Circuit board convenient for immersion metal processing

Abstract

The utility model relates to the technical field of circuit boards, and particularly discloses a circuit board convenient for immersion metal processing, which comprises an inner-layer core board and outer-layer boards attached and mounted on two sides of the inner-layer core board, the inner-layer core board is connected with the two outer-layer boards through prepregs, a first through hole is formed in the upper part of the inner-layer core board, and a second through hole is formed in the lower part of the inner-layer core board. A second through hole is formed in the lower portion of the inner-layer core plate, the inner diameter of the first through hole is larger than that of the second through hole, the first through hole and the second through hole which are different in aperture are formed in the inner-layer core plate, a stepped hole is formed, the first through hole in the upper layer can form a metal layer, electronic components can be conveniently connected, and the service life of the electronic components is prolonged. And the second through hole with the inner diameter smaller than that of the first through hole is formed, so that the gold immersion liquid can permeate into the first through hole more uniformly, the exchange of the gold immersion liquid is more sufficient, metal layers attached to the through holes are more uniform, and the quality of the circuit board is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board which is convenient for gold immersion processing. Background Art

[0002] A circuit board is a basic material used to connect and support electronic components in electromechanical devices. It is a plate-like substrate made of one or more layers of insulating material, covered with conductive copper foil, and formed with conductors and connection points with specific circuit patterns through chemical processing, photolithography, etching and other processes. These circuit patterns on the circuit board connect various electronic components, such as integrated circuits, capacitors, resistors, etc., to realize the functions of electronic equipment.

[0003] The PCB immersion gold is a surface treatment process that improves the conductivity, corrosion resistance and welding performance of the PCB by plating a layer of metal on the surface of the PCB. In order to make the multi-layer PCBs conduct to each other, the existing technology usually drills holes on the PCB first, and then transfers the drilled PCB to the chemical immersion gold solution after the chemical nickel plating is completed. In this step, the chemical immersion gold solution will enter the hole, and the metal atoms will be deposited from the immersion gold solution onto the nickel layer to form a metal covering layer covering the hole.

[0004] However, when the blind hole is etched with gold, since one end of the blind hole is closed, the liquid cannot be fully exchanged, which eventually leads to an uneven metal layer attached to the through hole, affecting the quality of the circuit board. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies in the prior art, the utility model provides a circuit board that is easy to process with immersion gold, which can solve the technical problem that the immersion gold liquid on the existing circuit board is difficult to penetrate into the through hole or penetrates unevenly, which ultimately leads to an uneven metal layer attached to the through hole and affects the quality of the circuit board.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a circuit board that is convenient for immersion gold processing, comprising an inner core board and outer boards mounted on both sides of the inner core board, the inner core board and the two outer boards are connected by a semi-cured sheet, a first through hole is opened in the upper part of the inner core board, a second through hole is opened in the lower part of the inner core board, and the inner diameter of the first through hole is greater than the inner diameter of the second through hole.

[0009] Through the above technical scheme, by setting the first through hole and the second through hole of different aperture sizes on the inner core board to form a stepped hole, the first through hole located on the upper layer can form a metal layer, which is not only convenient for connecting electronic components, but also by opening the second through hole with an inner diameter smaller than the first through hole, the immersion gold liquid can penetrate into the first through hole more evenly, making the metal layer attached to the through hole more uniform, thereby ensuring the quality of the circuit board.

[0010] Furthermore, the first through hole penetrates the outer layer plate located at the upper part, connecting the outer layer plate located at the upper part with the inner core plate.

[0011] Furthermore, the second through hole penetrates the outer layer board located below, connecting the outer layer board located below with the inner core board.

[0012] Through the above technical solution, the two outer plates and the inner core plate can be connected to each other to form a usable electronic circuit.

[0013] Furthermore, both the first through hole and the second through hole are metal holes.

