Semiconductor refrigeration module and refrigeration equipment
By using a combination of nylon thermal insulation shell and temperature guide parts in the semiconductor refrigeration module, the problem of insufficient thermal insulation of the temperature guide parts is solved, the refrigeration efficiency of the semiconductor refrigeration chip is improved, and environmentally friendly refrigeration effect is achieved.
Patent Information
- Application Number
- CN202421294393.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-06-06
AI Technical Summary
The thermal insulation of the existing semiconductor refrigeration modules is poor, resulting in too fast temperature dissipation and reducing the refrigeration efficiency of the semiconductor refrigeration chip.
Using a conductive assembly including a temperature guide member and a nylon thermal insulation shell, the nylon thermal insulation shell forms an accommodating cavity and a through-hole. The temperature guide member is arranged in the accommodating cavity. The hot end or cold end of the semiconductor refrigeration chip comes into contact with the temperature guide member through the through-hole, and the temperature guide member is dissipated by a radiator.
The insulation performance of the nylon insulation shell reduces heat conduction, improves the temperature stability of the temperature conductor, enhances the refrigeration efficiency of the semiconductor refrigeration chip, and avoids leakage and environmental pollution due to the absence of refrigerant.
Smart Images
Figure CN222617238U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor refrigeration technology, and in particular to a semiconductor refrigeration module and refrigeration equipment. Background Art
[0002] The semiconductor refrigeration module includes a semiconductor refrigeration chip, a thermal conductive part and a heat sink. The thermal conductive part contacts the hot end of the semiconductor refrigeration chip, and the heat sink dissipates the heat of the thermal conductive part. The thermal insulation of the thermal conductive part in the related art is poor, resulting in faster heat dissipation, which reduces the temperature difference between the hot end and the cold end of the semiconductor refrigeration chip, and then reduces the cooling efficiency of the semiconductor refrigeration chip. Utility Model Content
[0003] In view of this, the embodiments of the present application hope to provide a semiconductor refrigeration module and refrigeration equipment that can reduce the probability of cold leakage.
[0004] In order to achieve the above-mentioned purpose, the technical solution of the embodiment of the present application is implemented as follows:
[0005] The present application discloses a semiconductor refrigeration module, including:
[0006] Semiconductor refrigeration chip;
[0007] A conduction component, the conduction component comprising a thermal conduction member and a nylon heat-insulating shell, the nylon heat-insulating shell being formed with a receiving cavity and a through-hole communicating with the receiving cavity, the thermal conduction member being arranged in the receiving cavity, and the hot end of the semiconductor refrigeration chip or the cold end of the semiconductor refrigeration chip being in contact with the thermal conduction member through the through-hole;
[0008] The heat sink is used to dissipate the heat of the thermal conductive component.
[0009] In one embodiment, the material of the thermal conductive component is copper or aluminum.
[0010] In one embodiment, the nylon heat insulating shell includes a first shell and a second shell, at least one of the first shell and the second shell is formed with a accommodating space having an opening, the first shell and the second shell are covered along the penetrating direction of the through-opening to define the accommodating space as the accommodating cavity, and the first shell is formed with the through-opening.
[0011] In one embodiment, the first shell and the second shell are detachably connected.
[0012] In one embodiment, the conductive component includes a fastener, the outer wall of the first shell is formed with a first mounting ear, the outer wall of the second shell is formed with a second mounting ear, and the fastener is inserted through the first mounting ear and the second mounting ear.
[0013] In one embodiment, the number of the first mounting ears, the second mounting ears and the fasteners are all multiple, the multiple first mounting ears are arranged at intervals along the circumference of the first shell, the multiple second mounting ears are arranged at intervals along the circumference of the second shell, and each of the fasteners is passed through the corresponding first mounting ear and the corresponding second mounting ear.
[0014] In one embodiment, the semiconductor refrigeration module includes a fixing member, and the fixing member is penetrated through the second mounting ear and the heat sink.
[0015] In one embodiment, part of the heat conducting component is protruded circumferentially along the through-opening to form an abutment portion, and limiting ribs are formed in both the first shell and the second shell. When the first shell and the second shell are covered, the two limiting ribs abut against the abutment portion along the through-opening direction.
