Terminal and vehicle

Abstract

The utility model relates to a terminal and a vehicle, and the terminal comprises a terminal module which comprises a mainboard and a module main body, and the mainboard is installed on the module main body; the heat conduction shell covers the mainboard and is connected with the module main body, and the mainboard is in heat conduction contact with the heat conduction shell; the heat dissipation assembly comprises a semiconductor chilling plate, the semiconductor chilling plate is arranged outside the heat conduction shell and is in heat conduction contact with the heat conduction shell, the terminal has high heat dissipation efficiency, and the power consumption of the terminal can be effectively reduced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of radiators, and in particular, to a terminal and a vehicle. Background Art

[0002] At present, mass-produced hosts mostly use semiconductor refrigeration for active heat dissipation. Usually, the semiconductor refrigeration sheet is arranged inside the host shell through a mounting bracket, one side of the semiconductor refrigeration sheet is attached to the host shell, and the other side is attached to the side of the metal copper sheet embedded in the mounting bracket. At the same time, the metal copper sheet is close to the motherboard chip (i.e. the heating part), and the semiconductor refrigeration sheet is used to cool the chip to reduce the heat, and the heat is dissipated through the host shell.

[0003] However, in the above-mentioned heat dissipation method, there will be condensed water on the cooling side of the semiconductor refrigeration plate, which causes the semiconductor refrigeration plate to start working only above 84°C. When the semiconductor refrigeration plate is not working, the chip of the host does not directly contact the host housing, and the heat dissipation teeth provided on the host housing cannot play a corresponding heat dissipation role, resulting in very low heat dissipation efficiency. Utility Model Content

[0004] The purpose of the present disclosure is to provide a terminal and a vehicle, wherein the terminal has high heat dissipation efficiency.

[0005] In order to achieve the above-mentioned purpose, the present disclosure provides a terminal, which includes: a terminal module, the terminal module includes a main board and a module body, the main board is installed on the module body; a heat-conducting shell, the heat-conducting shell cover is arranged on the main board and connected to the module body, the main board is in thermal contact with the heat-conducting shell; and a heat dissipation component, the heat dissipation component includes a semiconductor refrigeration sheet, the semiconductor refrigeration sheet is arranged outside the heat-conducting shell, and is in thermal contact with the heat-conducting shell.

[0006] Optionally, a plurality of first heat dissipation teeth are formed on the heat conductive shell, and a gap is formed between two adjacent first heat dissipation teeth, and the gap is used to connect the internal space of the heat conductive shell with the external environment.

[0007] Optionally, a plurality of first bosses are provided on the inner wall of the heat-conducting shell, and the plurality of first bosses are arranged at intervals and are respectively used to contact the heat-generating components on the mainboard.

[0008] Optionally, the outer wall of the heat-conducting shell is provided with a plurality of second bosses, the plurality of second bosses are arranged at intervals, the number of the semiconductor refrigeration sheets is multiple, and the plurality of semiconductor refrigeration sheets are fitted with the plurality of second bosses in a one-to-one correspondence.

[0009] Optionally, the heat dissipation assembly includes a support frame, the support frame is connected to the heat-conducting shell and is provided with a fixing groove, the semiconductor cooling plate is installed in the fixing groove and is in thermal contact with the heat-conducting shell through the fixing groove.

[0010] Optionally, the heat dissipation assembly further includes a containing shell, the containing shell is connected to the outside of the heat-conducting shell, the semiconductor refrigeration plate is mounted in the containing shell through the support, and the containing shell is provided with a heat dissipation port, which is used to connect the internal space of the containing shell with the external environment.

[0011] Optionally, the heat dissipation assembly further includes a fan, and the fan is arranged between the support frame and the accommodating shell.

[0012] Optionally, the heat dissipation assembly further includes a heat sink, the heat sink is disposed between the support frame and the fan, a second heat dissipation tooth is disposed on a side of the heat sink facing the fan, and the fan is mounted on the heat sink.

