating device, comprising a housing (1), characterized in that: A plurality of blowing holes (2) for blowing air to heat and weld PCB boards on a production line are evenly arranged on the bottom plate of the shell (1); a thick film heating plate (3) with holes is installed in the shell (1) and on the upper part of the bottom plate; a gas diverter (4) is installed on the upper part of the thick film heating plate (3); a gas bearing groove (5) is installed on the upper part of the gas diverter (4); the gas bearing groove (5) is fixed on an upper cover plate (6); the upper cover plate (6) is fixed on the upper surface of the shell (1); a mounting hole (13) for mounting an axial flow fan (7) is provided on the upper cover plate (6); the wind generated by the axial flow fan (7) sends gas into the gas bearing groove (5) and guides it into the gas diverter (4); the wind diverted by the gas diverter (4) is blown to the thick film heating plate (3) to be heated into hot air, and passes through the thick film heating plate (3) to be blown out from the blowing holes (2) on the bottom plate of the shell to heat the PCB boards on the patch assembly line.
2. The gas heating device according to claim 1, characterized in that: The gas diverter (4) forms a plurality of blowing holes through a partition plate (8), an upper wind shield plate (9), and a lower wind shield plate (10), and an airflow adjustment plate (11) is installed on each blowing hole on the upper wind shield plate. The area of the blowing hole covered by the airflow adjustment plate (11) is adjusted to thereby adjust the flow rate of the gas blown toward the thick film heating plate (3).
3. The gas heating device according to claim 2, characterized in that: One end of the airflow adjustment plate (11) is fixed to the upper wind shield plate (9) by means of bolts.
4. The gas heating device according to claim 2, characterized in that: The lower wind shield (10) is provided with a vent hole (12).