Vehicle-mounted integrated electromagnetic shielding case

By adopting a partition structure, a maze structure, an EMI power filter unit, a low thermal resistance heat dissipation path, anti-malfunction and high-rigidity support structure in the vehicle electromagnetic shielding chassis, the problems of electrical discontinuity, complex structure, insufficient heat dissipation design and easy damage to the board and card plug-in and unplugging in the harsh environment are solved, and better electromagnetic shielding, heat dissipation and maintenance performance are achieved.

CN222582855UActive Publication Date: 2025-03-07CHINA NORTH IND NEW TECH PROMOTION INST +1
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Patent Information

Application Number
CN202420783814.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-16
Publication Date
2025-03-07
Estimated Expiration
2034-04-16

AI Technical Summary

Technical Problem

When traditional vehicle-mounted electromagnetic shielded chassis is used in harsh environments, there are problems such as electrical discontinuity, complex structure, insufficient heat dissipation design, and easy to damage the board and card plugging, which is difficult to meet the electromagnetic compatibility and maintenance requirements of military equipment.

Method used

A vehicle-mounted integrated electromagnetic shielded chassis is designed, adopting a partition structure and a maze structure design, and an integrated EMI power filter unit provides a low thermal resistance heat dissipation path, designing anti-interpolation function of the board and card components and a high-rigid support structure of the printed base plate.

Benefits of technology

It realizes the electrical continuity and electromagnetic shielding effect of the chassis, improves the heat dissipation performance and the safety of the board components, and is convenient for maintenance and use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a vehicle-mounted integrated electromagnetic shielding case, and belongs to the technical field of communication and filtering. According to the utility model, the EMI power supply filtering unit is integrated, the electromagnetic interference between the case and the outside through a power line is effectively isolated, the design of the sub-cabin section structure and the labyrinth structure is adopted, the integrated electromagnetic shielding effect of the working cabin section of the case is ensured, the working cabin section is effectively isolated from the heat dissipation cabin section, and daily disassembly and maintenance of the case are facilitated; the integrated electromagnetic shielding effect of the case is considered, meanwhile, a low-thermal-resistance heat dissipation path is designed, and a reasonable heat dissipation airflow channel design is matched, so that heat generated by high-power-consumption components on the board card assembly is quickly dissipated into the environment through the case body, and normal operation of an electronic system in the case is guaranteed.
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Description

Technical Field

[0001] The utility model belongs to the technical field of communication and filtering, and in particular relates to a vehicle-mounted integrated electromagnetic shielding chassis. Background Art

[0002] Electromagnetic shielding chassis is an important part of vehicle-mounted electronic control systems. For military equipment, vehicle-mounted electromagnetic shielding chassis usually serve in harsh environments, often facing complex electromagnetic environments and harsh climatic conditions such as humidity, heat, salt spray, and acidic atmosphere. In order to ensure the normal operation of various electronic equipment in military equipment, standards such as GJB151B-2013 and GJB150A-2009 stipulate that military equipment must be able to withstand certain intensity electromagnetic interference and environmental conditions.

[0003] The defects of traditional vehicle-mounted shielded chassis are as follows:

[0004] 1. Affected by factors such as process and materials, the structural parts of the shielded chassis are mainly in point contact state. Using segmented conductive rubber strips for sealing will inevitably produce gaps, which is not conducive to the electrical integrity of the chassis;

[0005] 2. Lack of segmented protection design. In order to achieve the shielding protection effect, the chassis structure is complicated, which is not conducive to the miniaturization design and cost saving of the chassis, and is not conducive to the installation and maintenance of the electronic system in the chassis;

[0006] 3. With the use of high-performance components, it is difficult to balance the electromagnetic protection and thermal design of traditional shielded chassis, and chassis heat dissipation restricts the performance of equipment;

[0007] 4. For chassis with multiple board components, there is a lack of effective anti-wrong insertion function during the board insertion and removal process, and wrong insertion of boards can easily cause damage to connectors;

[0008] 5. The chassis may need to repeatedly plug and unplug board components during use. For traditional chassis, the printed baseboard support rigidity is insufficient, and the printed baseboard may deform too much during the plug-in process.

[0009] At present, common protection methods for chassis include filling chassis gaps with conductive rubber strips, sealing holes with metal mesh covers, and applying sealant to mounting holes. These measures only focus on overall protection, making it difficult to achieve the electrical integrity of the chassis' mechanical and electrical interfaces and joints, and are not convenient for maintenance. At the same time, there is a lack of effective anti-wrong insertion function for multi-board chassis, and the strength design of the printed baseboard in the chassis is insufficient. During the process of board insertion and removal, connectors are easily deformed and the printed baseboard is damaged due to excessive deformation.

