Wafer needle card based on spring needle structure
By adopting a wafer needle card based on a spring needle structure in wafer testing, the up and down movement of the probe guide plate and spring probe are used to solve the shortcomings of traditional needle cards under the requirements of high frequency and high speed transmission, and efficient signal transmission and low-cost maintenance are achieved.
Patent Information
- Application Number
- CN202420857241.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-04-24
AI Technical Summary
Traditional wafer test pin cards have problems with long and irregular signal transmission paths when facing high frequency and high speed transmission requirements, resulting in the inability to effectively transmit high frequency signals and high maintenance costs.
The wafer needle card based on the spring needle structure is adopted. Through the arrangement of the probe guide plate, the up and down movement of the spring probe is utilized to avoid the lateral force of the probe, which is convenient for on-site maintenance, and the accuracy and reliability of the probe are improved through the split structure and high precision machining.
It realizes wafer testing suitable for high-frequency and high-speed transmission, reduces the production cycle and cost of needle cards, and facilitates on-site maintenance by customers, avoiding the need for overall replacement.
Smart Images
Figure CN222618690U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of needle cards, in particular to a wafer needle card based on a spring needle structure. Background Art
[0002] Wafer testing is to test each die on the wafer. Several probes thinner than hair are installed on the test needle card, which contact the bumps on the die to form electrical contact. The test signal measured by the probe is then sent to the automatic test equipment (ATE) for analysis and judgment. Therefore, the electrical characteristic test results of each die on the wafer can be obtained. Unqualified die will be marked and cut and eliminated. This avoids increasing manufacturing costs later. Wafer testing is a very important testing process, which is a report card that reflects the Fab's capabilities. During the wafer testing process, the electrical capabilities and circuit structure mechanisms of each die are detected.
[0003] Traditional wafer testing may only be a simple continuity test and an electrical test with a frequency of only tens of megahertz, so the requirements for wafer probe cards are not very high. The use of traditional cantilever beams and vertical probe cards can meet its testing requirements. With the rapid development of technologies such as 5G, GPU, Internet of Things, and artificial intelligence, as well as the improvement of Fab process capabilities, the functions of grains are becoming more and more powerful, and the requirements for their testing are also getting higher and higher. For example, the test frequency reaches tens of thousands of megahertz, the contact impedance is required to be 50 ohms, and the parasitic parameters of the probe are required to be smaller and smaller. Therefore, it is necessary to develop new wafer testing solutions to adapt to new testing needs.
[0004] In addition, traditional wafer test needle cards, such as cantilever beam needle cards, require special equipment because their needle tips are polished, and their needle tails are welded, so on-site maintenance is not convenient, and special equipment and professional engineers are required to replace them. Therefore, the maintenance cycle and cost are relatively high.
[0005] As the frequency requirements for wafer testing become higher and higher, the transmission rate and anti-interference requirements for the probe cards used are getting higher and higher. Traditional wafer test probe cards, such as cantilever beam probe cards and vertical probe cards, are relatively long, and the signal transmission path is long and irregular, and cannot transmit very high frequencies. It is necessary to develop a probe card suitable for high-frequency and high-speed transmission.
[0006] The traditional needle card probe is welded to the PCB end, and the head is polished to ensure its flatness. If one of the probes is broken, it cannot be repaired on site and needs to be reassembled and welded at a special repair center or factory. Utility Model Content
[0007] The technical problem to be solved by the utility model is to provide a wafer needle card based on a spring needle structure, which solves the problem of the probe card measuring the bumps on the wafer by setting a probe guide plate. The spring probe is movable up and down without lateral force, which avoids the probe scratching the bump. At the same time, it is convenient for customers to repair on site without the need for overall replacement. It is suitable for wafer testing with higher speed and frequency requirements, and reduces the production cycle and cost of the needle card.
[0008] In order to solve the above technical problems, the utility model provides a wafer needle card based on a spring needle structure, including an upper support plate and a probe guide plate, wherein probe holes are spaced apart on the probe guide plate, and a positioning pin and a first screw are arranged between the probe guide plate and the upper support plate; the other end of the probe guide plate is connected to a lower support plate, and a guide pin and a second screw are arranged between the upper support plate and the lower support plate.
[0009] Furthermore, the upper support plate and the lower support plate are both provided with placement grooves at positions corresponding to the probe guide plate, and the placement grooves are provided with auxiliary holes corresponding to the probe holes, and fixing holes adapted to the positioning pins and the first screws.
[0010] Furthermore, a needle protection cover is provided on a side of the upper support plate away from the probe guide plate.
