Terminal temperature detection device and inverter
By designing a terminal temperature detection device for thermal conductors and temperature measuring parts at intervals in the photovoltaic inverter, the problem of excessive temperature caused by the false connection of terminals in the inverter is solved, the detection accuracy and safety are improved, and the cost is reduced.
Patent Information
- Application Number
- CN202420864074.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-04-24
AI Technical Summary
The virtual connection and poor contact of DC terminals in photovoltaic inverters cause the terminal to heat up, causing local temperature to be too high and may cause fire. The existing temperature measurement devices have reliability and accuracy problems on PCB boards and are costly.
A terminal temperature detection device is designed, including a heat conducting member and a temperature measuring member installed on the heat conducting member. The heat conducting member is arranged at a distance from the PCB board. The heat conducting zone is used to transfer heat to the heat conducting member. The temperature measuring member is located on the side of the heat conducting zone for temperature detection.
By setting heat conductors at intervals, the impact of PCB board temperature on detection is reduced, the accuracy and real-time performance of terminal temperature detection is improved, fire risk is reduced, and costs are reduced.
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Figure CN222598989U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of inverters, and in particular to a terminal temperature detection device and an inverter. Background Art
[0002] At present, due to the problem of virtual connection and poor contact of the DC terminals on the DC side of the photovoltaic inverter, when the inverter is running at high current, the DC terminals will heat up and cause local overtemperature and fire.
[0003] At present, the method adopted by photovoltaic inverters is to weld the DC terminals to the PCB board, and use the temperature measuring device set on the PCB board to realize the detection and protection of abnormal temperature rise when the DC side terminal is not connected. Due to the presence of many solder joints and other working components on the PCB board, this solution has certain risks in reliability, poor measurement accuracy, and high cost. Therefore, it is urgent to improve the existing terminal temperature measurement method. Utility Model Content
[0004] One of the objectives of the present application is to provide a terminal temperature detection device that can solve at least one of the defects in the above-mentioned background technology.
[0005] Another object of the present application is to provide an inverter that can solve at least one of the defects in the above-mentioned background technology.
[0006] In order to achieve at least one of the above-mentioned purposes, the technical solution adopted in the present application is: a terminal temperature detection device, comprising a heat conductive member and a temperature measuring member installed on the heat conductive member; the heat conductive member is fixedly installed and spaced apart from a PCB board on which a terminal is installed, a heat conductive area is provided on the heat conductive member, and the terminal is suitable for passing through the heat conductive area and transferring heat to the heat conductive member; the temperature measuring member is located on the side of the heat conductive area and detects the temperature of the terminal.
[0007] Preferably, the heat conducting member is a plate-shaped structure, and is provided with heat conducting holes forming the heat conducting area, and the size of the heat conducting holes matches the size of the terminals.
[0008] Preferably, the heat conducting member is a copper plate.
[0009] Preferably, the PCB board is fixedly installed on the box, and the heat conducting member is fixedly installed between the box.
[0010] Preferably, the heat conducting member and the box body are fixedly mounted via a snap connection or fasteners.
[0011] Preferably, the heat conducting member is fixedly installed by cooperation between the heat conducting hole and the terminal.
[0012] Preferably, the heat conducting member is fixedly installed between the heat conducting hole and the terminal by means of one of tight sleeve connection, threaded connection and snap-fit connection.
[0013] Preferably, the temperature measuring element is a thermistor.
[0014] Preferably, the temperature measuring element adopts a chip-type NTC thermistor or a high-power NTC thermistor.
[0015] An inverter comprises the above-mentioned terminal temperature detection device.
[0016] Compared with the prior art, the beneficial effects of this application are:
[0017] By spacing the heat conductor and the PCB board, the influence of the PCB board temperature on the terminal temperature detection can be effectively reduced. At the same time, it can also facilitate the rapid transfer of heat from the terminal to the detection element, thereby effectively improving the accuracy of terminal temperature detection and enabling real-time detection of the terminal temperature. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a partial structural schematic diagram of the inverter in the utility model.
[0019] Figure 2 It is a schematic diagram of the overall structure of the terminal temperature detection device in the present utility model.
[0020] Figure 3 It is a partial structural schematic diagram of one embodiment of the utility model in which the heat conducting member is installed on the box body.
[0021] Figure 4 It is a partial structural schematic diagram of another embodiment of the utility model in which the heat conducting member is installed on the box body.
