Grounding assembly and semiconductor process chamber

Abstract

The utility model discloses a grounding assembly and a semiconductor process chamber, and relates to the technical field of semiconductors. The grounding assembly is used for the semiconductor process chamber and comprises a conductive sleeve, an elastic assembly arranged in the conductive sleeve and a second conductive column, one of the conductive sleeve and the second conductive column is used for being electrically connected with an internal part of the semiconductor process chamber, and the other one of the conductive sleeve and the second conductive column is used for being grounded. According to the scheme, the problems that the grounding performance of internal parts of a current semiconductor process chamber is poor, particles are generated by moving parts of a grounding assembly, the conductive ring cannot be electrically connected with the internal parts due to clamping stagnation of the conductive ring, and the grounding assembly is inconvenient to install and maintain can be solved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a grounding component and a semiconductor process chamber. Background Art

[0002] In the process of wafer thin film preparation, physical vapor deposition is a relatively common method, which specifically involves introducing process gas into the process chamber, generating plasma under the excitation of voltage, bombarding the target material, and the target material particles sputtered by the bombardment fall on the surface of the wafer, thereby completing the preparation of the wafer thin film. However, when the target material particles are deposited on the surface of the wafer, they are also deposited on other structures in the process chamber, which is not desirable. Therefore, replaceable process components such as shielding rings, cover rings and deposition rings are usually set in the process chamber. The process components, wafers, and targets together form a closed process area, thereby limiting the sputtered target material particles within the process area.

[0003] In practical applications, the grounding requirements for structures such as the shielding ring and the base that supports the wafer are very strict. If the grounding is poor, an electric potential difference will be generated between the chamber body with zero potential, causing the gas outside the process area to be excited and produce a glow discharge phenomenon. Since the glow occurs outside the process area and is not desirable, this phenomenon is also called "leakage glow", which contaminates the chamber body and its internal components. In the prior art, the internal parts of the chamber body (such as a shielding ring and a base) are connected in series to achieve grounding through multiple conductive rings, guide rods that limit the movement of the conductive rings along the axis, and multiple elastic devices. However, since the internal parts and the chamber body are connected in series to achieve grounding through multiple conductive rings, the entire power path is longer and the resistance is larger, which makes the grounding performance of the internal parts poor, and further makes it easy for ignition to occur outside the process area; and when the base is raised or lowered, the guide rod of the grounding component moves relative to the conductive ring. At this time, the guide rod will inevitably rub against other parts in the chamber body, thereby generating fine particles and contaminating the wafer. At the same time, if the guide rod of the elastic device tilts during the deformation process, the conductive ring is prone to get stuck, resulting in the inability of the elastic electrical connector of the conductive ring to rise or fall, thereby causing the conductive ring to be unable to achieve electrical connection with the internal parts; in addition, since the internal space of the chamber body is limited and the grounding component has many parts, its installation and maintenance are very inconvenient. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a grounding component and a semiconductor process chamber that can solve the problems of poor grounding performance of internal components of the current semiconductor process chamber, particle generation caused by moving parts of the grounding component, stuck conductive rings that make it impossible for the conductive rings to achieve electrical connection with internal components, and inconvenient installation and maintenance of the grounding component.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a grounding assembly for a semiconductor process chamber, comprising:

[0007] A conductive sleeve, an elastic component arranged in the conductive sleeve, and a second conductive column, wherein one of the conductive sleeve and the second conductive column is used for electrically connecting the internal components of the semiconductor process chamber, and the other is used for grounding.

[0008] In a second aspect, an embodiment of the present application further provides a semiconductor process chamber, comprising:

[0009] chamber body;

[0010] An inner liner, the inner liner being arranged inside the chamber body;

[0011] A base, the base is arranged inside the chamber body, and the base has a supporting surface for supporting a wafer;

[0012] And the above-mentioned grounding assembly, wherein one of the conductive sleeve and the second conductive column is used for electrically connecting to the liner or the base, and the other is used for grounding.