[0016] In one embodiment, a weight-reducing groove is formed on the outer side wall of the nylon heat-insulating shell.
[0017] In one embodiment, there are multiple weight-reducing grooves, and the multiple weight-reducing grooves are arranged on the outer side wall of the nylon insulation shell at intervals along the circumference of the through-hole.
[0018] In one embodiment, the semiconductor refrigeration module includes a temperature sensor, the nylon insulation shell is formed with a mounting hole connected to the accommodating cavity, the thermal conductive component is formed with a fixing hole, and the temperature sensor passes through the mounting hole so that the sensing end of the temperature sensor is arranged in the fixing hole.
[0019] In one embodiment, the nylon heat-insulating shell is formed with a heat dissipation port communicating with the accommodating cavity, and a portion of the heat-conducting component protrudes out of the heat dissipation port and contacts with a heat dissipation surface of the radiator.
[0020] Another aspect of the present application discloses a refrigeration device, comprising the semiconductor refrigeration module in any one of the above embodiments.
[0021] The embodiment of the present application discloses a semiconductor refrigeration module and refrigeration equipment, which uses semiconductor refrigeration chips for refrigeration. Not only is the noise low during operation and the service life long, but also no refrigerant is needed, so there is no leakage and no pollution to the environment. By forming a receiving cavity and a through-hole connected to the receiving cavity in the nylon heat-insulating shell, a thermal conductive member can be arranged in the receiving cavity, and the hot end or cold end of the semiconductor refrigeration chip can contact the thermal conductive member through the through-hole to conduct heat to the hot end or cold end of the semiconductor refrigeration chip. Finally, a heat sink is used to dissipate the temperature of the thermal conductive member to better control the temperature difference between the hot end or cold end of the semiconductor refrigeration chip. In this way, on the one hand, by setting up a nylon insulation shell, the nylon material has good insulation properties and is not easy to transfer heat. It can effectively reduce the heat conduction of the thermal conductor to the outside and the heat conduction from the outside to the inside, reduce the heat leakage or cold leakage of the thermal conductor, so that the temperature stability of the thermal conductor is improved, and the cooling efficiency of the semiconductor refrigeration chip is high; on the other hand, the nylon material has good corrosion resistance and aging resistance, and can maintain stable performance during long-term use; on the other hand, nylon has a high structural strength and can withstand a large impact. In this way, it can not only better protect the thermal conductor inside it, but also facilitate the installation and fixation of subsequent parts such as radiators; on the other hand, the thermal conductor is set in the accommodating cavity, which can quickly position the thermal conductor, reduce the shaking during work, and have good working stability; on the other hand, the thermal conductor is set in the accommodating cavity. When the volume of the thermal conductor in the conduction component and the related technology is certain, the volume of the thermal conductor of the present application can be designed to be smaller. In this way, it can not only reduce costs, but also reduce the quality of the thermal conductor, facilitate installation and improve assembly efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 A schematic diagram of the structure of a conductive component provided in an embodiment of the present application;
[0023] Figure 2 for Figure 1 Explosion diagram of
[0024] Figure 3 for Figure 1 Schematic diagram of the structure from another perspective.
[0025] Description of Reference Numerals
[0026] Conducting component 1; thermal conductive member 11; thermal conductive portion 111; abutting portion 112; nylon heat insulating shell 12; accommodating cavity 12a; through-hole 12b; accommodating space 12c; opening 12d; limiting rib 12e; weight-reducing groove 12f; mounting hole 12g; heat dissipation port 12h; first shell 121; first mounting ear 121a; first fixing hole 121a1; fifth fixing hole 121a2; second shell 122; second mounting ear 122a; second fixing hole 122a1; third fixing hole 122a2. DETAILED DESCRIPTION
[0027] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of the present application and should not be regarded as an improper limitation on the present application.
[0028] The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The descriptions of "first", "second", etc. in the embodiments of the present application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly including at least one feature. In the description of the embodiments of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically limited.