[0022] Figure 5 It is a partial structural schematic diagram of one embodiment of the utility model in which the heat conducting member is installed on the terminal.
[0023] Figure 6 It is a partial structural schematic diagram of another embodiment of the utility model in which the heat conducting member is installed on the terminal.
[0024] In the figure: base plate 100, connecting plate 110, block 120, PCB board 200, terminal 300, first threaded section 310, buckle 320, avoidance groove 330, terminal temperature detection device 4, heat conducting member 41, heat conducting hole 410, clamping hole 411, second threaded section 412, clamping groove 413, temperature measuring member 42, fastener 500. DETAILED DESCRIPTION
[0025] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0026] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present application.
[0027] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.
[0028] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.
[0029] One aspect of the present application provides a terminal temperature detection device 4; Figure 1 and Figure 2 As shown, one preferred embodiment includes a heat conducting member 41 and a temperature measuring member 42 installed on the heat conducting member 41. The heat conducting member 41 is fixedly installed and spaced apart from the PCB board 200 on which the terminal 300 is installed, so that the heat generated by the components on the PCB board 200 during operation will be difficult to transfer to the heat conducting member 41. A heat conducting area is provided on the heat conducting member 41. After the heat conducting member 41 is installed, the terminal 300 can pass through the heat conducting area and transfer heat to the heat conducting member 41, and then the temperature measuring member 42 located on the side of the heat conducting area can detect the temperature of the terminal 300.
[0030] It is understandable that after the heat conductor 41 and the PCB board 200 are spaced apart, the temperature of the components on the PCB board 200 will not or will hardly affect the temperature measuring component 42 installed on the heat conductor 41; that is, the heat detected by the temperature measuring component 42 basically comes from the terminal 300, thereby effectively improving the temperature detection accuracy of the terminal 300, and also being able to detect the temperature of the terminal 300 in real time. Based on the technical solution of this embodiment, the main function of the heat conductor 41 is to efficiently and quickly transfer the heat of the terminal 300 to the temperature measuring component 42, and to provide space for the installation of the temperature measuring component 42.
[0031] It should be known that, based on the function of the temperature measuring element 42, i.e., detecting the temperature of the terminal 300, the temperature measuring element 42 can be installed on the side of the heat conducting element 41 close to the PCB board 200. For the way that the temperature measuring element 42 is installed on the side of the heat conducting element 41 close to the PCB board 200, the distance X between the PCB board 200 and the heat conducting element 41 needs to be large enough, and the value of the distance X can be calculated by the heat transfer formula of the PCB board 200, based on the fact that the heat of the PCB board 200 does not affect the normal operation of the temperature measuring element 42. Of course, the temperature measuring element 42 can also be installed on the side of the heat conducting element 41 away from the PCB board 200, which can further reduce the influence of the heat generated by the components on the PCB board 200 on the temperature measuring element 42.
[0032] It should also be known that the number of terminals 300 can be one or more. For multiple terminals 300, heat transfer zones corresponding to the number of terminals 300 can be set on the heat transfer element 41, and a temperature measuring element 42 can be installed on the side of each heat transfer zone to perform independent temperature detection on each terminal 300. The heat transfer zone is mainly for heat transfer of the terminal 300, so the heat transfer zone can partially cover the terminal 300 in the circumferential direction or can fully cover it.
[0033] For partial coverage, a specific example is that the heat transfer zone is attached to or close to half of the terminal 300 along the circumferential direction, and the temperature measuring element 42 is installed at a position directly opposite the heat transfer zone. For full coverage, the heat transfer zone is attached to or close to the entire side of the terminal 300 along the circumferential direction. In order to ensure the heat transfer stability of the terminal 300 and facilitate the installation of the temperature measuring element 42, the above-mentioned full coverage method is preferably used for the coverage method of the heat transfer zone and the terminal 300 in this embodiment.
[0034] In this embodiment, there are various specific structures of the heat conducting member 41 that can achieve the above functions. For ease of understanding, two specific examples are provided below for illustration, but the specific structure of the heat conducting member 41 is not limited to these two examples.
[0035] Example 1: Figure 1 and Figure 2 As shown, the heat conducting member 41 is a plate-like structure, and is provided with a heat conducting hole 410 forming a heat conducting area, and the size of the heat conducting hole 410 can be adapted to the size of the terminal 300. The temperature measuring member 42 is installed at the side position of the heat conducting hole 410.
