Wafer measuring device
By designing a wafer measuring device with a rotatable stage and undulating track, the problem of easy damage during the wafer measurement process in the prior art is solved, and accurate measurement and safety protection of the wafer surface are achieved.
Patent Information
- Application Number
- CN202421317743.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-06-11
AI Technical Summary
During the semiconductor wafer production process, existing dial gauge thickness gauge is prone to shattering or scratching the wafer during the measurement process.
A wafer measuring device is designed, including a device body, a measuring assembly and a transmission assembly. The transmission assembly includes a rotatable stage and a track that undulates in the vertical direction, and the measurement assembly includes a liftable measuring instrument head and a follower. Through the rotation of the stage and the ups and downs of the track, the follower drives the measuring instrument head to lift and lower, achieving accurate measurement of the wafer surface.
By driving the measuring instrument head to lift and lower, the device avoids damage to the wafer when switching the measurement points, reduces the possibility of shattering or scratching the wafer, and improves the accuracy and safety of the measurement.
Smart Images
Figure CN222619688U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer measuring device. Background Art
[0002] During the production process of semiconductor wafers, it is necessary to measure the surface parameters of the wafers, such as using a micrometer thickness gauge to measure the thickness of the wafer.
[0003] When using the existing micrometer thickness gauge, a person needs to lift the micrometer head, place the wafer on the stage, control the micrometer head to drop to the wafer surface, and after measuring one point, move the micrometer head to measure other points. During the measurement process, when the micrometer head descends, the speed is too fast and the wafer is easily broken, and when the micrometer head moves, the wafer is easily scratched. Utility Model Content
[0004] In view of this, the purpose of the present application is to provide a wafer measuring device for solving the problem that the wafer is easily damaged during the wafer measurement process.
[0005] In order to achieve the above technical objectives, the present application provides a wafer measurement device, comprising: a device body, a measurement component and a transmission component;
[0006] The transmission assembly comprises: a carrier;
[0007] The carrier can be rotatably arranged on the device body;
[0008] The platform is surrounded by a track that rises and falls in the vertical direction;
[0009] The measuring assembly comprises: a measuring head and a follower;
[0010] The measuring head can be lifted and lowered on the device body and is located above the carrier;
[0011] The follower is fixedly connected to the measuring head, and the follower is movably arranged on the track;
[0012] During the rotation of the carrier, the follower moves along the track and drives the measuring head to rise and fall following the ups and downs of the track.
[0013] Furthermore, the transmission assembly further comprises: an outer knob and a planetary gear;
[0014] The outer knob is rotatably disposed on the device body;
[0015] The planetary gear meshes and connects the outer knob and the carrier.
[0016] Furthermore, the transmission assembly further comprises: a central shaft;
[0017] The central shaft can be rotatably sleeved in the outer knob;
[0018] The carrier is fixed on the central axis;
[0019] The planetary gear is disposed between the central shaft and the outer knob, and is meshedly connected with the central shaft and the outer knob respectively.
[0020] Furthermore, an inner gear ring is provided on the inner periphery of the outer knob;
[0021] An outer gear ring is provided on the outer periphery of the central shaft;
[0022] The planetary gears include a plurality of planetary gears, which are distributed circumferentially around the central axis;
[0023] The planetary gears mesh with and connect the inner gear ring and the outer gear ring.
[0024] Furthermore, a column is provided on the main body of the device;
[0025] The measuring head is arranged on the column.
[0026] Furthermore, the track is in a uniform wavy ring shape.
[0027] Further, it also includes a damping member;
[0028] The damping member is arranged on the track.
[0029] Further, the track includes a high point area and a low point area;
[0030] When the follower is located in the high point area, the measuring head is separated from the wafer on the stage;
[0031] When the follower is located in the low point area, the measuring head contacts the wafer on the stage;
[0032] The damping member is arranged in the low point area.
[0033] Furthermore, the damping element is a rubber element.
[0034] Furthermore, the follower is a ball.
[0035] It can be seen from the above technical scheme that the present application provides a wafer measuring device, comprising: a device body, a measuring component and a transmission component; the transmission component comprises: a carrier; the carrier is rotatably arranged on the device body; a track that rises and falls in the vertical direction is arranged around the carrier; the measuring component comprises: a measuring head and a follower; the measuring head is liftably arranged on the device body and is located above the carrier; the follower is fixedly connected to the measuring head, and the follower is movably arranged on the track; during the rotation of the carrier, the follower moves along the track and drives the measuring head to rise and fall following the rise and fall of the track.