[0014] Through the above technical solution, the first through hole is a metal hole, which is convenient for connecting other electronic components, and the second through hole is a non-metal hole, which can be beneficial to the penetration of immersion gold liquid during the subsequent immersion gold processing and ensure the quality of immersion gold.

[0015] Furthermore, the first through hole and the second through hole are both circular holes.

[0016] Through the above technical solution, the circular hole is easier to process and the processing cost is saved.

[0017] Furthermore, a mounting seat is provided on the upper outer plate, and a mounting column is mounted on the mounting seat.

[0018] Furthermore, an internal thread groove is provided on the mounting seat, an external thread is provided on the outer wall of the mounting column, and the mounting column is threadedly connected to the internal thread groove via the external thread.

[0019] Furthermore, a conducting contact is provided at the bottom of the mounting column, and the conducting contact is electrically connected to the inner wall of the first through hole.

[0020] Through the above technical solution, electronic components can be installed on the mounting column, and the conductive contacts are connected to the first through holes as metal holes, so that the connection between the electronic components and the circuit board can be quickly completed, and the electronic components can be powered or signals can be transmitted.

[0021] Furthermore, a heat sink is provided on the top of the mounting column.

[0022] Furthermore, the number of heat sinks is set to be multiple.

[0023] Through the above technical solution, when the heat dissipation pressure of the circuit board is large, the electronic components on the mounting column can be replaced with multiple heat sinks to enhance the heat dissipation capacity of the circuit board and avoid overheating of the circuit board.

[0024] Compared with the prior art, the utility model provides a circuit board that is easy to process with immersion gold, and has the following beneficial effects:

[0025] In the utility model, a stepped hole is formed by arranging a first through hole and a second through hole of different aperture sizes on the inner core board, so that the first through hole located in the upper layer can form a metal layer, which is not only convenient for connecting electronic components, but also by opening a second through hole with an inner diameter smaller than the first through hole, the immersion gold liquid can penetrate into the first through hole more evenly, and the exchange of the immersion gold liquid is more sufficient, so that the metal layer attached to the through hole is more uniform, thereby ensuring the quality of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0027] Figure 2 It is a structural schematic diagram of the conducting contact in the utility model;

[0028] Figure 3 It is a schematic diagram of the installation method of the installation column and the installation seat in the utility model;

[0029] Figure 4 It is a schematic diagram of the structure of the heat sink in the utility model.

[0030] Among them: 1. inner core board; 2. outer board; 3. first through hole; 4. second through hole; 5. prepreg; 6. mounting seat; 7. internal thread groove; 8. mounting column; 9. external thread; 10. conducting contact; 11. heat sink. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Embodiment 1

[0033] See also Figure 1-Figure 3The utility model provides a technical solution: a circuit board that is convenient for immersion gold processing, comprising an inner core board 1 and outer boards 2 mounted on both sides of the inner core board 1, the inner core board 1 and the two outer boards 2 are connected by a semi-cured sheet 5, a first through hole 3 is opened on the upper part of the inner core board 1, a second through hole 4 is opened on the lower part of the inner core board 1, and the inner diameter of the first through hole 3 is greater than the inner diameter of the second through hole 4.

[0034] In the utility model, a stepped hole is formed by arranging a first through hole 3 and a second through hole 4 of different aperture sizes on the inner core board 1, so that the first through hole 3 located in the upper layer can form a metal layer, which is not only convenient for connecting electronic components, but also by opening the second through hole 4 with an inner diameter smaller than the first through hole 3, the immersion gold liquid can penetrate into the first through hole 3 more evenly, and the exchange of the immersion gold liquid is more sufficient, so that the metal layer attached to the through hole is more uniform, thereby ensuring the quality of the circuit board.

[0035] See also Figure 1 The first through hole 3 penetrates the upper outer layer board 2, connecting the upper outer layer board 2 with the inner core board 1. The second through hole 4 penetrates the lower outer layer board 2, connecting the lower outer layer board 2 with the inner core board 1. The two outer layer boards 2 and the inner core board 1 can be connected to each other to form a usable electronic circuit.

