Multi-layer pressing device for circuit board processing

Abstract

The utility model relates to the technical field of circuit board processing equipment, in particular to a multilayer pressing device for circuit board processing, which comprises a mounting table, and a pressing mechanism, an ejection mechanism, a pushing mechanism and a collecting mechanism which are arranged on the mounting table, a discharging port is formed in one side of the mounting table, the downward pressing mechanism is arranged on the mounting table, the ejection mechanism is arranged at the bottom of the mounting table, the pushing mechanism is arranged on the side, away from the discharging port, of the mounting table, and the collecting mechanism is arranged at the discharging port formed in the mounting table. According to the circuit board press-fit device, the press-fit circuit board can be automatically jacked to the discharging port from the press-fit groove formed in the mounting table, the circuit board is pushed out of the discharging port of the mounting table through the arrangement of the pushing mechanism, then the press-fit circuit board is collected through the collecting mechanism, the device has the automatic material taking function, manual material taking is not needed, and the production efficiency is improved. The workload of workers is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing equipment, in particular to a multi-layer pressing device for circuit board processing. Background Art

[0002] In the production process of circuit boards, multi-layer lamination is a necessary step, because each layer in a multi-layer board is made of resin and other materials, which will change under the action of heat and pressure. The molecular structure of the resin will change from loose to tight, resulting in dimensional deformation, and the difference in shrinkage rate of different layers may cause the board to warp. Therefore, through multi-layer lamination, these changes can be controlled, deformation and warping can be reduced, and the quality of the circuit board can be guaranteed.

[0003] The Chinese patent CN218301801U discloses a mounting platform, mounting blocks are fixedly provided on both sides of the top of the mounting platform, pressing components are provided on the tops of the two mounting blocks, the pressing components include two slide bars, a fixing plate, an electric cylinder, a mounting hole and an extrusion mechanism, the two slide bars are respectively fixedly provided on the tops of the two mounting blocks, fixing plates are fixedly provided on the tops of the two slide bars, and mounting holes are provided on the tops of the fixing plates. The beneficial effects of the utility model are as follows: by designing the mutual cooperation between the slide bar and the slider, the telescopic end of the electric cylinder drives the extrusion mechanism to move downward and is not easy to deviate, by designing the mutual cooperation between the two support blocks and the metal pressing plate, the contact area is increased and the force is more uniform, and the metal pressing plate is heated by the heating tube, which is more conducive to the pressing of multiple circuit boards coated with an adhesive layer and is not easy to fall off.

[0004] After the equipment in the above-mentioned comparative document completes the multi-layer lamination of the circuit board, it still needs to be manually removed. This not only increases the workload of the workers, but also the workers will feel a certain degree of fatigue after a long period of manual material removal, resulting in a slower material removal speed. When the material removal of the circuit board that has completed the lamination on the equipment becomes slower, it will affect the equipment's next multi-layer lamination process of the circuit board, thereby reducing production efficiency. Utility Model Content

[0005] In view of the above problems, a multi-layer lamination device for circuit board processing is provided. After completing the multi-layer lamination processing of the circuit board, the device can automatically remove the circuit boards in the lamination area and collect them, without the need for manual material removal, thereby improving the production efficiency of the device.

[0006] In order to solve the problems of the prior art, the utility model provides a multi-layer pressing device for processing circuit boards, comprising a mounting platform and a pressing mechanism, an ejecting mechanism, a pushing mechanism and a collecting mechanism arranged on the mounting platform; a pressing groove for placing the circuit board is opened in the middle of the mounting platform, and a discharge port is opened on one side of the mounting platform; the pressing mechanism is arranged on the mounting platform; the ejecting mechanism is arranged on the bottom of the mounting platform, and the working end of the ejecting mechanism passes through the bottom of the mounting platform and extends upward into the pressing groove; the pushing mechanism is arranged on a side of the mounting platform away from the discharge port; and the collecting mechanism is arranged at the discharge port opened on the mounting platform.

