Frame stamping die
By designing a frame stamping mold including a punch seat, a discharge plate, an elastic buffer mechanism and a die insert, the problem of insufficient output of existing molds is solved, the number of punches per time is improved and the production efficiency is improved, and the needs of multiple customers are met.
Patent Information
- Application Number
- CN202420930356.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-04-30
AI Technical Summary
When the existing stamping molds are produced in SOP16R frames, the output cannot meet the rapid growth of customers, resulting in inefficient production.
A frame stamping mold is designed, including upper and lower dies. By setting a punch seat, unloading plate and elastic buffer mechanism in the upper die, and setting a die seat and die insert in the lower die, the stamping process is optimized, and the production quantity and overall production efficiency are improved for each punch.
The production quantity of each turnover is doubled, and the overall production efficiency is increased by 70%, reducing labor costs and time costs, effectively meeting the production needs of multiple customers, improving the yield of products and reducing the proportion of bad products.
Smart Images

Figure CN222607756U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of forming and stamping technology, and specifically relates to a frame stamping die. Background Art
[0002] With the development of intelligence, electronic products have gradually become an indispensable part of various fields. Among them, the chip is an important core structure of electronic products, and the plastic packaging of the chip is a necessary part of the manufacturing process. Common packaging types include DIP, BGA, QFP, SOP, SIP, TO, etc. Due to the high system integration, small size, light weight, high packaging density, excellent performance, high reliability and low production cost of the SOP type, the punching method is especially adopted for high output and short market launch cycle. At present, the stamping die adopts 24 per punch for the SOP16R frame. However, due to the increasing demand of customers, the output has gradually failed to meet the needs of customers.
[0003] Therefore, it is necessary to provide a frame stamping die with higher production efficiency and stronger stability to solve the above problems. Utility Model Content
[0004] The purpose of the embodiment of the present application is to provide a frame stamping die, which doubles the production quantity of each punch of its products, improves the overall production efficiency by 70%, reduces labor costs and time costs, and can effectively meet the production needs of multiple customers, thereby solving at least one technical problem involved in the background technology.
[0005] In order to solve the above technical problems, this application is implemented as follows:
[0006] An embodiment of the present application provides a frame stamping die, comprising an upper die and a lower die that cooperates with the upper die for stamping, the upper die comprising a punch seat, a stripper plate installed below the punch seat through an elastic buffer mechanism, and a punch that is arranged below the punch seat and can pass through the stripper plate; the lower die comprises a die seat and a die insert that is arranged above the die seat and cooperates with the punch.
[0007] As a preferred improvement of the utility model, the upper die also includes a punch fixing plate fixedly arranged below the upper die, and the punch is fixed on the punch fixing plate.
[0008] As a preferred improvement of the utility model, the lower die also includes a die fixing plate fixedly arranged above the lower die, and the die insert is fixedly arranged on the die fixing plate.
[0009] As a preferred improvement of the utility model, it also includes a large guide column vertically arranged between the punch seat and the die seat and with the upper end fixed to the punch seat, and a first ball guide sleeve arranged on the die seat and sleeved on the large guide column.
[0010] As a preferred improvement of the utility model, the lower die also includes a bushing embedded in the die seat and having an opening at one end, and the first ball guide sleeve is inserted into the bushing through the opening.
[0011] As a preferred improvement of the utility model, it also includes a small guide column vertically arranged between the punch seat and the die seat and passing through the unloading plate, and a second ball guide sleeve arranged on the punch seat and sleeved on the small guide column, and the upper end of the small guide column is fixed to the punch seat.
[0012] As a preferred improvement of the present invention, the shape tolerance of the die insert is controlled within ±0.001 mm, and the gap between the die insert and the punch is controlled within a range of 0.001 mm to 0.004 mm.
[0013] As a preferred improvement of the utility model, the elastic buffer mechanism includes a spring column with one end fixed to the punch seat and a spring sleeved on the spring column and fixed to the punch seat at one end and fixed to the unloading plate at the other end.
[0014] As a preferred improvement of the utility model, the upper mold also includes a positioning pin provided on the unloading plate for positioning the product at each step.
[0015] As a preferred improvement of the utility model, the die repair amount of the punch is reserved to be 3-8 mm, and the design thickness of the discharge plate is 38 mm.
[0016] Compared with the prior art, this application has the following beneficial effects:
[0017] 1. The production quantity of each punch of the product is doubled, the overall production efficiency is increased by 70%, and the labor cost and time cost are reduced;
[0018] 2. Able to effectively meet the production needs of multiple customers, gain more competitive advantages in the market competition, and harvest more opportunities and challenges;
[0019] 3. At the same time, the increase in production quantity is conducive to reducing product size fluctuations, improving product yield and reducing the defective ratio. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:
[0021] Figure 1 A schematic diagram of the overall structure of the frame stamping die provided in an embodiment of the present application;
[0022] Figure 2 A structural layout diagram of the frame stamping die provided in an embodiment of the present application. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0024] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.
[0025] See also Figure 1 and Figure 2 As shown, an embodiment of the present application provides a frame stamping die, specifically a SOP8L-12R high-efficiency stamping die, including an upper die and a lower die cooperating with the upper die for stamping, the upper die including a punch seat 1, a stripping plate 12 installed under the punch seat 1 through an elastic buffer mechanism, and a punch 6 arranged under the punch seat 1 and capable of passing through the stripping plate 12.
[0026] The upper die also includes a punch fixing plate 5 fixedly arranged below the upper die, and the punch 6 is fixed on the punch fixing plate 5 .