[0010] Therefore, in order to ensure the reliable and stable operation of military equipment, a new integrated electromagnetic shielding chassis that can meet the following requirements is very necessary:

[0011] 1. Small size and light weight, all joint gaps and mating surfaces of the chassis shell need to achieve electrical continuity;

[0012] 2. It has a filter circuit that can filter out the electromagnetic interference conducted from the external system to the box through the power line;

[0013] 3. Meet the requirements of electromagnetic compatibility standards (GJB151B-2013, GJB150A-2009);

[0014] 4. It has the function of preventing wrong insertion of board components and effectively reinforces the printed baseboard. Utility Model Content

[0015] 1. Technical issues to be resolved

[0016] The technical problem to be solved by the utility model is to design a vehicle-mounted integrated electromagnetic shielding case which takes into account the requirements of electromagnetic shielding and environmental adaptability and is suitable for ground military equipment.

[0017] (II) Technical solution

[0018] In order to solve the above technical problems, the utility model provides a vehicle-mounted integrated electromagnetic shielding chassis, including a control board card assembly, an interface board card assembly, a chassis panel, a chassis air intake cover, an upper guide rail group 5, a lower guide rail group 6, a printed bottom plate, a printed bottom plate insulating pad, a printed bottom plate reinforcement plate, a debugging interface 12, a baffle 13, a wire rack 14, an EMI power supply filter unit 15, an S7 electrical connector 16, and a cooling fan 18;

[0019] The control board card assembly and the interface board card assembly both include a puller 19, a wedge-shaped locking strip 20, and a cold conduction plate 21. The puller 19 is installed at both ends of the top of the cold conduction plate 21, and the wedge-shaped locking strip 20 is installed on both sides of the cold conduction plate 21. The control board card assembly and the interface board card assembly are plugged in and locked in the guide slot structure of the upper guide rail group 5 and the lower guide rail group 6 by the puller 19 and the wedge-shaped locking strip 20. The inner wall of the cold conduction plate 21 is processed with a heat-conducting boss structure 32, and a heat-conducting insulating pad is pasted on the heat-conducting boss structure 32.

[0020] The chassis panel includes a left side panel 23, a right side panel 24, a front panel 25, a rear panel 26, an upper cover plate, and a lower cover plate, and the six parts are fastened by screws to form a frame structure; the chassis air intake cover plate includes a left chassis air intake cover plate 29 and a right chassis air intake cover plate 30, which are respectively installed on the outside of the left side panel 23 and the right side panel 24, and the upper air intake port 35 on the left chassis air intake cover plate 29 and the right chassis air intake cover plate 30 corresponds to the heat dissipation fins 34 and the openings 36 on the left side panel 23 and the right side panel 24 to form a forced heat dissipation airflow channel; the upper guide rail group 5 and the lower guide rail group 6 are installed on the inner walls of the left side panel 23 and the right side panel 24, and the guide slot structure on the upper guide rail group 5 and the lower guide rail group 6 is used to cooperate with the extractor 19 and the wedge-shaped locking strip 20 of the control board card assembly and the interface board card assembly to realize the plugging and locking of the control board card assembly and the interface board card assembly;

[0021] The printed base plate insulation pad is placed on the annular support platform on the inner side of the lower cover plate, the printed base plate is placed on the printed base plate insulation pad, the printed base plate reinforcement plate is placed on the printed base plate, and the four are fixed together by 12 three-combination screws; the printed base plate reinforcement plate presses the printed base plate from the top, and the printed base plate insulation pad isolates the printed base plate from the lower cover plate; the debugging interface 12 is installed on the lower guide rail group 6;

[0022] The baffle 13 and the wire rack 14 are auxiliary structures inside the chassis, which can assist in binding debugging cables; the EMI power filter unit 15 is installed on the upper guide rail group 5, located below the baffle 13, between the control board assembly and the interface board assembly, and introduces the power supply of the chassis through the S7 electrical connector 16; the S7 electrical connector 16 is installed on the rear panel 26; the cooling fan 18 provides a power source for forced cooling of the chassis and is installed on the front panel 25.

