COB (Chip On Board) packaging small-spacing lamp panel with good heat dissipation effect

Abstract

The utility model relates to the technical field of COB (Chip On Board) packaging lamp panels, in particular to a COB packaging small-spacing lamp panel with a good heat dissipation effect, which comprises a substrate and a heat dissipation mechanism, a side plate is fixed above the substrate, and lamp strips distributed at equal intervals are arranged above the substrate close to the side plate; the LED lamp has the beneficial effects that heat can be absorbed through the heat conduction strip and the heat conduction plate, heat can be evenly dissipated through the annularly-distributed first heat dissipation holes, the heat dissipation area is increased, the heat conduction material and the multiple heat dissipation holes conduct heat dissipation together, and when the lampshade needs to be detached and replaced, the lampshade can be directly rotated anticlockwise, so that the heat dissipation efficiency is improved. When the butt joint block reaches the through groove, the lampshade is pulled upwards to drive the butt joint block to be separated from the through groove, and therefore the lampshade can be replaced conveniently and rapidly; and the heat dissipation efficiency and the convenience of the COB packaging small-spacing lamp panel are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of COB packaged light boards, in particular to a COB packaged small-pitch light board with good heat dissipation effect. Background Art

[0002] COB package small pitch light board is an emerging LED display technology with the characteristics of high brightness, high resolution and high reliability. COB package is a packaging technology that directly mounts multiple bare chips on a substrate. Unlike traditional SMD packaging, COB packaging directly bonds the LED chip to the substrate and makes electrical connections through gold wires, and then covers the entirety with a protective layer or light conversion material. This method simplifies the manufacturing process, reduces solder joints, and improves reliability and heat dissipation performance.

[0003] When using COB packaged small-pitch light boards, a lot of heat will be generated during the operation of the light boards. If the heat is not dissipated in time, it will affect the service life of the light boards. However, most light boards only have some through holes on the substrate for heat dissipation. The heat dissipation effect is not good. Therefore, we propose a COB packaged small-pitch light board with good heat dissipation effect. Utility Model Content

[0004] The utility model aims to provide a COB packaged small-pitch light board with good heat dissipation effect, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a COB packaged small-pitch light board with good heat dissipation effect, comprising a substrate and a heat dissipation mechanism, a side panel is fixed above the substrate, and light strips distributed at equal intervals are installed above the substrate near the side panel, and the heat dissipation mechanism is arranged on the inner side of the substrate and the side panel, and the heat dissipation mechanism comprises a No. 1 heat dissipation hole, a heat conduction plate, a No. 2 heat dissipation hole and a heat conduction strip, and a No. 2 heat dissipation hole distributed in a ring is opened in the middle of the substrate.

[0006] Preferably, a number 1 heat dissipation hole distributed in an annular pattern is provided on the inner side of the side plate, and a heat conducting plate is fixed to a side of the side plate close to the light strip.

[0007] Preferably, the substrate is provided with heat conducting strips distributed at equal intervals above the light strip, and the heat conducting strips are located in the gaps of the light strip.

[0008] Preferably, a lampshade is provided above the side panel, a docking mechanism is connected to the lampshade below the side panel, one side of the docking mechanism is connected to the side panel, and a first magnetic sheet and a second magnetic sheet are provided inside the docking mechanism.

[0009] Preferably, the docking mechanism comprises a through groove, a docking block and a docking groove, a docking block is connected below the lampshade, and one side of the docking block is connected to the second magnetic sheet.

[0010] Preferably, a through groove and a docking groove are provided above the side plate close to the docking block, and the docking groove is located on one side of the through groove, and the No. 1 magnetic sheet is located on the inner side of the docking groove.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The COB packaged small-pitch lamp board with good heat dissipation effect proposed by the utility model can absorb heat through the heat-conducting strips and the heat-conducting plates, and the annularly distributed No. 1 heat dissipation holes can dissipate heat evenly, increase the heat dissipation area, and the heat-conducting material and the plurality of heat dissipation holes dissipate heat together, and when the lampshade needs to be disassembled and replaced, the lampshade can be directly rotated counterclockwise to make the lampshade drive the No. 2 magnetic sheet on one side of the docking block to separate from the No. 1 magnetic sheet, and then the docking block slides to one side in the docking groove, and when the docking block reaches the through groove, the lampshade is pulled upwards to make the lampshade drive the docking block to separate from the through groove, so that the lampshade can be quickly replaced, thereby improving the heat dissipation efficiency and convenience of the COB packaged small-pitch lamp board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the cross-sectional structure of the utility model from top view;

[0014] Figure 2 This is a schematic diagram of the top view structure of the substrate of the utility model;

[0015] Figure 3 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0016] Figure 4 The utility model is a schematic diagram of the three-dimensional structure of the lampshade.

[0017] In the figure: 1. base plate; 2. side plate; 3. light strip; 4. heat dissipation mechanism; 401. heat dissipation hole No. 1; 402. heat conducting plate; 403. heat dissipation hole No. 2; 404. heat conducting strip; 5. lampshade; 6. docking mechanism; 601. through groove; 602. docking block; 603. docking groove; 7. magnetic sheet No. 1; 8. magnetic sheet No. 2. DETAILED DESCRIPTION

[0018] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Embodiment 1

[0020] See also Figure 1-Figure 3 The utility model provides a technical solution: a COB package small-pitch light board with good heat dissipation effect, comprising a substrate 1 and a heat dissipation mechanism 4, a side plate 2 is fixed above the substrate 1, and a light strip 3 with equal intervals is installed above the substrate 1 near the side plate 2, the heat dissipation mechanism 4 is arranged on the inner side of the substrate 1 and the side plate 2, the heat dissipation mechanism 4 comprises a No. 1 heat dissipation hole 401, a heat conduction plate 402, a No. 2 heat dissipation hole 403 and a heat conduction strip 404, a No. 2 heat dissipation hole 403 with an annular distribution is opened in the middle of the substrate 1, a No. 1 heat dissipation hole 401 with an annular distribution is arranged on the inner side of the side plate 2, a heat conduction plate 402 is fixed on the side of the side plate 2 close to the light strip 3, a heat conduction strip 404 with equal intervals is arranged above the substrate 1 close to the light strip 3, and the heat conduction strip 404 is located at the gap of the light strip 3, the heat conduction plate 402 and the heat conduction strip 404 are both made of aluminum, and the heat conduction plate 402 is a mesh plate.