[0036] When measuring the surface parameters of a wafer, the wafer measuring device provided by the present invention can drive the measuring head to rise and fall by moving the stage, so that the measuring head is raised or lowered to be close to or away from the surface of the wafer, thereby preventing the measuring head from scratching the wafer during switching of the measuring point. At the same time, the method of driving the measuring head to rise and fall by rotating helps to control the height of the measuring head, thereby reducing the possibility of the measuring head piercing and crushing the wafer, and effectively solving the problem of easy damage to the wafer during the wafer measurement process. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0038] Figure 1 A schematic diagram of the structure of a wafer measuring device provided in an embodiment of the present application;
[0039] Figure 2 A top view of a wafer measuring device provided in an embodiment of the present application;
[0040] Figure 3 A perspective view of a transmission assembly of a wafer measuring device provided in an embodiment of the present application;
[0041] In the figure: 10, device body; 11, column; 20, measuring assembly; 21, measuring head; 22, follower; 23, meter body; 30, transmission assembly; 31, carrier; 32, track; 33, planetary gear; 34, center axis; 35, outer knob; 40, buffer. DETAILED DESCRIPTION
[0042] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the specification of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection requested by the present application.
[0043] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0044] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
[0045] See also Figures 1 to 3 A wafer measuring device provided in an embodiment of the present application includes: a device body 10, a measuring component 20 and a transmission component 30.
[0046] The transmission assembly 30 includes a stage 31, which is rotatably disposed on the device body 10. The stage 31 can be used to place a wafer.
[0047] A track 32 that rises and falls in the vertical direction is disposed around the carrier 31. Specifically, the track 32 can be disposed on the outer periphery of the carrier 31.
[0048] The measuring assembly 20 includes: a measuring head 21 and a follower 22. The measuring head 21 can be, for example, a micrometer thickness gauge; the measuring head 21 can be raised and lowered on the device body 10 and is located above the stage 31. The measuring head 21 can be connected to the device body 10 in a liftable manner, for example, a column 11 is provided on the device body 10, and the measuring head 21 can be slidably provided on the column 11 along a vertical direction, so that the measuring head 21 can be raised and lowered relative to the device body 10. The measuring head 21 can also be retractable, for example, the measuring assembly 20 includes a body 23; the body 23 is fixed on the column 11, and the measuring head 21 can be retractably connected to the body 23, so that the measuring head 21 can be raised and lowered relative to the device body 10.
[0049] The follower 22 is fixedly connected to the measuring head 21 and is movably disposed on the track 32 . During the rotation of the platform 31 , the follower 22 moves along the track 32 and drives the measuring head 21 to rise and fall following the rise and fall of the track 32 .
[0050] In this embodiment, the track 32 may be a concave structure, and the follower 22 may slide along the track 32; in order to facilitate the sliding of the follower 22, the follower 22 may be configured as a ball structure. In addition, in this embodiment, the track 32 is configured to rise and fall in the vertical direction, so that when the follower 22 slides along the track 32, the follower 22 rises and falls in the vertical direction to follow the track 32, thereby driving the measuring head 21 to rise and fall in the vertical direction.
[0051] The track 32 can be a uniform wavy ring. In the actual measurement process, after placing the wafer on the stage 32, the rotating stage 31 can drive the follower 22 to descend along the track 32 until the measuring head 21 contacts the wafer surface and measures the thickness and other parameters of the wafer; the process of rotating and driving the measuring head 21 to descend can effectively reduce the impact force of the measuring head on the wafer compared to the method of directly controlling the descent of the measuring head 21, thereby reducing the possibility of piercing the wafer. When switching the measurement point, the rotating stage 32 can drive the wafer to switch and align the position of the measuring head 21, thereby realizing point switching; and in the process of switching the point, the rotating stage 32 will drive the measuring head 21 to rise and move away from the wafer, avoiding friction and scratches between the wafer and the measuring head 21 during rotation, effectively protecting the wafer.
[0052] That is, in this solution, when the follower 22 moves to the low point of the track 32, the measuring head 21 contacts the wafer; when the follower 22 moves away from the low point of the track 32, the measuring head 21 separates from the wafer. The number of low points of the track 32 can be set according to the number of measurement points required for the wafer. The wafer measuring device provided by this solution can achieve that during measurement, the staff can continuously rotate the stage 32 to control the measuring head 21 to contact and separate from different measurement points of the wafer, thereby switching the wafer measurement points, effectively improving the convenience of the staff's measurement and effectively reducing the probability of wafer damage during the switching process.
[0053] In a further improved embodiment, a damping member 40 is further included; the damping member 40 is disposed on the track 32. The damping member 40 can provide a buffering effect for the sliding process of the follower 22 and provide a buffering effect for the contact between the measuring head 21 and the wafer.
[0054] Specifically, the track 32 includes a high point area and a low point area; when the follower 22 is located in the high point area, the measuring head 21 is separated from the chip on the stage 31; when the follower 22 is located in the low point area, the measuring head 21 is in contact with the chip on the stage 31; the damping member 40 is arranged in the low point area, so that in the process of the follower 22 moving from the high point area to the low point area, that is, in the process of the measuring head 21 descending to contact the chip, the damping member 40 has a buffering effect on the follower 22 and the measuring head 21.