[0023] Preferably, the debugging interface 12 is used to install a fixed debugging cable, the J30J-MK66ZKP-A electrical connector at one end of the debugging cable is fixed in the debugging interface 12 structure, and the J30J-66TJL-A300 electrical connector at the other end of the debugging cable is plugged into the J30J-66ZKNP5-J electrical connector on the printed circuit board.

[0024] Preferably, the power supply of the chassis is connected to the input end of the EMI power filter unit 15, and the output end cable is connected to other electrical connectors.

[0025] Preferably, the EMI power filter unit 15 can filter out electromagnetic interference transmitted from the external system to the box through the power line.

[0026] Preferably, the chassis is plugged into the cabinet via an S7 electrical connector 16 .

[0027] Preferably, the rear panel 26, left side panel 23, right side panel 24 and lower guide rail group 6 of the integrated electromagnetic shielding chassis constitute a frame structure, i.e., a working compartment, and the front panel 25, lower guide rail group 6 and left side panel 23, right side panel 24 constitute a heat dissipation compartment; grooves are processed in the area where the upper and lower surfaces of each structure of the working compartment are spliced ​​with the upper cover plate and the lower cover plate for laying conductive rubber strips, and the corners of the grooves are processed into 45° splicing chamfers.

[0028] Preferably, a maze structure is designed at the joint positions of the lower guide rail group 6 and the left and right panels 23, 24, and the rear panel 26 and the left and right panels 23, 24, so that when the lower guide rail group 6 or the rear panel 26 is assembled with the left and right panels 23, 24, a continuous U-shaped gap with a gap of 0.1 mm is formed.

[0029] Preferably, the cold plate 21 of the control board assembly and the interface board assembly is a shell structure, the holes on the outside are used to install the wedge-shaped locking strip 20 and the puller 19, 11 cylindrical support platforms 31 with threaded holes are designed on the inside, and 11 cylindrical support platforms 31 with holes are also designed on the back cover 22, and then the cold plate 21 and the back cover 22 are fixed together with countersunk screws; the surface of the heat-conducting boss structure 32 on the inner wall of the cold plate 21 is pasted with a thermal insulation pad and is close to the heat dissipation components on the 6U printed circuit board, and the surface of the heat-conducting boss 33 on the inner wall of the right side plate 24 is pasted The thermally conductive insulating pad is in direct contact with the outer wall of the cold conduction plate 21. The outer surfaces of the left side plate 23 and the right side plate 24 are heat dissipation fins 34, which together with the left air intake cover plate 29 and the right air intake cover plate 30 on the outside of the left side plate 23 and the right side plate 24 constitute a heat dissipation duct. The airflow enters from the air inlet 35 of the left air intake cover plate 29 and the right air intake cover plate 30, flows through the heat dissipation fins 34 on the outside of the left side plate 23 and the right side plate 24, and enters the heat dissipation compartment through the openings 36 on the left side plate 23 and the right side plate 24, and is discharged by the heat dissipation fan 18 through the exhaust port 37 at the rear of the chassis.

[0030] Preferably, a card slot is designed on the guide slots of the upper guide rail group 5 and the lower guide rail group 6, and a step structure is designed on the corresponding side of the cold conduction plate 21. The step structure cooperates with the card slot during the insertion of the control board board assembly and the interface board board assembly. When the control board board assembly and the interface board board assembly are inserted into the guide rail group in the wrong direction, the end of the cold conduction plate without the step structure interferes with the card slot on the upper guide rail group 5 and the lower guide rail group 6, preventing the control board board assembly and the interface board board assembly from continuing to be inserted.

[0031] Preferably, a multi-stage annular support platform is processed on the inner side of the lower cover plate, a printed baseboard insulating pad is placed between the annular support platform and the printed baseboard, a printed baseboard reinforcement plate is installed above the printed baseboard, and the four are fixed together by screws distributed at intervals.

[0032] (III) Beneficial effects

[0033] The utility model has the following advantages:

[0034] 1. The integrated EMI power filter unit effectively isolates the chassis from the electromagnetic interference from the outside world through the power line. The compartment structure and maze structure design ensure the integrated electromagnetic shielding effect of the chassis working compartment. The working compartment is effectively isolated from the heat dissipation compartment, which is convenient for daily disassembly and maintenance of the chassis.

