High-temperature-resistant PCB (Printed Circuit Board)

Abstract

The utility model discloses a high temperature resistant PCB circuit board, which comprises a circuit board main body, the circuit board main body comprises a CPU module, a power connection module, an electronic component 7, a capacitor and a card insertion module, the CPU module is electrically connected to the center position of the top of the circuit board main body, and the electronic component 7 and the capacitor are electrically connected to the two sides of the top of the circuit board main body far away from the CPU module. The power connection module and the card insertion module are electrically connected to the side, away from the electronic element 7, of the top of the circuit board body, the bottom of the circuit board body is fixedly connected with a cold conduction plate, the bottom of the cold conduction plate is fixedly connected with a refrigeration plate, the inner side of the bottom of the refrigeration plate is fixedly connected with a semiconductor refrigeration sheet, and the bottom of the refrigeration plate is fixedly connected with a heat dissipation box. Through the arrangement of the refrigeration plate, the semiconductor refrigeration sheet and the cold conduction plate, heat emitted by the circuit board main body can be quickly absorbed, so that the PCB can be ensured to be at a relatively low temperature, and the PCB has a high-temperature-resistant effect.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high-temperature resistant PCB circuit board. Background Art

[0002] PCB circuit board is also called printed circuit board or printed circuit board. Multilayer printed circuit board refers to a printed circuit board with more than two layers. It is composed of connecting wires on several layers of insulating substrate and pads for assembling and welding electronic components 7. It has the function of conducting each layer of circuit and insulating each other.

[0003] The patent document with the prior art publication number CN217825473U provides a high temperature resistant PCB circuit board, including a circuit board body, the four corners of the bottom of the circuit board body are fixedly connected with heightening columns, the bottom of the circuit board body is fixedly connected with a high temperature resistant layer 1, the top of the circuit board body is fixedly connected with a high temperature resistant layer 2, the surface of the heightening columns is sleeved with a heat conducting plate, the top of the heat conducting plate is provided with thermal conductive silicone grease, and the top of the thermal conductive silicone grease contacts the bottom of the circuit board body. The utility model is used in coordination with the circuit board body, heightening columns, high temperature resistant layer 1, high temperature resistant layer 2, heat conducting plate, thermal conductive silicone grease, ring sleeve, sealing ring, fixing sleeve, heat sink group and micro cooling fan, so as to have the advantage of good high temperature resistance, solve the problem that the traditional PCB circuit board has a single structure, poor high temperature resistance, and is easily damaged when used in a high temperature environment, resulting in a low service life of the PCB circuit board.

[0004] However, during the use of the existing PCB circuit board, since a large number of electronic components 7 are installed on the PCB circuit board, and during the operation of the PCB circuit board, these electronic components 7 will generate heat, resulting in a relatively high temperature of the PCB circuit board. However, when the high temperature is generated, most of them use a cooling fan to dissipate the heat, which cannot effectively cool the overall temperature of the PCB circuit board, resulting in the temperature of the PCB circuit board being continuously maintained at a certain high temperature, resulting in the problem that the high temperature resistance of the PCB circuit board is poor. For this reason, we propose a high temperature resistant PCB circuit board. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies in the prior art, the utility model provides a high temperature resistant PCB circuit board to solve the problems raised in the above background technology.

[0007] (II) Technical solution

[0008] To achieve the above purpose, the utility model is implemented through the following technical solutions: a high temperature resistant PCB circuit board, including a circuit board body, the circuit board body including a CPU module, a power connection module, an electronic component 7, a capacitor and a card module, the CPU module is electrically connected to the top center position of the circuit board body, the electronic component 7 and the capacitor are electrically connected to the two sides of the top of the circuit board body away from the CPU module, the power connection module and the card module are electrically connected to the side of the top of the circuit board body away from the electronic component 7, the bottom of the circuit board body is fixedly connected with a cold conduction plate, the bottom of the cold conduction plate is fixedly connected with a refrigeration plate, the inner side of the bottom of the refrigeration plate is fixedly connected with a semiconductor refrigeration sheet, and the bottom of the refrigeration plate is fixedly connected with a heat dissipation box.

