Power module and vehicle inverter

Abstract

The utility model provides a power module and a vehicle inverter, the power module comprises a heat dissipation assembly, a bus capacitor and a power module, the heat dissipation assembly comprises a heat dissipation substrate and a heat dissipation structure, the heat dissipation substrate is internally provided with a heat dissipation cavity, the heat dissipation cavity is arranged along the extension direction of the heat dissipation substrate, and the heat dissipation structure is arranged in the heat dissipation cavity; the bus capacitor and the power module are installed on the two opposite sides of the heat dissipation substrate respectively, and the bus capacitor and the power module are located on the outer surface of the heat dissipation cavity. Compared with the prior art, the heat dissipation structure is arranged in the heat dissipation substrate through the heat dissipation cavity in the heat dissipation substrate, so that parts such as screws and sealing rings required between the heat dissipation substrate and the shell are reduced, the design cost is reduced, the structural design is simplified, and the overall integration level of the power module is relatively high.

Description

Technical Field

[0001] The utility model relates to the technical field of inverters, and in particular to a power module and a vehicle inverter. Background Art

[0002] During operation, new energy electric vehicles need to convert the high-voltage direct current of the battery pack into the alternating current required for motor operation. Therefore, as the core component of the direct current to alternating current conversion, the layout, structure and key parameters of the inverter have a great impact on the performance of the whole vehicle. In new energy vehicles, the dual inverter receives the input signal from the outside world. After the high-voltage direct current is filtered and input by the DC bus capacitor, it outputs two alternating currents, one for driving the motor and the other for driving the generator. Compared with the single inverter of new energy pure electric vehicles, the dual inverter has a more complex internal layout, a larger size, a more complex production process and a higher cost.

[0003] With the rise of the new energy vehicle industry and the market demand for vehicle functionality, higher requirements are placed on the miniaturization, lightweight and low cost of the inverter design. Therefore, the core parts of the inverter (i.e., the power module) have a greater impact on the overall layout design of the inverter. The power module mainly includes a DC bus capacitor, a power module 10, a transfer copper bus and a water-cooled plate assembly. When the power module is powered on, the power module 10 and the bus capacitor will generate heat. In order to ensure the functionality and safety of the whole machine, the power module 10 and the bus capacitor need to be effectively cooled. Therefore, when arranging the power module, an efficient heat dissipation solution needs to be designed, while taking into account the requirements of miniaturization, lightweight, low cost and high power density of the inverter module.

[0004] like Figure 1 As shown, the main heat dissipation and layout scheme for the dual inverter is as follows: the power module 10 and the water-cooled substrate 20 are first packaged as one body, a pin-fin heat dissipation structure (i.e., a PinFin heat dissipation column structure, PinFin structure) is designed at the bottom of the water-cooled substrate 20, the sealing ring 40 is installed in the sealing groove of the shell 50, and the shell 50 and the water-cooled substrate 20 are sealed by fastening with screws 60, thereby forming a closed water channel cavity. When the coolant passes into the water channel cavity and flows through the PinFin structure 30 at the bottom of the water-cooled substrate 20, the coolant will take away the heat on the PinFin structure 30, thereby dissipating the heat of the power module 10 above the water-cooled substrate 20.

[0005] The advantages of the above solution are high heat dissipation efficiency and simple assembly process, but there are still at least the following disadvantages:

[0006] (1) The method of fastening with screws 60 requires a larger assembly space, so the inverter is larger in size and difficult to meet the requirements of miniaturization. Even if the water-cooling base plate 20 and the housing 50 are fixed by welding, on the one hand, sufficient laser welding fixture space needs to be reserved, and on the other hand, it is difficult to weld the copper water-cooling base plate 20 and the aluminum housing 50. Therefore, the production cost will be increased and the volume will be larger;

[0007] (2) The core components of this solution include a water-cooled base plate 20, a sealing ring 40, and a housing 50, etc., which have a low integration level and are not conducive to improving the power density of the whole machine;

[0008] (3) Due to space and process limitations, it is difficult to design a structure of the support plate 80 for fixing the circuit control board 70 on the water-cooled base plate 20, and it is impossible to integrate the circuit control board 70, the support plate 80 and the power module into one, so the integration is poor;

[0009] (4) The conventional connection method between the power module 10 and the water-cooled substrate 20 is a silver sintering process. The silver paste used in the production process is relatively expensive, which is not conducive to cost reduction.

