Heat exchange cooling device for chemical synthetic material adhesive processing

By introducing a temperature sensor and adjusting the flow of the coolant into the cooling device for adhesive processing, the problem of the existing device being unable to adjust the cooling area and causing the adhesive temperature to be too low, and the stability of the adhesive performance is achieved.

CN222598211UActive Publication Date: 2025-03-11TIANJIN SDORF NEW MATERIAL R & D CO LTD
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Patent Information

Application Number
CN202421249361.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-03
Publication Date
2025-03-11
Estimated Expiration
2034-06-03

AI Technical Summary

Technical Problem

The existing low-temperature cooling devices for adhesive processing cannot adjust the cooling area, resulting in the adhesive temperature being too low when discharged, affecting its performance.

Method used

A heat exchange cooling device for the processing of adhesives in chemical synthetic materials was designed. The temperature sensor was used to detect the temperature of the adhesive, and the flow of the coolant was adjusted through the cooling sleeve and return valve at the inlet and outlet ends to ensure that the temperature of the adhesive was suitable during discharge.

Benefits of technology

By dynamically adjusting the flow of coolant, the problem of too low adhesive temperature is avoided and the performance of the adhesive is ensured.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN222598211U_ABST
    Figure CN222598211U_ABST
Patent Text Reader

Abstract

The utility model discloses a heat exchange cooling device for chemical synthetic material adhesive processing, which comprises a material conveying pipeline and a temperature sensor arranged at the upper end part of the inner side wall surface of the material conveying pipeline, and a cooling structure is arranged on the material conveying pipeline. When the temperature sensor detects that the temperature of the adhesive is high, cooling liquid enters the cooling sleeve at the inlet end, then enters the cooling sleeve at the outlet end through the extended cooling valve and flows back into the storage box through the water return valve at the lower end, the material conveying pipeline makes contact with the cooling liquid to be cooled, and the adhesive flowing through the position is cooled. When the temperature sensor detects that the temperature of the adhesive is not too high, the cooling liquid enters the cooling sleeve at the inlet end and flows back into the storage box through the water return valve at the upper end, the flowing range of the cooling liquid is adjusted, the situation that the temperature of the adhesive is extremely low when the adhesive is discharged out of the conveying pipeline is avoided, and the performance of the adhesive is guaranteed.
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Description

Technical Field

[0001] The utility model relates to the technical field of heat exchange cooling devices, in particular to a heat exchange cooling device for processing chemical synthetic material adhesives. Background Art

[0002] Adhesive, also known as adhesive or bonding agent, is a medium that can connect two or more homogeneous or heterogeneous materials together. This medium usually has sufficient strength after curing to meet different usage requirements. When the adhesive performs its function, it mainly connects materials through its internal viscosity and adhesion. The adhesive needs to be heated during the production process. In order to increase the viscosity of the adhesive, a cooling device is usually required for cooling operation. A low-temperature cooling device for adhesive processing with publication number CN217383519U discloses a processing box, a feed connecting hopper, a coolant circulation pipe, a cooler, a water pump and an adhesive cooling pipe. A reinforced heat dissipation component is installed on the adhesive cooling pipe. The reinforced heat dissipation component includes a connecting sleeve block fixedly mounted on the adhesive cooling pipe and a cooling plate fixed to the side wall of one side of the connecting sleeve block. The connecting sleeve block and the cooling plate are both arranged inside the processing box. In this patent document, the cooling area cannot be adjusted, that is, it is not convenient to control the degree of cooling. When the temperature of the adhesive entering the feed connecting hopper is not too high, the temperature of the adhesive will be extremely low when it is discharged from the processing box, affecting the performance of the adhesive.

[0003] There may already be technical means to solve the above problems in the prior art, but this case intends to provide an alternative or replacement technical solution. Utility Model Content

[0004] In order to solve the problems raised in the background technology, the utility model is implemented through the following technical solutions: a heat exchange cooling device for processing chemical synthetic material adhesives, comprising a material delivery pipeline and a temperature sensor installed at the upper end of the inner wall surface of the material delivery pipeline, wherein a cooling structure is installed on the material delivery pipeline;

[0005] The cooling structure includes an inlet cooling sleeve and an outlet cooling sleeve fixedly mounted on the feed pipeline, the inlet cooling sleeve and the outlet cooling sleeve being mounted in the up-and-down directions, a water inlet pipe is inserted into the upper end portion of the side wall surface of the inlet cooling sleeve, a water chiller is installed at one end of the water inlet pipe, a connecting pipe is installed at one end of the water chiller, a storage box is mounted on the connecting pipe, a water pump is installed at one end of the connecting pipe, the water pump is located inside the storage box, an upper return water valve is inserted into the lower end portion of the side wall surface of the inlet cooling sleeve, a lower return water valve is inserted into the lower end portion of the side wall surface of the outlet cooling sleeve, both the upper return water valve and the lower return water valve are connected to the storage box, and the inlet cooling sleeve and the outlet cooling sleeve are connected to each other via the extended cooling valve.