[0009] Preferably, mounting studs are movably connected through the four corners of the top of the circuit board body, and the mounting studs penetrate the cold conduction plate and the heat dissipation box.

[0010] Preferably, the four corners of the bottom of the heat dissipation box are fixedly connected with limiting rods, and the bottom ends of the limiting rods are fixedly connected with floor mats.

[0011] Preferably, the floor mat is made of rubber material and is in the shape of a disc.

[0012] Preferably, the cooling plate is made of aluminum material, and the outer surface of the cooling plate is smooth.

[0013] Preferably, a cooling fan is fixedly connected to the inner side of the heat dissipation box, and four heat dissipation boxes are provided, and the four heat dissipation boxes are the same in size.

[0014] (III) Beneficial effects

[0015] The utility model provides a high temperature resistant PCB circuit board, which has the following beneficial effects:

[0016] (1) This high-temperature resistant PCB circuit board, through the provision of a refrigeration plate, a semiconductor refrigeration sheet and a cold conduction plate, when the PCB circuit board is in use, when the electronic component 7 on the PCB circuit board emits heat, the semiconductor refrigeration sheet on the refrigeration plate will start to operate, and the refrigeration surface of the semiconductor refrigeration sheet will begin to generate low temperature, which will act on the cold conduction plate, and the cold conduction plate will transfer the low temperature to the circuit board body, and the low temperature will absorb the heat, thereby cooling the circuit board body, so that the heat emitted by the circuit board body can be quickly absorbed, thereby ensuring that the PCB circuit board can be at a lower temperature, and thus the PCB circuit board has a high-temperature resistant effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a partial structural schematic diagram of the main body of the circuit board of the utility model;

[0019] Figure 3 It is a partial structural schematic diagram of the cold conduction plate of the utility model;

[0020] Figure 4 It is a cross-sectional view of the refrigeration plate of the utility model.

[0021] In the figure: 1. Refrigeration plate; 101. Semiconductor refrigeration plate; 2. Cold conduction plate; 3. Circuit board body; 4. Mounting studs; 5. CPU module; 6. Power connection module; 7. Electronic component 7; 8. Capacitor; 9. Card module; 10. Limit rod; 11. Floor mat; 12. Heat sink; 13. Cooling fan. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-4 The utility model provides a technical solution: a high temperature resistant PCB circuit board, including a circuit board body 3, the circuit board body 3 includes a CPU module 5, a power connection module 6, an electronic component 7, a capacitor 8 and a card module 9, the CPU module 5 is electrically connected to the top center position of the circuit board body 3, the electronic component 7 and the capacitor 8 are electrically connected to the top of the circuit board body 3 on both sides away from the CPU module 5, the power connection module 6 and the card module 9 are electrically connected to the top of the circuit board body 3 on one side away from the electronic component 7, the bottom of the circuit board body 3 is fixedly connected with a cold conduction plate 2, the bottom of the cold conduction plate 2 is fixedly connected with a refrigeration plate 1, the bottom inner side of the refrigeration plate 1 is fixedly connected with a semiconductor refrigeration sheet 101, and the bottom of the refrigeration plate 1 is fixedly connected with a heat dissipation box 12.

[0024] In the present embodiment, specifically, the top four corners of the circuit board body 3 are movably connected with mounting studs 4, and the mounting studs 4 pass through the cold conduction plate 2 and the heat dissipation box 12. The mounting studs 4 enable the PCB circuit board to be firmly fixed to the device.

[0025] In the present embodiment, specifically, the four corners of the bottom of the heat dissipation box 12 are fixedly connected with limiting rods 10, and the bottom end of the limiting rods 10 is fixedly connected with a ground pad 11. Through the limiting rods 10, after the circuit board body 3 is installed, there is a certain gap between the bottom of the PCB circuit board and the device.