[0010] (5) The signal connection between the traditional power module 10 and the circuit control board 70 is achieved by selecting a plurality of pins 90 set by welding or crimping technology, so the production process cost is relatively high. In addition, when the length of the pins 90 remains unchanged, the height between the circuit control board 70 and the power module 10 is fixed, so it is difficult to freely adjust the height of the entire inverter, which is not conducive to the flexibility and compatibility of the overall layout design of the inverter. Utility Model Content

[0011] The utility model aims to provide a power module and a vehicle inverter to solve the problem that the layout design of the power module in the prior art leads to a large inverter volume and is difficult to meet the miniaturization requirements.

[0012] To solve the above technical problems, based on one aspect of the utility model, the utility model provides a power module, which includes a heat dissipation component, a bus capacitor and a power module;

[0013] The heat dissipation assembly includes a heat dissipation substrate and a heat dissipation structure. The heat dissipation substrate has a heat dissipation cavity therein, and the heat dissipation cavity is arranged along the extension direction of the heat dissipation substrate. The heat dissipation structure is arranged in the heat dissipation cavity.

[0014] The bus capacitor and the power module are respectively mounted on two opposite sides of the heat dissipation substrate, and both the bus capacitor and the power module are located on the outer surface of the heat dissipation cavity.

[0015] Optionally, the number of the power modules is at least one; the power module includes a U-phase power unit, a V-phase power unit and a W-phase power unit which are arranged on the heat dissipation substrate at intervals from each other.

[0016] Optionally, a metal welding layer is provided on one side of the heat dissipation substrate, and the heat dissipation substrate is welded to the power module via the metal welding layer; or, the heat dissipation substrate is sintered to the power module.

[0017] Optionally, the heat dissipation substrate and the power module are welded by vapor phase welding or reflow welding.

[0018] Optionally, the power module also includes a circuit board assembly and a signal connection assembly, the circuit board assembly is mounted on the heat dissipation substrate, the power module is located between the heat dissipation substrate and the circuit board assembly, and the power module and the circuit board assembly are electrically connected via the signal connection assembly.

[0019] Optionally, the signal connection assembly includes a plurality of flexible circuit boards, one end of the flexible circuit board is welded to the power module, and the other end of the flexible circuit board is plugged into the circuit board assembly.

[0020] Optionally, the signal connection assembly includes a plurality of rigid pins, one end of each rigid pin is welded to the power module, and the other end of each rigid pin is welded to the circuit board assembly;

[0021] Alternatively, the signal connection assembly includes a plurality of plug-in communication components, one end of each of which is plugged into the power module, and the other end of each of which is plugged into the circuit board assembly.

[0022] Optionally, the circuit board assembly is provided with a plurality of connection columns protruding toward the heat dissipation substrate, and the connection columns are connected to the heat dissipation substrate by welding or screws.

[0023] Optionally, the circuit board assembly includes a circuit control board, which is mounted on the heat dissipation substrate and is electrically connected to the signal connection assembly.

[0024] Alternatively, the circuit board assembly includes a support plate and a circuit control board, the circuit control board is mounted on the support plate, the support plate is connected to the heat dissipation substrate, and the signal connection assembly passes through the support plate and is electrically connected to the circuit control board.

[0025] Optionally, the power module also includes a DC transfer copper bus, an AC transfer copper bus and a three-phase output copper bus, the power module and the bus capacitor are electrically connected through the DC transfer copper bus, and the power module and the three-phase output copper bus are connected through the AC transfer copper bus.

[0026] Optionally, the heat dissipation structure includes a pin-fin-shaped heat dissipation column structure, and the heat dissipation structure is welded to the heat dissipation substrate.

[0027] Based on another aspect of the utility model, the utility model also provides a vehicle inverter, which includes the power module as described above.

[0028] In the power module and vehicle inverter provided by the utility model, the power module includes a heat dissipation component, a bus capacitor and a power module, the heat dissipation component includes a heat dissipation substrate and a heat dissipation structure, the heat dissipation substrate has a heat dissipation cavity, and the heat dissipation cavity is arranged along the extension direction of the heat dissipation substrate, and the heat dissipation structure is arranged in the heat dissipation cavity; the bus capacitor and the power module are respectively installed on the opposite sides of the heat dissipation substrate, and the bus capacitor and the power module are both located on the outer surface of the heat dissipation cavity. Compared with the prior art, the utility model arranges the heat dissipation structure in the heat dissipation substrate through the heat dissipation cavity in the heat dissipation substrate, reduces the screws and sealing rings required between the heat dissipation substrate and the shell, reduces the design cost, simplifies the structural design, and makes the overall integration of the power module higher, and the bus capacitor and the power module are both cooled by the cooling medium flowing in the heat dissipation cavity and the heat dissipation structure, so that the bus capacitor and the power module share the same cooling structure, which can improve the heat dissipation efficiency, improve the overall integration of the power component, reduce the volume, make the overall structure more compact, and meet the requirements of miniaturization.