[0035] 2. While taking into account the integrated electromagnetic shielding effect of the chassis, a low thermal resistance heat dissipation path is designed, and a reasonable heat dissipation airflow path design is combined to enable the heat generated by high-power components on the board assembly to be quickly dissipated into the environment through the chassis body, ensuring the normal operation of the electronic system in the chassis;

[0036] 3. Design the anti-wrong-insertion structure of the control board assembly and the interface board assembly and the high-rigidity support structure of the printed base plate, so that the connectors and the printed base plate are effectively protected from damage when the board assembly is plugged in and out. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a schematic diagram of the integrated electromagnetic shielding chassis of the utility model;

[0038] Figure 2 Schematic diagram of the appearance of the integrated electromagnetic shielding chassis in different directions;

[0039] Figure 3 This is a schematic diagram of the integrated electromagnetic shielding chassis control board assembly;

[0040] Figure 4 It is a schematic diagram of the position relationship between the control board card assembly, the interface board card assembly and the upper guide rail assembly;

[0041] Figure 5 This is a schematic diagram of the location of the nameplate and the debugging interface cover;

[0042] Figure 6 This is a schematic diagram of the position relationship between the debugging interface and the lower guide rail assembly;

[0043] Figure 7 It is a schematic diagram of the position of the wire rack and the baffle;

[0044] Figure 8 This is a schematic diagram of the installation position of the Class B locking device, EMI power filter unit, and S7 electrical connector;

[0045] Fig. 9 Schematic diagram of the integrated electromagnetic shielding compartment structure and the conductive rubber strip laying position, where (a) is a schematic diagram of the chassis working compartment and heat dissipation compartment frame structure, (b) is a schematic diagram of the 45° chamfered splicing structure at the groove corner, and (c) is a schematic diagram of the conductive rubber strip laying position (thick solid line, one for each of the upper and lower cover plates of the chassis);

[0046] Fig.10 (a) and (b) are schematic diagrams of maze structures at different locations;

[0047] Fig.11 Schematic diagram of the local heat dissipation path structure of the integrated electromagnetic shielding chassis, where (a) is the heat conduction boss on the inner wall of the cold plate, and (b) is the heat conduction boss on the inner wall of the right side plate of the chassis;

[0048] Fig.12 The figure in the figure is a schematic diagram of another part of the heat dissipation path structure of the integrated electromagnetic shielding chassis, where (a), (b), and (c) are the heat dissipation fins on the outside of the left and right side panels of the chassis and the heat dissipation fan heat dissipation ducts;

[0049] Fig.13 Schematic diagram of the structure of the integrated electromagnetic shielding chassis anti-misinsertion function, where (a) is a schematic diagram of the structure of the upper and lower guide rails to prevent misinsertion of the card slots, and (b) is a schematic diagram of the step structure of the cold conduction plate;

[0050] Fig.14 Schematic diagram of the printed base support structure of the integrated electromagnetic shielding chassis, where (a) is a schematic diagram of the chassis lower cover structure, (b) is a schematic diagram of the printed base insulation pad structure, (c) is a schematic diagram of the printed base reinforcement plate structure, and (d) is a schematic diagram of the printed base high-rigidity support installation. DETAILED DESCRIPTION

[0051] In order to make the purpose, content and advantages of the utility model clearer, the specific implementation methods of the utility model are further described in detail below in conjunction with the drawings and embodiments.

[0052] The utility model designs a vehicle-mounted integrated electromagnetic shielding chassis suitable for ground military equipment, which takes into account the requirements of electromagnetic shielding and environmental adaptability, integrates an EMI power supply filtering unit, adopts a compartment segment structure design and a maze structure design, has a low thermal resistance heat conduction path, a board mechanical anti-misinsertion function, and has a printed baseboard high-rigidity support structure.

[0053] The utility model provides a vehicle-mounted integrated electromagnetic shielding chassis composition block diagram as shown Figure 1 , the appearance is shown as Figure 2 As shown, the vehicle-mounted integrated electromagnetic shielding chassis consists of a control board assembly, an interface board assembly, a chassis panel, a chassis air intake cover, an upper guide rail group 5, a lower guide rail group 6, a nameplate 7, a printed base plate, a printed base plate insulating pad, a printed base plate reinforcement plate, a debugging interface cover 11, a debugging interface 12, a baffle 13, a wire rack 14, an EMI power supply filter unit 15, an S7 electrical connector 16, a Class B locker 17, a cooling fan 18, etc.