[0007] Preferably, two symmetrically arranged limit grooves are provided on both sides of the pressing groove opened by the mounting platform, and the ejection mechanism includes a top plate, a lifting member and a buffer member; the top plate is horizontally arranged at the bottom of the pressing groove; the lifting member is arranged below the mounting platform, and the lifting end of the lifting member extends upward through the mounting platform into the pressing groove, and the lifting end of the lifting member is abutted against the bottom of the top plate; the number of buffer members is the same as the number of limit grooves and corresponds one to one, and is arranged in the limit grooves opened in the pressing groove, and the buffer member is connected to the side of the top plate.

[0008] Preferably, a rectangular groove that passes through the mounting platform is opened at the bottom of the pressing groove, and the lifting member includes a bottom plate, a lifting cylinder, a lifting rod and an abutment plate; the bottom plate is arranged at the bottom of the mounting platform; the lifting cylinder is arranged on the bottom plate, and the output end of the lifting cylinder is arranged upward; the lifting rod is coaxially fixed at the output end of the lifting cylinder, and one end of the lifting rod away from the lifting cylinder extends into the rectangular groove; the abutment plate is arranged in the rectangular groove, one end of the abutment plate is fixedly connected to the end of the lifting rod away from the lifting cylinder, and the other end of the abutment plate is abutted against the bottom of the top plate.

[0009] Preferably, the buffer component includes a first limit rod, a limit block, a sealing portion and a buffer spring; the first limit rod is vertically arranged in a limit groove formed by the pressing groove; a through hole is formed on the limit block for the first limit rod to pass through, the limit block is arranged in the limit groove, and one side of the limit block is connected to one side of the top plate; the sealing portion is arranged on the mounting table, the top of the limit groove is completely covered by the sealing portion, and the top of the first limit rod is abutted against the bottom of the sealing portion; the buffer spring is sleeved on the outside of the first limit rod, and the buffer spring is located between the limit block and the sealing portion.

[0010] Preferably, a threaded hole for inserting the first limiting rod is formed at the bottom of the limiting groove, and an external thread is formed on the outside of one end of the bottom of the first limiting rod.

[0011] Preferably, the sealing portion includes a cover plate and fixing screws; the cover plate is arranged on one side of the pressing groove; there are a plurality of fixing screws, and the cover plate is fixed on the mounting platform by the fixing screws.

[0012] Preferably, a mounting groove is opened on the side of the mounting platform away from the discharge port, and the pushing mechanism includes an electric push rod, a push plate and a second limit rod; the electric push rod is arranged in the mounting groove, and the output end of the electric push rod is arranged in the direction of the pressing groove; the push plate is arranged at the output end of the electric push plate and the electric push rod; the second limit rod has two symmetrically arranged on the side of the push plate close to the electric push rod, and the end of the second limit rod away from the push plate passes through the mounting groove and extends outward.

[0013] Preferably, the collecting mechanism comprises a mounting plate and a collecting box; the mounting plate is arranged outside the mounting platform, and the mounting plate is located below the discharge port; and the collecting box is placed on the mounting plate.

[0014] Compared with the prior art, the utility model has the following beneficial effects: the present application can automatically push the pressed circuit board from the pressing groove opened by the mounting table to the discharge port through the setting of the ejection mechanism, push the circuit board out of the discharge port of the mounting table through the setting of the pushing mechanism, and then collect the pressed circuit board through the collecting mechanism. The device has the function of automatic material taking, and does not need manual material taking, thereby reducing the workload of workers. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The present invention is a schematic diagram of the overall structure of a multi-layer pressing device for processing circuit boards.

[0016] Figure 2 A schematic diagram of the partial structure of a multi-layer lamination device for circuit board processing Figure 1

[0017] Figure 3 A schematic diagram of the partial structure of a multi-layer lamination device for circuit board processing Figure 2 .

[0018] Figure 4 The present invention is a partial structural internal cross-sectional view of a multi-layer pressing device for circuit board processing.

[0019] Figure 5 This application Figure 3 A partial enlarged view of point A in the middle.

