Color conversion panel and light emitting diode display including same

Abstract

The utility model relates to a color conversion panel and a light emitting diode display comprising the same. The light emitting diode display includes: a first panel including an emission layer and a pixel defining layer having an opening for a light emitting diode (LED); and a second panel placed on the first panel and including a bank and a plurality of spacer elements, in which the bank overlaps the plurality of spacer elements and includes a plurality of spacer support portions extending longitudinally in a first direction by a distance greater than a distance extending in a second direction crossing the first direction, and a plurality of spacer elements disposed on the plurality of spacer support portions.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2022-0017185, filed on February 9, 2022, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Embodiments of the present invention generally relate to a light emitting diode display, and more particularly, to a light emitting diode display including a color conversion panel having a spacer. Background Art

[0004] A light emitting diode display is a device that displays a picture, and includes a liquid crystal display (LCD) and an organic light emitting diode (OLED) display, etc. Such a light emitting diode display is used in various electronic devices such as a portable phone, a navigation device, a digital camera, an electronic book, a portable game machine, or various terminals.

[0005] An organic light emitting diode (OLED) display includes two electrodes and an organic emission layer between the two electrodes. Electrons injected from one electrode and holes injected from the other electrode recombine in the organic emission layer to generate excitons. The generated excitons change from an excited state to a ground state, releasing energy to emit light.

[0006] Recently, a light-emitting diode display including a color conversion panel has been proposed to reduce light loss and provide a light-emitting diode display with high color reproducibility. For example, the light-emitting diode display may include a display panel and a color conversion panel overlapping the display panel. The color conversion panel may include a color conversion layer containing semiconductor nanocrystals such as quantum dots, and may convert incident light into light of different colors. Further, the color conversion panel may also include a spacer to maintain a gap between the two panels when the display panel and the color conversion panel are combined. For example, the spacer may be formed by patterning using a deposition mask.

[0007] The above information disclosed in this Background section is only for understanding the background of the present invention concept and therefore, the above information may contain information that does not constitute the prior art. Utility Model Content

[0008] Applicants have discovered that, since the patterned spacers are formed by using a separate deposition mask process, the patterned spacers may increase manufacturing costs and process time of the display device.

[0009] A light emitting diode display including a color conversion panel constructed according to the principles and exemplary embodiments of the present invention can reduce the manufacturing cost and process time of a display device by using spacers formed by an inkjet method. In the inkjet method, ink is applied by a moving inkjet head to form spacers at predetermined intervals. The applicant further discovered that the process tolerance for forming the spacers is very narrow, which may lead to misalignment, quality problems, and / or reliability problems.

[0010] In order to form spacers using an inkjet method while avoiding quality and reliability issues caused by narrow process tolerances, a light-emitting diode display including a color conversion panel constructed according to the principles and exemplary embodiments of the present invention includes spacers that can be formed along an area that is elongated in a direction substantially orthogonal to the direction of movement of the inkjet head to provide a margin area that provides a greater tolerance or multiple positions for the spacers to be formed by any of the nozzles in the inkjet head of the inkjet device. For example, the spacers can be formed on the bottom surface of the partition wall of the color conversion panel, the bottom surface of the partition wall being elongated in one direction to provide a margin area, so that the spacers can be formed on the partition wall by the inkjet method, which is also used to form other components of the display device. Accordingly, the manufacturing cost and process time of the display device can be reduced.

[0011] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned through practice of the inventive concept.

[0012] According to one aspect of the utility model, a light emitting diode display includes: a first panel, including an emission layer and a pixel defining layer having an opening for a light emitting diode (LED); and a second panel, which is placed on the first panel and includes a levee and a plurality of spacer elements, wherein the levee overlaps with the plurality of spacer elements and includes a plurality of spacer support portions, the plurality of spacer support portions longitudinally extending a distance in a first direction greater than the distance the plurality of spacer support portions extend in a second direction intersecting the first direction, and the plurality of spacer elements are arranged on the plurality of spacer support portions.

[0013] A pitch of the plurality of spacer elements in the second direction may be substantially equal to an integer multiple of a pitch of the plurality of pixels in the second direction, and a pitch of the plurality of spacer elements in the first direction may not correspond to an integer multiple of the pitch of the plurality of pixels in the first direction.

[0014] The spacing element is formed by a movable inkjet head of the inkjet device, and the first direction may be substantially the same direction as an extension direction of the movable inkjet head and may be substantially orthogonal to a direction in which the inkjet head of the inkjet device moves.

[0015] The spacer element may include a spacer having a diameter of about 10 μm or more and about 30 μm or less and a height of about 2 μm or more and about 10 μm or less.

[0016] The bank may include a partition wall, and the spacer support portion may include a bottom of the partition wall, and a margin of the spacer support portion in the first direction excluding the spacer is about 14.1 μm or more and about 70.5 μm or less.

[0017] The inkjet head of the inkjet device may include a plurality of nozzles, and the margin in the first direction may be substantially the same as a minimum interval of the plurality of nozzles in the first direction.

[0018] A length of the bottom portion in the first direction may be about 24.1 μm or more and about 90.5 μm or less.

[0019] The partition wall may further include an additional margin portion disposed around the bottom, and the additional margin portion may have a width of about 5 μm or more and about 15 μm or less.

[0020] The plan shape of the additional margin portion may be substantially the same as or different from the plan shape of the bottom portion.

[0021] The second panel may further include an upper capping layer, which may include silicon nitride (SiN x ), silicon oxide (SiO x ) and silicon oxynitride (Si x N y ) and the upper capping layer may substantially completely cover the dam and the spacing elements.

[0022] The second panel may further include an upper capping layer, which may include silicon nitride (SiN x ), silicon oxide (SiO x ) and silicon oxynitride (Si x N y ) and an upper capping layer may be placed between the embankment and the spacing element.

[0023] The bank may include a partition wall having first, second and third openings, and the second panel may further include a first color conversion layer disposed within the first opening, a second color conversion layer disposed within the second opening, and a transmissive layer disposed within the third opening.

[0024] The pixel defining layer may include a plurality of openings for the light emitting diodes (LEDs), and the plurality of openings for the light emitting diodes (LEDs) may overlap with the first opening, the second opening, and the third opening of the partition wall, respectively.

[0025] The second panel may further include a first color filter, a second color filter, and a third color filter, the first color filter may overlap with the first color conversion layer, the second color filter may overlap with the second color conversion layer, the third color filter may overlap with the transmission layer, and the second panel may further include a light blocking area overlapping with the partition wall, in which at least two of the first color filter, the second color filter, and the third color filter overlap.

[0026] The partition wall may further include a dummy opening, and the dummy opening may overlap the light blocking region.

[0027] According to another aspect of the present invention, a color conversion panel includes: a plurality of spacer elements; a dam overlapping the plurality of spacer elements and including a plurality of spacer support portions extending longitudinally in a first direction, the dam further including a first opening, a second opening, and a third opening; a first color conversion layer placed in the first opening; a second color conversion layer placed in the second opening; and a transmissive layer placed in the third opening, wherein the plurality of spacer elements overlap with a portion of the plurality of spacer support portions, respectively.

[0028] The plurality of spacer elements may include a plurality of spacers having a pitch in a first direction that is different from a pitch in a second direction that is substantially perpendicular to the first direction.

[0029] The plurality of spacing elements may include a plurality of spacers formed by a movable inkjet head of the inkjet device, and the first direction may be substantially the same direction as an extension direction of the movable inkjet head and may be approximately orthogonal to a direction in which the inkjet head of the inkjet device moves.

[0030] The embankment may include a partition wall, and the plurality of spacer support portions may include a plurality of bottoms of the partition wall, and the partition wall further includes a plurality of additional margin portions respectively placed around the plurality of bottoms, each of the plurality of spacers may have a diameter of about 10 μm or more and about 30 μm or less and a height of about 2 μm or more and about 10 μm or less, a margin in a first direction of the spacer support portion excluding the spacers placed at each of the plurality of bottoms may be about 14.1 μm or more and about 70.5 μm or less, and each of the plurality of additional margin portions may have a width of about 5 μm or more and about 15 μm or less.

[0031] The first color filter, the second color filter and the third color filter may further include, the first color filter may overlap with the first color conversion layer, the second color filter may overlap with the second color conversion layer, and the third color filter may overlap with the transmission layer, and the light-blocking area in which at least two of the first color filter, the second color filter and the third color filter overlap may overlap with the embankment, and the embankment may further include a dummy opening, and the dummy opening overlaps with the light-blocking area.

[0032] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the inventive concept.

[0034] Figure 1 It is a schematic cross-sectional view of an embodiment of a light emitting diode display constructed according to the principle of the present utility model.

[0035] Figure 2 yes Figure 1 A cross-sectional view of an embodiment of a color conversion panel is shown in FIG.

[0036] Figure 3 Yes Figure 2 The color conversion panel Figure 1 Detailed cross-sectional view of a light-emitting diode display.

[0037] Figure 4 It is shown in Figure 2 sectional view of a step of forming spacers on a color conversion panel by an inkjet method.