[0013] Optionally, the heat dissipation assembly further includes a first heat conductive sheet, which is bonded to the heat sink and adhered to the semiconductor cooling sheet.

[0014] Optionally, the module body is provided with a third boss, the inner wall of the heat-conducting shell is provided with a fourth boss, a second heat-conducting sheet is provided between the third boss and the fourth boss, and the third boss and the fourth boss are respectively pressed tightly against the second heat-conducting sheet.

[0015] Optionally, the terminal module includes a temperature sensor and a controller, and the controller is electrically connected to the temperature sensor and the semiconductor refrigeration sheet.

[0016] According to a second aspect of the present disclosure, a vehicle is provided, comprising the terminal as described above.

[0017] Through the above technical solution, in the terminal provided by the present disclosure, the heat-conducting shell cover is arranged on the mainboard and is in thermal contact with the mainboard, the heat generated by the mainboard can be conducted to the heat-conducting shell, and the heat-conducting shell can also be in contact with the module body while being connected to the module body, so that the heat of the module body can also be conducted to the heat-conducting shell, and the air flow can take away part of the heat on the heat-conducting shell. In addition, the semiconductor refrigeration sheet has a refrigeration side for absorbing heat and a heat dissipation side for dissipating heat, and the refrigeration side of the semiconductor refrigeration sheet is fitted with the heat-conducting shell to quickly absorb the heat on the heat-conducting shell to improve the heat dissipation efficiency of the heat-conducting shell, and the semiconductor refrigeration sheet is placed outside the heat-conducting shell to be physically isolated from the mainboard, ensuring that the condensed water generated by the refrigeration side of the semiconductor refrigeration sheet during refrigeration will not enter the heat-conducting shell, and the terminal module can be prevented from being damaged by water ingress. Through the above structure, when the temperature of the terminal module is lower than the set temperature, the heat-conducting shell can extract the heat of the terminal module to achieve passive heat dissipation, and when the temperature of the terminal module is higher than the set temperature, the semiconductor refrigeration sheet is started to quickly perform active heat dissipation on the terminal module. Therefore, the semiconductor refrigeration sheet can work together with the heat-conducting shell to achieve heat dissipation treatment for the terminal module to ensure the heat dissipation effect. The terminal has high heat dissipation efficiency and can effectively reduce the power consumption of the terminal.

[0018] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0020] Figure 1 is an exploded schematic diagram of a terminal provided by an embodiment of the present disclosure;

[0021] Figure 2 is a cross-sectional schematic diagram of a terminal provided by an embodiment of the present disclosure;

[0022] Figure 3 is an exploded schematic diagram of a heat dissipation component in a terminal provided by an embodiment of the present disclosure;

[0023] Figure 4 is a cross-sectional view of a heat dissipation component in a terminal provided by an embodiment of the present disclosure;

[0024] Figure 5 is a schematic diagram of the structure of a module body in a terminal provided by an embodiment of the present disclosure;

[0025] Figure 6 is a schematic structural diagram of a heat-conducting shell in a terminal provided in an embodiment of the present disclosure, wherein a first boss and a fourth boss are shown.

[0026] Description of Reference Numerals

[0027] 1-terminal module, 11-mainboard, 111-heating device, 12-module body, 121-third boss, 2-heat-conducting shell, 21-first heat dissipation tooth, 22-first boss, 23-second boss, 24-fourth boss, 3-heat dissipation component, 31-semiconductor refrigeration plate, 32-containing shell, 321-heat dissipation port, 33-support frame, 34-fan, 35-heat sink, 351-second heat dissipation tooth, 36-first heat-conducting plate. DETAILED DESCRIPTION

[0028] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0029] In the present disclosure, unless otherwise specified, the directional words "inside" and "outside" used refer to the "inside" and "outside" relative to the contour of the corresponding component itself. In addition, the use of words such as "first" and "second" is intended to distinguish different components and does not have order and importance. In addition, when referring to the drawings in the following description, the same symbols in different drawings represent the same elements. It should be understood by those skilled in the art that the above definitions are only used to explain and illustrate the present disclosure and should not be understood as limitations on the present disclosure.