[0011] Furthermore, a needle tail protection cover is provided on one side of the lower support plate away from the probe guide plate, a third screw is provided between the needle head protection cover and the needle tail protection cover, and the third screw passes through the upper support plate and the lower support plate.
[0012] Furthermore, the needle tail protection cover is provided with a groove adapted to the auxiliary hole.
[0013] Furthermore, the upper support plate is provided with a first through hole adapted to the guide pin, a second through hole adapted to the second screw, and a third through hole adapted to the third screw.
[0014] Furthermore, the lower support plate is provided with a fourth through hole adapted to the guide pin, a fifth through hole adapted to the second screw, and a sixth through hole adapted to the third screw.
[0015] Furthermore, a spring probe is included, the spring probe corresponds to the probe hole one by one, and the shape of the spring probe is stepped.
[0016] Beneficial effects of the utility model:
[0017] 1. Solved the problem of probe card measuring bumps on wafers. The spring probe moves up and down without lateral force, which prevents the probe from scratching the bumps.
[0018] 2. Convenient for customers to solve on-site maintenance problems.
[0019] 3. Suitable for wafer testing with higher speed and frequency requirements.
[0020] 4. Reduce the production cycle and cost of needle cards. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic diagram of the overall structure disassembly of the utility model.
[0022] Figure 2 It is a structural schematic diagram of an upper support plate of the utility model.
[0023] Figure 3 It is a schematic diagram of the structure of the lower support plate of the utility model.
[0024] Figure 4 It is a schematic diagram of the structure of the spring probe of the utility model.
[0025] Explanation of the numbers in the figure: 1. Probe guide plate; 2. Spring probe; 3. Probe hole; 4. Upper support plate; 41. First through hole; 42. Second through hole; 43. Third through hole; 5. Lower support plate; 51. Fourth through hole; 52. Fifth through hole; 53. Sixth through hole; 54. Placement slot; 55. Auxiliary hole; 56. Fixing hole; 6. Positioning pin; 7. First screw; 8. Guide pin; 9. Second screw; 10. Needle tip protection cover; 11. Needle tail protection cover; 12. Third screw; 13. Groove. DETAILED DESCRIPTION
[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.
[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0029] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0030] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.
[0032] Reference Figures 1 to 4As shown, an embodiment of a wafer needle card based on a spring needle structure of the utility model includes an upper support plate 4 and a probe guide plate 1, the probe guide plate 1 is provided with probe holes 3 spaced apart, a positioning pin 6 and a first screw 7 are arranged between the probe guide plate 1 and the upper support plate 4; the other end of the probe guide plate 1 is connected to a lower support plate 5, a guide pin 8 and a second screw 9 are arranged between the upper support plate 4 and the lower support plate 5; the upper support plate 4 and the lower support plate 5 are provided with placement grooves 54 at positions corresponding to the probe guide plate 1, the placement grooves 54 are provided with auxiliary holes 55 corresponding to the probe holes 3, and fixing holes 56 adapted to the positioning pins 6 and the first screws 7.
[0033] Among them, the upper support plate 4 is made of high-performance engineering plastics to ensure its dimensional stability and strong machinability. It is processed by a high-precision machining center to ensure the dimensional accuracy and position requirements of the probe hole 3, and can ensure the position of the probe and the flatness requirements of its needle tip; the probe guide plate 1 is made of high-performance engineering plastics to ensure its dimensional stability and strong machinability. It is processed by a high-precision machining center to ensure the dimensional accuracy and position requirements of the probe hole 3, and plays a guiding role in the installation of the probe; the lower support plate 5 is made of high-performance engineering plastics to ensure its dimensional stability and strong machinability. It is processed by a high-precision machining center to ensure the dimensional accuracy and position requirements of the probe hole 3, and ensure reliable contact between the probe and the needle clamp.
[0034] Since the probe hole 3 is relatively small, in order to ensure that the position and dimensional tolerance of the probe hole 3 meet the requirements, and also considering the economy of processing, the general probe upper support plate is divided into two parts, and a probe guide plate 1 is added. The probe guide plate is fixed to the upper support plate 4 by a first screw 7 and a positioning pin 6, and then the probe is transferred to each probe hole 3, and then the support plate 5 is covered to ensure that the probe can move freely in the probe seat; then it is connected to the needle card plate through the positioning pin 6 and fixed by the first screw 7 to form a test needle card. During use, if one of the probes is broken, just follow the reverse steps above to replace the broken probe, and then it can be used immediately after assembly.