[0038] Figure 5 yes Figure 4 A bottom view of an embodiment of an inkjet head of an inkjet device.

[0039] Figure 6 It is a top view of an embodiment of a spacer constructed according to the principle of the utility model and a partition wall arranged around the spacer.

[0040] Figure 7 It is shown Figure 6 Top view of various positions of the spacer.

[0041] Figure 8 yes Figure 2 A top view of an embodiment of a portion of a color conversion panel.

[0042] Fig. 9 is a top view of a comparative example of a patterned spacer and a partition wall disposed around the spacer.

[0043] Fig.10 is a top view of a comparative example of a color conversion panel.

[0044] Figures 11 to 151 is a top view of various embodiments of a spacer and a partition wall disposed around the spacer constructed according to the principle of the present invention.

[0045] Fig.16 and Fig.17 yes Figure 2 A top view of another embodiment of a portion of a color conversion panel.

[0046] Fig.18 is a cross-sectional view of another embodiment of a color conversion panel constructed according to the principle of the present invention.

[0047] Fig.19 Yes Fig.18 A cross-sectional view of an embodiment of a color conversion panel for a light emitting diode display. DETAILED DESCRIPTION

[0048] In the following description, for the purpose of explanation, many specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the utility model. As used herein, "embodiment" and "implementation" are interchangeable words for non-limiting examples of one or more devices or methods using the utility model concept disclosed herein. However, it is apparent that various embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other examples, known structures and devices are shown in block diagram form to avoid unnecessary obscurity of various embodiments. Further, various embodiments can be different, but do not have to be exclusive. For example, the specific shape, configuration and characteristics of an embodiment can be used or implemented in another embodiment without departing from the utility model concept.

[0049] Unless otherwise specified, the illustrated embodiments should be understood as providing exemplary features of different details of some ways in which the present invention can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as "elements") can be combined, separated, interchanged and / or rearranged in other ways without departing from the present invention.

[0050] The use of cross hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Therefore, unless specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for the specific material, material properties, size, ratio, commonality between the illustrated elements and / or any other characteristics, attributes, properties, etc. of the elements. Further, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the embodiment can be implemented differently, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals refer to the same elements.

[0051] When an element or layer is referred to as being "on", "connected to" or "coupled to" another element or layer, the element or layer may be directly on, directly connected to or coupled to, or there may be an intervening element or layer. However, when an element or layer is referred to as being "directly" on, "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers. For this reason, the term "connected" may refer to a physical, electrical and / or fluid connection with or without an intervening element. Further, the D1 axis, the D2 axis, and the D3 axis are not limited to three axes of a rectangular coordinate system, such as an x-axis, a y-axis, and a z-axis, and may be interpreted in a broader sense. For example, the D1 axis, the D2 axis, and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0052] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, the first element discussed below may be referred to as the second element without departing from the teachings of the present disclosure.

[0053] For descriptive purposes, spatially relative terms such as "below," "below," "under," "down," "above," "up," "above," "higher," and "side" (e.g., as in "sidewall") may be used herein, and thereby describe the relationship of one element relative to another element(s) as illustrated in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, spatially relative terms are intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is flipped, an element described as being "below" or "below" other elements or features will then be oriented as being "above" the other elements or features. Thus, the exemplary term "below" can cover both above and below orientations. In addition, the device can be oriented in other ways (e.g., rotated 90 degrees or oriented in other orientations), and therefore, the spatially relative descriptors used herein are interpreted accordingly.

[0054] The term used herein is used to describe the purpose of specific embodiments, and is not intended to limit. As used herein, unless the context clearly indicates otherwise, the singular "one" and "the (described)" are intended to also include plural forms. In addition, when used in this specification, the term "includes" and / or "comprising" indicates the existence of stated features, integral bodies, steps, operations, elements, parts and / or its groups, but does not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or its groups. It should also be noted that, as used herein, the term "substantially", "about" and other similar terms are used as approximate terms rather than degree terms, and are therefore utilized to consider the inherent deviation of the value recognized by those of ordinary skill in the art, calculated and / or provided.

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those of ordinary skill in the art to which the present disclosure belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an idealized or overly formal sense unless specifically defined as such herein.

[0056] Figure 1 is a schematic cross-sectional view of an embodiment of a light emitting diode display constructed according to the principle of the present utility model, Figure 2 yes Figure 1 A cross-sectional view of an embodiment of a color conversion panel is shown in FIG. Figure 3 Yes Figure 2 The color conversion panel Figure 1 Detailed cross-sectional view of a light-emitting diode display.

[0057] like Figure 1As shown in FIG. 1 , the light emitting diode display according to the embodiment mainly includes a display panel 1000 and a color conversion panel 2000 which overlap each other in a thickness direction DR3.

[0058] The display panel 1000 (hereinafter, also referred to as the lower panel) may include a plurality of pixels PX1, PX2, and PX3, and a light emitting element ED may be placed for each of the pixels PX1, PX2, and PX3. That is, the display panel 1000 may include a plurality of light emitting elements ED. The plurality of pixels PX1, PX2, and PX3 may include a first pixel PX1, a second pixel PX2, and a third pixel PX3. Each light emitting element ED may emit light, and the display panel 1000 may display brightness by controlling the intensity of light emitted from the light emitting element ED of each pixel PX1, PX2, and PX3, and display an image by displaying brightness. Here, the color of the light emitted by the light emitting element ED included in each of the plurality of pixels PX1, PX2, and PX3 may be substantially the same, and the color is converted into three primary colors in the color conversion panel 2000 described later, thereby displaying a color.

[0059] The light emitting element ED may be composed of an organic light emitting element, and the display panel 1000 may be composed of an organic light emitting panel. However, the type of the display panel 1000 is not limited thereto, and various types of panels may be used. For example, the display panel 1000 may be formed of a liquid crystal panel, an electrophoretic display panel, an electrowetting display panel, or the like. In addition, the display panel 1000 may be formed of a next generation display panel such as a micro light emitting diode (LED) (Micro LED) display panel.

[0060] The display panel 1000 may be constituted of a flat rigid display panel or a flexible display panel that may be flexibly bent.

[0061] The color conversion panel 2000 (hereinafter also referred to as the upper panel) may be placed to overlap with the display panel 1000 in the thickness direction DR3 and face the display panel 1000. The color conversion panel 2000 may include a first color conversion layer 520a, a second color conversion layer 520b, and a transmission layer 520c. The first color conversion layer 520a may overlap with the light emitting element ED placed at the first pixel PX1 in the thickness direction DR3. Light emitted from the light emitting element ED of the first pixel PX1 may pass through the first color conversion layer 520a to emit light of a first wavelength. The second color conversion layer 520b may overlap with the light emitting element ED placed at the second pixel PX2 in the thickness direction DR3. Light emitted from the light emitting element ED of the second pixel PX2 may pass through the second color conversion layer 520b to emit light of a second wavelength. The transmission layer 520c may overlap with the light emitting element ED placed at the third pixel PX3 in the thickness direction DR3. Light emitted from the light emitting element ED of the third pixel PX3 passes through the transmission layer 520c, and light of a third wavelength may be emitted as it is. For example, the light of the first wavelength may be red light, the light of the second wavelength may be green light, and the light of the third wavelength may be blue light. That is, the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be a red pixel, a green pixel, and a blue pixel, respectively. However, the embodiment is not limited thereto, and the colors displayed by the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be changed differently. In addition, in addition to the first pixel PX1, the second pixel PX2, and the third pixel PX3, pixels displaying different colors may be additionally included.

[0062] In the following, reference Figure 2 and Figure 3 The layered structure of the color conversion panel 2000 of the light emitting diode display according to the embodiment is described in detail.

[0063] The color conversion panel 2000 may include a substrate 210 (also referred to as an upper substrate), and first, second, and third color filters 230 a , 230 b , and 230 c disposed on one side surface of the substrate 210 .

[0064] The first color filter 230a may transmit light of the first wavelength and absorb light of the remaining wavelengths, thereby improving the purity of the light of the first wavelength emitted to the outside of the light emitting diode display.

[0065] The second color filter 230b may transmit the light of the second wavelength and absorb the light of the remaining wavelength, thereby improving the purity of the light of the second wavelength emitted to the outside of the light emitting diode display.

[0066] The third color filter 230c may transmit light of the third wavelength and absorb light of the remaining wavelengths, thereby improving the purity of light of the third wavelength emitted to the outside of the light emitting diode display.

[0067] The first color filter 230a, the second color filter 230b and the third color filter 230c can be placed to overlap with different pixels PX1, PX2 and PX3 in the thickness direction DR3. At each boundary of the pixels PX1, PX2 and PX3, the first color filter 230a, the second color filter 230b and the third color filter 230c can overlap each other to form a light blocking area LB. In the light blocking area LB, the first color filter 230a, the second color filter 230b and the third color filter 230 are shown as all overlapping, but are not limited to this. For example, two color filters among the first color filter 230a, the second color filter 230b and the third color filter 230c can overlap to form a light blocking area. For example, at the boundary between the first pixel PX1 and the second pixel PX2, the first color filter 230a and the second color filter 230b can overlap. The second color filter 230b and the third color filter 230c may overlap at a boundary between the second pixel PX2 and the third pixel PX3. The third color filter 230c and the first color filter 230a may overlap at a boundary between the third pixel PX3 and the first pixel PX1.