[0013] In the embodiment of the present application, the grounding assembly includes a conductive sleeve, an elastic assembly and a second conductive column, the elastic assembly is arranged in the conductive sleeve, one of the conductive sleeve and the second conductive column is used to electrically connect the internal parts of the semiconductor process chamber, and the other is used for grounding. At this time, the current on the ground with zero potential does not need to flow through the support member in the semiconductor process chamber, which can greatly shorten the current path to reduce the resistance, thereby improving the grounding performance of the internal parts. Therefore, the present application can solve the problem that the internal parts of the semiconductor process chamber currently have poor grounding performance. In addition, when the internal parts move, the grounding assembly is fixed relative to the chamber body, which can avoid friction with other parts in the chamber body to produce fine particles and then contaminate the wafer, and at the same time, it can also avoid the problem in the prior art that if the guide rod of the elastic device is tilted during the deformation process, the conductive ring is easily stuck, resulting in the conductive ring being unable to achieve electrical connection with the internal parts; in addition, the grounding assembly structure provided by the present application is relatively simple, and even if the internal space of the chamber body of the semiconductor process chamber is limited, it is convenient to install and maintain. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the structure of a grounding assembly disclosed in an embodiment of the present application;

[0015] Figure 2 An exploded view of a grounding assembly disclosed in an embodiment of the present application;

[0016] Figure 3A cross-sectional view of a grounding assembly disclosed in an embodiment of the present application;

[0017] Figure 4 A schematic diagram of the structure of a grounding assembly disclosed in an embodiment of the present application;

[0018] Figure 5 A schematic diagram of the structure of a grounding assembly disclosed in another embodiment of the present application;

[0019] Figure 6 A schematic diagram of the structure of a grounding assembly disclosed in another embodiment of the present application;

[0020] Figure 7 This is a schematic structural diagram of a grounding assembly disclosed in yet another embodiment of the present application;

[0021] Figures 8 to 9 Schematic diagram of the structure of the semiconductor process chamber disclosed in the embodiment of the present application at different viewing angles;

[0022] Figure 10 to Figure 11 It is a schematic structural diagram of a semiconductor process chamber disclosed in another embodiment of the present application at different viewing angles;

[0023] Fig.12 This is a schematic structural diagram of a semiconductor process chamber disclosed in yet another embodiment of the present application;

[0024] Fig.13 This is a schematic structural diagram of a semiconductor process chamber disclosed in yet another embodiment of the present application.

[0025] Description of reference numerals:

[0026] 100-chamber body, 110-bottom plate;

[0027] 200-base;

[0028] 300-lining;

[0029] 400-grounding component, 411-first conductive column, 411a-first main body, 411b-first connecting column, 411c-positioning end surface, 411d-accommodating groove, 411e-deformable conductive portion, 412-second conductive column, 412a-second main body, 412b-second connecting column, 412d-guide column, 412e-first end surface, 412f-threaded connecting portion, 412f1-venting hole, 413-conductive sleeve, 413'-first conductive sleeve, 413"-second conductive sleeve, 414-elastic component, 420-conductive connecting member, 421-first connecting hole, 422-first connecting portion, 423-deformable portion, 423a-first section, 423b-second section, 423c-third section, 424-second connecting portion, 425-second connecting hole;

[0030] 500-wafer;

[0031] 610 - power supply, 620 - vacuum pump, 630 - gas source, 640 - target material, 650 - cover ring, 660 - deposition ring, 670 - support member, 680 - insulation ring. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0034] The grounding assembly and the semiconductor process chamber provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0035] like Figures 1 to 7 As shown, the embodiment of the present application discloses a grounding component for a semiconductor process chamber, the grounding component comprising: a conductive sleeve 413, an elastic component 414 disposed in the conductive sleeve 413, a second conductive column 412, the second conductive column 412 being electrically connected to the conductive sleeve 413 through the elastic component 414, one of the conductive sleeve 413 and the second conductive column 412 being used to electrically connect to the internal components of the semiconductor process chamber, and the other being used for grounding. Optionally, the number of elastic components 414 may be one or at least two, when the number of elastic components 414 may be one, only a small driving force is required to drive the elastic component 414 to deform; when the number of elastic components 414 may be at least two, each elastic component 414 is disposed side by side in the conductive sleeve 413 to improve the connection stability between the second conductive column 412 and the conductive sleeve 413.

[0036] In the embodiment of the present application, one of the conductive sleeve 413 and the second conductive column 412 is used to electrically connect the internal parts of the semiconductor process chamber, and the other is used for grounding. At this time, the current on the ground with zero potential does not need to flow through the support 670 in the semiconductor process chamber, which can greatly shorten the current path to reduce resistance, thereby improving the grounding performance of the internal parts. Therefore, the present application can solve the problem of poor grounding performance of the internal parts of the current semiconductor process chamber. In addition, when the internal parts move, the grounding component 400 is fixed relative to the chamber body 100, which can avoid friction with other parts in the chamber body 100 to produce fine particles and then contaminate the wafer 500. At the same time, it can also avoid the problem in the prior art that if the guide rod of the elastic device tilts during the deformation process, the conductive ring is prone to get stuck, resulting in the conductive ring being unable to achieve electrical connection with the internal parts; in addition, the grounding component 400 provided in the present application has a relatively simple structure, and is convenient for installation and maintenance even if the internal space of the chamber body of the semiconductor process chamber is limited.