[0030] According to the specific implementation of the present disclosure, Figures 1 to 6 As shown, a terminal is provided, the terminal comprising: a terminal module 1, the terminal module 1 comprising a main board 11 and a module body 12, the main board 11 being mounted on the module body 12; a heat-conducting shell 2, the heat-conducting shell 2 being covered on the main board 11 and connected to the module body 12, the main board 11 being in heat-conducting contact with the heat-conducting shell 2; and a heat dissipation component 3, the heat dissipation component 3 comprising a semiconductor cooling sheet 31, the semiconductor cooling sheet 31 being arranged outside the heat-conducting shell 2 and in heat-conducting contact with the heat-conducting shell 2.

[0031] Through the above technical solution, in the terminal provided by the present disclosure, the heat-conducting shell 2 is covered on the main board 11 and is in thermal contact with the main board 11. The heat generated by the main board 11 can be conducted to the heat-conducting shell 2, and the heat-conducting shell 2 can also be in contact with the module body 12 while being connected to the module body 12. In this way, the heat of the module body 12 can also be conducted to the heat-conducting shell 2, and the air flow can take away part of the heat on the heat-conducting shell 2. In addition, the semiconductor refrigeration sheet 31 has a refrigeration side for absorbing heat and a heat dissipation side for dissipating heat. The refrigeration side of the semiconductor refrigeration sheet 31 is attached to the heat-conducting shell 2 and can quickly absorb the heat on the heat-conducting shell 2 to improve the heat dissipation efficiency of the heat-conducting shell 2. The semiconductor refrigeration sheet 31 is placed outside the heat-conducting shell 2 to be physically isolated from the main board 11, ensuring that the condensed water generated by the refrigeration side of the semiconductor refrigeration sheet 31 during refrigeration will not affect the main board 11, and can prevent the components on the main board 11 from being damaged by water. Through the above structure, when the temperature of the terminal module 1 is lower than the set temperature, the heat-conducting shell 2 can extract the heat of the terminal module 1 to achieve passive heat dissipation, and when the temperature of the terminal module 1 is higher than the set temperature, the semiconductor refrigeration sheet 31 is started to quickly perform active heat dissipation treatment on the terminal module 1. Therefore, the semiconductor refrigeration sheet 31 can work together with the heat-conducting shell 2 to achieve heat dissipation treatment of the terminal module 1, ensuring the heat dissipation effect, and the terminal has a high heat dissipation efficiency and can effectively reduce the power consumption of the terminal.

[0032] In some embodiments of the present disclosure, the terminal module 1 may be a screen module, and the module body 12 may be a touch screen assembly, wherein the touch screen assembly includes a screen body and a housing, the screen body is mounted on the housing, and the heat-conducting shell 2 is connected to the housing and in heat-conducting contact to improve the heat dissipation efficiency of the screen module. In other embodiments of the present disclosure, the terminal module 1 may also be other electronic devices that require heat dissipation, such as a vehicle-mounted video server, a camera device, etc., and the present disclosure does not specifically limit this.

[0033] In some embodiments of the present disclosure, reference Figure 1 and Figure 5 As shown, a plurality of first heat dissipation teeth 21 are formed on the heat-conducting shell 2, and a gap is formed between two adjacent first heat dissipation teeth 21, and the gap is used to connect the internal space of the heat-conducting shell 2 with the external environment. The arrangement of the plurality of first heat dissipation teeth 21 can increase the contact area between the heat-conducting shell 2 and the air, thereby improving the heat dissipation efficiency of the heat-conducting shell 2. At the same time, the hot air generated by the heat generated by the main board 11 and the module body 12 in the heat-conducting shell 2 can exchange heat with the external air through the gap to take away the heat of the main board 11 and the module body 12, thereby improving the heat dissipation efficiency of the terminal module 1.