[0068] The low refractive index layer 240 may be placed on the first color filter 230a, the second color filter 230b and the third color filter 230c. The low refractive index layer 240 may overlap all of the first color filter 230a, the second color filter 230b and the third color filter 230c. In other words, the low refractive index layer 240 may be completely placed on the substrate 210. The low refractive index layer 240 may include an organic material or an inorganic material with a low refractive index. For example, the refractive index of the low refractive index layer 240 may be greater than or equal to about 1.1 and less than or equal to about 1.3.

[0069] The first capping layer 250 (hereinafter, also referred to as a lower capping layer) may be placed on the low refractive index layer 240. The first capping layer 250 is a layer for protecting the low refractive index layer 240, and may include silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y The first capping layer 250 may be a single layer or multi-layer structure of the material.

[0070] A bank in the form of a partition wall 265 may be placed on the first capping layer 250. The partition wall 265 may include a first opening 267a vertically overlapping the first color filter 230a, a second opening 267b vertically overlapping the second color filter 230b, and a third opening 267c vertically overlapping the third color filter 230c. The first opening 267a may overlap with the light-emitting region of the first pixel PX1, the second opening 267b may overlap with the light-emitting region of the second pixel PX2, and the third opening 267c may overlap with the light-emitting region of the third pixel PX3. The partition wall 265 may overlap with the light-blocking region LB where the first color filter 230a, the second color filter 230b, and the third color filter 230c overlap with each other. Accordingly, the partition wall 265 may overlap with the boundary between the pixels PX1, PX2, and PX3. The partition wall 265 additionally includes a dummy opening overlapping with the light blocking area LB where the first color filter 230a, the second color filter 230b, and the third color filter 230c overlap with each other (see FIG. 24 ). Figure 8 267-v).

[0071] First color conversion layer 520a may be placed in first opening 267a, second color conversion layer 520b may be placed in second opening 267b, and transmissive layer 520c may be placed in third opening 267c. On the other hand, the color conversion layer may not be placed in the dummy openings, but when the color conversion layer is formed, the material of the color conversion layer may flow into some of the dummy openings and be placed.

[0072] The first color conversion layer 520a may overlap with the first color filter 230a. The first color conversion layer 520a may not overlap with the second color filter 230b and the third color filter 230c. The first color conversion layer 520a may convert light incident from the light emitting element ED of the first pixel PX1 into light of a first wavelength. In this case, the light of the first wavelength may be red light having a maximum emission peak wavelength of about 600nm to about 650nm (e.g., about 620nm to about 650nm). According to an embodiment, the first color conversion layer 520a may include a plurality of first quantum dots 521a and a plurality of scatterers 530.

[0073] The second color conversion layer 520b may overlap with the second color filter 230b. The second color conversion layer 520b may not overlap with the first color filter 230a and the third color filter 230c. The second color conversion layer 520b may convert light incident from the light emitting element ED of the second pixel PX2 into light of a second wavelength. In this case, the light of the second wavelength may be green light having a maximum emission peak wavelength of about 500nm to about 550nm (e.g., about 510nm to about 550nm). According to an embodiment, the second color conversion layer 520b may include a plurality of second quantum dots 521b and a plurality of scatterers 530.

[0074] The transmission layer 520c may overlap with the third color filter 230c. The transmission layer 520c may not overlap with the first color filter 230a and the second color filter 230b. The transmission layer 520c may transmit light incident from the light emitting element ED of the third pixel PX3. The light passing through the transmission layer 520c may be light of a third wavelength. The light of the third wavelength may be blue light having a maximum emission peak wavelength of about 380nm to about 480nm (e.g., about 420nm or more, about 430nm or more, about 440nm or more, or about 445nm or more and about 470nm or less, about 460nm or less, or about 455nm or less). According to an embodiment, the transmission layer 520c may include a plurality of scatterers 530, but may not include quantum dots.

[0075] The plurality of scatterers 530 may improve light efficiency by scattering light incident to the first color conversion layer 520a, the second color conversion layer 520b, and the transmission layer 520c. The scatterers 530 may include a material such as TiO 2 、SiO 2 ,BaSO 4 、ZnO、Al 2 O 3 、CaCO 3 The particle size of the scatterer 530 may be greater than or equal to about 50 nm and less than or equal to about 800 nm.

[0076] The first quantum dot 521a and the second quantum dot 521b (hereinafter, quantum dots are referred to as semiconductor nanocrystals) can each independently include a II-VI group compound, a III-V group compound, a IV-VI group compound, a IV group element or compound, a I-III-VI group compound, a II-III-VI group compound, a I-II-IV-VI group compound, or a combination thereof. Quantum dots such as the first quantum dot 521a and the second quantum dot 521b may not include cadmium.

[0077] The II-VI compound may be selected from the group consisting of binary compounds, ternary compounds and quaternary compounds, wherein the binary compound is selected from the group consisting of CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS and mixtures thereof; the ternary compound is selected from the group consisting of AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, The group consisting of CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS and mixtures thereof; the quaternary compound is selected from the group consisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and mixtures thereof. The II-VI group compound may further include a Group III metal.

[0078] The III-V compound can be selected from a group including binary compounds, ternary compounds and quaternary compounds, the binary compound is selected from the group consisting of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb and mixtures thereof; the ternary compound is selected from the group consisting of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InZnP, InPSb and mixtures thereof; the quaternary compound is selected from the group consisting of GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb and mixtures thereof. The Group III-V compound may further include a Group II metal (eg, InZnP).

[0079] The IV-VI Group compound can be selected from a group including binary compounds, ternary compounds and quaternary compounds, the binary compound is selected from the group consisting of SnS, SnSe, SnTe, PbS, PbSe, PbTe and mixtures thereof; the ternary compound is selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe and mixtures thereof; the quaternary compound is selected from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe and mixtures thereof.

[0080] The Group IV element or compound may be selected from the group including a unitary compound selected from the group consisting of Si, Ge, and a combination thereof; and a binary compound selected from the group consisting of SiC, SiGe, and a combination thereof.

[0081] The group I-III-VI compound may be selected from the group consisting of CuInSe 2 、CuInS 2 , CuInGaSe and CuInGaS, but is not limited thereto.

[0082] The II-III-VI Group compound can be selected from the group consisting of ZnGaS, ZnAlS, ZnInS, ZnGaSe, ZnAlSe, ZnInSe, ZnGaTe, ZnAlTe, ZnInTe, ZnGaO, ZnAlO, ZnInO, HgGaS, HgAlS, HgInS, HgGaSe, HgAlSe, HgInSe, HgGaTe, HgAlTe, HgInTe, MgGaS, MgAlS, MgInS, MgGaSe, MgAlSe, MgInSe and combinations thereof.

[0083] The Group I-II-IV-VI compound may be selected from CuZnSnSe and CuZnSnS, however, it is not limited thereto.

[0084] In one embodiment, the quantum dots may not include cadmium. The quantum dots may include semiconductor nanocrystals based on group III-V compounds including indium and phosphorus. The group III-V compounds may further include zinc. The quantum dots may include semiconductor nanocrystals based on group II-VI compounds including chalcogens (e.g., sulfur, selenium, tellurium, or a combination thereof) and zinc.

[0085] In quantum dots, binary compounds, ternary compounds, or quaternary compounds as described above may be present in the particle at a substantially uniform concentration, or may be present in the particle at a concentration distribution that may be partially divided into different states. In addition, quantum dots may have a core / shell structure in which one quantum dot surrounds another quantum dot. The interface between the core and the shell may have a concentration gradient in which the concentration of the element present in the shell decreases toward the center.

[0086] In some embodiments, quantum dots may have a core / shell structure including a core comprising the nanocrystals described above and a shell surrounding the core. The shell of the quantum dot may be used as a protective layer to maintain semiconductor properties by preventing chemical denaturation of the core and / or as a charging layer to impart electrophoretic properties to the quantum dot. The shell may be monolayer or multilayer. The interface between the core and the shell may have a concentration gradient in which the concentration of the element present in the shell decreases toward the center. Examples of shells of quantum dots include metal or non-metal oxides, semiconductor compounds, or combinations thereof.

[0087] For example, metal or non-metal oxides may be exemplified by SiO 2 、Al 2 O 3 、TiO 2 、ZnO、MnO、Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 , NiO or binary compounds such as MgAl 2 O 4 、CoFe 2 O 4 、NiFe 2 O 4 and CoMn 2 O 4 The ternary compound, however, the embodiment is not limited thereto.

[0088] In addition, the semiconductor compounds can be exemplified as CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP and AlSb, but the illustrated embodiments are not limited thereto.