[0054] The control board assembly and the interface board assembly are composed of a puller 19, a wedge-shaped locking strip 20, a cooling plate 21, a rear cover 22 and other structural parts. Figure 3 As shown, the puller 19 is installed at both ends of the top of the cold guide plate 21, the wedge-shaped locking strips 20 are installed on both sides of the cold guide plate 21, the 3U printed board is installed on the 6U printed board, and the 6U printed board is pressed by the cold guide plate 21 and the back cover 22 and fastened with 11 cross countersunk screws. The above structure provides installation, fixation and protection for the 3U and 6U printed boards. The puller 19 and the wedge-shaped locking strips 20 are used to realize the plugging and locking of the control board card assembly and the interface board card assembly in the guide slot structure of the upper guide rail group 5 and the lower guide rail group 6, as shown in FIG. Figure 4 As shown, a heat-conducting boss structure 32 is processed on the inner wall of the cold plate 21, and a heat-conducting insulating pad is pasted on the heat-conducting boss structure 32. The heat-conducting insulating pad is closely attached to the high-power consumption components on the printed circuit board, thereby providing a low thermal resistance heat dissipation path.

[0055] The chassis panel includes six parts, namely, a left side panel 23, a right side panel 24, a front panel 25, a rear panel 26, an upper cover plate, and a lower cover plate. The frame structure is formed by screw fastening, and provides a mounting and fixing foundation for the components inside and outside the chassis. The chassis air intake cover plate includes a left air intake cover plate 29 and a right air intake cover plate 30, which are respectively mounted on the outside of the left side panel 23 and the right side panel 24. The upper air intake port 35 on the left air intake cover plate 29 and the right air intake cover plate 30 of the chassis corresponds to the heat dissipation fins 34 and the openings 36 on the left side panel 23 and the right side panel 24 to form a forced heat dissipation airflow channel. The upper guide rail group 5 and the lower guide rail group 6 are mounted on the inner wall of the left side panel 23 and the right side panel 24. The guide slot structure on the upper guide rail group 5 and the lower guide rail group 6 is used to cooperate with the extractor 19 and the wedge-shaped locking strip 20 of the control board card assembly and the interface board card assembly to realize the plugging and unplugging and locking of the control board card assembly and the interface board card assembly.

[0056] The nameplate 7 is installed on the front panel 25, and displays information such as product name, production serial number, batch number, year, and manufacturer. Figure 5 As shown. The printed base plate insulation pad is placed on the annular support platform on the inner side of the lower cover, the printed base plate is placed on the printed base plate insulation pad, and the printed base plate reinforcement plate is placed on the printed base plate. The four are fixed together by 12 three-combination screws. The annular support platform on the inner side of the lower cover increases the support area of ​​the printed base plate. The printed base plate reinforcement plate presses the printed base plate from above. The two together achieve high-rigidity support for the printed base plate. The printed base plate insulation pad is used to isolate the printed base plate from the lower cover and plays an insulating and protective role. The debugging interface 12 is installed on the lower guide rail group 6, as shown in FIG. Figure 6As shown, the debugging interface 12 is used to install and fix the debugging cable. The debugging cable is a loose-wire cable used in the electrical installation process. Both ends of the cable are equipped with electrical connectors to transmit signal data. The J30J-MK66ZKP-A electrical connector at one end of the debugging cable is fixed in the debugging interface 12 structure. When the chassis needs to be connected to an external device for debugging, remove the debugging interface cover 11 and plug the external device electrical connector into the J30J-MK66ZKP-A electrical connector. The J30J-66TJL-A300 electrical connector at the other end of the debugging cable is plugged into the J30J-66ZKNP5-J electrical connector on the printed circuit board. The baffle 13 and the wire rack 14 are auxiliary structures in the chassis, which are used to assist in binding the debugging cable. The cooling fan 18 provides a power source for forced heat dissipation of the chassis and is installed on the front panel 25. Figure 7 shown.

[0057] The EMI power filter unit 15 is installed on the upper guide rail group 5, located below the baffle 13, between the control board card assembly and the interface board card assembly, and the power supply of the chassis is introduced through the S7 electrical connector 16. The power supply of the chassis is connected to the input end of the EMI power filter unit 15, and the output end cable is connected to other electrical connectors. The EMI power filter unit 15 is used to filter out the electromagnetic interference transmitted from the external system to the chassis through the power line. Conversely, it can also filter out the electromagnetic interference transmitted from the internal components of the chassis to the external system through the power line. At the same time, it also plays a certain role in eliminating spike pulses and can effectively isolate the two from the electromagnetic transmission. The S7 electrical connector 16 is installed on the rear panel 26. The chassis is plugged into the cabinet through the S7 electrical connector 16 to achieve signal interconnection with other equipment on the vehicle. The chassis is generally installed on a vehicle body mounting frame or test fixture. The fork-shaped structural component on the mounting frame or test fixture cooperates with the Class B locker 17 to achieve mechanical locking of the chassis. The installation position relationship of the three components is as shown in the figure. Figure 8 shown.

