Compressor heat dissipation device

Abstract

The utility model relates to the technical field of heat dissipation devices, in particular to a compressor heat dissipation device which comprises a fan and further comprises a heat conduction assembly used for absorbing heat to dissipate heat of a compressor and comprising a curved surface heat conduction cover installed on the compressor and heat dissipation fins installed on the curved surface heat conduction cover. The cold and warm bin is installed on the heat conduction assembly and used for providing a low-temperature cold environment; the flow guide air ring is installed on the cold and warm bin, and the fan is installed on the flow guide air ring and used for providing flowing cold air; according to the heat dissipation device for the compressor, heat of the compressor can be better absorbed through the arranged heat conduction assembly, the arranged cold and warm bin can be matched with the fan to provide flowing cold air for the surface of the heat conduction assembly, rapid heat dissipation is facilitated, combination of air circulation heat dissipation and water cooling heat dissipation is achieved, and more efficient heat dissipation performance is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a compressor heat dissipation device. Background Art

[0002] The heat dissipation of the compressor usually includes natural heat dissipation, air circulation heat dissipation and water cooling. Currently, the most widely used method is air circulation heat dissipation. When the heat dissipation of the compressor is insufficient, it will not only lead to an increase in the temperature rise of the compressor, but also indirectly increase the working environment temperature of other refrigeration components, electrical devices, etc., thereby leading to an increase in product energy consumption and an increase in failure rate.

[0003] However, the current natural heat dissipation or air cooling has limited effects, and the heat dissipation effect is poor when dealing with high power and high heat generation; therefore, we consider how to better improve the heat dissipation performance of the compressor. In view of this, we propose a compressor heat dissipation device. Utility Model Content

[0004] The purpose of the utility model is to solve the deficiencies mentioned in the above background technology and provide a compressor heat dissipation device.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A compressor heat dissipation device comprises a fan and further comprises:

[0007] A heat-conducting component, used for absorbing heat to dissipate heat from the compressor, comprising a curved heat-conducting cover mounted on the compressor, and heat-dissipating fins mounted on the curved heat-conducting cover;

[0008] A cold and warm chamber, installed on the heat conducting component to provide a low temperature cold environment;

[0009] The guide air ring is installed on the cold and warm warehouse, and the fan is installed on the guide air ring to provide flowing cold air.

[0010] Preferably, the curved heat-conducting cover is in contact with the heat dissipation surface of the compressor, and a recessed structure for increasing the surface area is provided on the inner wall of the curved heat-conducting cover;

[0011] The recessed structure is coated with thermal conductive silicone grease.

[0012] Preferably, a sealing strip is installed on the inner wall of the curved heat-conducting cover to prevent the loss of thermal grease.

[0013] Preferably, the cold-temperature warehouse is provided with a liquid storage chamber for containing coolant, and the cold-temperature warehouse wall is provided with ventilation holes evenly distributed.

[0014] Preferably, a plurality of semiconductor refrigeration plates for absorbing heat to reduce the temperature of the coolant are installed on the outer wall of the cold and warm warehouse.

[0015] Preferably, the air guide ring adopts a truncated cone structure with a diameter that gradually shrinks from bottom to top.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] The compressor heat dissipation device can better absorb the heat of the compressor through the heat-conducting component, and the cold temperature chamber can cooperate with the fan to provide flowing cold air to the surface of the heat-conducting component, which is conducive to rapid heat dissipation. The device realizes the combination of air circulation heat dissipation and water cooling heat dissipation, and has more efficient heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0019] Figure 1 It is a schematic diagram of an embodiment of the utility model;

[0020] Figure 2 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 3 This is an exploded view of the overall structure of the utility model;

[0022] Figure 4 It is a cutaway diagram of the overall structure of the utility model;

[0023] Figure 5 It is a schematic diagram of the heat conduction component of the utility model.

[0024] The meaning of each number in the figure is:

[0025] 1. Compressor; 2. Heat-conducting component; 21. Curved heat-conducting cover; 22. Heat-dissipating fins; 3. Cold and warm chamber; 31. Ventilation holes; 301. Liquid storage chamber; 4. Air guide ring; 5. Fan; 6. Semiconductor refrigeration sheet. DETAILED DESCRIPTION

[0026] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-5 The utility model describes the above technical solution in detail through the following embodiments:

[0028] A compressor heat dissipation device, comprising a fan 5, and further comprising:

[0029] The heat conducting component 2 is used to absorb heat to dissipate heat from the compressor 1, and includes a curved heat conducting cover 21 mounted on the compressor 1, and heat dissipating fins 22 mounted on the curved heat conducting cover 21, see Figure 5 In the structure shown, the curved heat-conducting cover 21 adopts a concave structure that fits the heat dissipation surface of the compressor 1, and a concave structure for increasing the surface area is provided on the inner wall of the curved heat-conducting cover 21, and thermal grease is coated in the concave structure, so that the thermal grease improves the heat exchange efficiency through a larger contact area, which is conducive to faster transfer of heat from the compressor 1 to the heat-conducting component 2, and a sealing strip is installed on the inner wall of the curved heat-conducting cover 21 to prevent the loss of thermal grease.