[0037] In an optional embodiment, the inner component is a liner 300 or a base 200, and in this case, one of the conductive sleeve 413 and the second conductive column 412 is used to electrically connect the liner 300 or the base 200 disposed in the semiconductor process chamber, and the other is used for grounding. Since the grounding requirements for structures such as the liner and the base supporting the wafer 500 are very strict during the process, if the grounding is poor, a potential difference will be generated between the liner and the zero potential ground, resulting in a glow discharge phenomenon, thereby contaminating the chamber body of the semiconductor process chamber and its internal components, therefore, by electrically connecting the grounding component to the liner 300 or the base 200, the occurrence of the glow discharge phenomenon can be reduced, thereby protecting the chamber body and its internal components.

[0038] Optionally, the above-mentioned internal parts can be a lining 300 and a base 200, that is, the number of internal parts can be two, including a first internal part and a second internal part, one of the first internal part and the second internal part is the lining 300, and the other is the base 200. At this time, the conductive sleeve 413 is electrically connected to the lining 300 and the base 200, respectively.

[0039] In an optional embodiment, the elastic component 414 is disposed in the accommodating cavity of the conductive sleeve 413, the first end of the elastic component 414 abuts against the bottom wall of the accommodating cavity, and at least part of the second end of the second conductive column 412 extends into the accommodating cavity of the conductive sleeve 413 and abuts against the elastic component 414, specifically abuts against the second end of the elastic component 414, so that the second conductive column 412 is electrically connected to the conductive sleeve 413 through the elastic component 414. In this solution, the elastic component 414 is connected to the conductive sleeve 413 in an abutting manner, and the connection area between the conductive sleeve 413 and the elastic component 414 is large, which is conducive to improving the connection stability of the elastic connector 413. In addition, when the position of the inner component (such as the liner 300) changes, the conductive sleeve 413 can move relative to the second conductive column 412, and the elastic component 414 is deformed at this time, and the second conductive column 412 can provide guidance for the elastic component 414 and the conductive sleeve 413 to prevent them from tilting.

[0040] Optionally, the elastic component 414 may be always in a deformed state to improve the connection stability between the second conductive pillar 412 and the elastic component 414 .

[0041] Optionally, there may be a gap between part of the circumference of the second conductive column 412 and the conductive sleeve 413, so that when the position of the internal component changes and the internal component needs to be replaced, the conductive sleeve 413 is conveniently displaced relative to the second conductive column 412; or, in other embodiments, the circumference of the second conductive column 412 fits with the inner surface of the conductive sleeve 413, and the accommodating cavity of the conductive sleeve 413 is a closed space. During the deformation of the elastic component 414, particles generated by the friction between the elastic component 414 and the inner wall of the conductive sleeve 413 are stored in the closed space, which can prevent the particles from falling outside the conductive sleeve 413, that is, into the accommodating space of the chamber body 100, thereby avoiding contamination of other structures in the chamber body 100; in addition, the circumference of the second conductive column 412 fits with the inner surface of the conductive sleeve 413, which can provide a better guiding effect for the conductive sleeve 413, thereby avoiding the conductive sleeve 413 from getting stuck during the displacement relative to the second conductive column 412.

[0042] In a further optional embodiment, the second conductive column 412 includes a second main body 412a, a second connecting column 412b and a guide column 412d which are connected in sequence, at least a portion of the second connecting column 412b extends into the accommodating cavity of the conductive sleeve 413, and at least a portion of the elastic component 414 is sleeved on the guide column 412d. At this time, the guide column 412d provides internal guidance for the elastic component 414, and the conductive sleeve 413 provides external guidance for the elastic component 414, that is, the guide column 412d cooperates with the conductive sleeve 413 to avoid the elastic component 414 from tilting during the deformation process, and can be maintained at a certain position without being offset, so that it is not easy for the elastic component 414 to tilt and apply lateral force to the conductive sleeve 413, causing the conductive sleeve 413 to tilt. Therefore, such a setting can prevent the conductive sleeve 413 from getting stuck when replacing internal components. Optionally, the connection between the guide column 412d and the second connecting column 412b forms a first end surface 412e, and the second end of the elastic component 414 abuts against the first end surface 412e, thereby increasing the contact area between the elastic component 414 and the second conductive column 412, thereby improving the conductive performance of the elastic component 414. Of course, the guide column 412d may not be provided, in which case the second end of the elastic component 414 directly abuts against the end surface of the second connecting column 412b.