[0058] The relevant innovative design includes the following five parts:

[0059] 1. Compartment structure design: The rear panel 26, left panel 23, right panel 24 and lower rail group 6 of the integrated electromagnetic shielding chassis form a frame structure, namely the working compartment, and the front panel 25, lower rail group 6, left panel 23 and right panel 24 form the heat dissipation compartment. The upper and lower surfaces of each structure of the working compartment and the area where the upper cover and lower cover are spliced ​​are processed with grooves for laying conductive rubber strips, and the corners of the grooves are processed into 45° splicing chamfers, such as Fig. 9 As shown, this makes it easier to lay the entire conductive rubber strip connected end to end, reducing the impact of gaps caused by laying multiple sections on the overall electrical integrity of the chassis.

[0060] 2. Labyrinth structure design: Affected by the machining accuracy of chassis structural parts and the surface roughness of materials, it is difficult for the chassis structural parts to form surface contact on the joint surface, and they are mostly discrete point contacts. This makes the joint surface have many gaps, which is not conducive to ensuring the overall electromagnetic sealing of the chassis. In order to form a complete electromagnetic seal for the chassis working compartment, the joint positions of the lower guide rail group 6 and the left side panel 23 and the right side panel 24, and the rear panel 26 and the left side panel 23 and the right side panel 24 are designed as follows: Fig.10 The labyrinth structure shown changes the traditional plane splicing method and designs a splicing groove structure. When the lower guide rail group 6 or the rear panel 26 is assembled with the left panel 23 and the right panel 24, a continuous U-shaped gap with a gap of 0.1 mm can be formed. The above-mentioned labyrinth structure increases the effective contact area of ​​the splicing surface, and when combined with filling with conductive sealant, it can improve the overall shielding performance of the box.

[0061] 3. Low thermal resistance heat dissipation path: The cold plate 21 of the control board assembly and the interface board assembly is a shell structure, and the holes on the outside are used to install the wedge-shaped locking strip 20 and the puller 19. Eleven cylindrical support platforms 31 with threaded holes are designed on the inside. The side of the 6U printed circuit board that needs to dissipate heat faces the cold plate 21 and is placed on the cylindrical support platform 31. Eleven cylindrical support platforms 31 with holes are also designed on the back cover 22. Press from the other side of the 6U printed circuit board, and then fix the cold plate 21, the 6U printed circuit board and the back cover 22 together with countersunk screws. The surface of the heat-conducting boss structure 32 on the inner wall of the cold-conducting plate 21 is pasted with a heat-conducting insulating pad and is close to the heat-dissipating components on the 6U printed circuit board. The surface of the heat-conducting boss 33 on the inner wall of the right side plate 24 is pasted with a heat-conducting insulating pad and is directly in contact with the outer wall of the cold-conducting plate 21. The outer surfaces of the left side plate 23 and the right side plate 24 are heat-dissipating fins 34, which together with the left air intake cover plate 29 and the right air intake cover plate 30 on the outer sides of the left side plate 23 and the right side plate 24 form a heat-dissipating air duct. The airflow enters from the air inlet 35 of the left air intake cover plate 29 and the right air intake cover plate 30, flows through the heat-dissipating fins 34 on the outside of the left side plate 23 and the right side plate 24, enters the heat-dissipating compartment through the openings 36 on the left side plate 23 and the right side plate 24, and is discharged by the heat-dissipating fan 18 through the exhaust port 37 at the rear of the chassis, as shown in FIG. Fig.11 , Fig.12 shown.

[0062] 4. Card mis-insertion prevention function: card slots are designed on the guide slots of the upper guide rail group 5 and the lower guide rail group 6, and a step structure is designed on the corresponding side of the cold guide plate 21. The step structure cooperates with the card slot to realize the mis-insertion prevention function during the insertion of the control board card assembly and the interface board card assembly. Fig.13 As shown, when the control board card assembly and the interface board card assembly are inserted into the guide rail group in the wrong direction, the end of the cold guide plate without the step structure interferes with the card slots on the upper guide rail group 5 and the lower guide rail group 6, preventing the control board card assembly and the interface board card assembly from continuing to be inserted to protect the electrical connector from being damaged.