[0030] It should be noted that if Figure 4 and Figure 5 In the structure shown, the heat dissipation fins 22 of this embodiment are arranged continuously, and the heat dissipation fins 22 of other embodiments can also be arranged to be distributed along the central ring. The main purpose is to obtain external flowing air, so that the air can flow through the surface of the heat dissipation fins 22 to take away the heat, and then realize continuous and effective heat dissipation.

[0031] The cold and warm chamber 3 is installed on the heat conducting component 2 to provide a low temperature cold environment. Figure 4 In the structure shown, a liquid storage chamber 301 for containing coolant is provided on the cold-temperature bin 3, and ventilation holes 31 are evenly distributed on the bin wall of the cold-temperature bin 3. A plurality of semiconductor refrigeration sheets 6 for absorbing heat and reducing the temperature of the coolant are installed on the outer bin wall of the cold-temperature bin 3; one side of the semiconductor refrigeration sheet 6 absorbs heat for cooling, and the other side releases heat for dissipation. In this embodiment, the semiconductor refrigeration sheet 6 is attached to the outer bin wall of the cold-temperature bin 3 to cool the coolant in the bin.

[0032] The guide air ring 4 is installed on the cold and warm chamber 3, and the fan 5 is installed on the guide air ring 4 to provide flowing cold air. The guide air ring 4 adopts a truncated cone structure with a diameter that gradually shrinks from bottom to top; the flowing air is inhaled along the ventilation holes 31, and the low-temperature cold and warm chamber 3 obtains cold air. The cold air flows through the heat-absorbing curved heat-conducting cover 21 and the heat dissipating fins 22, taking away the heat and dissipating it from the fan 5.

[0033] The compressor heat dissipation device of this embodiment has the following working principle: during use, the heat conduction component 2 and the cold and warm chamber 3 can reduce the peak temperature of the compressor 1 during operation by heat conduction. In this embodiment, the device is installed on the compressor 1, and the inner cover surface of the curved heat conduction cover 21 is coated with thermal grease. The curved heat conduction cover 21 absorbs heat and then conducts it to the heat dissipation fins 22. The semiconductor refrigeration sheet 6 is attached to the outer wall of the cold and warm chamber 3 for periodic cooling. Whether the semiconductor refrigeration sheet 6 is to be operated is determined by whether the compressor 1 is in operation. In this embodiment, the semiconductor refrigeration sheet 6 is started for rapid cooling when the compressor 1 is shut down due to high temperature as an example. The generated cold energy is stored in the cold and warm chamber 3, and the cold and warm chamber 3 is cooled. The fan 5 is set to rotate constantly. During the contraction and diversion process of the guide air ring 4, the flowing airflow passes through the ventilation holes 31 to obtain cold air. The cold air flows through the surface of the heat dissipation fins 22 to take away the heat, and finally takes away the heat and discharges it, thereby obtaining continuous heat dissipation performance.

[0034] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0035] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0036] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A compressor heat dissipation device, comprising a fan (5), characterized in that: Also includes: A heat-conducting component (2) is used to absorb heat to dissipate heat from the compressor (1), comprising a curved heat-conducting cover (21) mounted on the compressor (1), and heat-dissipating fins (22) mounted on the curved heat-conducting cover (21); A cold and warm chamber (3), installed on the heat conducting component (2) and used for providing a low-temperature cold environment; The guide air ring (4) is installed on the cold and warm warehouse (3), and the fan (5) is installed on the guide air ring (4) to provide flowing cold air.

2. The compressor heat dissipation device according to claim 1, characterized in that: The curved heat-conducting cover (21) is in contact with the heat dissipation surface of the compressor (1), and a recessed structure for increasing the surface area is provided on the inner wall of the curved heat-conducting cover (21); The recessed structure is coated with thermal conductive silicone grease.

3. The compressor heat dissipation device according to claim 2, characterized in that: The inner wall of the curved heat-conducting cover (21) is provided with a sealing strip for preventing the loss of heat-conducting silicone grease.

4. The compressor heat dissipation device according to claim 1, characterized in that: The cold-warm bin (3) is provided with a liquid storage chamber (301) for storing cooling liquid, and the wall of the cold-warm bin (3) is provided with ventilation holes (31) evenly distributed.

5. The compressor heat dissipation device according to claim 4, characterized in that: A plurality of semiconductor refrigeration sheets (6) for absorbing heat and lowering the temperature of the cooling liquid are installed on the outer wall of the cold and warm chamber (3).

6. The compressor heat dissipation device according to claim 1, characterized in that: The guide air ring (4) adopts a truncated cone structure with a diameter that gradually shrinks from bottom to top.

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