[0055] Optionally, the damping member 40 may be a rubber member.
[0056] In other embodiments, the transmission assembly 30 further includes: an outer knob 35 and a planetary gear 33 ; the outer knob 35 is rotatably disposed on the device body 10 ; and the planetary gear 33 meshes and connects the outer knob 35 and the carrier 31 .
[0057] The outer circumference of the outer knob 35 may be provided with friction patterns to facilitate the user's manipulation. The outer knob 35 is connected to the stage 31 through the planetary gear 33, so that turning the outer knob 35 can control the rotation of the stage 31, and the planetary gear 33 can play a deceleration transmission effect, thereby improving the control progress of the height control of the measuring head 21, and further preventing the measuring head 21 from falling too quickly and damaging the wafer.
[0058] In a more specific embodiment, the transmission assembly 30 also includes: a central shaft 34; the central shaft 34 can be rotatably sleeved in the outer knob 35; the carrier 31 is fixed on the central shaft 34; the planetary gear 33 is arranged between the central shaft 34 and the outer knob 35, and is respectively meshed and connected to the central shaft 34 and the outer knob 35.
[0059] The inner circumference of the outer knob 35 may be provided with an inner gear ring; the outer circumference of the central shaft 34 may be provided with an outer gear ring. The planetary gears 33 may include a plurality of planetary gears distributed around the central shaft 34; the planetary gears 33 mesh with the inner gear ring and the outer gear ring. When the outer knob 35 is turned, the outer knob 35 drives the planetary gears 33 to rotate, and then the planetary gears 33 drive the central shaft 34 and the carrier 31 to rotate.
[0060] The wafer measuring device provided by the embodiment of the present application can improve the measurement efficiency of the wafer and reduce the damage to the wafer during the measurement process, and can effectively improve product quality and measurement accuracy.
[0061] The above are only preferred embodiments of the present application and are not intended to limit the present utility model. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions recorded in the aforementioned examples or make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A wafer measuring device, characterized in that: include: A device body (10), a measuring component (20) and a transmission component (30); The transmission assembly (30) comprises: a carrier (31); The carrier (31) is rotatably arranged on the device body (10); The carrier (31) is surrounded by a track (32) that rises and falls in a vertical direction; The measuring assembly (20) comprises: a measuring head (21) and a follower (22); The measuring head (21) is movably arranged on the device body (10) and is located above the carrier (31); The follower (22) is fixedly connected to the measuring head (21), and the follower (22) is movably arranged on the track (32); During the rotation of the carrier (31), the follower (22) moves along the track (32) and drives the measuring head (21) to rise and fall following the rise and fall of the track (32).
2. The wafer measuring device according to claim 1, characterized in that: The transmission assembly (30) further comprises: an outer knob (35) and a planetary gear (33); The outer knob (35) is rotatably arranged on the device body (10); The planetary gear (33) meshes and connects the outer knob (35) and the carrier (31).
3. The wafer measuring device according to claim 2, characterized in that: The transmission assembly (30) further includes: a central shaft (34); The central shaft (34) is rotatably sleeved in the outer knob (35); The carrier (31) is fixed on the central axis (34); The planetary gear (33) is disposed between the central shaft (34) and the outer knob (35), and is meshedly connected to the central shaft (34) and the outer knob (35) respectively.
4. The wafer measuring device according to claim 3, characterized in that: The inner circumference of the outer knob (35) is provided with an inner gear ring; An outer gear ring is arranged on the outer periphery of the central shaft (34); The planetary gears (33) include a plurality of planetary gears (33) which are distributed circumferentially around the central axis (34); The planetary gear (33) meshes and connects the inner gear ring and the outer gear ring.
5. The wafer measuring device according to claim 1, wherein: The device body (10) is provided with a column (11); The measuring head (21) is arranged on the column (11).
6. The wafer measuring device according to claim 1, characterized in that: The track (32) is in a uniform wavy ring shape.
7. The wafer measuring device according to claim 1 or 6, characterized in that: Also includes a damping member (40); The damping member (40) is arranged on the track (32).
8. The wafer measuring device according to claim 7, characterized in that: The track (32) includes a high point area and a low point area; When the follower (22) is located in the high point area, the measuring head (21) is separated from the wafer on the carrier (31); When the follower (22) is located in the low point area, the measuring head (21) contacts the wafer on the carrier (31); The damping member (40) is arranged in the low point area.
9. The wafer measuring device according to claim 7, characterized in that: The damping member (40) is a rubber member.
10. The wafer measuring device according to claim 1, wherein: The follower (22) is a ball.