[0043] Optionally, the cross-sectional shape of the second main body portion 412a may be hexagonal to facilitate installation using a hexagonal wrench.

[0044] Optionally, the diameter of the second main body portion 412 a may be greater than, less than, or equal to the diameter of the second connecting column 412 b , and this embodiment of the present application does not impose any specific limitation on this.

[0045] In another optional embodiment, the conductive sleeve 413 can be directly electrically connected to the inner component (such as the base 200); or, the grounding assembly further includes a conductive connector 420, the first connecting portion 422 of the conductive connector 420 is connected to the conductive sleeve 413, and the conductive connector 420 is used to electrically connect the conductive sleeve 413 and the inner component, so that the conductive sleeve 413 and the inner component are more flexible when electrically connected. Optionally, the conductive connector 420 can be used to electrically connect the conductive sleeve 413 and the base 200.

[0046] It should be noted that the above-mentioned conductive connector 420 and the conductive sleeve 413 can be directly connected or indirectly connected through other internal conductive parts (such as the first conductive column 411 described later), and the embodiments of the present application do not impose any specific restrictions on this. In addition, the conductive connector 420 and the internal parts can be directly connected or indirectly connected, such as through a conductive adapter, and the embodiments of the present application do not impose any specific restrictions on this.

[0047] Optionally, the two ends of the conductive connector 420 are electrically connected to the conductive sleeve 413 and the internal component respectively. When the elastic component 414 is deformed, the conductive sleeve 413 will drive at least part of the conductive connector 420 to move together, and on the basis of ensuring that the conductive connector 420 has good conductive performance, the grounding requirements of the internal components at different heights are met. Of course, the conductive connector 420 can also be electrically connected to the second conductive column 412, that is, the conductive connector 420 can be connected to any one of the conductive sleeve 413, the second conductive column 412, and the first conductive column 411 described later.

[0048] In an optional embodiment, the conductive connector 420 is a deformable member. During the movement of the inner member, the conductive connector 420 is deformed to ensure that the inner member moves smoothly while the two still have good conductivity. Of course, the conductive connector 420 can also be a non-deformable structure. In this case, the conductive connector 420 and the inner member can be connected by sliding, thereby ensuring the smooth movement of the inner member.

[0049] Optionally, the conductive connector 420 may be an integrated deformable component, which has good deformation continuity at various locations, thereby further improving the smoothness of movement of the internal components; and the integrated deformable component is easy to install, thereby improving assembly efficiency.

[0050] In an optional embodiment, the conductive connector 420 includes a deformation portion 423, which may be a part of the conductive connector 420, and the rest of the conductive connector 420 may not be deformed. During the movement of the inner component, the deformation portion 423 is deformed to ensure smooth movement of the inner component.

[0051] In a further optional embodiment, the conductive connector 420 further includes a first connecting portion 422 and a second connecting portion 424, and the first connecting portion 422 and the second connecting portion 424 are respectively connected to the deformable portion 423. Optionally, the first connecting portion 422 and the second connecting portion 424 can be bent relative to the deformable portion 423, and the bending directions of the two are opposite, so that the first connecting portion 422 and the second connecting portion 424 are respectively connected to the conductive sleeve 413 and the inner component. The first connecting portion 422 is electrically connected to the conductive sleeve 413, and the second connecting portion 424 is electrically connected to the inner component. In this solution, when the inner component moves, the deformable portion 423 is deformed, and the second connecting portion 424 moves with the inner component, thereby ensuring that the conductive connector 420 is fully in contact with the inner component, and the conductive performance between the two is good.

[0052] Optionally, the deformation portion 423 is an arc-shaped structure, that is, the deformation portion 423 is a U-shaped structure, thereby reducing the space occupied by the deformation portion 423 to save the accommodation space in the chamber body 100. Specifically, the deformation portion 423 can be a wave-shaped structure, which occupies a larger space; or, in other optional embodiments, the deformation portion 423 includes a first section 423a, a second section 423b and a third section 423c connected in sequence, the first section 423a and the third section 423c are arranged opposite to each other, the first section 423a is connected to the first connecting portion 422, and the third section 423c is connected to the second connecting portion 424. The deformation portion 423 of this structure is more flexible. During the deformation of the deformation portion 423, the lengths of the first section 423a and the third section 423c change dynamically, so that the deformation of the entire deformation portion 423 is smoother, and at the same time, the deformation portion 423 can be prevented from being damaged due to excessive bending angles.

