Groove type wafer bracket for batch wafer cleaning

Abstract

The utility model discloses a groove type wafer bracket used for batch wafer cleaning, which comprises a bracket main body, wafer supporting seats and arc-shaped slots, the two sides of the upper surface of the bracket main body are symmetrically provided with straight-strip-shaped wafer supporting seats, the wafer supporting seats are arranged along the long sides of the bracket main body, the top surfaces of the wafer supporting seats are supporting surfaces, and the arc-shaped slots are arranged in the supporting surfaces. The supporting surface is an arc-shaped surface with a high outer side and a low inner side, a plurality of limiting teeth are arranged on the top surface of the wafer supporting seat along the length, the limiting teeth are perpendicular to the long edge of the bracket main body, the limiting teeth are parallel and are arranged at equal intervals, arc-shaped slots which are sunken downwards are formed between the adjacent limiting teeth, and a wafer workpiece is inserted into the corresponding arc-shaped slots on the two sides. The radius corresponding to the groove bottom of each arc-shaped slot is consistent with the radius of the wafer workpiece, and the total contact length of the two arc-shaped slots and the circumferential surface of the wafer workpiece does not exceed 1 / 3 of the perimeter of the wafer workpiece; according to the bracket, the contact area with the wafers can be reduced, the supporting effect on a plurality of wafers is ensured, and the wafers cleaned in batches can achieve a higher cleaning effect.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing jigs, and in particular relates to a slot-type wafer bracket for batch wafer cleaning. Background Art

[0002] Cleaning is a very important step in wafer manufacturing, photolithography, etching, deposition and other key processes. Wafer cleaning is sometimes required by the process, and sometimes it is for pre-cleaning the surface to remove surface contaminants. The surface of the wafer must be clean before entering each process. After repeated cleaning steps, particles, organic matter, metal impurities and natural oxide layers on the wafer surface can be removed.

[0003] There are two ways to clean wafers: single wafer cleaning and batch cleaning. Single wafer cleaning is to clean wafers one by one through a fixture. This method has good cleaning effect but low efficiency and is only suitable for cleaning wafers produced in small batches. Batch cleaning is to bring multiple wafers together and process a large number of wafers in batches at the same time. Batch cleaning uses slot trays to store wafers, which is prone to cross contamination during the cleaning process. This is because the slot tray must increase the contact area to ensure the supporting effect on batches of wafers, and the contact surface between the contact tray and the wafer is difficult to clean. The larger the contact surface, the worse the cleaning effect. Once the contamination spreads, it will endanger the yield of the entire batch of wafers. If the contact surface between the slot tray and the wafer is reduced, the wafer is prone to tilt and fall over due to liquid flow impact during the cleaning process, resulting in collision damage or mutual contamination, making it even more difficult to clean. Therefore, batch wafer cleaning to achieve a higher cleaning quality is a major difficulty in wafer cleaning. Utility Model Content

[0004] In view of the above problems and technical requirements, the utility model provides a trough-type wafer holder for batch wafer cleaning, which can reduce the contact area with the wafer, ensure the supporting effect for multiple wafers, and achieve a higher cleaning effect for batch cleaned wafers.

[0005] The technical scheme of the utility model is as follows: a slot-type wafer bracket for batch wafer cleaning, comprising a bracket body, a wafer support seat and an arc-shaped slot, the bracket body being rectangular, and straight-bar-type wafer support seats are symmetrically arranged on both sides of the upper surface of the bracket body, the wafer support seats are arranged along the long side of the bracket body, and the top surface of the wafer support seat is a supporting surface, which is an arc-shaped surface with a high outer side and a low inner side. A plurality of limiting teeth are arranged on the upper length of the top surface of the wafer support seat, the limiting teeth are perpendicular to the long side of the bracket body, the limiting teeth are parallel and equidistantly arranged, and there is an arc-shaped slot recessed downward between adjacent limiting teeth, a wafer workpiece is inserted into the corresponding arc-shaped slots on both sides, the wafer workpiece remains upright, the radius corresponding to the bottom of the arc-shaped slot is consistent with the radius of the wafer workpiece, and the total contact length between the two arc-shaped slots and the peripheral surface of the wafer workpiece does not exceed 1 / 3 of the circumference of the wafer workpiece.