[0020] Figure 6 A schematic diagram of the partial structure of a multi-layer lamination device for circuit board processing Figure 3 .

[0021] Figure 7 This application Figure 5 A partial enlarged view of point B in the middle.

[0022] The numbers in the figure are: 1. mounting table; 11. pressing groove; 111. rectangular groove; 12. limiting groove; 121. threaded hole; 13. discharge port; 14. mounting groove; 2. pressing mechanism; 3. ejection mechanism; 31. top plate; 32. lifting member; 321. bottom plate; 322. lifting cylinder; 323. lifting rod; 324. abutment plate; 33. buffer member; 331. first limiting rod; 3311. external thread; 332. limiting block; 3321. through hole; 333. sealing part; 3331. cover plate; 3332. fixing screw; 334. buffer spring; 4. pushing mechanism; 41. electric push rod; 42. pushing plate; 43. second limiting rod; 5. collecting mechanism; 51. mounting plate; 52. collecting box. DETAILED DESCRIPTION

[0023] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0024] See also Figures 1 to 7 As shown, a multi-layer pressing device for processing a circuit board includes a mounting table 1 and a pressing mechanism 2, an ejecting mechanism 3, a pushing mechanism 4 and a collecting mechanism 5 arranged on the mounting table 1; a pressing groove 11 for placing the circuit board is opened in the middle of the mounting table 1, and a discharge port 13 is opened on one side of the mounting table 1; the pressing mechanism 2 is arranged on the mounting table 1; the ejecting mechanism 3 is arranged at the bottom of the mounting table 1, and the working end of the ejecting mechanism 3 passes through the bottom of the mounting table 1 and extends upward into the pressing groove 11; the pushing mechanism 4 is arranged on the side of the mounting table 1 away from the discharge port 13; and the collecting mechanism 5 is arranged at the discharge port 13 opened on the mounting table 1.

[0025] When the device is needed, first, multiple circuit boards are placed in sequence in the pressing grooves 11 opened on the mounting table 1, and then the pressing mechanism 2 is started to press the multiple circuit boards in the pressing grooves 11. The pressing mechanism 2 is an existing pressing device and does not fall within the scope of protection of the present application, so there is no need to explain it in detail in the text. When the pressing of multiple circuit boards in the pressing grooves 11 is completed, the ejection mechanism 3 is started to push the multi-layer circuit board attached to the bottom of the pressing grooves 11 upward, so that the bonding between the multi-layer circuit board and the bottom of the pressing grooves 11 is separated. When the multi-layer circuit board is pushed upward to a specified height, the multi-layer circuit board that has been pressed will be located at the mounting table. The discharge port 13 opened on the mounting table 1 is then opened, and the pushing mechanism 4 is started to push the multi-layer circuit board that has completed the pressing in the pressing groove 11 outward from the discharge port 13 opened on the mounting table 1, and then the multi-layer circuit board coming out of the discharge port 13 is collected by the collecting mechanism 5. Through the cooperation of the ejecting mechanism 3, the pushing mechanism 4 and the collecting mechanism 5, the circuit board is automatically taken out of the pressing groove 11 after completing the multi-layer pressing, and there is no need to manually take out the circuit board that has completed the multi-layer pressing, which improves the degree of automation of the device and reduces the workload of the staff. Compared with manual material taking, the device realizes the automatic material taking function and improves production efficiency.

[0026] See also Figure 2 and Figure 3 As shown, two symmetrically arranged limit grooves 12 are arranged on both sides of the pressing groove 11 opened by the mounting platform 1, and the ejection mechanism 3 includes a top plate 31, a lifting member 32 and a buffer member 33; the top plate 31 is horizontally arranged at the bottom of the pressing groove 11; the lifting member 32 is arranged below the mounting platform 1, and the lifting end of the lifting member 32 passes through the mounting platform 1 and extends upward into the pressing groove 11, and the lifting end of the lifting member 32 is abutted against the bottom of the top plate 31; the number of buffer members 33 is the same as the number of limit grooves 12 and corresponds one to one, and is arranged in the limit grooves 12 opened in the pressing groove 11, and the buffer member 33 is connected to the side of the top plate 31.