[0036] Example 2: The heat conducting member 41 includes heat conducting rings corresponding to the number of the terminals 300 and connecting ribs connecting the heat conducting rings. The heat conducting rings can be sleeved on the terminals 300, and the temperature measuring member 42 is arranged on the outside of the heat conducting rings, so that the terminals 300 can absorb heat through the heat conducting rings and transfer it to the temperature measuring member 42 on the outside quickly and efficiently, thereby realizing temperature detection of the terminals 300.
[0037] It can be understood that both of the above two examples can meet the requirements of this embodiment. In order to further facilitate the processing of the heat conductive component 41 and the installation of the temperature measuring component 42, the specific structure of the heat conductive component 41 in this embodiment preferably adopts the above example 1.
[0038] In this embodiment, it can be known from the above content that the function of the heat conductor 41 is to absorb and transfer heat quickly and efficiently, that is, the heat conductor 41 needs to have good thermal conductivity. Solid materials with good thermal conductivity mainly include silicon carbide, aluminum and copper, etc. The heat conductor 41 can be made of materials such as silicon carbide, aluminum and copper. Since silicon carbide is relatively expensive and the chemical properties of aluminum are more active than copper, in this embodiment, the heat conductor 41 can preferably be made of copper plate.
[0039] In this embodiment, the PCB board 200 is fixedly installed on the box of the power equipment. The specific installation method of the PCB board 200 and the box is a well-known technology for those skilled in the art, so it will not be elaborated in detail here. There are mainly two installation situations for the fixed installation of the heat conducting member 41: the first is that the heat conducting member 41 is fixedly installed between the box; the second is that the heat conducting member 41 is fixedly installed through the cooperation of the heat conducting hole 410 and the terminal 300. For the convenience of understanding, the following will be described in detail based on the two installation situations of the heat conducting member 41.
[0040] 1. The heat conducting member 41 is fixedly installed on the box body.
[0041] There are many specific installation methods for the heat conductor 41 and the box body. For easy understanding, two specific examples are used to illustrate below, but the specific installation method for the heat conductor 41 and the box body is not limited to these two examples.
[0042] Example 1: Figure 3 As shown, the heat conducting member 41 is fixedly connected to the box body via a fastener 500 .
[0043] Specifically, Figure 3As shown, in order to ensure the installation of the temperature measuring element 42 and the accuracy of the measurement, the heat conducting element 41 needs to be spaced apart from the bottom plate 100 on one side of the box. Then, the side of the heat conducting element 41 and the bottom plate 100 can be spaced apart and supported by the connecting plate 110, and then the two ends of the connecting plate 110 are fastened to the heat conducting element 41 and the bottom plate 100 respectively by the fasteners 500, so that the fastening connection between the heat conducting element 41 and the box can be achieved.
[0044] It should be known that the specific structure and working principle of the fastener 500 are well-known technologies to those skilled in the art, so they will not be elaborated in detail here; common fasteners 500 include bolts and screws, etc. The specific selection of the fastener 500 can be made according to the actual needs of those skilled in the art.
[0045] Example 2: Figure 4 As shown, the heat conducting member 41 is connected to the box body by snap-fitting for fixed installation.
[0046] Specifically, Figure 4 As shown, a block 120 extending toward the heat conducting member 41 is fixed on the bottom plate 100, and a clamping hole 411 is provided on the side of the heat conducting member 41, so that the block 120 can extend into the clamping hole 411 through the elastic clamping portion provided at the end to be clamped and connected with the heat conducting member 41, thereby realizing the clamping fixation between the heat conducting member 41 and the box body. Of course, the block 120 can also be fixedly set on the heat conducting member 41, and then a corresponding clamping hole 411 is opened on the bottom plate 100. For ease of understanding, the subsequent content is also described by taking the block 120 installed on the bottom plate 100 as an example.
[0047] It is understandable that the fixing of the block 120 and the bottom plate 100 may be performed by using a fastener 500, such as a screw that passes through the bottom plate 100 and is threadedly matched with the block 120, thereby fastening the block 120 to the bottom plate 100. Alternatively, an adhesive method may be used, that is, the block 120 may be bonded to the bottom plate 100 by strong glue. Alternatively, welding may be used, that is, the block 120 may be fixed to the bottom plate 100 by bottom welding.
