Magnetron sputtering equipment

Abstract

The utility model discloses magnetron sputtering equipment, which belongs to the technical field of magnetron sputtering, and adopts the technical scheme that the magnetron sputtering equipment comprises a sputtering cabin body, a winding mechanism is arranged in the sputtering cabin body, a target material assembly is arranged in the sputtering cabin body and positioned on the side surface of the winding mechanism, and the target material assembly comprises a copper target piece; a spring rod is arranged on the copper target piece, the spring rod is connected with the sputtering cabin body, a pull rope piece is connected to the position, close to the spring rod, of the copper target piece, the pull rope piece is connected with an electric push rod, and the electric push rod is connected with the sputtering cabin body. According to the utility model, the distance between the target material and the substrate can be accurately adjusted in real time, the sputtering equipment does not need to be disassembled for adjustment, the adjustment time is conveniently and quickly saved, and the coating efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of magnetron sputtering, in particular to a magnetron sputtering device. Background Art

[0002] Magnetron sputtering is an important method for surface thin film dry electroplating processing. Magnetron sputtering equipment is a key equipment for modern multifunctional thin film and electronic thin film processing, and is an important way to realize the conductorization of non-metallic materials or surface coating of materials. The existing magnetron sputtering equipment has a fixed and non-adjustable target-base distance, and cannot realize dynamic adjustment of the base distance, which easily causes problems such as uneven thickness of the subsequent water-plated thickened coating and low adhesion of the coating. The operator cannot solve the problem by adjusting the target-base distance of the sputtering equipment in time, and needs to stop working and disassemble the sputtering equipment before adjusting the target-base distance, which is very inconvenient and affects the coating efficiency. Therefore, a magnetron sputtering equipment is needed. Utility Model Content

[0003] In view of the problems existing in the prior art, the purpose of the utility model is to provide a magnetron sputtering device that can accurately and in real time adjust the distance between the target material and the substrate without disassembling the sputtering device for adjustment, thereby conveniently, quickly and effectively saving adjustment time and improving coating efficiency.

[0004] The above technical objectives of the utility model are achieved through the following technical solutions: A magnetron sputtering device comprises a sputtering chamber, a winding mechanism is arranged in the sputtering chamber, and a target assembly is arranged inside the sputtering chamber on the side of the winding mechanism;

[0005] The target assembly includes a copper target, a spring rod is arranged on the copper target, the spring rod is connected to the sputtering chamber, a pull rope is connected to the end of the copper target, the pull rope is connected to an electric push rod, and the electric push rod is connected to the sputtering chamber.

[0006] In some embodiments, the winding mechanism includes a film roll, a substrate, and a film.

[0007] In some embodiments, two of each of the film roll and the substrate are provided.

[0008] In some embodiments, two target assemblies are provided, which are respectively located on both sides of the sputtering chamber and face the substrate.

[0009] In some embodiments, four of the spring rods and four of the pull rope members are provided.

[0010] In some embodiments, a non-slip pad is provided at the bottom of the sputtering chamber.

[0011] In some embodiments, the sputtering chamber is provided with a partition, and a slide groove connecting the partition with the interior of the sputtering chamber is opened on the inner wall of the sputtering chamber, and the pull rope member is located in the partition.

[0012] In summary, the utility model has the following beneficial effects:

[0013] The utility model arranges a target material assembly inside a sputtering chamber, and utilizes the linkage of an electric push rod and a pull rope member to accurately and in real time adjust the distance between the copper target and the substrate, and adjusts the constraint force of the magnetic field and the electric field in the sputtering chamber on the metal ion path by adjusting the distance between the copper target and the substrate, thereby improving the sputtering rate during coating and the uniformity of metal ion implantation and deposition, ensuring the uniformity and consistency of the coating, and eliminating the need to disassemble the sputtering equipment for adjustment, thereby conveniently, quickly and effectively saving adjustment time and improving the coating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a cross-sectional view of the sputtering chamber of the utility model;

[0016] Figure 3 This is a schematic diagram of the internal structure of the sputtering chamber of the utility model;

[0017] Figure 4 It is a partial structural schematic diagram of the target material assembly of the utility model.