[0035] A needle protection cover 10 is provided on the side of the upper support plate 4 away from the probe guide plate 1, and a needle tail protection cover 11 is provided on the side of the lower support plate 5 away from the probe guide plate 1. A third screw 12 is provided between the needle protection cover 10 and the needle tail protection cover 11, and the third screw 12 passes through the upper support plate 4 and the lower support plate 5. A groove 13 adapted to the auxiliary hole 55 is provided on the needle tail protection cover 11;
[0036] The upper support plate 4 is provided with a first through hole 41 adapted to the guide pin 8, a second through hole 42 adapted to the second screw 9 and a third through hole 43 adapted to the third screw 12, and the lower support plate 5 is provided with a fourth through hole 51 adapted to the guide pin 8, a fifth through hole 52 adapted to the second screw 9 and a sixth through hole 53 adapted to the third screw 12, all of which are used for connecting and fixing the overall structure.
[0037] The probe adopts a spring needle structure, and the spring probe 2 corresponds to the probe hole 3 one by one. Since the needle tube is relatively thin, in order to ensure the dimensional accuracy and elasticity of the probe needle, the probe adopts a step needle structure. The needle and the needle tube are riveted to ensure the stability of the probe resistance value. At the same time, the space of the spring is increased so that it can generate sufficient elastic force. The specific benefits are as follows:
[0038] 1. The probe adopts a spring structure, relying on the elastic force of the spring to ensure reliable contact between the probe and the bumps on the crystal and the pads on the board; 2. Since the probe is relatively thin, the needle tube adopts chemical deposition molding technology, in which the material uses high-performance metal to ensure that it does not deform when the tube wall is very thin, and has high hardness and good wear resistance; 3. Since the probe is relatively slender, if the traditional two-piece structure is adopted, the position and size stability of the pinhole cannot be guaranteed. The split structure is adopted to reduce the depth-to-diameter ratio of the pinhole, thereby improving the size accuracy and position of the pinhole; 4. The probe adopts a single-moving needle structure, and the size from the single-moving needle tip to the needle shoulder is easy to control, thereby ensuring the needle tip height of the needle card.
[0039] The above-described embodiments are only preferred embodiments for fully illustrating the present utility model, and the protection scope of the present utility model is not limited thereto. Equivalent substitutions or changes made by technicians in the technical field on the basis of the present utility model are all within the protection scope of the present utility model. The protection scope of the present utility model shall be subject to the claims.
Claims
1. A wafer pin card based on a spring pin structure, characterized in that: The invention comprises an upper support plate (4) and a probe guide plate (1), wherein the probe guide plate (1) is provided with probe holes (3) at intervals, and a positioning pin (6) and a first screw (7) are arranged between the probe guide plate (1) and the upper support plate (4); the other end of the probe guide plate (1) is connected to a lower support plate (5), and a guide pin (8) and a second screw (9) are arranged between the upper support plate (4) and the lower support plate (5).
2. The wafer pin card based on the spring pin structure as claimed in claim 1, characterized in that: The upper support plate (4) and the lower support plate (5) are both provided with placement grooves (54) at positions corresponding to the probe guide plate (1), and the placement grooves (54) are provided with auxiliary holes (55) corresponding to the probe holes (3), and fixing holes (56) adapted to the positioning pins (6) and the first screws (7).
3. The wafer pin card based on the spring pin structure as claimed in claim 2, characterized in that: A needle protection cover (10) is provided on a side of the upper support plate (4) away from the probe guide plate (1).
4. The wafer pin card based on the spring pin structure as claimed in claim 3, characterized in that: A needle tail protection cover (11) is arranged on the side of the lower support plate (5) away from the probe guide plate (1), and a third screw (12) is arranged between the needle head protection cover (10) and the needle tail protection cover (11), and the third screw (12) passes through the upper support plate (4) and the lower support plate (5).
5. The wafer pin card based on the spring pin structure as claimed in claim 4, characterized in that: The needle tail protection cover (11) is provided with a groove (13) adapted to the auxiliary hole (55).
6. The wafer pin card based on the spring pin structure as claimed in claim 4, characterized in that: The upper support plate (4) is provided with a first through hole (41) adapted to the guide pin (8), a second through hole (42) adapted to the second screw (9), and a third through hole (43) adapted to the third screw (12).
7. The wafer pin card based on the spring pin structure as claimed in claim 4, characterized in that: The lower support plate (5) is provided with a fourth through hole (51) adapted to the guide pin (8), a fifth through hole (52) adapted to the second screw (9), and a sixth through hole (53) adapted to the third screw (12).
8. The wafer pin card based on the spring pin structure as claimed in claim 1, characterized in that: It comprises a spring probe (2), the spring probe (2) corresponds to the probe hole (3) one by one, and the shape of the spring probe (2) is stepped.