[0006] Preferably, the outer wall surface of the inlet end cooling sleeve is covered with an inlet end insulation sleeve.

[0007] Preferably, the outer wall surface of the outlet cooling sleeve is covered with an outlet insulation sleeve.

[0008] Preferably, a liquid filling port is installed on the side wall surface of the storage box.

[0009] Preferably, the sum of the length dimensions of the inlet end cooling sleeve and the outlet end cooling sleeve is smaller than the length dimension of the material conveying pipeline.

[0010] Preferably, the temperature sensor is located at the upper end of the cooling sleeve at the inlet end.

[0011] Beneficial Effects

[0012] The utility model provides a heat exchange cooling device for processing chemical synthetic material adhesives. Compared with the prior art, the utility model has the following beneficial effects: when the temperature sensor detects that the temperature of the adhesive is relatively high, the cooling liquid enters the cooling sleeve at the inlet end, then enters the cooling sleeve at the outlet end through the extended cooling valve, and flows back into the storage box through the lower end return valve, the feed pipeline contacts the cooling liquid to be cooled, and the adhesive flowing through this position is cooled; when the temperature sensor detects that the temperature of the adhesive is not too high, the cooling liquid enters the cooling sleeve at the inlet end, and flows back into the storage box through the upper end return valve, thereby adjusting the flow range of the cooling liquid, avoiding extremely low temperature when the adhesive is discharged from the feed pipeline, and ensuring the performance of the adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The utility model is a schematic diagram of the main cross-sectional structure of a heat exchange cooling device for processing chemical synthetic material adhesives.

[0014] Figure 2 It is a three-dimensional structural schematic diagram of a partial main viewing angle of a heat exchange cooling device for processing chemical synthetic material adhesives according to the utility model.

[0015] Figure 3 It is a three-dimensional structural schematic diagram of a partial rear view angle of a heat exchange cooling device for processing chemical synthetic material adhesives of the utility model.

[0016] In the figure: 1. feed pipeline, 2. temperature sensor, 3. cooling sleeve at the inlet end, 4. cooling sleeve at the outlet end, 5. water inlet pipeline, 6. chiller, 7. connecting pipe, 8. storage box, 9. water pump, 10. upper return valve, 11. lower return valve, 12. extended cooling valve, 13. insulation sleeve at the inlet end, 14. insulation sleeve at the outlet end, 15. liquid filling port. DETAILED DESCRIPTION

[0017] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.

[0018] Embodiment: Through the personnel in this field, all the electrical components in this case are connected to their adapted power supplies through wires, and a suitable controller should be selected according to the actual situation to meet the control requirements. The specific connection and control sequence should refer to the following working principle, and the electrical connection between the electrical components is completed in the working order. The detailed connection means are well-known technologies in this field. The following mainly introduces the working principle and process, and does not explain the electrical control.

[0019] In order to solve the problem that the temperature of the adhesive will be extremely low due to the inability to adjust the cooling area, which affects the performance of the adhesive, this technical solution is designed. The detailed technical solution is as follows. Please refer to Figure 1-3 , a heat exchange cooling device for processing chemical synthetic material adhesives, comprising a feed pipe 1 and a temperature sensor 2 installed at the upper end of the inner wall surface of the feed pipe 1, and a cooling structure is installed on the feed pipe 1;

[0020] It should be noted that the adhesive enters from one end of the material delivery pipeline 1 and is transported to the other end, and the temperature sensor 2 detects the temperature of the adhesive entering the material delivery pipeline 1;

[0021] Specifically, the cooling structure includes an inlet cooling sleeve 3 and an outlet cooling sleeve 4 fixedly sleeved on the material conveying pipeline 1, the inlet cooling sleeve 3 and the outlet cooling sleeve 4 are installed in the up-down direction, a water inlet pipe 5 is inserted at the upper end of the side wall surface of the inlet cooling sleeve 3, a water chiller 6 is installed at one end of the water inlet pipe 5, a connecting pipe 7 is installed at one end of the water chiller 6, a storage box 8 is sleeved on the connecting pipe 7, a water pump 9 is installed at one end of the connecting pipe 7, and the water pump 9 is located inside the storage box 8, an upper return water valve 10 is inserted at the lower end of the side wall surface of the inlet cooling sleeve 3, a lower return water valve 11 is inserted at the lower end of the side wall surface of the outlet cooling sleeve 4, the upper return water valve 10 and the lower return water valve 11 are both connected to the storage box 8, and the inlet cooling sleeve 3 and the outlet cooling sleeve 4 are connected to each other through the extended cooling valve 12;