[0053] Alternatively, in other embodiments, the deformable portion 423 is a torsion spring, and the first connection portion 422 and the second connection portion 424 are both connecting rods. Since the torsion spring has good toughness, it has good fatigue resistance and good elasticity, which is conducive to extending the service life of the conductive connector 420.

[0054] Optionally, the conductive sleeve 413 can be directly electrically connected to the inner component (such as the liner 300); or, in any of the above embodiments, the grounding assembly further includes a first conductive column 411, and the first conductive column 411 is connected to the conductive sleeve 413. Optionally, the first conductive column 411 and the conductive sleeve 413 can be connected by welding, threaded connection, or tenon connection, so as to improve the connection firmness between the two. The first conductive column 411 is used to electrically connect the conductive sleeve 413 and the inner component, so that the conductive sleeve 413 and the inner component are more flexible when electrically connected. Optionally, the first conductive column 411 can be used to electrically connect the conductive sleeve 413 and the liner 300.

[0055] Optionally, the first conductive pillar 411 and the inner component may be directly connected or indirectly connected via a conductive adapter, which is not specifically limited in the embodiment of the present application.

[0056] Optionally, the second conductive column 412 is disposed below the first conductive column 411 , so that the grounding component extends in a vertical direction.

[0057] In an optional embodiment, the first conductive column 411 includes a first main body 411a and a first connecting column 411b connected to each other. The first connecting column 411b is connected to the conductive sleeve 413, and the connection area between the two is large, and it has good conductive performance; optionally, the first connecting column 411b and the conductive sleeve 413 can be connected by a detachable connection method such as a threaded connection or a tenon connection, which is convenient for disassembly and maintenance of the first conductive column 411 and the conductive sleeve 413 on the basis of ensuring good conductive performance between the two. Of course, the first connecting column 411b and the conductive sleeve 413 can also be connected by welding or other methods. The connection between the first connecting column 411b and the first main body 411a forms a positioning end face 411c, and the grounding assembly also includes a conductive connector 420, and the first connecting portion 422 of the conductive connector 420 is clamped between the positioning end face 411c and the conductive sleeve 413, thereby increasing the contact area between the conductive connector 420 and the first conductive column 411, thereby improving the conductive performance and connection firmness of the conductive connector 420. Of course, the conductive connecting member 420 may also be bonded or welded to the first conductive pillar 411 to fix the conductive connecting member 420 .

[0058] Optionally, the conductive connector 420 is a plate-shaped structure. In this case, the first connecting portion 422 of the conductive connector 420 is thinner, which can reduce the distance between the positioning end surface 411c and the conductive sleeve 413, thereby reducing the length of the entire grounding assembly.

[0059] It should be noted that in the above embodiment, when the first connection portion 422 of the conductive connector 420 is clamped between the positioning end surface 411 c and the conductive sleeve 413 , the conductive connector 420 can also be electrically connected to the first conductive column 411 , thereby further improving the conductive performance of the conductive connector 420 .

[0060] In an optional embodiment, the first connection portion 422 of the conductive connector 420 is provided with a first connection hole 421, and the first connection hole 421 is sleeved on the first connection column 411b, thereby further improving the connection firmness between the conductive connector 420 and the first conductive column 411. Of course, the first connection portion 422 of the conductive connector 420 may also not be provided with the first connection hole 421, and its edge can be clamped between the positioning end surface 411c and the conductive sleeve 413.

[0061] Optionally, the second connection portion 424 of the conductive connection member 420 may be provided with a second connection hole 425 , and the second connection hole 425 is connected to the inner member through a fastener.

[0062] Optionally, the inner component and the end surface of the first end of the first conductive column 411 can be directly connected, but the two are in hard contact and the connection area is small; therefore, in another optional embodiment, the first conductive column 411 includes a deformable conductive portion 411e, and optionally, the deformable conductive portion 411e can be a conductive spring, a conductive spring, etc., which is not specifically limited here. Optionally, the surface of the deformable conductive portion 411e can be plated with a material with good conductivity such as silver, gold, copper, aluminum, etc., so as to improve its conductivity. The end surface of the first end of the first conductive column 411 is provided with a receiving groove 411d, and at least part of the deformable conductive portion 411e is arranged in the receiving groove 411d. The deformable conductive portion 411e is used to abut the inner component or the ground, and the inner component or the ground is electrically connected to the first conductive column 411 through the deformable conductive portion 411e, so that the inner component or the ground is fully in contact with the first conductive column 411, thereby improving the conductivity of the first conductive column 411 and the inner component or the ground. Optionally, the first conductive column 411 is electrically connected to the liner 300 through the deformation conductive portion 411 e.