[0063] 5. High rigidity support for printed baseboard: a multi-stage annular support platform is processed on the inner side of the lower cover plate, a printed baseboard insulation pad (epoxy phenolic resin laminated glass cloth board) is placed between the support platform and the printed baseboard, a printed baseboard reinforcement plate (6061-T6 aluminum alloy) is installed above the printed baseboard, and the four are fixed together by 12 three-combination screws distributed at intervals, which can effectively improve the rigidity of the printed baseboard. Fig.14 shown.

[0064] It can be seen that the advantages of the utility model are as follows:

[0065] 1. The chassis is designed with compartment sections, which has complete electromagnetic shielding and environmental adaptability, and is easy to disassemble and maintain;

[0066] 2. Low thermal resistance heat dissipation path makes the chassis have good heat dissipation effect and stable working performance;

[0067] 3. The chassis has the function of preventing wrong insertion of board components and a high-rigidity support structure of the printed base plate to prevent damage to the board.

[0068] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A vehicle-mounted integrated electromagnetic shielding chassis, characterized in that: It includes a control board assembly, an interface board assembly, a chassis panel, a chassis air intake cover, an upper guide rail assembly (5), a lower guide rail assembly (6), a printed base plate, a printed base plate insulating pad, a printed base plate reinforcement plate, a debugging interface (12), a baffle (13), a wire rack (14), an EMI power supply filter unit (15), an S7 electrical connector (16), and a cooling fan (18); The control board card assembly and the interface board card assembly both comprise a puller (19), a wedge-shaped locking strip (20), and a cold conduction plate (21); the puller (19) is installed at both ends of the top of the cold conduction plate (21), and the wedge-shaped locking strip (20) is installed on both sides of the cold conduction plate (21); the control board card assembly and the interface board card assembly are plugged in and locked in the guide slot structure of the upper guide rail group (5) and the lower guide rail group (6) by means of the puller (19) and the wedge-shaped locking strip (20); a heat-conducting boss structure (32) is processed on the inner wall of the cold conduction plate (21), and a heat-conducting insulating pad is pasted on the heat-conducting boss structure (32); The chassis panel comprises a left side panel (23), a right side panel (24), a front panel (25), a rear panel (26), an upper cover plate, and a lower cover plate, and the six parts are fastened by screws to form a frame structure; the chassis air intake cover plate comprises a left chassis air intake cover plate (29) and a right chassis air intake cover plate (30), which are respectively installed on the outside of the left side panel (23) and the right side panel (24), and are connected to the left side panel (23) and the right side panel (24) through the upper air intake ports (35) on the left chassis air intake cover plate (29) and the right chassis air intake cover plate (30) correspondingly. The heat dissipation fins (34) and the openings (36) on the right side plate (24) together form a forced heat dissipation airflow channel; the upper guide rail group (5) and the lower guide rail group (6) are installed on the inner walls of the left side plate (23) and the right side plate (24); the guide slot structures on the upper guide rail group (5) and the lower guide rail group (6) are used to cooperate with the extractors (19) and the wedge-shaped locking strips (20) of the control board card assembly and the interface board card assembly to realize the plugging, unplugging and locking of the control board card assembly and the interface board card assembly; The printed base plate insulation pad is placed on the annular support platform on the inner side of the lower cover plate, the printed base plate is placed on the printed base plate insulation pad, the printed base plate reinforcement plate is placed on the printed base plate, and the four are fixed together by screws; the printed base plate reinforcement plate presses the printed base plate from the top, and the printed base plate insulation pad isolates the printed base plate from the lower cover plate; the debugging interface (12) is installed on the lower guide rail group (6); The baffle (13) and the wire rack (14) are auxiliary structures in the chassis and can assist in binding the debugging cables; The EMI power filter unit (15) is installed on the upper rail assembly (5), located below the baffle (13), between the control board card assembly and the interface board card assembly, and introduces the power supply of the chassis through the S7 electrical connector (16); the S7 electrical connector (16) is installed on the rear panel (26); the cooling fan (18) provides a power source for forced cooling of the chassis and is installed on the front panel (25).

2. The vehicle-mounted integrated electromagnetic shielding chassis according to claim 1, characterized in that: The debugging interface (12) is used to install and fix the debugging cable. The J30J-MK66ZKP-A electrical connector at one end of the debugging cable is fixed in the debugging interface (12) structure. The J30J-66TJL-A300 electrical connector at the other end of the debugging cable is plugged into the J30J-66ZKNP5-J electrical connector on the printed circuit board.