[0048] It is also understandable that the block 120 can be made of plastic or metal. There are many specific structures of the buckle portion provided at the end of the block 120, which are all well-known technologies for those skilled in the art; a specific example is as follows: Figure 4As shown, the block 120 includes a conical top and a polished rod section, and a groove portion adapted to the inner diameter of the clamping hole 411 is provided near the top of the polished rod section, and the groove portion forms a corresponding buckle portion through a through groove provided at the center of the block 120. Therefore, when fixing the heat conductor 41, the block 120 can extend into the clamping hole 411 through the conical top, and then the conical surface and the side wall of the clamping hole 411 are squeezed to drive the groove portion to elastically deform toward the through groove position, until the buckle portion corresponds to the position of the clamping hole 411, and the groove portion can be elastically reset to engage the clamping hole 411. For the block 120 made of plastic material, the thickness of the groove portion can be appropriately thicker to improve the structural strength; for the block 120 made of metal material, the groove portion can be slightly thinner to facilitate elastic deformation.
[0049] 2. The heat conducting member 41 and the terminal 300 are fixedly installed.
[0050] There are many specific installation methods for the heat conductor 41 and the terminal 300. For ease of understanding, three specific examples are provided below for illustration. However, the specific installation methods for the heat conductor 41 and the terminal 300 are not limited to these three examples.
[0051] Example 1: The heat conducting hole 410 and the terminal 300 are tightly fitted together to fix the heat conducting member 41 .
[0052] Specifically, a transition or interference fit may be adopted between the heat conducting hole 410 and the terminal 300, thereby realizing fixed installation between the heat conducting member 41 and the terminal 300. Alternatively, an abutting portion having a diameter larger than the inner diameter of the heat conducting hole 410 may be integrally formed on the terminal 300. After the terminal 300 is fixedly installed on the PCB board 200, the heat conducting member 41 is sleeved on the terminal 300 through the heat conducting hole 410 until it abuts against the abutting portion, and then fixedly installed on the terminal 300 through an additional fastening ring and abuts against the side of the heat conducting member 41 away from the abutting portion. The fastening ring may be transitionally or interference fit with the terminal 300, or may be threadedly connected, or even glued.
[0053] Example 2: Figure 5 As shown, the heat conducting hole 410 and the terminal 300 are connected by threads to fix the heat conducting member 41 .
[0054] Specifically, Figure 5 As shown, the heat conducting hole 410 is a circular hole, and the inner wall of the heat conducting hole 410 is provided with a second thread segment 412; the outer side of the terminal 300 is integrally formed with a first thread segment 310. Therefore, when installing the heat conducting member 41, the terminal 300 can be firstly screwed with the second thread segment 412 on the heat conducting hole 410 through the first thread segment 310, and then the terminal 300 can be fixed to the PCB board 200 to achieve the fixed installation of the heat conducting member 41.
[0055] Example 3: Figure 6 As shown, the heat conducting hole 410 and the terminal 300 are connected by snap-fitting to fix the heat conducting member 41 .
[0056] Specifically, Figure 6 As shown, the inner diameter of the heat-conducting hole 410 is adapted to the outer diameter of the terminal 300. The inner wall of the heat-conducting hole 410 is provided with a card slot 413; the outer wall of the terminal 300 is provided with a buckle 320. When the heat-conducting member 41 is fixedly installed, the terminal 300 can be first fixedly installed on the PCB board 200, and then the heat-conducting member 41 is aligned with the terminal 300 through the heat-conducting hole 410 to be mutually sleeved. The buckle 320 can be elastically deformed in the direction of the avoidance groove 330 set near the inner side of the buckle 320 of the terminal 300 by squeezing the port of the heat-conducting hole 410, until the buckle 320 extends into the heat-conducting hole 410 and aligns with the card slot 413, the buckle 320 can be elastically reset and connected with the card slot 413. Of course, the buckle 320 can also be set on the heat-conducting member 41, and the card slot 413 can be set on the terminal 300. The specific setting method can refer to the above content, so it is not elaborated in detail here.
[0057] In this embodiment, there are many types of temperature measuring components 42 that can detect the temperature of the terminal 300. Based on the temperature measurement principle, there are mainly methods of measuring the temperature by measuring the radiation energy of the object itself using infrared rays, measuring the temperature by using the characteristic that the resistance value changes with the temperature, measuring the temperature by using the temperature difference of different metals, etc. Based on the requirements of the installation space, such as Figure 2 As shown, in this embodiment, a resistance temperature measurement method is preferably adopted. For example, the temperature measuring element 42 can adopt a thermistor to measure the temperature.