[0006] Furthermore, the cross-sectional shape of the arc-shaped slot is axisymmetric, and the arc-shaped slot includes a slot bottom surface, slot side walls and a buffer slope surface. The slot bottom surface is a semicircular surface, and the slot side walls are symmetrically arranged on both sides of the slot bottom surface obliquely upward. The buffer slope surface is connected to the top of the slot side walls, and the angle between the slot side walls is smaller than the angle between the buffer slope surfaces.

[0007] In the above scheme, the wafer workpiece is vertically inserted into the arc-shaped slot, and the two arc-shaped slots support the wafer workpiece along the contour of the wafer workpiece. Since the inner shape of the arc-shaped slot is V-shaped and the bottom surface of the slot is semicircular, after the wafer is inserted, the contact area between the edge of the wafer and the arc-shaped slot is very small, and there is no large-area surface clamping. Instead, the wafer is straightened by the arc. During cleaning, pure water can penetrate into the arc-shaped slot and even into the bottom surface of the slot. It can not only clean in large quantities, but also achieve good cleaning effects.

[0008] Furthermore, the radius of the bottom surface of the groove is within 0.25 mm, the angle between the two groove side walls is 15°±1°, and the angle between the two buffer slopes is 90°±1°. The groove side walls with small angles can not only limit the position of the wafer workpiece, but also ensure that the contact with the surface of the wafer workpiece is not as close as possible. The buffer slope has a large slope, and the gentle slope improves the safety of the wafer workpiece when clamping.

[0009] Furthermore, the top of the limiting tooth is a flat top surface, which is connected to the buffer slope surfaces on both sides, and the highest point of the outer end of the flat top surface gradually widens to form a triangular surface, which is a horizontal surface.

[0010] Furthermore, a straight groove is provided in the middle of the bracket body, the straight groove is recessed between the two wafer support seats, a rectangular through hole is provided in the middle of the straight groove, and two countersunk screw holes are provided on both sides of the rectangular through hole. The bracket body can be fixed by inserting the countersunk screws into the countersunk screw holes, and the cleaning liquid can directly enter the straight groove through the rectangular through holes to clean the bottom of the vertically placed wafer, thereby improving the cleaning efficiency.

[0011] Furthermore, a positioning groove is provided on the bottom surface of the bracket body, and ribs are provided on both sides of the positioning groove. When two brackets are stacked, the ribs of the upper bracket are correspondingly stacked on the triangular surface of the end of the limiting tooth of the next bracket.

[0012] Compared with the prior art, the utility model has the following beneficial effects: 1) the bracket adopts a symmetrically arranged wafer support seat to support the wafer workpiece, the wafer workpiece is placed in the arc-shaped slot to maintain a vertical state, the bottom of the slot side wall clamps the wafer workpiece, and the upper part of the slot side wall is V-shaped and does not contact the wafer surface, so the contact surface between the wafer and the arc-shaped slot is very small, and the cleaning liquid can be flushed into the slot for cleaning during cleaning, leaving no dead corners, and the cleaning effect is good, and no cross contamination occurs, which is suitable for cleaning of large quantities of wafer workpieces; 2) two arc-shaped slots jointly support a workpiece, and the total contact length of the two arc-shaped slots and the peripheral surface of the wafer workpiece does not exceed 1 / 3 of the circumference of the wafer workpiece, which further reduces the contact surface with the edge of the wafer, and the vacant straight slot in the middle allows the cleaning liquid to clean upward through the rectangular through hole, ensuring the cleaning effect of the bottom of the wafer; a triangular surface is arranged on the top of the limit tooth, and the triangular surface is a horizontal surface. When the bracket is idle, the triangular surface can support the stacking of multiple brackets, which is convenient for the storage of the bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a three-dimensional structural diagram of the slot-type wafer bracket of the utility model;