[0089] According to an embodiment, the interface between the core and the shell can have a concentration gradient so that the concentration of the element present in the shell gradually decreases as the element approaches the center of the shell. In addition, the semiconductor nanocrystal can have a structure comprising a semiconductor nanocrystal core and a multilayer shell around the core. In an embodiment, the multilayer shell can have two or more layers, such as two, three, four, five or more layers. Two adjacent layers of the shell can have a single composition or different compositions. In the multilayer shell, each layer can have a composition that varies along a radius.

[0090] The quantum dots may have a full width at half maximum (FWHM) of about 45 nm or less, preferably about 40 nm or less, and more preferably about 30 nm or less, and color purity or color reproducibility may be improved within this range. In addition, since the light emitted by the quantum dots is emitted in all directions, a wide viewing angle may be improved.

[0091] In quantum dots, the shell material and the core material may have energy band gaps that are different from each other. For example, the energy band gap of the shell material may be greater than the energy band gap of the core material. Alternatively, the energy band gap of the shell material may be less than the energy band gap of the core material. Quantum dots may have multiple layers of shells. In a multilayer shell, the energy band gap of the outer layer may be greater than the energy band gap of the inner layer (e.g., the layer closer to the core). In a multilayer shell, the energy band gap of the outer layer may be less than the energy band gap of the inner layer.

[0092] The absorption / luminescence wavelength of quantum dots can be controlled by adjusting the composition and size of the quantum dots. The maximum peak emission wavelength of the quantum dots can be from ultraviolet (UV) wavelength to infrared wavelength or a wavelength greater than the above wavelength range.

[0093] The quantum dots may contain organic ligands (e.g., having a hydrophobic portion). The organic ligands may be bound to the surface of the quantum dots. The organic ligands may include RCOOH, RNH 2 , R 2 NH, R 3 N, RSH, R 3 PO, R 3 P, ROH, RCOOR, RPO(OH) 2 , RHPOOH, R 2 POOH or a combination thereof, and wherein R is independently a substituted or unsubstituted C3 to C40 aliphatic hydrocarbon group (such as a substituted or unsubstituted C3 to C40 (e.g., C5 or more and C24 or less) alkyl group or a substituted or unsubstituted C3 to C40 alkenyl group), a substituted or unsubstituted C6 to C40 (e.g., C6 or more and C20 or less) aromatic hydrocarbon group (such as a substituted or unsubstituted C6 to C40 aryl group), or a combination thereof.

[0094] Examples of the organic ligand may include: a thiol compound such as methyl mercaptan, ethyl mercaptan, propanethiol, butanethiol, pentanethiol, hexanethiol, octanethiol, dodecanethiol, hexadecanethiol, octadecanethiol or benzyl mercaptan; an amine such as methaneamine, ethaneamine, propaneamine, butaneamine, pentaneamine, hexaneamine, octaneamine, nonylamine, decaneamine, dodecaneamine, hexadecaneamine, octadecaneamine, dimethylamine, diethylamine, dipropylamine, tributylamine or trioctylamine; a carboxylic acid such as formic acid, acetic acid, propionic acid, butane acid, pentane acid, hexane acid, heptane acid, octane acid, dodecane acid, hexadecane acid, octadecane acid, oleic acid or benzoic acid. Compounds; phosphine compounds such as methyl phosphine, ethyl phosphine, propyl phosphine, butyl phosphine, pentyl phosphine, octyl phosphine, dioctyl phosphine, tributyl phosphine or trioctyl phosphine; phosphine compounds such as methyl phosphine oxide, ethyl phosphine oxide, propyl phosphine oxide, butyl phosphine oxide, pentyl phosphine oxide, tributyl phosphine oxide, octyl phosphine oxide, dioctyl phosphine oxide, trioctyl phosphine oxide or their oxides; diphenyl ether, triphenyl ether compounds or their oxides; and C5 to C20 alkyl phosphonic acids (such as hexyl phosphonic acid, octyl phosphonic acid, dodecane phosphonic acid, tetradecane phosphonic acid, hexadecane phosphonic acid or octadecane phosphonic acid), etc., but not limited thereto. The quantum dot may contain only the hydrophobic organic ligand or as a mixture of at least two types. The hydrophobic organic ligand may not contain a photopolymerizable portion (e.g., an acrylate group, a methacrylate group, etc.).

[0095] Each of the first color conversion layer 520a, the second color conversion layer 520b, and the transmission layer 520c may further include a monomer. In this case, the monomer may be formed of a non-volatile monomer and may be formed of an organic material for photocuring. The monomer may have an acrylate functional group at one or both ends. The monomer may have a boiling point of about 200°C or higher and a thermal conductivity of about 10 -2 Characteristics of vapor pressures of mmHg or less.

[0096] Each of the first color conversion layer 520a, the second color conversion layer 520b, and the transmissive layer 520c may include two or more different monomers. That is, each of the first color conversion layer 520a, the second color conversion layer 520b, and the transmissive layer 520c may include a first monomer and a second monomer. In this case, the first monomer and the second monomer may include different materials. In this case, the first monomer and the second monomer may have an acrylate functional group at one or both ends, respectively.

[0097] A spacing element in the form of a spacer CS is placed on the partition wall 265. The spacer CS is used to maintain a gap between the two panels when the display panel 1000 and the color conversion panel 2000 are combined. In the illustrated embodiment, the spacer CS is not formed by patterning using a mask, but is formed by an inkjet method.

[0098] Compared with the case where the spacer CS is patterned using a deposition mask, when the spacer CS is formed by the inkjet method, the position where the spacer CS is formed may be uneven, but since no mask is used, the manufacturing cost and process time are reduced. Therefore, in the illustrated embodiment, in order to accurately form the spacer CS without misalignment in the inkjet method, the spacer support portion (the spacer support portion may be the bottom surface of the partition wall 265) is formed long in the direction DR2 substantially orthogonal to the direction DR1 in which the inkjet head moves (refer to Figure 6 The spacer support portion CSL) is formed so that the spacer CS is formed at any one of a plurality of positions on the bottom surface of the partition wall 265. Figure 6 Let's describe it in more detail.

[0099] The second capping layer 280 (hereinafter, also referred to as the upper capping layer) may be placed on the first color conversion layer 520a, the second color conversion layer 520b, the transmissive layer 520c, the partition wall 265, and the spacer CS. The second capping layer 280 is substantially completely placed on the substrate 210, and may have a structure covering the first color conversion layer 520a, the second color conversion layer 520b, the transmissive layer 520c, the partition wall 265, and the spacer CS. The second capping layer 280 is a layer that covers and protects the first color conversion layer 520a, the second color conversion layer 520b, and the transmissive layer 520c, and may be formed of an inorganic material. For example, the second capping layer 280 may include a silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y ) inorganic insulating material. The second capping layer 280 can be a single layer or multilayer structure of the material. Figure 2 In the embodiment of the present invention, the second capping layer 280 is formed after the first color conversion layer 520a, the second color conversion layer 520b, the transmission layer 520c, and the spacer CS are formed. The present embodiment may have a stacking process sequence in which the first color conversion layer 520a, the second color conversion layer 520b, and the transmission layer 520c are formed between the partition walls 265 in an inkjet method, and then the spacer CS on the partition wall 265 is also formed in an inkjet method, and then the second capping layer 280 is stacked. As a result, the inkjet process can be continuously applied, so this can have an advantage of shortening the entire process time.

[0100] The filling layer 290 may be placed on the second capping layer 280. The filling layer 290 may be placed completely throughout the substrate 210. The filling layer 290 is placed between the display panel 1000 and the color conversion panel 2000 in a state where the display panel 1000 and the color conversion panel 2000 are bonded.

[0101] In the following, reference Figure 3 A state in which the display panel 1000 and the color conversion panel 2000 are combined is described. Figure 3 middle, Figure 2 The color conversion panel 2000 shown in FIG. 1 may be combined in a state where the top and bottom are reversed to face the display panel 1000. Figure 3 , because of the spacer CS disposed on the color conversion panel 2000, when the display panel 1000 and the color conversion panel 2000 are combined, a gap between the two panels may be maintained substantially constant.

[0102] The display panel 1000 may include a substrate 110 (also referred to as a lower substrate), a transistor TFT including a semiconductor 131, a gate electrode 124, a source electrode 173, and a drain electrode 175 disposed on the substrate 110, a gate insulating layer 120, a first interlayer insulating layer 160, an organic layer 180, a pixel electrode 191, an emission layer 370, a pixel defining layer 350, a common electrode 270, and an encapsulation layer 400. According to an embodiment, the transistor TFT may not include the source electrode 173 or the drain electrode 175.

[0103] The substrate 110 may include a material having rigid properties such as glass, or a flexible material that can be bent such as plastic or polyimide. On the substrate 110, a buffer layer 111 may be further placed to make the surface of the substrate 110 flat and block impurities from penetrating into the semiconductor 131. The buffer layer 111 may include an inorganic material, for example, silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y ) inorganic insulating material. The buffer layer 111 may be a single layer or a multilayer structure of the material. A barrier layer may be further placed on the substrate 110. In this case, the barrier layer may be placed between the substrate 110 and the buffer layer 111. The barrier layer may include, for example, silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y The barrier layer can be a single layer or multilayer structure of the material.