[0029] It should be noted that, since the inverter includes the power module, it also has the beneficial technical effects brought by the power module, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Those skilled in the art should understand that the drawings provided are for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.

[0031] Figure 1 It is a schematic diagram of a power module liquid cooling design in the prior art;

[0032] Figure 2 This is an exploded view of a power module of an embodiment of the utility model;

[0033] Figure 3 This is a schematic diagram of separating the circuit board components from the power module of one embodiment of the utility model;

[0034] Figure 4 This is an assembly diagram of a power module of an embodiment of the utility model;

[0035] Figure 5 is a schematic diagram of a power module according to an embodiment of the present utility model;

[0036] Figure 6 It is an exploded view of a circuit board assembly according to an embodiment of the utility model.

[0037] In the attached figure:

[0038] 10-power module; 20-water-cooling base plate; 30-PinFin structure; 40-sealing ring; 50-housing; 51-water-cooling cavity; 60-screw; 70-circuit control board; 80-support board; 90-pin;

[0039] 100-power unit; 110-heat dissipation substrate; 111-heat dissipation cavity; 120-busbar capacitor; 130-metal welding layer; 140-flexible circuit board; 150-connecting column; 160-DC transfer copper busbar; 170-AC transfer copper busbar; 180-three-phase output copper busbar. DETAILED DESCRIPTION

[0040] In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.

[0041] As used in the present invention, the singular forms "one", "an" and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the term "at least two" is usually used to include the meaning of "two or more". In addition, the terms "first", "second" and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" and "the proximal end" and "the distal end" generally refer to two corresponding parts, which not only include the endpoints, and the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. In addition, as used in the present invention, an element disposed on another element generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements may be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, an element may be in any orientation such as inside, outside, above, below or on one side of another element, unless otherwise clearly indicated in the content. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] Figure 2 This is an exploded view of a power module of an embodiment of the utility model. Figure 3 This is a schematic diagram of separating the circuit board components from the power module of one embodiment of the utility model. Figure 4 This is an assembly diagram of a power module of an embodiment of the utility model. Figures 2 to 4, an embodiment of the utility model schematically provides a power module suitable for a vehicle inverter, the power module comprising a heat dissipation component, a bus capacitor 120 and a power module 10. The heat dissipation component comprises a heat dissipation substrate 110 and a heat dissipation structure, the heat dissipation substrate 110 has a heat dissipation cavity 111, and the heat dissipation cavity 111 is arranged along the extension direction of the heat dissipation substrate 110 (that is, the plate-shaped direction of the heat dissipation substrate 110), so that the heat dissipation cavity 111 is roughly a plate-shaped cavity, the heat dissipation structure is arranged in the heat dissipation cavity 111, and the heat dissipation structure is arranged in the heat dissipation cavity 111 within the range of the heat dissipation cavity 111 along the extension direction of the heat dissipation substrate 110, ensuring that the heat dissipation cavity 111 has a heat dissipation structure at every location. The bus capacitor 120 and the power module 10 are respectively mounted on opposite sides of the heat dissipation substrate 110, and the bus capacitor 120 and the power module 10 are both located on the outer surface of the heat dissipation cavity 111, so that the heat generated by the power module 10 and the bus capacitor 120 during operation can be conducted to the heat dissipation structure. It should be noted that the heat dissipation cavity 111 has a medium inlet and a medium outlet, and the setting positions of the medium inlet and the medium outlet are not limited, for example, they can be respectively set on the opposite sides of the heat dissipation cavity 111 along the extension direction of the heat dissipation substrate 110, and of course, they can also be set on the same side of the heat dissipation cavity 111. The cooling medium enters the heat dissipation cavity 111 from the medium inlet and flows out of the heat dissipation cavity 111 from the medium outlet, so that the heat on the heat dissipation structure is taken out by the cooling medium, and the heat dissipation of the power module 10 and the bus capacitor 120 is realized. The cooling medium here can be a coolant or a cooling gas. In this way, the utility model sets the heat dissipation structure in the heat dissipation substrate 110 through the heat dissipation cavity 111 in the heat dissipation substrate 110, reduces the screws 60 and the sealing ring 40 and other parts required between the heat dissipation substrate 110 and the shell 50, reduces the design cost, simplifies the structural design, and makes the overall integration of the power module higher. In addition, the bus capacitor 120 and the power module 10 are both cooled by the cooling medium and the heat dissipation structure flowing in the heat dissipation cavity 111, so that the bus capacitor 120 and the power module 10 share the same set of cooling structures, which can improve the heat dissipation efficiency, improve the overall integration of the power component, reduce the volume, make the overall structure more compact, and meet the requirements of miniaturization. In one embodiment, the heat dissipation substrate 110 is formed by metal brazing of the upper and lower parts of the shell 50 (the material can be aluminum), and the heat dissipation cavity 111 is integrally formed inside, which has good airtightness.