[0014] Figure 2 This is an enlarged view of the details of the wafer support seat in the utility model;

[0015] Figure 3 It is a top view of the slot-type wafer bracket of the utility model;

[0016] Figure 4 for Figure 3 The cross-section at A in the middle;

[0017] Figure 5 It is a cross-sectional detail view of the arc-shaped slot in the utility model;

[0018] Marked in the figure are: bracket body 1, positioning groove 11, retaining edge 12, wafer support seat 2, supporting surface 21, arc-shaped slot 22, slot bottom surface 221, slot side wall 222, buffer slope 223, limiting teeth 23, flat top surface 231, triangular surface 232, straight groove 3, rectangular through hole 31, countersunk screw hole 32. DETAILED DESCRIPTION

[0019] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0020] like Figure 1-5The utility model is shown as a slot-type wafer bracket for batch wafer cleaning, comprising a bracket body 1, a wafer support seat 2 and an arc-shaped slot 22. The bracket body 1 is rectangular, and straight-bar-type wafer support seats 2 are symmetrically arranged on both sides of the upper surface of the bracket body 1. The wafer support seats 2 are arranged along the long side of the bracket body 1, and the top surface of the wafer support seat 2 is a supporting surface 21. The supporting surface 21 is an arc-shaped surface with a high outer side and a low inner side. A plurality of limiting teeth 23 are arranged along the length of the upper edge of the top surface of the wafer support seat 2. The limiting teeth 23 are perpendicular to the long side of the bracket body 1, and the limiting teeth 23 are arranged in parallel and equidistantly, and there is an arc-shaped slot 22 recessed downward between adjacent limiting teeth 23.

[0021] The cross-sectional shape of the arc-shaped slot 22 is axisymmetric, and the arc-shaped slot 22 includes a slot bottom surface 221, a slot sidewall 222, and a buffer slope 223. The slot bottom surface 221 is a semicircular surface, and the slot sidewalls 222 are symmetrically arranged on both sides of the slot bottom surface 221. The buffer slope 223 is connected to the slot sidewalls 222, and the angle between the slot sidewalls 222 is smaller than the angle between the buffer slopes 223. The radius of the slot bottom surface 221 is within 0.25 mm, the angle between the two slot sidewalls 222 is 15°±1°, and the angle between the two buffer slopes 223 is 90°±1°.

[0022] A wafer workpiece is inserted into the arc-shaped slots 22 corresponding to the two sides, the wafer workpiece is kept upright, the radius corresponding to the bottom of the arc-shaped slot 22 is consistent with the radius of the wafer workpiece, and the total contact length between the two arc-shaped slots 22 and the peripheral surface of the wafer workpiece does not exceed 1 / 3 of the circumference of the wafer workpiece. The small angle groove sidewall 222 can not only limit the position of the wafer workpiece, but also ensure that it is not in close contact with the surface of the wafer workpiece as much as possible. The buffer slope 223 has a large slope, and the gentle slope improves the safety of the wafer workpiece when clamping.

[0023] The top of the limiting tooth 23 is a flat top surface 231, which is connected to the buffer slopes 223 on both sides. The highest point of the outer end of the flat top surface 231 gradually widens to form a triangular surface 232, which is a horizontal surface. The bottom surface of the bracket body 1 is provided with a positioning groove 11, and the two sides of the positioning groove 11 are ribs 12. When two brackets are stacked, the ribs 12 of the upper bracket are stacked on the triangular surface 232 at the end of the limiting tooth 23 of the next bracket. A triangular surface 232 is set on the top of the limiting tooth 23, and the triangular surface 232 is a horizontal surface. When the bracket is idle, the triangular surface 232 can support the stacking of multiple brackets, which is convenient for the storage of the bracket.

[0024] A straight groove 3 is provided in the middle of the bracket body 1, and the straight groove 3 is recessed between the two wafer support seats 2. A rectangular through hole 31 is provided in the middle of the straight groove 3, and two countersunk screw holes 32 are respectively provided on both sides of the rectangular through hole 31. The bracket body 1 can be fixed by inserting the countersunk screws into the countersunk screw holes 32, and the cleaning liquid can directly enter the straight groove 3 through the rectangular through holes 31 to clean the bottom of the vertically placed wafer, thereby improving the cleaning efficiency.