3. The vehicle-mounted integrated electromagnetic shielding chassis according to claim 1, characterized in that: The power supply of the chassis is connected to the input end of the EMI power supply filter unit (15), and the output end cable is connected to other electrical connectors.

4. The vehicle-mounted integrated electromagnetic shielding chassis according to claim 1, characterized in that: The EMI power supply filter unit (15) can filter out electromagnetic interference transmitted from the external system to the box through the power line.

5. The vehicle-mounted integrated electromagnetic shielding chassis according to claim 1, characterized in that: The chassis is plugged into the cabinet via an S7 electrical connector (16).

6. The vehicle-mounted integrated electromagnetic shielding chassis according to claim 1, characterized in that: The rear panel (26), the left side panel (23), the right side panel (24) and the lower guide rail group (6) of the integrated electromagnetic shielding chassis form a frame structure, namely a working compartment, and the front panel (25), the lower guide rail group (6) and the left side panel (23) and the right side panel (24) form a heat dissipation compartment; the upper and lower surfaces of each structure of the working compartment and the area where the upper cover plate and the lower cover plate are spliced ​​are processed with grooves for laying conductive rubber strips, and the corner positions of the grooves are processed into 45° splicing chamfers.

7. The vehicle-mounted integrated electromagnetic shielding chassis according to claim 1, characterized in that: A labyrinth structure is designed at the joint positions of the lower guide rail group (6) and the left side panel (23) and the right side panel (24), and the rear panel (26) and the left side panel (23) and the right side panel (24). When the lower guide rail group (6) or the rear panel (26) and the left side panel (23) and the right side panel (24) are assembled, a continuous U-shaped gap with a certain gap is formed.

8. The vehicle-mounted integrated electromagnetic shielding chassis according to claim 1, characterized in that: The cooling plate (21) of the control board assembly and the interface board assembly is a shell structure, the outer holes of which are used to install the wedge-shaped locking strip (20) and the puller (19), the inner side is designed with a plurality of columnar support platforms (31) with threaded holes, and the back cover (22) is also designed with a plurality of columnar support platforms (31) with holes, and then the cooling plate (21) and the back cover (22) are fixed together with countersunk screws; the surface of the heat-conducting boss structure (32) on the inner wall of the cooling plate (21) is pasted with a heat-conducting insulating pad and is closely attached to the heat dissipation components on the printed circuit board, and the surface of the heat-conducting boss (33) on the inner wall of the right side plate (24) is pasted with a heat-conducting insulating pad and is directly attached to the cooling plate (21). The left side plate (23) and the right side plate (24) are in contact with the outer wall of the left side plate (23) and the right side plate (24), and the outer surfaces of the left side plate (23) and the right side plate (24) are heat dissipation fins (34), which together with the left air intake cover plate (29) and the right air intake cover plate (30) on the outer sides of the left side plate (23) and the right side plate (24) form a heat dissipation air duct. The airflow enters from the air intake port (35) of the left air intake cover plate (29) and the right air intake cover plate (30), flows through the heat dissipation fins (34) on the outer sides of the left side plate (23) and the right side plate (24), enters the heat dissipation compartment through the openings (36) on the left side plate (23) and the right side plate (24), and is discharged by the heat dissipation fan (18) through the exhaust port (37) at the rear of the chassis.

9. The vehicle-mounted integrated electromagnetic shielding chassis according to claim 1, characterized in that: A card slot is designed on the guide slots of the upper guide rail group (5) and the lower guide rail group (6), and a step structure is designed on the corresponding side of the cold conduction plate (21). During the insertion of the control board card assembly and the interface board card assembly, the step structure cooperates with the card slot. When the control board card assembly and the interface board card assembly are inserted into the guide rail group in the wrong direction, the end of the cold conduction plate without the step structure interferes with the card slot on the upper guide rail group (5) and the lower guide rail group (6), thereby preventing the control board card assembly and the interface board card assembly from being further inserted.

10. The vehicle-mounted integrated electromagnetic shielding chassis according to claim 1, characterized in that: A multi-level annular support platform is processed on the inner side of the lower cover plate, a printed baseboard insulating pad is placed between the annular support platform and the printed baseboard, a printed baseboard reinforcement plate is installed above the printed baseboard, and the four are fixed together by screws distributed at intervals.

Citation Information

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