[0063] It should be noted that when the inner member or ground is pressed on the deformable conductive portion 411e, the inner member or ground may also contact the end surface of the first end of the first conductive column 411 (ie, the edge of the accommodating groove 411d), thereby further improving the conductivity of the first conductive column 411.

[0064] In an optional embodiment, the grounding assembly 400 includes a plurality of the above-mentioned conductive sleeves 413 and a plurality of the above-mentioned second conductive pillars 412, and adjacent conductive sleeves 413 are connected in series through the second conductive pillars 412, that is, adjacent conductive sleeves 413 are electrically connected and physically connected through the second conductive pillars 412, so as to improve the structural strength and conductive performance of the grounding assembly, and avoid the poor structural stability and conductive performance of the elastic assembly 414 disposed in the conductive sleeve 413 when the length of the grounding assembly is large. Of course, the conductive sleeve 413 can also be a continuous integral structure.

[0065] Further optionally, the multiple conductive sleeves 413 include at least a first conductive sleeve 413' and a second conductive sleeve 413", and both ends of the second conductive column 412 can extend into the first conductive sleeve 413' and the second conductive sleeve 413", respectively, so that the second conductive column 412 is in full contact with the adjacent conductive sleeves 413, thereby improving the connection stability and conductive performance between the conductive sleeves 413.

[0066] like Figures 8 to 13As shown, based on the grounding component disclosed in the embodiment of the present application, the embodiment of the present application also discloses a semiconductor process chamber, which includes: a chamber body 100; a liner 300, the liner 300 is arranged inside the chamber body 100, and optionally, the liner 300 can specifically be a shielding ring; a base 200, the base 200 is arranged inside the chamber body 100, and the base 200 has a supporting surface for supporting a wafer 500; and a grounding component 400 described in any of the above embodiments, wherein one of the conductive sleeve 413 and the second conductive column 412 is used to electrically connect the liner 300 or the base 200, and the other is used for grounding. Optionally, the ground here can be the chamber body 100. Since the atmospheric side of the chamber body 100 is grounded, the chamber body 100 is a zero potential structure. As the ground, the structure of the chamber body 100 can be simplified. Of course, an additional zero potential structure can also be set in the chamber body 100 as the ground.

[0067] Optionally, a power supply 610, a vacuum pump 620 and a gas source 630 are provided outside the chamber body 100. The vacuum pump 620 is used to extract the gas in the chamber body 100 to maintain a vacuum state in the chamber body 100. The gas source 630 is used to transport process gas into the chamber body 100 in a vacuum state. The power supply 610 is used to apply voltage to form plasma.

[0068] Optionally, structures such as a target 640, a cover ring 650, a deposition ring 660, and a support member 670 may be further disposed in the chamber body 100. The plasma is used to bombard the target 640, and the bombarded target particles fall on the surface of the wafer 500 to form a thin film. The support member 670 is disposed on the chamber body 100. The support member 670 is used to support the liner 300. The target 640, the liner 300, the cover ring 650, the deposition ring 660, and the wafer 500 together enclose a process area ( Figures 8 to 13 There is a gap between the cover ring 650 and the liner 300 to allow process gas to enter the process area, and the gap can ground the liner 300, which has zero potential, thereby achieving smooth ignition.

[0069] Optionally, an insulating ring 680 is further provided in the chamber body 100 . The insulating ring 680 is supported on the support member 670 . The insulating ring 680 is used to separate the target material 640 from the zero potential ground.

[0070] In addition, the elastic component 414 is a deformable member to meet the needs of semiconductor process chambers for different processes. For example, different processes may require different distances between the target 640 and the wafer 500, or different distances between the liner 300 and the bottom wall of the chamber body 100.

[0071] In an optional embodiment, the grounding assembly further includes a conductive connector 420 and a first conductive column 411, the two ends of the conductive connector 420 are respectively connected to the base 200 and the conductive sleeve 413, the first end of the second conductive column 412 is connected to the chamber body 100, and at least part of the second end of the second conductive column 412 extends into the conductive sleeve 413. When the elastic component 414 is deformed, the second conductive column 412 provides guidance for the conductive sleeve 413 to prevent the conductive sleeve 413 from tilting. The first conductive column 411 abuts against the liner 300 so that the two are in full contact, thereby improving the electrical connection stability between the grounding assembly 400 and the liner 300.