[0027] In a specific embodiment, the punch 6 is mainly used for forming the product, and a mold repair amount of 3-8 mm is reserved. The unloading plate 12 is used to separate the production strip from the punch 6, and the designed thickness is 38 mm.
[0028] The upper mold also includes a positioning pin 13 provided on the stripper plate 12 for positioning each step of the product. The diameter of the positioning pin 13 is 1.52 mm, and correspondingly, the groove fixing plate 5 is provided with a positioning hole that cooperates with the positioning pin 13, and the aperture of the positioning hole is also 1.52 mm.
[0029] The lower die includes a die seat 19, a lower die seat 18 arranged below the die seat 19, and a die insert 21 arranged above the die seat 19 and cooperating with the punch 6. The die insert 21 should correspond one-to-one to the punch 6 and be processed by a four-coordinate wire-cutting machine tool to ensure the position accuracy of the cavity and the shape.
[0030] The lower die base 18 bears the pressure during the punching of the entire die.
[0031] The lower die also includes a die fixing plate 20 fixedly mounted thereon, and the die insert 21 is fixedly mounted on the die fixing plate 20 .
[0032] In a specific embodiment, the shape tolerance of the die insert 21 is controlled within ±0.001 mm, and the gap between the die insert 21 and the punch 6 is controlled within a range of 0.001 mm to 0.004 mm.
[0033] The frame stamping die also includes a large guide column 11 vertically arranged between the punch seat 1 and the die seat 19 and fixed at the upper end to the punch seat 1 and a first ball guide sleeve 14 arranged at the die seat 19 and sleeved on the large guide column 11.
[0034] The lower die further includes a bushing 15 which is embedded in the die seat 19 and has an opening at one end, and the first ball guide sleeve 14 is inserted into the bushing 15 through the opening.
[0035] The frame stamping die also includes a small guide column 8 vertically arranged between the punch seat 1 and the die seat 19 and passing through the unloading plate 12, and a second ball guide sleeve 9 arranged on the punch seat 1 and sleeved on the small guide column 8, and the upper end of the small guide column 8 is fixed to the punch seat 1.
[0036] In a specific embodiment, the diameter of the small guide pillar 8 is 50 mm, the diameter of the large guide pillar 11 is 76 mm, and the diameter of the balls of the first ball guide sleeve 14 and the second ball guide sleeve 9 is 5 mm.
[0037] The elastic buffer mechanism includes a spring column 3 with one end fixed to the punch seat 1 and a spring 2 which is sleeved on the spring column 3 and fixed to the punch seat 1 at one end and fixed to the unloading plate 12 at the other end. The spring 2 and the spring column 3 are used together to alleviate the impact force of the continuous high-speed punching process to extend the service life of the mold.
[0038] The working principle of the frame stamping die provided in the embodiment of the present application is as follows:
[0039] When the frame is punching, the material belt is leveled and passes through the concave die insert 21 below. The feeder conveys the material belt into the mold. The mold is driven by the punching machine to punch according to the set frequency. The punch 6 is used to punch the product positioning hole first, so that the subsequent positioning needle 13 can position each step of the product. The production distance of each step is 30mm, and the production quantity of the punch 6 is 24 per step. After the punch 6 punches down and rises, it passes through the unloading plate 12 to separate the product from the punch 6. The large guide pillars 11 and the small guide pillars 8 ensure the accuracy of the product punching. After the product is punched, it is collected in the tray.
[0040] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.
[0041] In addition, it should be noted that the scope of the methods and systems in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
[0042] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.
Claims
1. A frame stamping die, characterized in that: It includes an upper die and a lower die for stamping with the upper die, wherein the upper die includes a punch seat, a stripper plate installed below the punch seat through an elastic buffer mechanism, and a punch arranged below the punch seat and capable of passing through the stripper plate; the lower die includes a die seat and a die insert arranged above the die seat and cooperating with the punch.
2. The frame stamping die according to claim 1, characterized in that: The upper die also includes a punch fixing plate fixedly arranged below the upper die, and the punch is fixed on the punch fixing plate.
3. The frame stamping die according to claim 1 or 2, characterized in that: The lower die also includes a die fixing plate fixedly arranged above the lower die, and the die insert is fixedly arranged on the die fixing plate.
4. The frame stamping die according to claim 3, characterized in that: It also includes a large guide column vertically arranged between the punch seat and the die seat and fixedly arranged on the punch seat at its upper end, and a first ball guide sleeve arranged on the die seat and sleeved on the large guide column.
5. The frame stamping die according to claim 4, characterized in that: The lower die also includes a bushing which is embedded in the die seat and has an opening at one end, and the first ball guide sleeve is inserted into the bushing through the opening.
6. The frame stamping die according to claim 5, characterized in that: It also includes a small guide column vertically arranged between the punch seat and the die seat and passing through the unloading plate, and a second ball guide sleeve arranged on the punch seat and sleeved on the small guide column, and the upper end of the small guide column is fixed to the punch seat.
7. The frame stamping die according to claim 1, characterized in that: The shape tolerance of the die insert is controlled within ±0.001 mm, and the gap between the die insert and the punch is controlled within 0.001 mm to 0.004 mm.
8. The frame stamping die according to claim 1, characterized in that: The elastic buffer mechanism comprises a spring column with one end fixed to the punch seat and a spring sleeved on the spring column and fixed to the punch seat at one end and fixed to the stripping plate at the other end.
9. The frame stamping die according to claim 1 or 8, characterized in that: The upper mold also includes positioning pins provided on the stripper plate for positioning each step of the product.
10. The frame stamping die according to claim 1, characterized in that: The die repair amount of the punch is reserved to be 3-8 mm, and the design thickness of the stripper plate is 38 mm.