[0027] When the circuit board has completed multi-layer lamination in the lamination groove 11 opened on the mounting table 1, the lifting member 32 is started to drive the top plate 31 to move upward from the bottom of the lamination groove 11, and the circuit board that has completed lamination in the lamination groove 11 is driven to move upward synchronously. When the circuit board that has completed lamination moves upward to the height of the discharge port 13 opened on the designated mounting table 1, the lifting member 32 will stop rising, so that the circuit board that has completed lamination is pushed to the discharge port 13 by the pushing mechanism 4, so that the device can realize the automatic material taking function. Two symmetrical limit grooves 12 are provided to facilitate installation of the buffer members 33 in the corresponding limit grooves 12. Through the cooperation of a plurality of buffer members 33, a certain impact force can be relieved when the top plate 31 moves upward to the limit stroke, thereby protecting the top plate 31. At the same time, through the cooperation of a plurality of buffer members 33, the top plate 31 can be ensured to be always in a horizontal state during the lifting process, preventing the top plate 31 from deviating in position during the lifting process, thereby causing the position of the pressed circuit board to deviate, affecting the pushing effect of the pushing mechanism 4.

[0028] See also Figure 4 As shown, a rectangular groove 111 penetrating the mounting platform 1 is provided at the bottom of the pressing groove 11, and the lifting member 32 includes a bottom plate 321, a lifting cylinder 322, a lifting rod 323 and an abutment plate 324; the bottom plate 321 is arranged at the bottom of the mounting platform 1; the lifting cylinder 322 is arranged on the bottom plate 321, and the output end of the lifting cylinder 322 is arranged upward; the lifting rod 323 is coaxially fixedly arranged at the output end of the lifting cylinder 322, and one end of the lifting rod 323 away from the lifting cylinder 322 extends into the rectangular groove 111; the abutment plate 324 is arranged in the rectangular groove 111, one end of the abutment plate 324 is fixedly connected to the end of the lifting rod 323 away from the lifting cylinder 322, and the other end of the abutment plate 324 is abutted against the bottom of the top plate 31.

[0029] By starting the lifting cylinder 322, the lifting rod 323 is driven to lift in the rectangular groove 111, and the top plate 31 in the pressing groove 11 is connected to the lifting rod 323 through the setting of the abutment plate 324. When the lifting rod 323 drives the abutment plate 324 to lift in the rectangular groove 111, it will synchronously drive the top plate 31 to lift in the pressing groove 11, thereby pushing the pressed circuit board in the pressing groove 11 upward.

[0030] See also Figure 4 and Figure 5As shown, the buffer member 33 includes a first limiting rod 331, a limiting block 332, a sealing portion 333 and a buffer spring 334; the first limiting rod 331 is vertically arranged in the limiting groove 12 opened by the pressing groove 11; the limiting block 332 is provided with a through hole 3321 for the first limiting rod 331 to pass through, the limiting block 332 is arranged in the limiting groove 12, and one side of the limiting block 332 is connected to one side of the top plate 31; the sealing portion 333 is arranged on the mounting platform 1, and the top of the limiting groove 12 is completely covered by the sealing portion 333, and the top of the first limiting rod 331 is abutted against the bottom of the sealing portion 333; the buffer spring 334 is sleeved on the outside of the first limiting rod 331, and the buffer spring 334 is located between the limiting block 332 and the sealing portion 333.

[0031] The first limit rod 331 cooperates with the limit block 332 to ensure that the horizontal plane of the top plate 31 will not be offset when it is raised or lowered in the pressing groove 11. The sealing portion 333 is provided to cover the top opening of the limit groove 12, thereby preventing the limit block 332 from detaching from the top of the first limit rod 331. The buffer spring 334 is provided to enable the top plate 31 to move synchronously with the limit block 332 when it moves upward, thereby avoiding the limit block 332 from colliding with the bottom of the sealing portion 333. At the same time, the elastic force of the squeezed buffer spring 334 itself can drive the limit block 332 to automatically reset, thereby driving the top plate 31 to automatically return to the bottom of the pressing groove 11.