[0104] The semiconductor 131 may be placed on the substrate 110. The semiconductor 131 may include any one of amorphous silicon, polycrystalline silicon, and an oxide semiconductor. For example, the semiconductor 131 may include low temperature polycrystalline silicon (LTPS) or an oxide semiconductor material including at least one of zinc (Zn), indium (In), gallium (Ga), tin (Sn), and a mixture thereof. For example, the semiconductor 131 may include indium gallium zinc oxide (IGZO). The semiconductor 131 may include a channel region, a source region, and a drain region classified according to whether impurity doping is performed. The source region and the drain region may have conductive properties corresponding to a conductor.

[0105] The gate insulating layer 120 may cover the semiconductor 131 and the substrate 110. The gate insulating layer 120 may include silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y The gate insulating layer 120 may have a single layer or multi-layer structure of the material.

[0106] The gate electrode 124 may be placed on the gate insulating layer 120. The gate electrode 124 may include a metal or a metal alloy such as copper (Cu), molybdenum (Mo), aluminum (Al), silver (Ag), chromium (Cr), tantalum (Ta) or titanium (Ti). The gate electrode 124 may be formed as a single layer or multiple layers. The region of the semiconductor 131 that overlaps with the gate electrode 124 may be a channel region.

[0107] The first interlayer insulating layer 160 may cover the gate electrode 124 and the gate insulating layer 120. The first interlayer insulating layer 160 may include silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y ). The first interlayer insulating layer 160 may have a single layer or multi-layer structure of the material.

[0108] The source electrode 173 and the drain electrode 175 may be placed on the first interlayer insulating layer 160. The source electrode 173 and the drain electrode 175 are connected to the source region and the drain region of the semiconductor 131, respectively, through openings formed in the first interlayer insulating layer 160 and the gate insulating layer 120. The semiconductor 131, the gate electrode 124, the source electrode 173, and the drain electrode 175 mentioned above constitute one transistor TFT. According to an embodiment, the transistor TFT may include only the source region and the drain region of the semiconductor 131, without including the source electrode 173 and the drain electrode 175. Although one transistor TFT is illustrated in each of the pixels PX1, PX2, and PX3, the embodiment is not limited thereto, and a plurality of transistors TFT may be placed in each of the pixels PX1, PX2, and PX3.

[0109] The source electrode 173 and the drain electrode 175 may include a metal or a metal alloy such as aluminum (Al), copper (Cu), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), nickel (Ni), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr) and tantalum (Ta), or may include various transparent conductive oxide layers such as indium tin oxide (ITO). The source electrode 173 and the drain electrode 175 may be composed of a single layer or multiple layers. The source electrode 173 and the drain electrode 175 according to the embodiment may be composed of three layers including an upper layer, an intermediate layer and a lower layer, the lower layer may include titanium (Ti), the intermediate layer may include copper (Cu), and the upper layer may include indium tin oxide (ITO) which is a transparent conductive oxide layer.

[0110] The organic layer 180 may be disposed on the source electrode 173 and the drain electrode 175. The organic layer 180 covers the source electrode 173, the drain electrode 175, and the first interlayer insulating layer 160. The organic layer 180 is used to planarize the surface of the substrate 110 on which the transistor TFT is formed, and the organic layer 180 may be an organic insulator and may include at least one material selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0111] The pixel electrode 191 may be disposed on the organic layer 180. The pixel electrode 191 is also referred to as an anode and may be composed of a single layer including a transparent conductive oxide layer or a metal material or a multilayer including a transparent conductive oxide layer or a metal material. The transparent conductive oxide layer may include indium tin oxide (ITO), poly ITO, indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium zinc oxide (ITZO), etc. The metal material may include silver (Ag), molybdenum (Mo), copper (Cu), gold (Au), and aluminum (Al).

[0112] The organic layer 180 may include a through hole 81 exposing the drain electrode 175. The drain electrode 175 and the pixel electrode 191 may be physically and electrically connected through the through hole 81 of the organic layer 180. Therefore, the pixel electrode 191 may receive an output current to be transmitted from the drain electrode 175 to the emission layer 370.

[0113] The pixel defining layer 350 may be placed on the pixel electrode 191 and the organic layer 180. The pixel defining layer 350 includes a pixel opening 351 (hereinafter, also referred to as an opening for a light emitting diode (LED)) overlapping at least a portion of the pixel electrode 191. In this case, the pixel opening 351 may overlap the central portion of the pixel electrode 191 and may not overlap the edge portion of the pixel electrode 191. Accordingly, the size of the pixel opening 351 may be smaller than the size of the pixel electrode 191. The pixel defining layer 350 may partition the formation position of the emission layer 370 so that the emission layer 370 may be placed on a portion where the upper surface of the pixel electrode 191 is exposed. The pixel defining layer 350 may be an organic insulator including at least one material selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin. According to an embodiment, the pixel defining layer 350 may be formed by a black pixel defining layer (BPDL) including a black pigment.

[0114] The pixel defining layer 350 may be placed at the boundary between the plurality of pixels PX1, PX2, and PX3. The pixel defining layer 350 may overlap vertically with the partition wall 265 of the color conversion panel 2000, and the pixel opening 351 of the pixel defining layer 350 may also overlap vertically with the first opening 267a, the second opening 267b, and the third opening 267c of the partition wall 265. In addition, the pixel opening 351 of the pixel defining layer 350 may overlap with the first color filter 230a, the second color filter 230b, and the third color filter 230c, and may also overlap vertically with the first color conversion layer 520a, the second color conversion layer 520b, and the transmission layer 520c. In addition, the pixel defining layer 350 may overlap with the light blocking area LB where the first color filter 230a, the second color filter 230b, and the third color filter 230c overlap.

[0115] The plurality of pixel openings 351 may each have a planar shape similar to the planar shape of the pixel electrode 191. For example, the pixel openings 351 and the pixel electrode 191 may be composed of polygons. In this case, the corner portions of the pixel openings 351 and the pixel electrode 191 may be chamfered. However, the shape of the pixel openings 351 and the shape of the pixel electrode 191 are not limited thereto and may be variously changed.

[0116] In this case, the plurality of pixel electrodes 191 corresponding to the first pixel PX1, the second pixel PX2, and the third pixel PX3 may have different sizes. Similarly, the plurality of pixel openings 351 corresponding to the first pixel PX1, the second pixel PX2, and the third pixel PX3 may have different sizes. For example, the pixel opening 351 and the pixel electrode 191 corresponding to the first pixel PX1 may have larger sizes than the pixel opening 351 and the pixel electrode 191 corresponding to the second pixel PX2, respectively. In addition, the pixel opening 351 and the pixel electrode 191 corresponding to the first pixel PX1 may have smaller or similar sizes than the pixel opening 351 and the pixel electrode 191 corresponding to the third pixel PX3, respectively. However, the embodiment is not limited thereto, and each of the pixel opening 351 and the pixel electrode 191 may be set to have various sizes.

[0117] The emission layer 370 may be placed in the pixel opening 351 defined by the pixel defining layer 350. However, the embodiment is not limited thereto, and the emission layer 370 may be placed on the pixel defining layer 350 and in the pixel opening 351. The emission layer 370 may be formed by performing a deposition process using an opening mask in which a portion corresponding to the display area is opened. The emission layer 370 may include an organic material of low molecular weight or high molecular weight. Although the emission layer 370 is illustrated as a single layer, in fact, auxiliary layers such as an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer may also be included above and below the emission layer 370. The hole injection layer and the hole transport layer may be placed under the emission layer 370, and the electron transport layer and the electron injection layer may be placed on the light emitting layer 370. According to an embodiment, the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer may be placed on the pixel defining layer 350, and may be placed throughout the entire area of ​​the substrate 110. In addition, another emission layer may be further placed on the emission layer 370. That is, two or more emission layers 370 may be stacked.

[0118] A lower spacer may be further placed on the pixel defining layer 350. The lower spacer may be formed of the same material as the pixel defining layer 350. However, the embodiment is not limited thereto, and the lower spacer may be made of a material different from that of the pixel defining layer 350. The lower spacer may be an organic insulator including at least one material selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0119] The common electrode 270 may be placed on the pixel defining layer 350 and the emission layer 370. The common electrodes 270 of each pixel PX1, PX2 and PX3 may be connected to each other. The common electrode 270 may be formed to be completely connected on the substrate 110. The common electrode 270 is also referred to as a cathode and may be formed by a transparent conductive layer including indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO) and indium tin zinc oxide (ITZO). The common electrode 270 may be made of a metal material such as silver (Ag) or magnesium (Mg) or a mixture thereof. At this time, the thickness of the common electrode 270 may be adjusted to be formed by a transparent conductive layer. In addition, the common electrode 270 may have a translucent property, and in this case, a microcavity may be formed together with the pixel electrode 191.