[0029] Working principle of semiconductor refrigeration chip: After the semiconductor refrigeration chip is powered on, heat conduction will occur between the two ends of the semiconductor refrigeration chip, and the heat will be transferred from one end to the other end, thereby generating a temperature difference to form a cold end and a hot end. However, the semiconductor chip itself will have resistance. When current flows through it, it will generate heat, which will affect the heat conduction. In addition, the heat between the hot end and the cold end will also be reversely conducted through the air and the semiconductor refrigeration chip itself. When the amount of heat conduction and reverse heat conduction is equal, the temperature of the cold end and the hot end will not continue to change, making the refrigeration efficiency of the semiconductor refrigeration chip lower. Therefore, a thermal conductive part and a heat sink are often used to dissipate the heat of the semiconductor refrigeration chip. The exposed setting of the thermal conductive part in the related technology results in no parts to insulate it, which makes the temperature dissipation faster, which will affect the temperature difference between the hot end and the cold end of the semiconductor refrigeration chip, and then cause the refrigeration efficiency of the semiconductor refrigeration chip to decrease, or even stop working.
[0030] In view of this, the present application provides a semiconductor refrigeration module. Figures 1 to 3 The semiconductor refrigeration module includes a semiconductor refrigeration chip, a conduction component 1 and a heat sink. The conduction component 1 includes a thermal conductive member 11 and a nylon heat insulating shell 12. The nylon heat insulating shell 12 is formed with a receiving cavity 12a and a through hole 12b communicating with the receiving cavity 12a. The thermal conductive member 11 is arranged in the receiving cavity 12a. The hot end of the semiconductor refrigeration chip or the cold end of the semiconductor refrigeration chip contacts the thermal conductive member 11 through the through hole 12b. The heat sink is used to dissipate the temperature of the thermal conductive member 11.
[0031] The semiconductor refrigeration module provided by the present application uses semiconductor refrigeration chips for refrigeration, which not only has low noise during operation and long service life, but also does not require the use of refrigerants, so there is no leakage and no pollution to the environment. By forming a receiving cavity 12a and a through-hole 12b connected to the receiving cavity 12a in the nylon heat-insulating shell 12, the thermal conductive member 11 can be arranged in the receiving cavity 12a, and the hot end or cold end of the semiconductor refrigeration chip can contact the thermal conductive member 11 through the through-hole 12b to conduct heat to the hot end or cold end of the semiconductor refrigeration chip, and finally a heat sink is used to dissipate the temperature of the thermal conductive member 11 to better control the temperature difference between the hot end or cold end of the semiconductor refrigeration chip. In this way, on the one hand, by setting the nylon heat insulation shell 12, the nylon material has good insulation performance and is not easy to transfer heat, which can effectively reduce the heat conduction of the temperature conducting member 11 to the outside and the heat conduction of the outside to the inside, and reduce the heat leakage or cold leakage of the temperature conducting member 11, so that the temperature stability of the temperature conducting member 11 is improved, and the refrigeration efficiency of the semiconductor refrigeration chip is high; on the other hand, the nylon material has good corrosion resistance and aging resistance, and can maintain stable performance during long-term use; on the other hand, nylon has a high structural strength and can withstand greater impact, so that it can not only better The thermal conductive component 11 inside it is protected and the subsequent installation and fixation of parts such as the radiator are also facilitated; on the other hand, the thermal conductive component 11 is arranged in the accommodating cavity 12a, which can quickly position the thermal conductive component 11 to reduce shaking during operation and improve working stability; on the other hand, the thermal conductive component 11 is arranged in the accommodating cavity 12a. When the volume of the thermal conductive component in the conductive component 1 and the related technology is constant, the volume of the thermal conductive component 11 of the present application can be designed to be smaller, which can not only reduce costs, but also reduce the quality of the thermal conductive component 11, facilitate installation and improve assembly efficiency.
[0032] Exemplarily, in one embodiment, the shape of the thermal conductive member 11 is not limited. For example, the shape of the thermal conductive member 11 may be a cuboid, a cylinder, a sphere, a cube, or the like.