[0043] In one embodiment, the heat dissipation structure is a heat dissipation fin pin, that is, a commonly used PinFin heat dissipation column structure (see Figure 1The PinFin structure 30 in the heat dissipation cavity 111 is formed, and a plurality of heat dissipating fins are welded on the inner surface of the heat dissipating cavity 111. The heat generated by the power module 10 during operation is conducted to the heat dissipating fins. The heat generated by the bus capacitor 120 during operation is conducted to the heat dissipating fins. The cooling medium entering and exiting the heat dissipating cavity 111 takes away the heat from the heat dissipating fins, thereby achieving heat dissipation for the bus capacitor 120 and the power module 10.

[0044] As can be understood by those skilled in the art, the function of the inverter is to convert direct current into alternating current, thereby outputting the alternating current to the motor or generator of the vehicle. In this embodiment, the number of power modules 10 can be one, then the inverter is a single inverter, and the converted alternating current is used to drive the motor or the generator; the number of power modules 10 can also be two, then the inverter is a dual inverter, thereby outputting two alternating currents, one for driving the motor and the other for driving the generator. The number of power modules 10 can also be more than two, thereby converting and outputting multiple alternating currents, which can be provided to at least one alternating current for the motor and at least one alternating current for the generator.

[0045] Figure 5 Schematic diagram of a power module according to an embodiment of the present invention. Figure 5 The power module 10 includes three power units 100, which are sequentially arranged on a heat dissipation substrate 110. The three power units 100 are respectively a U-phase power unit, a V-phase power unit and a W-phase power unit, which correspond to the U-phase, V-phase and W-phase of the three-phase alternating current, respectively. Figure 5 Two power modules 10 are shown, with a total of six power units. In one embodiment, the power module 10 may be an IGBT module, and the power unit 100 is an IGBT. Figure 2 and Figure 3 A plurality of power units 100 are sequentially arranged on one side of the heat dissipation substrate 110 along the length direction of the heat dissipation substrate 110, wherein three power units 100 form a group as a power module 10, and the three power units 100 of a power module 10 may be sequentially arranged adjacent to each other, or the power units 100 of other power modules 10 may be arranged therein.

[0046] The bus capacitor 120 can be used to store energy, balance voltage and current, and prevent electromagnetic interference. Figure 2, the bus capacitor 120 is connected to direct current, the power module 10 and the bus capacitor 120 are electrically connected through a direct current transfer copper bar 160, the power module 10 and the three-phase output copper bar 180 are connected through an alternating current transfer copper bar 170, and the three-phase output copper bar 180 is connected to a generator or a motor, thereby outputting three-phase alternating current to the generator or the motor. Specifically, each power unit 100 is connected to the bus capacitor 120 through a direct current transfer copper bar 160, and each power unit 100 is connected to the three-phase output copper bar 180 through an alternating current output copper bar.

[0047] Furthermore, the heat dissipation substrate 110 is welded to the power module 10, that is, welded to each power unit 100 of the power module 10. Generally, the material of the heat dissipation substrate 110 is different from the material of the outer surface of the power module 10. A metal welding layer 130 ( Figure 2 As shown), the metal material of the metal welding layer 130 is the same as the metal material of the outer surface of the power module 10, so that the heat dissipation substrate 110 is welded to the power module 10 through the metal welding layer 130 to achieve the welding connection between the heat dissipation substrate 110 and the power module 10. In one embodiment, the material of the heat dissipation substrate 110 is aluminum, and the metal welding layer 130 formed into a copper layer is sprayed on the heat dissipation substrate 110, and the heat dissipation substrate 110 is welded to the power module 10 through the copper layer. Furthermore, the welding method between the heat dissipation substrate 110 and the power module 10 is vapor phase welding or reflow soldering. In other embodiments, the connection method between the heat dissipation substrate 110 and the power module 10 is a sintering connection, such as a silver sintering connection. In this way, compared with the prior art that uses a fastener (such as a screw) to achieve the connection method between the power module 10 and the heat dissipation substrate 110, the power module 10 in this embodiment is directly welded to the heat dissipation substrate 110, which reduces the installation of mechanical parts and can improve the vibration resistance between the power module 10 and the heat dissipation substrate 110 during vehicle operation. The bus capacitor 120 may be mechanically mounted on the heat dissipation substrate 110 by means of screws 60 .