[0032] See also Figure 7 As shown, a threaded hole 121 for inserting the first limiting rod 331 is formed at the bottom of the limiting groove 12 , and an external thread 3311 is formed at the outside of one end of the bottom of the first limiting rod 331 .

[0033] The first limiting rod 331 can be quickly fixed in the limiting groove 12 by the cooperation of the external thread 3311 provided on the outside of one end of the first limiting rod 331 and the threaded hole 121 provided at the bottom of the limiting groove 12 .

[0034] See also Figure 6 As shown, the sealing portion 333 includes a cover plate 3331 and fixing screws 3332 ; the cover plate 3331 is arranged on one side of the pressing groove 11 ; there are a plurality of fixing screws 3332 , and the cover plate 3331 is fixed on the mounting platform 1 by the fixing screws 3332 .

[0035] By disposing the cover plate 3331 , the top of the limiting groove 12 opened in the pressing groove 11 is completely covered to prevent the top plate 31 from driving the buffer member 33 out of the limiting groove 12 when moving upward.

[0036] See also Figure 6As shown, a mounting groove 14 is opened on the side of the mounting table 1 away from the discharge port 13, and the pushing mechanism 4 includes an electric push rod 41, a push plate 42 and a second limiting rod 43; the electric push rod 41 is arranged in the mounting groove 14, and the output end of the electric push rod 41 is arranged in the direction of the pressing groove 11; the push plate 42 is arranged at the output end of the electric push plate 42 and the electric push rod 41; the second limiting rod 43 has two symmetrically arranged on one side of the push plate 42 close to the electric push rod 41, and the end of the second limiting rod 43 away from the push plate 42 passes through the mounting groove 14 and extends outward.

[0037] When the pressed circuit board is pushed to the same height as the discharge port 13 opened on the mounting table 1, the electric push rod 41 is started to drive the push plate 42 to move toward the pressing groove 11. Through the movement of the push plate 42, the pressed circuit board in the pressing groove 11 is pushed into the discharge port 13, so that the circuit board automatically comes out of the discharge port 13. The position of the push plate 42 is limited by the setting of two second limit rods 43 to prevent the push plate 42 from shifting during the movement.

[0038] See also Figure 3 As shown, the collecting mechanism 5 includes a mounting plate 51 and a collecting box 52 ; the mounting plate 51 is arranged outside the mounting platform 1 , and the mounting plate 51 is located below the discharge port 13 ; the collecting box 52 is placed on the mounting plate 51 .

[0039] By disposing the mounting plate 51 , the collecting box 52 can be placed on one side of the mounting table 1 , and the circuit boards coming out of the discharge port 13 can be collected in a centralized manner.

[0040] The above embodiments only express one or several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the attached claims.

Claims

1. A multi-layer lamination device for circuit board processing, characterized in that: It comprises a mounting platform (1) and a pressing mechanism (2), an ejecting mechanism (3), a pushing mechanism (4) and a collecting mechanism (5) arranged on the mounting platform (1); A pressing groove (11) for placing a circuit board is provided in the middle of the mounting platform (1), and a discharge port (13) is provided on one side of the mounting platform (1); The pressing mechanism (2) is arranged on the mounting platform (1); The ejection mechanism (3) is arranged at the bottom of the mounting platform (1), and the working end of the ejection mechanism (3) passes through the bottom of the mounting platform (1) and extends upward into the pressing groove (11); The pushing mechanism (4) is arranged on a side of the mounting platform (1) away from the discharge port (13); The collecting mechanism (5) is arranged at the discharge port (13) opened on the mounting platform (1).