[0120] The pixel electrode 191, the emission layer 370 and the common electrode 270 may constitute a light emitting element ED. In each of the pixels PX1, PX2 and PX3, a portion where the pixel electrode 191, the emission layer 370 and the common electrode 270 overlap may be a light emitting region of each light emitting element ED.

[0121] The light emitting element ED placed at the first pixel PX1 may vertically overlap the first color conversion layer 520a and the first color filter 230a. The light emitting element ED placed at the first pixel PX1 may not vertically overlap the second color conversion layer 520b, the transmission layer 520c, the second color filter 230b, and the third color filter 230c. Light emitted from the light emitting element ED of the first pixel PX1 may be converted into light of the first wavelength when passing through the first color conversion layer 520a, and may be emitted to the outside through the first color filter 230a.

[0122] The light emitting element ED placed at the second pixel PX2 may vertically overlap the second color conversion layer 520b and the second color filter 230b. The light emitting element ED placed at the second pixel PX2 may not vertically overlap the first color conversion layer 520a, the transmission layer 520c, the first color filter 230a, and the third color filter 230c. Light emitted from the light emitting element ED of the second pixel PX2 may be converted into light of a second wavelength when passing through the second color conversion layer 520b, and may be emitted to the outside through the second color filter 230b.

[0123] The light emitting element ED placed at the third pixel PX3 may vertically overlap the transmission layer 520c and the third color filter 230c. The light emitting element ED placed at the third pixel PX3 may not vertically overlap the first color conversion layer 520a, the second color conversion layer 520b, the first color filter 230a, and the second color filter 230b. The light of the third wavelength emitted from the light emitting element ED of the third pixel PX3 may sequentially pass through the transmission layer 520c and the third color filter 230c to be emitted to the outside.

[0124] The encapsulation layer 400 may be placed on the common electrode 270. The encapsulation layer 400 may include at least one inorganic layer and at least one organic layer. In the illustrated embodiment, the encapsulation layer 400 may include a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430. However, this is only an example, and the number of inorganic layers and organic layers constituting the encapsulation layer 400 may be changed differently. For example, the encapsulation layer 400 may be stacked in the order of a first inorganic encapsulation layer, a second inorganic encapsulation layer, a first organic encapsulation layer, and a third inorganic encapsulation layer. Alternatively, the encapsulation layer 400 may be stacked in the order of a first inorganic encapsulation layer, a first organic encapsulation layer, a second inorganic encapsulation layer, and a third inorganic encapsulation layer. The display panel 1000 may include a display area of ​​a display screen and a peripheral area surrounding the display area. The first inorganic encapsulation layer 410, the organic encapsulation layer 420, and the second inorganic encapsulation layer 430 may be placed in a portion of the display area and in the peripheral area. According to an embodiment, the organic encapsulation layer 420 may be formed around the display area, and the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 may even be formed in the peripheral area. The function of the encapsulation layer 400 is to protect the light emitting element ED from moisture or oxygen that may penetrate from the outside, and the ends of one side of the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 may be formed to be in direct contact.

[0125] The encapsulation layer 400 may contact the color conversion panel 2000, and specifically, the encapsulation layer 400 may contact the filling layer 290. Therefore, the second inorganic encapsulation layer 430 of the encapsulation layer 400 may contact the filling layer 290. However, this is only an example, and another layer may be further placed between the encapsulation layer 400 and the filling layer 290.

[0126] The light emitting diode display according to the embodiment may further include a sensing unit for sensing a touch. The sensing unit may include a plurality of sensing electrodes, and the sensing unit may be placed between the display panel 1000 and the color conversion panel 2000.

[0127] In the following, reference Figure 4 and Figure 5A method of forming the spacer CS on the color conversion panel 2000 and a shape of an inkjet head of an inkjet apparatus are described.

[0128] Figure 4 It is shown in Figure 2 A cross-sectional view of a step of forming spacers on a color conversion panel by an inkjet method, and Figure 5 yes Figure 4 A bottom view of an embodiment of an inkjet head of an inkjet device.

[0129] exist Figure 4 , a color conversion panel 2000 is shown according to a step of forming a first color conversion layer 520a, a second color conversion layer 520b, and a transmission layer 520c in the first opening 267a, the second opening 267b, and the third opening 267c, respectively, after forming a partition wall 265 including a first opening 267a, a second opening 267b, and a third opening 267c on a substrate 210. Thereafter, a step of forming a spacer CS by an inkjet method is performed. Figure 4 is shown in .

[0130] like Figure 4 As shown in FIG. 1 , the inkjet head HEAD of the inkjet device moves in the direction of the arrow (hereinafter, also referred to as the moving direction DR1) while emitting ink to form the spacer CS. Figure 5 The inkjet head HEAD of the inkjet device has a structure that is elongated in a direction DR2 (hereinafter, also referred to as an inkjet head extension direction DR2 or extension direction DR2) that is substantially orthogonal to the moving direction DR1.

[0131] exist Figure 5 In FIG. 1 , the inkjet head HEAD of the inkjet device is viewed from the substrate side, and a plurality of nozzles NZ are arranged. Figure 5 , adjacent nozzles NZ may be arranged in the inkjet head extension direction DR2 with a gap-nz between the nozzles NZ. The gap-nz between the nozzles NZ may be changed, and among these gap-nz, the smallest gap-nz between the nozzles NZ may be the bottom portion (reference) of the partition wall 265 extending in the direction DR2. Figure 6 The length of the spacer support portion CSL) is the value considered when forming the spacer CS. Figure 6 Described in detail in.

[0132] The inkjet head HEAD of the inkjet device can reduce the interval gap-nz between the nozzles NZ to a minimum by arranging the inkjet heads HEAD at substantially regular intervals while using a plurality of inkjet heads HEAD. In this case, the minimum interval gap-nz between the nozzles NZ reduced by using a plurality of inkjet heads HEAD can be a value considered when determining the length of the elongated portion to be formed in the direction DR2 of the bottom surface of the partition wall 265.

[0133] Here, the moving direction DR1 of the inkjet head HEAD extends substantially orthogonally to the extending direction DR2 of the inkjet head HEAD and the direction (ie, direction DR2) in which the interval gap-nz between the nozzles NZ is determined. Figure 5 As shown in FIG. 5 , the extending direction of the inkjet head HEAD and the direction defining the gap gap-nz between the nozzles NZ may be the same direction DR2.

[0134] In the following, reference Figure 6 and Figure 7 A planar structure of a spacer supporting portion and a position of the spacer CS according to an embodiment are described in more detail.

[0135] Figure 6 is a top view of an embodiment of a spacer constructed according to the principle of the present invention and a partition wall arranged around the spacer, and Figure 7 It is shown Figure 6 Top view of various positions of the spacer.

[0136] Figure 6 The spacer support portion CSL is shown at the bottom of the partition wall 265 and supports the spacer CS on the spacer support portion CSL. Here, the perimeter of the spacer support portion CSL has a structure in which the partition wall 265 is further formed to have a minimum width b. Hereinafter, the portion of the perimeter of the spacer support portion CSL having the minimum width b is also referred to as an additional margin portion. Figure 6 FIG. 2 shows that the perimeter of the spacer support portion CSL has only the minimum width b, but the embodiment is not limited thereto. Therefore, the partition wall 265 may be formed to have a width wider than this, and Figure 8 , Fig.16 and Fig.17 Various embodiments of the planar structure of the partition wall 265 are described in detail.

[0137] refer to Figure 7 , the dotted line shows that the spacer CS can be formed at various positions according to the extension direction DR2 of the spacer support portion CSL. Here, the extension direction DR2 of the spacer support portion can be substantially the same direction as the extension direction DR2 of the inkjet head HEAD of the inkjet device, and can be the same as the extension direction DR2 of the inkjet head HEAD of the inkjet device. Figure 6 The direction of the arrow shown by c corresponds to this. Figure 7 It is taught that the position where the spacer CS is formed may differ depending on the position of the nozzle NZ to be used among the plurality of nozzles NZ formed on the inkjet head HEAD of the inkjet apparatus.

[0138] Reference again Figure 6 , the spacer CS has a circular shape, and the diameter a may have a value of about 20 μm, and the value of the diameter a of the spacer CS may be 10 μm or more and 30 μm or less. According to an embodiment, the spacer CS may have a polygonal shape similar to a circle. Here, the spacer CS may be formed to have a height of 2 μm or more and 10 μm or less.

[0139] The spacer support portion CSL is formed to have a size large enough to include the diameter a of the spacer CS, the size becoming larger as the diameter a of the spacer CS increases.

[0140] Both ends of the spacer support portion CSL in the extension direction of the spacer support portion CSL may be formed in a planar shape substantially the same as a planar shape of the spacer CS. Figure 5 In the embodiment, the planar shapes of both ends of the spacer support portion CSL are formed into a substantially semicircular structure according to the planar shape of the circular spacer CS.