[0022] It should be noted that cooling liquid is stored in the storage box 8. When the temperature sensor 2 detects that the temperature of the adhesive is high, the upper return valve 10 is closed, the extended cooling valve 12 and the lower return valve 11 are opened, the water pump 9 works, and the cooling liquid in the storage box 8 enters the chiller 6 through the connecting pipe 7. The chiller 6 refrigerates the cooling liquid. The cooling liquid enters the cooling sleeve 3 at the inlet end, and then enters the cooling sleeve 4 at the outlet end through the extended cooling valve 12, and flows back into the storage box 8 through the lower return valve 11. The feed pipeline 1 contacts the cooling liquid and is cooled, and the adhesive flowing through this position is cooled. When the temperature sensor 2 detects that the temperature of the adhesive is not too high, the upper return valve 10 is opened, the extended cooling valve 12 and the lower return valve 11 are closed, and the cooling liquid enters the cooling sleeve 3 at the inlet end, and flows back into the storage box 8 through the upper return valve 10, thereby adjusting the flow range of the cooling liquid, avoiding the extremely low temperature of the adhesive when it is discharged from the feed pipeline 1, and ensuring the performance of the adhesive.

[0023] As a preferred embodiment, further, the outer wall surface of the inlet end cooling sleeve 3 is provided with an inlet end insulation sleeve 13 for heat preservation of the cooling liquid entering the inlet end cooling sleeve 3;

[0024] As a preferred embodiment, further, the outer wall surface of the outlet cooling sleeve 4 is provided with an outlet insulation sleeve 14 for heat preservation of the cooling liquid entering the outlet cooling sleeve 4;

[0025] As a preferred embodiment, further, a liquid filling port 15 is installed on the side wall of the storage box 8 for replenishing the cooling liquid;

[0026] As a preference, further, the sum of the length dimensions of the inlet end cooling sleeve 3 and the outlet end cooling sleeve 4 is smaller than the length dimension of the material delivery pipeline 1;

[0027] Preferably, further, the temperature sensor 2 is located at the upper end of the cooling sleeve 3 at the inlet end, and is used to detect the temperature of the uncooled adhesive.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat exchange cooling device for processing chemical synthetic material adhesives, comprising a feed pipe (1) and a temperature sensor (2) installed at the upper end of the inner wall surface of the feed pipe (1), characterized in that: The material conveying pipeline (1) is provided with a cooling structure; The cooling structure comprises an inlet cooling sleeve (3) and an outlet cooling sleeve (4) fixedly mounted on the material conveying pipeline (1); the inlet cooling sleeve (3) and the outlet cooling sleeve (4) are mounted in the vertical direction; an inlet pipe (5) is inserted into the upper portion of the side wall surface of the inlet cooling sleeve (3); a chiller (6) is mounted at one end of the inlet pipe (5); a connecting pipe (7) is mounted at one end of the chiller (6); a storage box (8) is mounted on the connecting pipe (7); and the connecting pipe ( 7) A water pump (9) is installed at one end, and the water pump (9) is located inside the storage box (8). An upper return water valve (10) is inserted at the lower end of the side wall surface of the inlet end cooling sleeve (3), and a lower return water valve (11) is inserted at the lower end of the side wall surface of the outlet end cooling sleeve (4). The upper return water valve (10) and the lower return water valve (11) are both connected to the storage box (8), and the inlet end cooling sleeve (3) and the outlet end cooling sleeve (4) are connected to each other through an extended cooling valve (12).

2. The heat exchange cooling device for processing chemical synthetic material adhesive according to claim 1, characterized in that: The outer wall surface of the inlet end cooling sleeve (3) is sleeved with an inlet end heat insulation sleeve (13).

3. The heat exchange cooling device for processing chemical synthetic material adhesive according to claim 1, characterized in that: The outer wall surface of the outlet end cooling sleeve (4) is sleeved with an outlet end heat insulation sleeve (14).

4. The heat exchange cooling device for processing chemical synthetic material adhesive according to claim 1, characterized in that: A liquid filling port (15) is installed on the side wall surface of the storage box (8).

5. The heat exchange cooling device for processing chemical synthetic material adhesive according to claim 1, characterized in that: The sum of the length dimensions of the inlet end cooling sleeve (3) and the outlet end cooling sleeve (4) is smaller than the length dimension of the material conveying pipeline (1).

6. The heat exchange cooling device for processing chemical synthetic material adhesive according to claim 1, characterized in that: The temperature sensor (2) is located at the upper end of the inlet end cooling sleeve (3).

Citation Information

Patent Citations

  • Low-temperature cooling device for adhesive processing

    CN217383519U