[0034] In some embodiments of the present disclosure, reference Figure 1 and Figure 6As shown, the inner wall of the heat-conducting shell 2 is provided with a plurality of first bosses 22, which are arranged at intervals and are respectively used to contact the heat-generating components 111 on the mainboard 11. In this way, the plurality of first bosses 22 can respectively conduct the heat of the heat-generating components 111 at different positions on the mainboard 11 to the heat-conducting shell 2, thereby improving the heat conduction rate of the heat-generating components 111 on the mainboard 11.

[0035] The heat-conducting shell 2 and the first boss 22 are both made of metal materials with good thermal conductivity. The heat-conducting shell 2 and the first boss 22 may also be made of other heat-conducting materials, and the present disclosure does not make specific restrictions on this. In addition, thermal grease may be provided between the first boss 22 and the heating device 111 to ensure rapid heat transfer and improve the thermal conductivity between the heating device 111 and the heat-conducting shell 2.

[0036] In some embodiments of the present disclosure, reference Figure 1 and Figure 2 As shown, the outer wall of the heat-conducting shell 2 is provided with a plurality of second bosses 23, the plurality of second bosses 23 are arranged at intervals, the number of semiconductor cooling sheets 31 is multiple, and the plurality of semiconductor cooling sheets 31 are fitted one by one with the plurality of second bosses 23. In this way, the heat of the heat-conducting shell 2 can be concentratedly conducted to the second bosses 23. Since the semiconductor cooling sheets 31 are arranged correspondingly to the second bosses 23, the semiconductor cooling sheets 31 can quickly dissipate the heat concentrated on the second bosses 23, further improving the heat dissipation efficiency of the semiconductor cooling sheets 31 to the heat-conducting shell 2.

[0037] Among them, in one embodiment of the present disclosure, the number of semiconductor cooling sheets 31 is set to three, and the number of second bosses 23 is also set to three. In other embodiments, the number of second bosses 23 and semiconductor cooling sheets 31 can be reasonably set according to the number of heating devices 111 or the number of first bosses 22, and the present disclosure does not limit this. In addition, thermal conductive silicone grease can be filled between the semiconductor cooling sheet 31 and the second boss 23 to improve the thermal conductivity between the second boss 23 and the semiconductor cooling sheet 31.

[0038] In some embodiments of the present disclosure, reference Figures 1 to 4 As shown, the heat dissipation assembly 3 may include a support frame 33, the support frame 33 is connected to the heat-conducting shell 2 and is provided with a fixing groove, and the semiconductor cooling sheet 31 is installed in the fixing groove and is in heat-conducting contact with the heat-conducting shell 2 through the fixing groove. In this way, the relative position of the semiconductor cooling sheet 31 and the heat-conducting shell 2 can be fixed by the support frame 33, and the semiconductor cooling sheet 31 can be positioned by the fixing groove, and the sliding of the semiconductor cooling sheet 31 relative to the heat-conducting shell 2 can be restricted, so as to avoid the semiconductor cooling sheet 31 being misaligned with the second boss 23 to affect the heat dissipation efficiency of the heat-conducting shell 2.

[0039] Among them, the height of the groove wall of the fixed groove can be consistent with the superimposed height of the second boss 23 and the semiconductor refrigeration plate 31. The second boss 23 and the semiconductor refrigeration plate 31 are both placed in the fixed groove so that the position of the semiconductor refrigeration plate 31 corresponds to that of the second boss 23, thereby dissipating heat for the second boss 23.

[0040] In some embodiments of the present disclosure, reference Figures 1 to 4 As shown, the heat dissipation assembly 3 further includes a housing shell 32, which is connected to the outside of the heat-conducting shell 2, and the semiconductor cooling sheet 31 is supported and erected in the housing shell 32, and the housing shell 32 is provided with a heat dissipation port 321, which is used to connect the internal space of the housing shell 32 with the external environment. In this way, the housing shell 32 can protect the semiconductor cooling sheet 31, prevent dust and the like from accumulating in the semiconductor cooling sheet 31 and causing damage, and the air in the housing shell 32 can exchange gas with the air in the external environment through the heat dissipation port 321, thereby taking away the heat on the heat dissipation side of the semiconductor cooling sheet 31, so as to achieve rapid heat dissipation on the heat dissipation side of the semiconductor cooling sheet 31.