[0033] Exemplarily, in one embodiment, the number of conduction components 1 can be one or two. When the number of conduction components 1 is one, the conduction component 1 can be set at the cold end of the semiconductor refrigeration chip. Of course, the conduction component 1 can also be set at the hot end of the semiconductor refrigeration chip; when the number of conduction components 1 is two, one conduction component 1 can be set at the cold end of the semiconductor refrigeration chip, and the other conduction component 1 can be set at the hot end of the semiconductor refrigeration chip.
[0034] It should be noted that the above-mentioned heat dissipation refers to heat dissipation or cold dissipation. For example, when the temperature conductive component 11 contacts the hot end of the semiconductor refrigeration chip, the corresponding heat sink is a hot end heat sink, which can dissipate heat for the temperature conductive component 11; when the temperature conductive component 11 contacts the cold end of the semiconductor refrigeration chip, the corresponding heat sink is a cold end heat sink, which can dissipate cold for the temperature conductive component 11.
[0035] In one embodiment, the material of the thermal conductive member 11 is copper or aluminum. Exemplarily, the material of the thermal conductive member 11 may be copper. On the one hand, copper has excellent thermal conductivity and can quickly conduct the heat of the hot end or cold end of the semiconductor refrigeration chip, reducing the temperature difference between the thermal conductive member 11 and the hot end or cold end of the semiconductor refrigeration chip; on the other hand, copper has good ductility and plasticity and can be easily processed into various shapes and sizes. In another embodiment, the material of the thermal conductive member 11 may be aluminum. Aluminum not only has good thermal conductivity, but also has lower quality and cost at the same volume, is easy to install and has low manufacturing cost.
[0036] For example, in one embodiment, the material of the thermal conductive element 11 may also be other materials with a higher heat transfer coefficient, such as iron.
[0037] In one embodiment, please refer to Figures 1 to 3 The nylon heat-insulating shell 12 includes a first shell 121 and a second shell 122. At least one of the first shell 121 and the second shell 122 is formed with a receiving space 12c having an opening 12d. The first shell 121 and the second shell 122 are covered along the through direction of the through opening 12b to define the receiving space 12c as a receiving cavity 12a. The first shell 121 is formed with a through opening 12b.
[0038] It should be noted that Figure 1 R1 in the figure may be the penetration direction of the penetration opening 12b, and R2 may be the inside-outside direction.
[0039] Exemplarily, the formation of the accommodating cavity 12a includes but is not limited to the following: the first shell 121 may be formed with an accommodating space 12c having an opening 12d, and the second shell 122 is covered on the opening 12d to define the accommodating cavity 12a; the second shell 122 may be formed with an accommodating space 12c having an opening 12d, and the first shell 121 is covered on the opening 12d to define the accommodating cavity 12a; both the first shell 121 and the second shell 122 may be formed with an accommodating space 12c having an opening 12d, and a side of the first shell 121 having the opening 12d is covered on a side of the second shell 122 having the opening 12d to define the accommodating cavity 12a. The through opening 12b may be formed on the first shell 121.
[0040] Here, the nylon insulation shell 12 adopts a split setting. On the one hand, when installing the thermal conductive component 11, the first shell 121 and the second shell 122 can be disassembled first, and then the thermal conductive component 11 is placed in the accommodating space 12c, and then the first shell 121 and the second shell 122 are covered, so as to facilitate the installation and positioning of the thermal conductive component 11; on the other hand, the split design can reduce the complexity and development cost of the mold.
[0041] In one embodiment, the first shell 121 and the second shell 122 are detachably connected. Here, the first shell 121 and the second shell 122 are detachably connected, which can make it easier to replace or repair the thermal conductive element 11 and clean the accommodating cavity 12a.
[0042] Exemplarily, in one embodiment, the detachable connection method may be a snap connection, for example, the first shell 121 and the second shell 122 are connected by a snap connection.
[0043] In one embodiment, please refer to Figure 1 The conducting component 1 includes a fastener, a first mounting ear 121a is formed on the outer wall of the first shell 121, a second mounting ear 122a is formed on the outer wall of the second shell 122, and the fastener is inserted through the first mounting ear 121a and the second mounting ear 122a.