[0036] See also Figure 1 The first through hole 3 and the second through hole 4 are both metal holes. The first through hole 3 is a metal hole, which is convenient for connecting other electronic components, while the second through hole 4 is a non-metal hole, which can be beneficial to the penetration of the immersion gold liquid in the subsequent immersion gold processing process to ensure the quality of the immersion gold.

[0037] See also Figure 1 The first through hole 3 and the second through hole 4 are both circular holes, which are easier to process and save processing costs.

[0038] See also Figure 2-Figure 3 A mounting seat 6 is provided on the outer layer plate 2 located at the top, and a mounting column 8 is installed on the mounting seat 6. An internal thread groove 7 is opened on the mounting seat 6, and an external thread 9 is provided on the outer wall of the mounting column 8. The mounting column 8 is threadedly connected to the internal thread groove 7 through the external thread 9. A conducting contact 10 is provided at the bottom of the mounting column 8, and the conducting contact 10 is electrically connected to the inner wall of the first through hole 3.

[0039] It should be noted that electronic components, such as cameras, sensors and other components, can be installed on the mounting column 8, and the conductive contact 10 is connected to the first through hole 3 which serves as a metal hole, so that the connection between the electronic components and the circuit board can be quickly completed, and these electronic components can be powered or signals can be transmitted.

[0040] Embodiment 2

[0041] See also Figure 4 The difference between this embodiment and the first embodiment is that a heat sink 11 is provided on the top of the mounting column 8, and the number of the heat sink 11 is set to be multiple.

[0042] Through the above technical solution, when the heat dissipation pressure of the circuit board is relatively large, the electronic components on the mounting column 8 can be replaced with a plurality of heat sinks 11 to enhance the heat dissipation capacity of the circuit board and avoid overheating of the circuit board.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board that is easy to process with immersion gold, comprising an inner core board (1) and outer boards (2) mounted on both sides of the inner core board (1), characterized in that: The inner core plate (1) and the two outer plates (2) are connected via a semi-cured sheet (5); a first through hole (3) is provided at the upper portion of the inner core plate (1); a second through hole (4) is provided at the lower portion of the inner core plate (1); and the inner diameter of the first through hole (3) is greater than the inner diameter of the second through hole (4).

2. A circuit board that is easy to process with immersion gold according to claim 1, characterized in that: The first through hole (3) penetrates the outer layer plate (2) located at the top, connecting the outer layer plate (2) located at the top with the inner core plate (1).

3. A circuit board that is easy to process with immersion gold according to claim 2, characterized in that: The second through hole (4) penetrates the outer layer plate (2) located below, connecting the outer layer plate (2) located below with the inner core plate (1).

4. A circuit board that is easy to process with immersion gold according to claim 1, characterized in that: The first through hole (3) and the second through hole (4) are both metal holes.

5. A circuit board that is easy to process with immersion gold according to claim 1, characterized in that: The first through hole (3) and the second through hole (4) are both circular holes.

6. A circuit board that is easy to process with immersion gold according to claim 1, characterized in that: A mounting seat (6) is provided on the outer layer plate (2) located at the top, and a mounting column (8) is mounted on the mounting seat (6).

7. A circuit board that is easy to process with immersion gold according to claim 6, characterized in that: The mounting seat (6) is provided with an internal thread groove (7), the outer wall of the mounting column (8) is provided with an external thread (9), and the mounting column (8) is threadedly connected to the internal thread groove (7) via the external thread (9).

8. A circuit board that is convenient for immersion gold processing according to claim 7, characterized in that: A conducting contact (10) is provided at the bottom of the mounting column (8), and the conducting contact (10) is electrically connected to the inner wall of the first through hole (3).

9. A circuit board that is convenient for immersion gold processing according to claim 8, characterized in that: A heat sink (11) is provided on the top of the mounting column (8).

10. A circuit board that is convenient for immersion gold processing according to claim 9, characterized in that: The number of the heat sinks (11) is set to be multiple.

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