[0025] The cleaning principle of the utility model is as follows: the bracket body 1 is horizontally prevented, and the wafer workpieces are vertically inserted into the corresponding arc-shaped slots 22 one by one, and the wafer workpieces are inserted to the bottom surface of the slot. The two arc-shaped slots 22 support the wafer workpiece along the contour. Since the inner shape of the arc-shaped slot 22 is V-shaped and the bottom surface 221 of the slot is semicircular, after the wafer is inserted, the contact surface between the edge of the wafer and the arc-shaped slot 22 is very small. The bracket body 1 is locked in the cleaning equipment through the countersunk screw hole 32 to keep the bracket body 1 stable. During cleaning, pure water can penetrate into the arc-shaped slot 22 and the bottom surface 221 of the slot, and a large number of wafer workpieces can be cleaned at the same time. The cleaning liquid can also clean upward through the rectangular through hole 31, ensuring the cleaning effect of the bottom of the wafer.

[0026] The above are only several preferred embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes and substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A trough-type wafer holder for batch wafer cleaning, characterized in that: The invention comprises a bracket body, a wafer support seat and an arc-shaped slot, wherein the bracket body is rectangular, and straight wafer support seats are symmetrically arranged on both sides of the upper surface of the bracket body, the wafer support seats are arranged along the long side of the bracket body, and the top surface of the wafer support seat is a supporting surface, which is an arc-shaped surface with a high outer side and a low inner side. A plurality of limiting teeth are arranged along the length of the upper edge of the top surface of the wafer support seat, and the limiting teeth are perpendicular to the long side of the bracket body, and the limiting teeth are arranged in parallel and equidistantly, and there is an arc-shaped slot recessed downwardly between adjacent limiting teeth, and a wafer workpiece is inserted into the corresponding arc-shaped slots on both sides, and the wafer workpiece is kept upright, and the radius corresponding to the bottom of the arc-shaped slot is consistent with the radius of the wafer workpiece, and the total contact length between the two arc-shaped slots and the peripheral surface of the wafer workpiece does not exceed 1 / 3 of the circumference of the wafer workpiece.

2. The trough-type wafer holder for batch wafer cleaning according to claim 1, characterized in that: The cross-sectional shape of the arc-shaped slot is axisymmetric, and the arc-shaped slot includes a slot bottom surface, slot side walls and a buffer slope surface. The slot bottom surface is a semicircular surface, and the slot side walls are symmetrically arranged on both sides of the slot bottom surface. The buffer slope surface is connected to the top of the slot side walls, and the angle between the slot side walls is smaller than the angle between the buffer slope surfaces.

3. The trough-type wafer holder for batch wafer cleaning according to claim 2, characterized in that: The radius of the groove bottom surface is within 0.25 mm, the angle between the two groove side walls is 15°±1°, and the angle between the two buffer slope surfaces is 90°±1°.

4. The trough-type wafer holder for batch wafer cleaning according to claim 3, characterized in that: The top of the limiting tooth is a flat top surface, which is connected to the buffer slope surfaces on both sides. The highest point of the outer end of the flat top surface gradually widens to form a triangular surface, and the triangular surface is a horizontal surface.

5. The trough-type wafer holder for batch wafer cleaning according to claim 4, characterized in that: A straight groove is provided in the middle of the bracket body, the straight groove is recessed between the two wafer support seats, a rectangular through hole is opened in the middle of the straight groove, and two countersunk screw holes are respectively provided on both sides of the rectangular through hole.

6. The trough-type wafer holder for batch wafer cleaning according to claim 5, characterized in that: The bottom surface of the bracket body is provided with a positioning groove, and the two sides of the positioning groove are ribs. When two brackets are stacked, the rib of the upper bracket is correspondingly stacked on the triangular surface of the end of the limiting tooth of the next bracket.

Images