[0072] Optionally, when different processes require replacement of the liner 300, the distance between the liner 300 and the bottom wall of the chamber body 100 is different. At this time, the elastic component 414 is deformed, and at the same time, the conductive connector 420 is driven to move. On the basis of ensuring that the conductive sleeve 413 and the conductive connector 420 have good contact performance, the application scope of the grounding component 400 is expanded, so that the grounding component 400 can be compatible with multiple processing processes or multiple sizes of liners 300; in addition, the elastic component 414 can always be in a deformed state, thereby increasing the contact area between the grounding component 400 and the liner 300 and the chamber body 100, respectively, thereby improving the conductivity of the grounding component 400.

[0073] In an optional embodiment, the first end of the second conductive column 412, i.e., the end facing away from the first conductive column 411, has a threaded connection portion 412f, and the threaded connection portion 412f is threadedly connected to the bottom plate 110 of the chamber body 100, thereby facilitating the disassembly and maintenance of the second conductive column 412; and, the second conductive column 412 is threadedly connected to the bottom plate 110 of the chamber body 100, which can increase the connection area between the two, thereby improving the conductivity of the second conductive column 412; in addition, the bottom plate 110 of the chamber body 100 is usually grounded, and the second conductive column 412 is threadedly connected to the bottom plate 110 of the chamber body 100, which can further shorten the current path, thereby improving the grounding performance of the liner 300 and the base 200.

[0074] When the second conductive column 412 is threadedly connected to the chamber body 100, the connection operation needs to be performed in the atmospheric state. Since the depth of the threaded hole usually opened on the chamber body 100 is greater than the length of the threaded connection portion 412f of the first conductive column 411, a part of air will remain in the threaded hole, and this part of air will be slowly released under a vacuum environment, thereby affecting the vacuum environment in the chamber body 100. Based on this, optionally, the end surface of the threaded connection portion 412f is provided with an air leakage hole 412f1, and the air leakage hole 412f1 is connected to the accommodation space of the chamber body 100 to release the air in the threaded hole, so that this part of air is extracted before the process is carried out, so that the chamber body 100 maintains a vacuum state during the process.

[0075] For example, in the deposition process, the pedestal 200 needs to rise a specified distance so that the wafer 500 reaches the optimal position. As the deposition process proceeds, the pedestal 200 is usually required to rise or fall a certain distance to control the distance between the wafer 500 and the target 640, so that the quality of the deposited film meets the requirements. Taking the rising height t of the pedestal 200 as an example, after the deformation of the conductive connector 420, the grounding assembly 400 still has a good working state, that is, the liner 300, the pedestal 200, and the chamber body 100 have good grounding performance at the same time.

[0076] Optionally, the number of the grounding components 400 may be one or more, and each grounding component 400 is arranged around the circumference of the base 200, thereby further improving the grounding performance of the liner 300 and the base 200. Optionally, each grounding component 400 may be arranged at intervals along the circumference of the base 200 to avoid mutual interference between adjacent grounding components 400.

[0077] Optionally, when the process requirements are not high, a conductive adapter with good conductive properties can be set between the first conductive column 411 and the lining 300 and between the conductive connector 420 and the base 200, so as to meet more compatibility of the grounding component 400, such as being suitable for bases 200, chamber bodies 100 and linings 300 of various sizes.

[0078] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A grounding assembly for a semiconductor process chamber, characterized in that: include: A conductive sleeve (413), an elastic component (414) arranged in the conductive sleeve (413), and a second conductive column (412), one of the conductive sleeve (413) and the second conductive column (412) is used to electrically connect the internal components of the semiconductor process chamber, and the other is used for grounding.

2. The grounding assembly according to claim 1, characterized in that: The inner component is a liner (300) or a base (200).

3. The grounding assembly according to claim 1, characterized in that: The elastic component (414) is arranged in the accommodating cavity of the conductive sleeve (413), and the first end of the elastic component (414) abuts against the bottom wall of the accommodating cavity. At least a portion of the second end of the second conductive column (412) extends into the accommodating cavity of the conductive sleeve (413) and abuts against the elastic component (414).

4. The grounding assembly according to claim 1, characterized in that: The circumferential surface of the second conductive column (412) is in contact with the inner surface of the conductive sleeve (413).