[0021] In specific implementation, since the lamp board will generate a lot of heat during operation, most lamp boards only open some through holes on the substrate 1 for heat dissipation. However, the heat dissipation effect is not good if the heat is only dissipated through the through holes of the substrate 1. Heat can be absorbed by the thermal conductive strip 404 and the thermal conductive plate 402, and the annularly distributed heat dissipation hole No. 1 401 can dissipate heat evenly and increase the heat dissipation area. The thermal conductive material dissipates heat together with several heat dissipation holes, thereby improving the heat dissipation efficiency of the COB packaged small-pitch lamp board.

[0022] Embodiment 2

[0023] See also Figure 1-Figure 4On the basis of the first embodiment, a lampshade 5 is provided above the side panel 2, and a docking mechanism 6 is connected to the lower part of the lampshade 5 near the side panel 2, one side of the docking mechanism 6 is connected to the side panel 2, and a first magnetic sheet 7 and a second magnetic sheet 8 are provided inside the docking mechanism 6, and the docking mechanism 6 includes a through groove 601, a docking block 602 and a docking groove 603, a docking block 602 is connected to the lower part of the lampshade 5, one side of the docking block 602 is connected to the second magnetic sheet 8, a through groove 601 and a docking groove 603 are provided above the side panel 2 near the docking block 602, and the docking groove 603 is located on one side of the through groove 601, and the first magnetic sheet 7 is located on the inner side of the docking groove 603, and the cross-sectional shapes of the docking block 602 and the docking groove 603 are both "T" shaped.

[0024] During specific implementation, a lampshade 5 is usually installed on the outside of the lamp board to protect the light strip 3 from bumps and dust intrusion. However, most lampshades 5 are fixed on the outside of the lamp board, which makes it inconvenient to disassemble and replace the lampshade 5 alone, reducing the service life of the lamp board. When the lampshade 5 needs to be disassembled and replaced, the lampshade 5 can be directly rotated counterclockwise to allow the lampshade 5 to drive the No. 2 magnetic sheet 8 on one side of the docking block 602 to separate from the No. 1 magnetic sheet 7, and then the docking block 602 slides to one side in the docking groove 603. When the docking block 602 reaches the through groove 601, the lampshade 5 is pulled upward again to allow the lampshade 5 to drive the docking block 602 to separate from the through groove 601, so that the lampshade 5 can be replaced quickly and conveniently, thereby improving the convenience of COB packaged small-pitch lamp boards.

[0025] In actual use, the light strip 3 emits light through the internal chip, and during the light-emitting process, heat is dissipated through the heat dissipation mechanism 4. When the lampshade 5 needs to be disassembled and replaced separately, the lampshade 5 can be quickly removed from the side panel 2 with the assistance of the docking mechanism 6, the first magnetic sheet 7 and the second magnetic sheet 8, which is convenient for replacement and improves the convenience and practicality of the COB packaged small-pitch light board.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A COB packaged small-pitch light board with good heat dissipation effect, comprising a substrate (1) and a heat dissipation mechanism (4), characterized in that: A side plate (2) is fixed above the base plate (1); light strips (3) are installed above the base plate (1) near the side plate (2) and are evenly spaced; the heat dissipation mechanism (4) is arranged on the inner side of the base plate (1) and the side plate (2); the heat dissipation mechanism (4) comprises a first heat dissipation hole (401), a heat conduction plate (402), a second heat dissipation hole (403) and a heat conduction strip (404); and a ring-shaped second heat dissipation hole (403) is provided in the middle of the base plate (1).

2. According to claim 1, a COB packaged small-pitch light board with good heat dissipation effect, characterized in that: The inner side of the side plate (2) is provided with a number 1 heat dissipation hole (401) distributed in an annular pattern, and a heat conduction plate (402) is fixed to a side of the side plate (2) close to the light strip (3).

3. According to claim 2, a COB packaged small-pitch light board with good heat dissipation effect is characterized in that: The substrate (1) is provided with heat-conducting strips (404) distributed at equal intervals above the light strip (3), and the heat-conducting strips (404) are located at the gaps of the light strip (3).

4. According to claim 1, a COB packaged small-pitch light board with good heat dissipation effect, characterized in that: A lampshade (5) is provided above the side panel (2); a docking mechanism (6) is connected to the lampshade (5) below the side panel (2); one side of the docking mechanism (6) is connected to the side panel (2); and a first magnetic sheet (7) and a second magnetic sheet (8) are provided inside the docking mechanism (6).

5. According to claim 4, a COB packaged small-pitch light board with good heat dissipation effect is characterized in that: The docking mechanism (6) comprises a through slot (601), a docking block (602) and a docking slot (603); the lower part of the lampshade (5) is connected with the docking block (602); one side of the docking block (602) is connected to the second magnetic sheet (8).

6. A COB packaged small-pitch light board with good heat dissipation effect according to claim 5, characterized in that: The side plate (2) is provided with a through slot (601) and a docking slot (603) above the docking block (602), and the docking slot (603) is located on one side of the through slot (601), and the first magnetic sheet (7) is located on the inner side of the docking slot (603).

Images