[0018] In the figure: 1. sputtering chamber; 11. slide chute; 2. winding mechanism; 21. film roll; 22. substrate; 23. film; 3. target assembly; 31. copper target; 32. spring rod; 33. pull rope; 34. electric push rod. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-3A magnetron sputtering device comprises a sputtering chamber 1, a winding mechanism 2 is arranged in the sputtering chamber 1, a target assembly 3 is arranged on the side of the winding mechanism 2 inside the sputtering chamber 1, the target assembly 3 comprises a copper target 31, a spring rod 32 is arranged on the copper target 31, the spring rod 32 is connected to the sputtering chamber 1, a pull rope 33 is connected to the end of the copper target 31, the pull rope 33 is connected to an electric push rod 34, the electric push rod 34 is connected to the sputtering chamber 1, the winding mechanism 2 comprises a film roll 21, a substrate 22 and a film 23, two of the film roll 21 and the substrate 22 are arranged, two of the target assembly 3 are arranged, which are respectively located on both sides of the sputtering chamber 1 and face the substrate 22, the electric push rod 34 has an existing control program built in, and the operator can control the extension and contraction of the electric push rod 34 through a computer, which will not be described in detail here. Figure 3 Taking the target assembly 3 on the left as an example, when in use, the operator controls the electric push rod 34 to retract and pull the pull rope member 33. The pull rope member 33 is an existing rope and pulley combination, which will not be described in detail here. The four pull rope members 33 jointly pull the copper target 31 up and move it toward the substrate 22, thereby adjusting the distance between the copper target 31 and the substrate 22, effectively realizing the adjustment of the magnetic field and electric field in the sputtering chamber 1 on the constraint force of the metal ion path, and can strengthen the trapping effect of the secondary electrons of the diode sputtering, improve the sputtering rate and the uniformity of the metal ion implantation deposition, and ensure the uniformity and consistency of the coating. During the movement of the copper target 31, the four spring rods 32 are respectively balanced with a pull rope member 33 to achieve stable movement of the copper target 31, and can accurately control the distance between the copper target 31 and the substrate 22, and the copper target 31 can rebound and reset through the elastic force of the spring rods 32. The same is true for the target assembly 3 on the right, that is, accurate distance adjustment is achieved to ensure the quality of the coating.

[0021] In some embodiments, four spring rods 32 and four pull rope members 33 are provided. The four spring rods 32 and the pull rope members 33 can ensure that the copper target 31 is subjected to balanced force when moving, thereby preventing the copper target 31 from tilting when the operator adjusts the distance between the copper target 31 and the substrate 22, resulting in uneven coating and affecting the coating effect.

[0022] In some embodiments, an anti-skid pad is provided at the bottom of the sputtering chamber 1, and the anti-skid pad can increase the friction between the sputtering chamber 1 and the placement platform, prevent the sputtering chamber 1 from sliding, and ensure the stability of the internal coating.

[0023] In some embodiments, the sputtering chamber 1 is provided with a partition, and a slide groove 11 connecting the partition and the interior of the sputtering chamber 1 is opened on the inner wall of the sputtering chamber 1, and the pull rope member 33 is located in the partition. When the operator controls the electric push rod 34 to drive the pull rope member 33 to work, the pull rope member 33 drives the end of the copper target 31 to move in the slide groove 11. The slide groove 11 can not only assist the pull rope member 33 to calibrate the moving route of the copper target 31 to ensure its stable movement, but also limit the copper target 31 to prevent the copper target 31 from deviating downward due to gravity, ensure that the copper target 31 is facing the substrate 22, and ensure the stability of the coating. In addition, the pull rope member 33 is located in the partition of the sputtering chamber 1, which can prevent the sputtered copper ions from being contaminated on the pull rope member 33 and causing copper waste.

[0024] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A magnetron sputtering device, comprising a sputtering chamber (1), characterized in that: A winding mechanism (2) is arranged in the sputtering chamber (1), and a target assembly (3) is arranged on the side of the winding mechanism (2) inside the sputtering chamber (1); The target assembly (3) comprises a copper target (31), a spring rod (32) is arranged on the copper target (31), the spring rod (32) is connected to the sputtering chamber (1), the end of the copper target (31) is connected to a pull rope (33), the pull rope (33) is connected to an electric push rod (34), and the electric push rod (34) is connected to the sputtering chamber (1).

2. A magnetron sputtering device according to claim 1, characterized in that: The winding mechanism (2) comprises a film roll (21), a substrate (22) and a film (23).

3. A magnetron sputtering device according to claim 2, characterized in that: The film roll (21) and the base (22) are both provided in two pieces.

4. A magnetron sputtering device according to claim 3, characterized in that: Two target assemblies (3) are provided, respectively located on two sides of the sputtering chamber (1) and facing the substrate (22).

5. The magnetron sputtering device according to claim 1, characterized in that: The spring rods (32) and the pull rope members (33) are each provided in four numbers.

6. The magnetron sputtering device according to claim 1, characterized in that: An anti-slip pad is provided at the bottom of the sputtering chamber (1).

7. The magnetron sputtering device according to claim 1, characterized in that: The sputtering chamber (1) is provided with a partition, and a slide groove (11) connecting the partition with the interior of the sputtering chamber (1) is provided on the inner wall of the sputtering chamber (1), and the pull rope member (33) is located in the partition.

Images