[0041] In some embodiments of the present disclosure, reference Figure 3 and Figure 4 As shown, the heat dissipation assembly 3 may further include a fan 34, which is arranged between the support frame 33 and the housing 32. In this way, the rotation of the fan 34 can accelerate the air flow in the housing 32, and increase the exchange rate between the gas in the housing 32 and the external gas to increase the air circulation, thereby improving the heat dissipation efficiency of the fan 34 on the heat dissipation side of the semiconductor cooling plate 31. At the same time, the rotation of the fan 34 can also take away the heat on the heat-conducting housing 2, further improving the heat dissipation efficiency of the heat-conducting housing 2.

[0042] The number of fans 34 can be set to two, or the number of fans 34 can be set reasonably according to actual conditions, and the present disclosure does not make specific restrictions on this. In addition, the way in which the fan 34 is connected to the support frame 33 and the way in which the housing 32 is connected to the heat-conducting housing 2 can be fixedly connected by screws or by welding, and the present disclosure does not make specific restrictions on this.

[0043] In some embodiments of the present disclosure, reference Figure 3 and Figure 4As shown, the heat dissipation assembly 3 may further include a heat sink 35, the heat sink 35 is arranged between the support frame 33 and the fan 34, the heat sink 35 is provided with a second heat dissipation tooth 351 on the side facing the fan 34, and the fan 34 is mounted on the heat sink 35. The heat sink 35 may cover the heat dissipation side of multiple semiconductor cooling fins 31, which is conducive to the second heat dissipation tooth 351 to simultaneously perform heat dissipation treatment on the heat dissipation side of multiple semiconductor cooling fins 35, and at the same time, the heat on the heat dissipation side of multiple semiconductor cooling fins 31 can be uniformly transferred, which is convenient for the fan 34 to synchronously perform heat dissipation treatment on the heat sink 35, thereby improving the heat dissipation efficiency of the heat dissipation side of the semiconductor cooling fins 31.

[0044] In some embodiments of the present disclosure, reference Figure 3 and Figure 4 As shown, the heat dissipation assembly 3 may further include a first heat conductive sheet 36, which is bonded to the heat sink 35 and fits with the semiconductor cooling sheet 31. In this way, the first heat conductive sheet 36 can cover a plurality of semiconductor cooling sheets 31, thereby evenly transferring the heat on the plurality of semiconductor cooling sheets 31 to the heat sink 35, so that the heat sink 35 and the fan 34 can dissipate heat from the heat dissipation side of the semiconductor cooling sheet 31.

[0045] The first heat conducting sheet 36 can be a graphite heat conducting sheet or other heat conducting materials with heat conducting effect, which is not specifically limited in the present disclosure. In addition, heat conducting silicone grease can be filled between the first heat conducting sheet 36 and the semiconductor cooling sheet 31 to improve the heat conducting efficiency.

[0046] In some embodiments of the present disclosure, reference Figure 1 and Figure 6 As shown, the module body 12 may be provided with a third boss 121, the inner wall of the heat-conducting shell 2 may be provided with a fourth boss 24, a second heat-conducting sheet may be provided between the third boss 121 and the fourth boss 24, and the third boss 121 and the fourth boss 24 may be pressed and fitted with the second heat-conducting sheet respectively. The third boss 121 may be provided in the heating area on the module body 12 so as to concentrate the heat in the heating area to the third boss 121, and transfer it to the heat-conducting shell 2 through the fourth boss 24, so as to perform heat dissipation treatment on the heating area of ​​the module body 12. At the same time, a second heat-conducting sheet may be provided between the third boss 121 and the fourth boss 24 to ensure the heat-conducting effect between the third boss 121 and the fourth boss 24, and further improve the heat-conducting efficiency between the heating area on the module body 12 and the heat-conducting shell 2.