[0044] Here, by forming a first mounting ear 121a on the outer wall of the first shell 121, and forming a second mounting ear 122a on the outer wall of the second shell 122, the first mounting ear 121a can be formed with a first fixing hole 121a1, and the second mounting ear 122a can be formed with a second fixing hole 122a1, and fasteners are inserted into the first fixing hole 121a1 and the second fixing hole 122a1 to connect the first shell 121 and the second shell 122. In this way, on the one hand, the connection method of the fasteners can provide The connection strength between the first shell 121 and the second shell 122 is high, and the working stability of the nylon insulation shell 12 is good; on the other hand, the first mounting ear 121a is located on the outer wall of the first shell 121, and the second mounting ear 122a is located on the outer wall of the second shell 122. In this way, when the fastener is passed through the first mounting ear 121a and the second mounting ear 122a, the distance between the fastener and the thermal conductor 11 is relatively far. Therefore, the heat conduction of the thermal conductor 11 through the fastener can be reduced, and the thermal insulation effect of the thermal conductor 11 is good.
[0045] Exemplarily, in one embodiment, the shapes of the first shell 121 and the second shell 122 are not limited. For example, the projections of the first shell 121 and the second shell 122 along the penetrating direction of the through opening 12 b may be square or rectangular.
[0046] In one embodiment, please refer to Figure 1 and Figure 2 The number of the first mounting ears 121a, the second mounting ears 122a and the fasteners are all multiple, the multiple first mounting ears 121a are arranged at intervals along the circumference of the first shell 121, and the multiple second mounting ears 122a are arranged at intervals along the circumference of the second shell 122, and each fastener is passed through the corresponding first mounting ear 121a and the corresponding second mounting ear 122a.
[0047] Exemplarily, the number of the first mounting ear 121a, the second mounting ear 122a and the fasteners can be four each. The four first mounting ears 121a can be arranged on the outer wall of the first shell 121 at 90° intervals along the circumferential direction, and the four second mounting ears 122a can be arranged on the outer wall of the second shell 122 at 90° intervals along the circumferential direction. Each fastener is inserted into the first fixing hole 121a1 of the corresponding first mounting ear 121a and the second fixing hole 122a1 of the corresponding second mounting ear 122a. In this way, the connection strength between the first shell 121 and the second shell 122 can be further improved, and the situation where the first shell 121 and the second shell 122 are separated due to shaking or impact can be reduced, and the working stability is good.
[0048] In one embodiment, please refer to Figure 1 and Figure 2 The semiconductor refrigeration module includes a fixing part, which is passed through the second mounting ear 122a and the radiator.
[0049] Exemplarily, the second mounting ear 122a can be formed with a third fixing hole 122a2, and the radiator can be formed with a fourth mounting hole 12g. Fasteners are passed through the third fixing hole 122a2 and the fourth mounting hole 12g. On the one hand, the connection strength between the radiator and the second shell 122 can be improved and the shaking of the two can be reduced; on the other hand, the second mounting ear 122a can provide an installation position for the radiator, which is conducive to modular assembly during production and installation.
[0050] For example, in one embodiment, please refer to Figure 2 The first mounting ear 121a is formed with a fifth fixing hole 121a2 for connecting with a heat dissipation device located on the other side of the semiconductor refrigeration chip relative to the radiator, which is beneficial to modular assembly.
[0051] In one embodiment, please refer to Figure 1 Part of the heat conducting member 11 is protruded along the circumferential direction of the through-opening 12b to form a contact portion 112, and limiting ribs 12e are formed in both the first shell 121 and the second shell 122. When the first shell 121 and the second shell 122 are covered, the two limiting ribs 12e contact the contact portion 112 along the through-opening 12b.