[0058] It should be known that the advantage of thermistors is fast response speed. Common thermistors include negative temperature coefficient thermistors, i.e., NTC thermistors; and positive temperature coefficient thermistors, i.e., PTC thermistors. The temperature measurement range of NTC thermistors is usually -50°C to +200°C, and the temperature measurement range of PTC thermistors is usually 0°C to +150°C, so NTC thermistors are preferably used in this embodiment.
[0059] Specifically, based on different application scenarios or different temperature measurement characteristics, there are many types of NTC thermistor structures. For scenarios requiring high sensitivity, NTC thermistors can preferably use surface mount NTC thermistors; for scenarios requiring high power, NTC thermistors can preferably use high-power NTC thermistors.
[0060] It should be known that there are many specific installation methods between the NTC thermistor and the heat conducting member 41, and the common installation methods mainly include welding, bonding and plugging. That is, the NTC thermistor is welded to the heat conducting member 41 by soldering; or the NTC thermistor is bonded to the heat conducting member 41 by glue bonding; or a corresponding slot is set on the heat conducting member 41, and the NTC thermistor is inserted into the slot for installation. The specific installation method can be selected according to the actual needs of technicians in this field.
[0061] Another aspect of the present application provides an inverter, such as Figure 1 As shown, one preferred embodiment includes a box (not shown), a PCB board 200, at least one terminal 300 and the above-mentioned terminal temperature detection device 4. The PCB board 200 is fixedly mounted on the box, and the terminal 300 is fixedly mounted on the PCB board 200 and faces and passes through the bottom plate 100 set on one side of the box. The terminal temperature detection device 4 is installed in the box and is located between the bottom plate 100 and the PCB board 200, and the terminal 300 can pass through the terminal temperature detection device 4, so that the terminal temperature detection device 4 can accurately and real-time detect the temperature of the terminal 300.
[0062] It should be noted that the specific structure and working principle of the terminal 300 and the PCB board 200 are well-known technologies to those skilled in the art, so they will not be elaborated in detail here. There are many types of terminals 300, such as MC4 DC terminals.
[0063] It should also be known that the technical solution of the present application can be applied not only to the inverter field, but also to other electrical equipment fields. It is only necessary to replace the terminal 300 in the technical solution of the present application with the corresponding component to be detected, and the fixed installation of the heat conductor 41 can be adaptively adjusted according to the actual application scenario.
[0064] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.
Claims
1. A terminal temperature detection device, characterized in that: It comprises a heat conducting member and a temperature measuring member installed on the heat conducting member; the heat conducting member is fixedly installed and spaced apart from a PCB board on which terminals are installed; a heat conducting area is arranged on the heat conducting member, and the terminal is suitable for passing through the heat conducting area and transferring heat to the heat conducting member; the temperature measuring member is located on the side of the heat conducting area and detects the temperature of the terminal.
2. The terminal temperature detection device according to claim 1, characterized in that: The heat conducting member is a plate-shaped structure, and is provided with heat conducting holes forming the heat conducting area, and the heat conducting holes are adapted to the size of the terminals.
3. The terminal temperature detection device according to claim 2, characterized in that: The heat conducting member is a copper plate.
4. The terminal temperature detection device according to claim 2, characterized in that: The PCB board is fixedly installed on the box body, and the heat conducting member is fixedly installed between the box body.
5. The terminal temperature detection device according to claim 4, characterized in that: The heat conducting member and the box body are fixedly installed by means of a snap connection or fasteners.
6. The terminal temperature detection device according to claim 2, characterized in that: The heat conducting member is fixedly installed by cooperating with the heat conducting hole and the terminal.
7. The terminal temperature detection device according to claim 6, characterized in that: The heat conducting hole and the terminal are connected by a tight sleeve, a threaded connection or a snap-fit connection to fix the heat conducting member.
8. The terminal temperature detection device according to any one of claims 1 to 7, characterized in that: The temperature measuring element adopts a thermistor.
9. The terminal temperature detection device according to claim 8, characterized in that: The temperature measuring element adopts a chip-type NTC thermistor or a high-power NTC thermistor.
10. An inverter, characterized in that: It comprises the terminal temperature detection device as described in any one of claims 1 to 9.