[0047] Among them, the first boss 22 and the fourth boss 24 are arranged along the width direction of the terminal module 1, and multiple semiconductor cooling plates 31 can be arranged at intervals along the width direction of the terminal module 1, so that the multiple second bosses 23 on the heat-conducting shell 2 can respectively concentrate the heat from the first boss 22 and the fourth boss 24, so that the semiconductor cooling plate 31 on each second boss 23 can respectively dissipate the heat transferred from the first boss 22 and / or the fourth boss 24, thereby improving the heat dissipation efficiency.

[0048] In some embodiments of the present disclosure, the terminal module 1 may include a temperature sensor and a controller, and the controller is electrically connected to the temperature sensor and the semiconductor cooling sheet 31. The temperature sensor can detect the temperature of the mainboard 11 and the module body 12, and transmit the detected temperature information to the controller. When the detected temperature is higher than the set temperature, the semiconductor cooling sheet 31 is started to dissipate heat for the heat-conducting shell 2. When the detected temperature is lower than the set temperature, the semiconductor cooling sheet 31 does not work, and heat is dissipated by heat exchange between the heat-conducting shell 2 and the external ambient air, which can effectively reduce the energy consumption of the terminal and avoid the problem of excessive energy consumption caused by the semiconductor cooling sheet 31 being turned on for a long time.

[0049] Furthermore, the terminal module 1 may be provided with a plurality of temperature sensors, which may be respectively provided at the plurality of heating devices 111 of the mainboard 11 and the heating area of ​​the module body 12, so as to respectively detect the temperature of the module body 12 and the plurality of heating areas on the mainboard 11. When the temperature of the module body 12 or one of the heating devices 111 is higher than the set temperature, only one corresponding semiconductor cooling plate 31 needs to be turned on for heat dissipation, which can quickly reduce the temperature of a single area while ensuring the heat dissipation performance of the whole machine, and avoid the increase of energy consumption caused by turning on a plurality of semiconductor cooling plates 31 at the same time.

[0050] When the terminal disclosed in the present invention is in use, the heat of the mainboard 11 is transferred to the heat-conducting shell 2 through the first boss 22, and the heat of the module body 12 is transferred to the heat-conducting shell 2 through the third boss 121 and the fourth boss 24. When the temperature of the heating area of ​​the module body 12 and the heating device 111 on the mainboard 11 are both lower than the set temperature, the heat on the heat-conducting shell 2 can be taken away by the flow of external air for heat dissipation, and the module body 12 and the mainboard 11 in the heat-conducting shell 2 can also directly contact with the external air through the gap of the first heat dissipation tooth 21 to achieve heat dissipation. At the same time, turning on the fan 34 can accelerate the air flow rate on the heat-conducting shell 2, further improving the heat dissipation efficiency of the heat-conducting shell 2. In this way, the first heat dissipation tooth 21 and the fan 34 on the heat-conducting shell 2 can independently dissipate the heat of the terminal module 1, and the semiconductor cooling plate 31 is placed outside the heat-conducting shell 2, which can be physically isolated from the components on the terminal module 1, ensuring that the condensed water generated by the operation of the semiconductor cooling plate 31 will not affect the components, and the semiconductor cooling plate 31 can also work under normal temperature and high humidity environment.

[0051] When the temperature of the heating area of ​​the module body 12 or the heating device 111 on the main board 11 is higher than the set temperature, the heat of the heat-conducting shell 2 is concentrated on the second boss 23 and transferred to the semiconductor refrigeration plate 31 attached to the second boss 23, so that the heat of the second boss 23 is quickly absorbed by the cooling side of the semiconductor refrigeration plate 31, and the heat is transferred to the heat sink 35 through the heat-dissipating plate by the heat-dissipating side of the semiconductor refrigeration plate 31. The heat sink 35 dissipates heat through the second heat dissipating teeth 351. At the same time, the air flow at the heat sink 35 can be accelerated by the fan 34 to accelerate the exchange of air in the housing shell 32 with the external air, thereby improving the heat dissipation efficiency of the heat dissipation side of the semiconductor refrigeration plate 31.