5. The grounding assembly according to claim 3, characterized in that: The second conductive column (412) comprises a second main body (412a), a second connecting column (412b) and a guide column (412d) which are connected in sequence, at least a portion of the second connecting column (412b) extends into the accommodating cavity of the conductive sleeve (413), at least a portion of the elastic component (414) is sleeved on the guide column (412d), and a first end surface (412e) is formed at a connection between the guide column (412d) and the second connecting column (412b), and a second end of the elastic component (414) abuts against the first end surface (412e).

6. The grounding assembly according to claim 5, characterized in that: The grounding assembly further comprises a conductive connector (420), a first connecting portion (422) of the conductive connector (420) being connected to the conductive sleeve (413), and the conductive connector (420) being used to electrically connect the conductive sleeve (413) and the inner component.

7. The grounding assembly according to claim 6, characterized in that: The conductive connecting member (420) is a deformable member.

8. The grounding assembly according to claim 7, characterized in that: The conductive connecting member (420) comprises a deformation portion (423), the first connecting portion (422) and a second connecting portion (424), wherein the first connecting portion (422) and the second connecting portion (424) are respectively connected to the deformation portion (423).

9. The grounding assembly according to claim 8, characterized in that: The deformation part (423) is a torsion spring, and the first connection part (422) and the second connection part (424) are connecting rods.

10. The grounding assembly according to any one of claims 1 to 9, characterized in that: The grounding assembly further comprises a first conductive column (411), wherein the first conductive column (411) is connected to the conductive sleeve (413), and the first conductive column (411) is used to electrically connect the conductive sleeve (413) and the inner component.

11. The grounding assembly according to claim 10, characterized in that: The first conductive column (411) comprises a first main body (411a) and a first connecting column (411b) which are connected to each other. The first connecting column (411b) is connected to the conductive sleeve (413). A positioning end surface (411c) is formed at the connection between the first connecting column (411b) and the first main body (411a). The grounding component also comprises a conductive connector (420). A first connecting portion (422) of the conductive connector (420) is clamped between the positioning end surface (411c) and the conductive sleeve (413).

12. The grounding assembly according to claim 10, characterized in that: The first conductive column (411) comprises a deformable conductive portion (411e), an end surface of a first end of the first conductive column (411) is provided with a receiving groove (411d), at least a portion of the deformable conductive portion (411e) is disposed in the receiving groove (411d), and the deformable conductive portion (411e) is used to abut against the inner component or the ground.

13. The grounding assembly according to claim 1, characterized in that: The grounding assembly (400) comprises a plurality of the conductive sleeves (413) and a plurality of the second conductive pillars (412), and adjacent conductive sleeves (413) are connected in series via the second conductive pillars (412).

14. The grounding assembly according to claim 13, characterized in that: The plurality of conductive sleeves (413) include at least a first conductive sleeve (413') and a second conductive sleeve (413"), and two ends of the second conductive column (412) can extend into the first conductive sleeve (413') and the second conductive sleeve (413") respectively.

15. A semiconductor process chamber, characterized in that: include: Chamber body(100); An inner liner (300), the inner liner (300) being arranged inside the chamber body (100); A base (200), the base (200) being arranged inside the chamber body (100), the base (200) having a supporting surface for supporting a wafer (500); And the grounding assembly (400) according to any one of claims 1 to 14, wherein one of the conductive sleeve (413) and the second conductive column (412) is used for electrically connecting the liner (300) or the base (200), and the other is used for grounding.

16. The semiconductor process chamber according to claim 15, characterized in that: The grounding assembly also includes a conductive connector (420) and the first conductive column (411), wherein two ends of the conductive connector (420) are respectively connected to the base (200) and the conductive sleeve (413), a first end of the second conductive column (412) is connected to the chamber body (100), at least a portion of the second end of the second conductive column (412) extends into the conductive sleeve (413), and the first conductive column (411) abuts against the liner (300).

17. The semiconductor process chamber according to claim 16, wherein: The first end of the second conductive column (412) has a threaded connection portion (412f), and the threaded connection portion (412f) is threadedly connected to the bottom plate (110) of the chamber body (100). The end surface of the threaded connection portion (412f) is provided with an air leakage hole (412f1), and the air leakage hole (412f1) is connected to the accommodating space of the chamber body (100).

18. The semiconductor process chamber according to claim 15, wherein: The number of the grounding components (400) is one or more, and each of the grounding components (400) is arranged circumferentially around the base (200).

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