2. A multi-layer pressing device for circuit board processing according to claim 1, characterized in that: Two symmetrically arranged limit grooves (12) are provided on both sides of the pressing groove (11) provided on the mounting platform (1); the ejection mechanism (3) comprises a top plate (31), a lifting member (32) and a buffer member (33); The top plate (31) is horizontally arranged at the bottom of the pressing groove (11); The lifting member (32) is arranged below the mounting platform (1), the lifting end of the lifting member (32) passes through the mounting platform (1) and extends upward into the pressing groove (11), and the lifting end of the lifting member (32) is arranged to abut against the bottom of the top plate (31); The number of the buffer members (33) is the same as the number of the limiting grooves (12) and corresponds one to one. The buffer members (33) are arranged in the limiting grooves (12) opened by the pressing groove (11). The buffer members (33) are connected to the side surfaces of the top plate (31).

3. A multi-layer pressing device for circuit board processing according to claim 2, characterized in that: A rectangular groove (111) penetrating the mounting platform (1) is provided at the bottom of the pressing groove (11); the lifting member (32) comprises a bottom plate (321), a lifting cylinder (322), a lifting rod (323) and an abutting plate (324); The bottom plate (321) is arranged at the bottom of the mounting platform (1); The lifting cylinder (322) is arranged on the bottom plate (321), and the output end of the lifting cylinder (322) is arranged upward; The lifting rod (323) is coaxially fixedly arranged at the output end of the lifting cylinder (322), and one end of the lifting rod (323) away from the lifting cylinder (322) extends into the rectangular groove (111); The abutment plate (324) is arranged in the rectangular groove (111), one end of the abutment plate (324) is fixedly connected to the end of the lifting rod (323) away from the lifting cylinder (322), and the other end of the abutment plate (324) is arranged to abut against the bottom of the top plate (31).

4. A multi-layer pressing device for circuit board processing according to claim 2, characterized in that: The buffer member (33) comprises a first limiting rod (331), a limiting block (332), a sealing portion (333) and a buffer spring (334); The first limiting rod (331) is vertically arranged in a limiting groove (12) opened by the pressing groove (11); The limiting block (332) is provided with a through hole (3321) for the first limiting rod (331) to pass through, the limiting block (332) is arranged in the limiting groove (12), and one side of the limiting block (332) is connected to one side of the top plate (31); The sealing portion (333) is arranged on the mounting platform (1), and the top of the limiting groove (12) is completely covered by the sealing portion (333), and the top of the first limiting rod (331) is arranged in contact with the bottom of the sealing portion (333); The buffer spring (334) is sleeved on the outside of the first limiting rod (331), and the buffer spring (334) is located between the limiting block (332) and the sealing portion (333).

5. A multi-layer pressing device for circuit board processing according to claim 4, characterized in that: A threaded hole (121) for inserting the first limiting rod (331) is provided at the bottom of the limiting groove (12), and an external thread (3311) is provided on the outside of one end of the bottom of the first limiting rod (331).

6. A multi-layer pressing device for circuit board processing according to claim 4, characterized in that: The sealing portion (333) includes a cover plate (3331) and fixing screws (3332); The cover plate (3331) is arranged on one side of the pressing groove (11); There are a plurality of fixing screws (3332), and the cover plate (3331) is fixed on the mounting platform (1) by the fixing screws (3332).

7. A multi-layer pressing device for circuit board processing according to claim 1, characterized in that: A mounting groove (14) is provided on a side of the mounting platform (1) away from the material discharge port (13), and the pushing mechanism (4) comprises an electric push rod (41), a push plate (42) and a second limit rod (43); The electric push rod (41) is arranged in the installation groove (14), and the output end of the electric push rod (41) is arranged in the direction of the pressing groove (11); The push plate (42) is arranged at the output end of the electric push plate (42) and the electric push rod (41); The second limiting rod (43) has two symmetrically arranged on one side of the push plate (42) close to the electric push rod (41), and one end of the second limiting rod (43) away from the push plate (42) passes through the installation slot (14) and extends outward.

8. The multi-layer pressing device for processing a circuit board according to claim 1, characterized in that: The collecting mechanism (5) comprises a mounting plate (51) and a collecting box (52); The mounting plate (51) is arranged outside the mounting platform (1), and the mounting plate (51) is located below the discharge port (13); The collection box (52) is placed on the mounting plate (51).

Images