[0052] Exemplarily, the inner wall of the first shell 121 and the inner wall of the second shell 122 may both be formed with circumferentially arranged and inwardly protruding limiting ribs 12e. The thermal conductive member 11 may include a thermal conductive portion 111 and a contact portion 112, wherein the contact portion 112 is connected to the outer peripheral wall of the thermal conductive portion 111 along the circumferential direction of the through-opening 12b, so that the contact portion 112 protrudes in the inner and outer directions away from the thermal conductive portion 111. In this way, when assembling the thermal conductive member 11, the thermal conductive member 11 may be first placed in the first shell 121, so that the limiting portion may contact the limiting rib 12e in the first shell 121 along the through-direction of the through-opening 12b on one side thereof. Then, the second shell 122 may be covered, so that the limiting portion may contact the limiting rib 12e in the second shell 122 along the through-direction of the through-opening 12b on one side thereof. In this way, the thermal conductive member 11 may be limited along the circumferential direction and through-direction of the through-opening 12b to achieve rapid positioning and reduce shaking.
[0053] In one embodiment, please refer to Figure 1 and Figure 2 The outer wall of the nylon heat-insulating shell 12 is formed with a weight-reducing groove 12f. In this way, on the one hand, the overall mass of the conductive component 1 can be reduced, which is convenient for installation; on the other hand, the overall manufacturing cost can be reduced, which is economical.
[0054] Exemplarily, in one embodiment, the weight-reducing groove 12f is separated from the accommodating cavity 12a, that is, the weight-reducing groove 12f is not connected to the accommodating cavity 12a, which can reduce heat conduction.
[0055] Exemplarily, in one embodiment, the first shell 121 and the second shell 122 are symmetrically designed. When the first shell 121 and the second shell 122 are covered, the weight-reducing groove 12f of the first shell 121 is connected with the weight-reducing groove 12f of the second shell 122. In this way, the weight-reducing groove 12f can be filled with foaming liquid during subsequent foaming. After curing, the thermal insulation effect of the nylon thermal insulation shell 12 can be better. The foaming process not only strengthens the structure of the nylon thermal insulation shell 12, but also enhances the connection strength between the first shell 121 and the second shell 122.
[0056] In one embodiment, please refer to Figure 1 and Figure 2 The number of the weight-reducing grooves 12f is multiple, and the multiple weight-reducing grooves 12f are arranged at intervals along the circumferential direction of the through opening 12b on the outer side wall of the nylon heat-insulating shell 12. In this way, the overall quality and manufacturing cost of the conductive component 1 can be further reduced.
[0057] In one embodiment, please refer to Figure 3The semiconductor refrigeration module includes a temperature sensor. The nylon insulation shell 12 is formed with a mounting hole 12g communicating with the accommodating cavity 12a. The thermal conductive member 11 is formed with a fixing hole. The temperature sensor passes through the mounting hole 12g so that the sensing end of the temperature sensor is arranged in the fixing hole.
[0058] For example, the mounting hole 12g can be composed of two half holes on the first shell 121 and the second shell 122, and the fixing hole can be aligned with the mounting hole 12g, so that the temperature sensor can pass through the mounting hole 12g so that its temperature sensing end is set in the fixing hole. On the one hand, the temperature of the temperature conducting member 11 can be monitored and timely processed; on the other hand, the design of the mounting hole 12g and the fixing hole can provide a fool-proof design for the installation of the first shell 121 and the second shell 122.
[0059] In one embodiment, please refer to Figure 1 and Figure 2 The nylon heat-insulating shell 12 is formed with a heat-dissipating port 12h communicating with the accommodating cavity 12a, and a portion of the heat-conducting member 11 protrudes out of the heat-dissipating port 12h and contacts with the heat-dissipating surface of the radiator.
[0060] Exemplarily, the heat dissipation port 12h and the through port 12b can be spaced apart along the through direction of the through port 12b, and part of the thermal conductive member 11 protrudes out of the heat dissipation port 12h and contacts the heat dissipation surface of the radiator. In this way, the heat dissipation area of the radiator to the thermal conductive member 11 can be increased, and the heat dissipation effect is better.
[0061] In one embodiment, the projection area of the semiconductor refrigeration chip along the penetration direction is located within the projection area of the thermal conductive member 11. In this way, the thermal conductive member 11 can more quickly conduct the heat of the semiconductor refrigeration chip, reduce the damage to the semiconductor refrigeration chip caused by heat accumulation, and increase the service life of the semiconductor refrigeration chip.