[0052] Furthermore, the controller can adjust the preset temperature according to actual needs, effectively reducing the power consumption of the semiconductor refrigeration chip 31 and improving the working efficiency of the terminal module 1. For example, when it is detected that the ambient temperature is higher than a preset value, the semiconductor refrigeration chip 31 stops working to avoid the situation where the semiconductor refrigeration chip 31 has a low heat dissipation effect and generates high energy consumption when the ambient temperature is too high.

[0053] According to a second aspect of the present disclosure, a vehicle is provided, comprising the terminal as described above. The vehicle has all the beneficial effects of the terminal as described above, which will not be elaborated in detail in the present disclosure.

[0054] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0055] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0056] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A terminal, characterized in that: The terminal comprises: A terminal module, the terminal module comprising a main board and a module body, the main board being mounted on the module body; A heat-conducting shell, the heat-conducting shell is disposed on the main board and connected to the module body, and the main board is in thermal contact with the heat-conducting shell; and The heat dissipation component includes a semiconductor refrigeration sheet, and the semiconductor refrigeration sheet is arranged outside the heat-conducting shell and is in thermal contact with the heat-conducting shell.

2. The terminal according to claim 1, characterized in that A plurality of first heat dissipation teeth are formed on the heat-conducting shell, and a gap is formed between two adjacent first heat dissipation teeth. The gap is used to connect the internal space of the heat-conducting shell with the external environment.

3. The terminal according to claim 1, characterized in that: The inner wall of the heat-conducting shell is provided with a plurality of first bosses, which are arranged at intervals and are respectively used to contact the heat-generating components on the mainboard.

4. The terminal according to claim 1, characterized in that: The outer wall of the heat-conducting shell is provided with a plurality of second bosses, the plurality of second bosses are arranged at intervals, the number of the semiconductor cooling sheets is multiple, and the plurality of semiconductor cooling sheets are fitted with the plurality of second bosses in a one-to-one correspondence.

5. The terminal according to any one of claims 1 to 4, characterized in that: The heat dissipation component includes a support frame, which is connected to the heat-conducting shell and is provided with a fixing groove. The semiconductor cooling sheet is installed in the fixing groove and is in thermal contact with the heat-conducting shell through the fixing groove.

6. The terminal according to claim 5, characterized in that: The heat dissipation assembly also includes a containing shell, which is connected to the outside of the heat-conducting shell. The semiconductor refrigeration plate is mounted in the containing shell through the support frame. The containing shell is provided with a heat dissipation port, which is used to connect the internal space of the containing shell with the external environment.

7. The terminal according to claim 6, characterized in that: The heat dissipation assembly further includes a fan, and the fan is arranged between the support frame and the accommodating shell.

8. The terminal according to claim 7, characterized in that: The heat dissipation assembly further comprises a heat sink, which is arranged between the support frame and the fan. A second heat dissipation tooth is arranged on a side of the heat sink facing the fan, and the fan is mounted on the heat sink.

9. The terminal according to claim 8, characterized in that: The heat dissipation assembly further includes a first heat conductive sheet, which is bonded to the heat dissipation sheet and adheres to the semiconductor cooling sheet.

10. The terminal according to claim 1, characterized in that: The module body is provided with a third boss, the inner wall of the heat-conducting shell is provided with a fourth boss, a second heat-conducting sheet is provided between the third boss and the fourth boss, and the third boss and the fourth boss are respectively pressed and fitted with the second heat-conducting sheet.

11. The terminal according to claim 1, characterized in that: The terminal module includes a temperature sensor and a controller, and the controller is electrically connected to the temperature sensor and the semiconductor refrigeration sheet.

12. A vehicle, characterized in that: The invention comprises the terminal according to any one of claims 1 to 11.

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