[0141] In addition, the spacer support portion CSL is formed to be elongated in a direction in which the spacer CS can be formed by any one of the nozzles of the moving inkjet head HEAD (i.e., the extension direction of the spacer support portion CSL). The length of the spacer support portion CSL in the extension direction is formed so that a margin c exists even after the spacer CS is formed. Here, it is possible to Figure 5 The margin c is determined by the minimum value of the intervals gap-nz between the nozzles NZ. In the illustrated embodiment, the margin c is set to the value of the minimum interval gap-nz between the nozzles NZ. The minimum interval gap-nz between the nozzles NZ may vary depending on the inkjet device, and the margin c may have a value of 14.1 μm or more and 70.5 μm or less. Here, considering the margin c and the diameter a of the spacer CS, the length of the spacer support portion CSL in the extension direction may be 24.1 μm or more and 90.5 μm or less.

[0142] However, when forming the spacer CS in an actual inkjet method, when taking into account accuracy and tolerance, in the partition wall 265 according to the illustrated embodiment, an additional margin portion having a minimum width b is formed around the spacer support portion CSL. As a result, the spacer CS may be formed to have a structure that always vertically overlaps the partition wall 265. Here, the minimum width b may have a value of about 10 μm, and the value of the minimum width b may be 5 μm or more and 15 μm or less.

[0143] According to the above structure, the partition wall 265 can be formed to have a minimum width b at and around the spacer support portion CSL, and the spacer CS can be formed to be stably and reliably placed on the partition wall 265 even if the spacer CS is formed using an inkjet method.

[0144] Specifically, in the partition wall 265 of the illustrated embodiment, the spacer support portion CSL has a structure that is elongated and extended in one direction DR2 (the extension direction of the spacer support portion CSL), thereby having an anisotropic planar structure having different widths based on the extension direction DR2 and the direction DR1 perpendicular to the extension direction DR2. As a result, in the inkjet head HEAD of the inkjet device, the spacer CS is formed so that even if the spacer CS is formed by any nozzle NZ among the plurality of nozzles NZ, the spacer CS can be placed on the partition wall 265.

[0145] As a result, since a deposition mask process is omitted, manufacturing costs and process time are advantageously reduced.

[0146] On the other hand, the specific structure of the partition wall 265 has a structure having a width substantially equal to or greater than the minimum width b (eg, margin width) in each direction of the spacer support portion CSL, and based on Figure 8 The specific structure of the partition wall 265 is described in detail.

[0147] Figure 8 yes Figure 2 A top view of an embodiment of a portion of a color conversion panel.

[0148] Figure 8The partition wall 265, the spacer CS, the first color conversion layer 520a, the second color conversion layer 520b, and the transmissive layer 520c are shown. In addition, the partition wall 265 includes a first opening 267a, a second opening 267b, and a third opening 267c that allow the first color conversion layer 520a, the second color conversion layer 520b, and the transmissive layer 520c to be placed therein, respectively, and may further include a dummy opening 267-v. The dummy opening 267-v does not overlap with the first color conversion layer 520a, the second color conversion layer 520b, and the transmissive layer 520c, but overlaps with the light blocking area LB. In addition, all openings adjacent to the perimeter of the partition wall 265 on which the spacer CS is placed may be dummy openings 267-v, and the spacer CS may be placed adjacent to the dummy opening 267-v of the partition wall 265.

[0149] On the other hand, Figure 8 , pitches Pitch-x and Pitch-y between four spacers CS adjacent to each other are shown.

[0150] The spacer CS may be placed while changing the position according to the extending direction of the spacer support portion CSL, and Figure 8 In the embodiment, the pitch Pitch-y in the vertical direction (eg, direction DR2) may have a different value from the pitch Pitch-x in the horizontal direction. Figure 8 In FIG. 1 , as the pitch Pitch-y in the vertical direction, a pitch Pitch-y2 in the second vertical direction is additionally shown to show that adjacent pitches in the vertical direction may be different from each other. Figure 8 An embodiment is shown in which the spacer CS placed at the top is placed upward in the spacer support portion CSL, the spacer CS placed in the middle is placed downward in the spacer support portion CSL, and the spacer CS placed at the bottom is placed in the center in the spacer support portion CS. However, the position of the spacer CS may be formed in a different position in the spacer support portion CSL.

[0151] More specifically, the pitch between the spacers CS can be described as follows. The pitch Pitch-x in the horizontal direction can all have a constant value, and can have substantially the same value as an integer multiple of the pitch value of the pixel in the horizontal direction. On the other hand, when the position of the spacer CS changes according to the extension direction, the pitch Pitch-y in the vertical direction can have various values, and adjacent pitches Pitch-y in the vertical direction can have different values. In addition, the pitch Pitch-y in the vertical direction can have a value different from an integer multiple of the pitch value of the pixel in the vertical direction. Here, the pitch of the pixel can be determined based on the spacing between adjacent color filters, color conversion layers and / or transmission layers, and the pitch can be determined based on the spacing between the openings in the partition wall that overlap the emission layer.

[0152] However, with Fig.10 Compared with the comparative example of FIG. 1 , in the comparative example, the pitch Pitch-y′ of the spacer CS′ in the vertical direction and the pitch Pitch-x′ in the horizontal direction have substantially the same value, and thus Figures 6 to 8 There are differences compared to the embodiment shown in .

[0153] In the following, for the purpose of comparison with the illustrated embodiment, Fig. 9 and Fig.10 The structure of the spacer CS' formed using the deposition mask is described.

[0154] Fig. 9 is a top view of a comparative example of a patterned spacer and a partition wall disposed around the spacer, and Fig.10 is a top view of a comparative example of a color conversion panel.

[0155] Because according to Fig. 9 The patterned spacer CS' of the comparative example is formed using a mask, so the spacer CS' can be formed at a correct position. Therefore, the spacer support portion is consistent with the planar shape of the spacer CS', and the spacer support portion is not formed to be elongated in one direction.

[0156] The diameter a' of the spacer CS' in the comparative example may be equal to Figure 6 The diameter a of the spacer CS, and the minimum width b' of the comparative example can be Figure 6 The minimum length b of the embodiments is substantially the same.

[0157] In addition, reference Fig.10 In the comparative example, the pitches Pitch-x' and Pitch-y' between the four spacers CS' may be substantially the same as each other. Fig.10In the comparative example of , the pitch Pitch-y' of the spacer CS' in the vertical direction and the pitch Pitch-x' in the horizontal direction have substantially the same value.

[0158] exist Fig. 9 and Fig.10 In these comparative examples, the spacer can be formed at the correct position using a mask, but if the spacer is formed by an inkjet method, the spacer may be placed on a portion that does not vertically overlap with the partition wall 265. In this case, there is a problem that the spacer does not function properly.

[0159] However, if Figures 6 to 8 As shown in FIG. 1 , the spacer support portion CSL of the partition wall 265 has an anisotropic planar structure that is elongated and extended in one direction DR2 (the extension direction of the spacer support portion CSL), so that even if the spacer CS is formed by any nozzle NZ of a plurality of nozzles NZ in the inkjet head HEAD of the inkjet device, the spacer CS can be formed on the partition wall 265. Since the deposition mask process is not used to form the spacer CS, the manufacturing cost is reduced and the process time is also reduced.

[0160] In the following, reference Figures 11 to 19 Many variant embodiments are described.

[0161] First, refer to Figures 11 to 15 describe Figure 6 A modified embodiment of .

[0162] Figures 11 to 15 1 is a top view of various embodiments of a spacer and a partition wall disposed around the spacer constructed according to the principle of the present invention.

[0163] By Figure 6 The spacer CS is moved downward in the structure to form Fig.11 Embodiment of the invention.

[0164] exist Fig.11 In the embodiment of the present invention, the spacer support portion CSL and the spacer CS have a structure having a first margin c1 and a second margin c2, and the sum of the first margin c1 and the second margin c2 may be equal to Figure 6 The sum of the first margin c1 and the second margin c2 may have a value of 14.1 μm or more and 70.5 μm or less.

[0165] Fig.12 Examples and Fig.13 The embodiment is as follows, in which, Fig.11The additional margin portion formed to have the minimum width and positioned at the outer side of the spacer support portion CSL in the embodiment of the present invention has a planar shape different from the planar shape of the spacer support portion CSL.

[0166] That is to say, Fig.12 As shown in FIG. 1 , the planar shape of the additional margin portion has an octagonal shape extending long in one direction, or may have a planar shape as shown in FIG. Fig.13 According to the embodiment, the shape of the additional margin part may be formed to be elongated in one direction and may have various shapes.

[0167] exist Fig.14 and Fig.15 In a modified embodiment of FIG. 1 , an embodiment is shown in which the spacer CS is not circular. Fig.14 In the example, the spacer CS has an octagonal shape and Fig.15 In the embodiment, the spacer CS has a quadrangular shape. Depending on the shape of the spacer CS, the spacer support portion CSL also has an octagonal and a quadrangular shape, respectively, and the spacer support portion CSL extends long in one direction.

[0168] exist Fig.14 and Fig.15 In an embodiment of the present invention, a plan shape of the additional margin part is substantially the same as a plan shape of the spacer support portion CSL, and the additional margin part may have a structure having a minimum width at an outer side of the spacer support portion CSL.