[0062] For example, in one embodiment, the contact surface between the thermal conductive element 11 and the semiconductor cooling chip and the contact surface between the thermal conductive element 11 and the heat sink need to ensure their flatness, so that heat conduction can be accelerated.
[0063] For example, in one embodiment, the contact surface between the temperature conducting member 11 and the semiconductor cooling chip and the contact surface between the temperature conducting member 11 and the heat sink may be provided with thermal conductive silicone grease to accelerate heat conduction.
[0064] Another aspect of the present application provides a refrigeration device, including the semiconductor refrigeration module in any one of the above embodiments. Exemplarily, the refrigeration device is formed with a storage cavity, and the semiconductor refrigeration module is used to control the temperature of the storage cavity. The refrigeration device provided by the present application has a light overall mass, small cold leakage, and high refrigeration efficiency.
[0065] Exemplarily, in one embodiment, the refrigeration device may be a refrigerator or a freezer.
[0066] The above is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. All modifications, equivalent substitutions, improvements, etc. within the spirit and principles of the present application are included in the protection scope of the present application.
Claims
1. A semiconductor refrigeration module, characterized in that: include: Semiconductor refrigeration chip; A conduction component, the conduction component includes a thermal conductive member and a nylon heat-insulating shell, the nylon heat-insulating shell includes a first shell and a second shell, at least one of the first shell and the second shell is formed with a receiving space having an opening, the first shell is formed with a through-hole, the first shell and the second shell are covered along the through-direction of the through-hole to define the receiving space as a receiving cavity, the thermal conductive member is arranged in the receiving cavity, the hot end of the semiconductor refrigeration chip or the cold end of the semiconductor refrigeration chip contacts the thermal conductive member through the through-hole, a part of the thermal conductive member is protruded along the circumference of the through-hole to form an abutment portion, limiting ribs are formed in the first shell and the second shell, and when the first shell and the second shell are covered, two limiting ribs abut against the abutment portion along the through-direction of the through-hole; The heat sink is used to dissipate the heat of the thermal conductive component.
2. The semiconductor refrigeration module according to claim 1, characterized in that: The material of the temperature conducting member is copper or aluminum.
3. The semiconductor refrigeration module according to claim 1, characterized in that: The first shell and the second shell are detachably connected.
4. The semiconductor refrigeration module according to claim 3, characterized in that: The conducting component includes a fastener, a first mounting ear is formed on the outer side wall of the first shell, a second mounting ear is formed on the outer side wall of the second shell, and the fastener is passed through the first mounting ear and the second mounting ear.
5. The semiconductor refrigeration module according to claim 4, characterized in that: The number of the first mounting ears, the second mounting ears and the fasteners are all multiple, the multiple first mounting ears are arranged at intervals along the circumference of the first shell, and the multiple second mounting ears are arranged at intervals along the circumference of the second shell, and each of the fasteners is passed through the corresponding first mounting ear and the corresponding second mounting ear.
6. The semiconductor refrigeration module according to claim 4, characterized in that: The semiconductor refrigeration module comprises a fixing part, and the fixing part is penetrated through the second mounting ear and the heat sink.
7. The semiconductor refrigeration module according to claim 1, characterized in that: The outer side wall of the nylon heat insulation shell is formed with a weight-reducing groove.
8. The semiconductor refrigeration module according to claim 7, characterized in that: There are multiple weight-reducing grooves, which are arranged on the outer side wall of the nylon heat-insulating shell at intervals along the circumference of the through-hole.
9. The semiconductor refrigeration module according to claim 1, characterized in that: The semiconductor refrigeration module includes a temperature sensor, the nylon insulation shell is formed with a mounting hole connected to the accommodating cavity, the thermal conductive component is formed with a fixing hole, and the temperature sensor passes through the mounting hole so that the sensing end of the temperature sensor is arranged in the fixing hole.
10. The semiconductor refrigeration module according to claim 1, characterized in that: The nylon heat-insulating shell is formed with a heat dissipation port communicating with the accommodating cavity, and a portion of the heat-conducting component protrudes out of the heat dissipation port and contacts with a heat dissipation surface of the radiator.
11. A refrigeration device, characterized in that: A semiconductor refrigeration module comprising any one of claims 1 to 10.