[0026] In this embodiment, specifically, the floor mat 11 is made of rubber material, and the floor mat 11 is in a disc shape. The floor mat 11 made of rubber material can buffer vibrations, thereby achieving a vibration reduction effect.

[0027] In this embodiment, specifically, the cold conduction plate 2 is made of aluminum material, and the outer surface of the cold conduction plate 2 is smooth. The cold conduction plate 2 made of aluminum material can apply low temperature to the circuit board body 3 to cool and dissipate heat.

[0028] In the present embodiment, specifically, a heat dissipation fan 13 is fixedly connected to the inner side of the heat dissipation box 12, and four heat dissipation boxes 12 are provided. The four heat dissipation boxes 12 are of the same size. When the electronic components 7 on the PCB circuit board emit heat, the semiconductor refrigeration sheet 101 on the refrigeration plate 1 will start to operate, and the heating surface on the semiconductor refrigeration sheet 101 emits heat. At the same time, the heat dissipation fan 13 on the heat dissipation box 12 will absorb and diffuse the heat when it is running.

[0029] Working principle: After the utility model is installed, first check the installation and safety protection of the utility model. When using the PCB circuit board, when the electronic components 7 on the PCB circuit board emit heat, the semiconductor refrigeration plate 101 on the refrigeration plate 1 will start to operate, and the heating surface of the semiconductor refrigeration plate 101 emits heat. At the same time, the heat dissipation fan 13 on the heat dissipation box 12 will absorb and diffuse the heat, and the cooling surface of the semiconductor refrigeration plate 101 will begin to generate low temperature, and the low temperature will act on the cold conduction plate 2, and the cold conduction plate 2 will transfer the low temperature to the circuit board body 3. At this time, the low temperature will absorb heat, thereby cooling the circuit board body 3, so that the heat emitted by the circuit board body 3 can be quickly absorbed, thereby ensuring that the PCB circuit board can be at a lower temperature, thus completing the use process of the utility model. The utility model has a simple structure and is safe and convenient to use.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A high temperature resistant PCB circuit board, comprising a circuit board body (3), characterized in that: The circuit board body (3) comprises a CPU module (5), a power connection module (6), an electronic component 7 (7), a capacitor (8) and a card module (9); the CPU module (5) is electrically connected to the top center of the circuit board body (3); the electronic component 7 (7) and the capacitor (8) are electrically connected to the top of the circuit board body (3) on both sides away from the CPU module (5); the power connection module (6) and the card module (9) are electrically connected to the top of the circuit board body (3) on one side away from the electronic component 7 (7); the bottom of the circuit board body (3) is fixedly connected to a cooling plate (2); the bottom of the cooling plate (2) is fixedly connected to a refrigeration plate (1); the inner side of the bottom of the refrigeration plate (1) is fixedly connected to a semiconductor refrigeration sheet (101); and the bottom of the refrigeration plate (1) is fixedly connected to a heat dissipation box (12).

2. A high temperature resistant PCB circuit board according to claim 1, characterized in that: The four corners of the top of the circuit board body (3) are movably connected with mounting studs (4), and the mounting studs (4) penetrate the cold conduction plate (2) and the heat dissipation box (12).

3. The high temperature resistant PCB circuit board according to claim 1, characterized in that: The four corners of the bottom of the heat dissipation box (12) are fixedly connected to limiting rods (10), and the bottom end of the limiting rod (10) is fixedly connected to a floor mat (11).

4. A high temperature resistant PCB circuit board according to claim 3, characterized in that: The floor mat (11) is made of rubber material and is in the shape of a disc.

5. The high temperature resistant PCB circuit board according to claim 1, characterized in that: The cooling plate (2) is made of aluminum material, and the outer surface of the cooling plate (2) is smooth.

6. The high temperature resistant PCB circuit board according to claim 1, characterized in that: A cooling fan (13) is fixedly connected to the inner side of the heat dissipation box (12), and four heat dissipation boxes (12) are provided, and the four heat dissipation boxes (12) are of the same size.

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