[0169] As described above, the spacer CS is placed within the spacer support portion CSL elongated in one direction, and the position of the spacer CS may be changed according to the extension direction of the spacer support portion CSL.

[0170] As described above, the spacer support portion CSL of the partition wall 265 has an anisotropic planar structure extending elongated in one direction (the extending direction of the spacer support portion CSL), and even if the spacer CS is formed by any nozzle NZ among a plurality of nozzles NZ in the inkjet head HEAD of the inkjet device, the spacer CS can be formed on the partition wall 265. As a result, since a deposition mask process is not used, manufacturing costs are reduced and process time is also reduced.

[0171] In the following, reference Fig.16 and Fig.17 describe Figure 8 The structure of the partition wall 265.

[0172] Fig.16 and Fig.17 yes Figure 2A top view of another embodiment of a portion of a color conversion panel.

[0173] exist Fig.16 In the embodiment, similar to Figure 8 In the embodiment of the present invention, the first opening 267a, the second opening 267b and the third opening 267c are formed in the partition wall 265 and correspond to the first color conversion layer 520a, the second color conversion layer 520b and the transmission layer 520c having a quadrilateral shape. However, the positions of the first opening 267a, the second opening 267b and the third opening 267c are different from Figure 8 location. Fig.16 An embodiment is an embodiment in which openings adjacent to the periphery of the partition wall 265 on which the spacer CS is placed are all dummy openings 267 - v.

[0174] refer to Fig.16 , the spacer CS is placed on a portion of the partition wall 265 that is elongated in one direction and is aligned with Fig.16 Unlike the portion shown in FIG. 1 , the position of the spacer CS may be moved in one direction and placed.

[0175] On the other hand, Fig.17 In, with Figure 8 Differently, the first opening 267a, the second opening 267b, and the third opening 267c formed in the partition wall 265 have a modified hexagonal structure based on a rhombus. Fig.17 , the spacer CS is placed on a portion of the partition wall 265 that is elongated in one direction and is aligned with Fig.17 Unlike the portion shown in FIG. 1 , the position of the spacer CS may be moved in one direction and placed.

[0176] exist Fig.17 In the embodiment, Figure 8 Differently, not all of the openings adjacent to the perimeter of the partition wall 265 where the spacer CS is placed are dummy openings 267-v, and some of the openings may be one of the first opening 267a, the second opening 267b, and the third opening 267c, and one of the first color conversion layer 520a, the second color conversion layer 520b, and the transmission layer 520c may be placed in the adjacent openings.

[0177] In the following, reference Fig.18 and Fig.19 describe Figure 2 and Figure 3 A modified embodiment of .

[0178] Fig.18 is a cross-sectional view of another embodiment of a color conversion panel, and Fig.19 Yes Fig.18A cross-sectional view of an embodiment of a color conversion panel for a light emitting diode display.

[0179] exist Fig.18 and Fig.19 In the embodiment, Figure 2 and Figure 3 Differently, the second capping layer 280' is placed under the spacer CS and between the partition wall 265 and the spacer CS. That is, the second capping layer 280' is placed on the first color conversion layer 520a, the second color conversion layer 520b, the transmission layer 520c and the partition wall 265. The second capping layer 280' may be completely placed on the substrate 210. The second capping layer 280' is a layer that covers and protects the first color conversion layer 520a, the second color conversion layer 520b and the transmission layer 520c, and may be made of an inorganic material. For example, the second capping layer 280' may include a silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (Si x N y The second capping layer 280' may be a single layer or multi-layer structure of the material.

[0180] The spacer CS may be placed on the second capping layer 280 ′, and the filling layer 290 may be placed on the spacer CS and the second capping layer 280 ′.

[0181] Fig.19 It shows that according to Fig.18 The color conversion panel 2000 ′ of the embodiment is bonded to the display panel 1000 .

[0182] exist Fig.18 and Fig.19 In the embodiment of the present invention, the spacer CS is formed by an inkjet method, and the spacer support portion CSL of the partition wall 265 may have an anisotropic planar structure elongatedly extending in one direction (the extending direction of the spacer support portion CSL).

[0183] Although certain embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the present invention is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those of ordinary skill in the art.

Claims

1. A light emitting diode display, comprising: A first panel including an emission layer and a pixel defining layer; as well as a second panel, placed on the first panel and comprising a dam and a plurality of spacer elements, wherein the embankment overlaps the plurality of spacer elements and comprises a plurality of spacer support portions, the plurality of spacer support portions longitudinally extending a distance in a first direction greater than the distance the plurality of spacer support portions extend in a second direction intersecting the first direction, and The plurality of spacer elements are disposed on the plurality of spacer support portions.

2. The light emitting diode display according to claim 1, wherein: A pitch of the plurality of spacer elements in the second direction is equal to an integer multiple of a pitch of the plurality of pixels in the second direction, and a pitch of the plurality of spacer elements in the first direction does not correspond to an integer multiple of the pitch of the plurality of pixels in the first direction.

3. The light emitting diode display according to claim 1, wherein: The spacing element is formed by a movable inkjet head of an inkjet device, and The first direction is the same direction as the extending direction of the movable inkjet head, and is orthogonal to the direction in which the inkjet head of the inkjet device moves.

4. The light emitting diode display according to claim 3, wherein: The spacer element includes a spacer having a diameter of 10 μm or more and 30 μm or less and a height of 2 μm or more and 10 μm or less, wherein the bank includes a partition wall, the spacer support portion includes a bottom of the partition wall, and a margin of the spacer support portion in the first direction excluding the spacer is 14.1 μm or more and 70.5 μm or less, wherein the inkjet head of the inkjet device comprises a plurality of nozzles, and the margin in the first direction is the same as the minimum interval between the plurality of nozzles in the first direction, wherein the length of the bottom in the first direction is greater than or equal to 24.1 μm and less than or equal to 90.5 μm, wherein the partition wall further includes an additional margin portion disposed around the bottom portion, and the additional margin portion has a width of 5 μm or more and 15 μm or less, and The planar shape of the additional margin portion is the same as or different from the planar shape of the bottom portion.

5. The light emitting diode display according to claim 1, wherein: The second panel further comprises an upper cover layer, And the upper capping layer completely covers the bank and the spacing element, or the upper capping layer is placed between the bank and the spacing element.

6. The light emitting diode display according to any one of claims 1 to 5, wherein: The bank includes a partition wall having a first opening, a second opening, and a third opening, and The second panel further includes a first color conversion layer disposed in the first opening, a second color conversion layer disposed in the second opening, and a transmissive layer disposed in the third opening, in, The pixel defining layer includes a plurality of openings for the light emitting diodes, and The plurality of openings for the light emitting diodes overlap with the first opening, the second opening, and the third opening of the partition wall, respectively. Wherein, the second panel further includes a first color filter, a second color filter and a third color filter, The first color filter overlaps the first color conversion layer, the second color filter overlaps the second color conversion layer, and the third color filter overlaps the transmission layer, and The second panel further comprises: a light-blocking region overlapping the partition wall, in which at least two of the first color filter, the second color filter, and the third color filter overlap, and Wherein, the partition wall further includes a dummy opening, and the dummy opening overlaps with the light blocking area.

7. A color conversion panel, comprising: a plurality of spacer elements; a dam overlapping the plurality of spacer elements and including a plurality of spacer support portions extending longitudinally in a first direction, the dam further including a first opening, a second opening, and a third opening; a first color conversion layer disposed in the first opening; a second color conversion layer disposed in the second opening; as well as a transmission layer, disposed in the third opening, The plurality of spacer elements respectively overlap a portion of the plurality of spacer support portions.

8. The color conversion panel according to claim 7, wherein: The plurality of spacer elements include a plurality of spacers having a pitch in the first direction different from a pitch in a second direction perpendicular to the first direction.

9. The color conversion panel according to claim 7, wherein: The plurality of spacing elements include a plurality of spacers formed by a movable inkjet head of an inkjet device, and The first direction is the same direction as the extending direction of the movable inkjet head and is orthogonal to the direction in which the inkjet head of the inkjet device moves, wherein the dam includes a partition wall, and the plurality of spacer support portions include a plurality of bottoms of the partition wall, and the partition wall further includes a plurality of additional margin portions respectively disposed around the plurality of bottoms, Each of the plurality of spacers has a diameter of 10 μm or more and 30 μm or less and a height of 2 μm or more and 10 μm or less, A margin of the spacer supporting portion in the first direction excluding the spacer placed at each of the plurality of bottoms is 14.1 μm or more and 70.5 μm or less, and Each of the plurality of additional margin portions has a width of 5 μm or more and 15 μm or less.

10. The color conversion panel according to claim 7, further comprising: a first color filter, a second color filter, and a third color filter, The first color filter overlaps the first color conversion layer, the second color filter overlaps the second color conversion layer, and the third color filter overlaps the transmission layer; a light-blocking region overlapping the bank, in which at least two color filters among the first color filter, the second color filter and the third color filter overlap, and The bank further includes a dummy opening, and the dummy opening overlaps the light-blocking region.

Images