[0048] Furthermore, the power module further includes a circuit board assembly and a signal connection assembly, wherein the circuit board assembly is mounted on the heat dissipation substrate 110, the power module 10 is located between the heat dissipation substrate 110 and the circuit board assembly, and the power module 10 and the circuit board assembly are electrically connected via the signal connection assembly. The circuit board assembly obtains the signal of the power module 10 via the signal connection assembly and controls the operation of the power module 10. Figure 6 is a schematic diagram of a circuit board assembly of an embodiment of the utility model. In one embodiment, refer to Figure 3 , Figure 4 and Figure 6The circuit board assembly includes a support plate 80 and a circuit control board 70. Preferably, the support plate 80, the circuit control board 70 and the heat dissipation substrate 110 are parallel to each other. The circuit control board 70 is mounted on the support plate 80, and the support plate 80 is connected to the heat dissipation substrate 110. The power module 10 is located between the support plate 80 and the heat dissipation substrate 110. The signal connection assembly passes through the support plate 80 and is electrically connected to the circuit control board 70.

[0049] Preferably, the circuit board assembly only includes a circuit control board 70, the circuit control board 70 is mounted on the heat dissipation substrate 110, the power module 10 is located between the heat dissipation substrate 110 and the circuit control board 70, and the circuit control board 70 is electrically connected to the signal connection assembly. Compared with the need to additionally set up a support plate 80 to install the circuit control board 70, this embodiment can directly install the circuit control board 70 on the heat dissipation substrate 110 and directly weld the power module 10 on the heat dissipation substrate 110, which can save installation components and reflects that the heat dissipation substrate 110 itself can be used as a support member to install the power module 10 and the circuit control board 70, so that the power module as a whole is highly integrated.

[0050] Further, see Figure 3 and Figure 6 The circuit board assembly is provided with a plurality of connection posts 150 protruding toward the heat dissipation substrate 110, and the connection posts 150 are connected to the heat dissipation substrate 110 by welding or screws 60. When the circuit board assembly includes the support plate 80 and the circuit control board 70, the connection posts 150 are arranged on the support plate 80. When the circuit board assembly includes only the circuit control board 70, the connection posts 150 are arranged on the circuit control board 70.

[0051] See also Figure 2 , Figure 3 and Figure 5 In this embodiment, the signal connection assembly includes a plurality of flexible circuit boards 140, one end of the flexible circuit board 140 is welded to the power module 10 (such as laser welding), and the other end of the flexible circuit board 140 is plugged into the circuit board assembly, specifically the circuit control board 70. When the circuit board assembly has a support plate 80, the flexible circuit board 140 passes through the support plate 80 and is plugged into the circuit control board 70. Specifically, the flexible circuit board 140 corresponds to the power unit 100 one by one, and the flexible circuit board 140 is welded on the corresponding power unit 100 to realize the electrical connection between the power unit 100 and the circuit control board 70. In this way, due to its own elastic characteristics, the flexible circuit board 140 can not only ensure the electrical connection between the power module 10 and the circuit board, but also realize the adjustable distance between the power module 10 and the circuit board assembly under the premise of the electrical connection between the two, thereby improving the flexibility and compatibility of the power module.

[0052] In other embodiments, the signal connection assembly includes a plurality of rigid pins (see Figure 1 The pin 90 in the circuit board assembly is welded to the power module 10 at one end of the rigid pin, and the other end of the rigid pin is welded to the circuit control board 70 of the circuit board assembly. Alternatively, the signal connection assembly includes a plurality of plug-in communication components, one end of which is plugged into the power module 10, and the other end of which is plugged into the circuit control board 70 of the circuit board assembly. In this way, the connection between the power module 10 and the circuit board assembly and the plug-in communication components is a plug-in detachable connection, which is convenient for disassembly and assembly.

[0053] Based on the above-mentioned power module, the utility model also provides a vehicle inverter, which can be a single inverter, a dual inverter, or a multi-way inverter, and can be suitable for hybrid vehicles or new energy pure electric vehicles. The vehicle inverter of this embodiment includes the above-mentioned power module, and the vehicle inverter of this embodiment can be used to convert the direct current of the vehicle's high-voltage battery into three-phase alternating current for output to a generator. It should be noted that those skilled in the art can learn about other structural components of the inverter and the working distance of the inverter based on the prior art, which will not be elaborated here.

[0054] Although the utility model is disclosed as above with preferred embodiments, the above embodiments are not intended to limit the utility model. For any technician familiar with the art, without departing from the scope of the technical solution of the utility model, the above disclosed technical content can be used to make many possible changes and modifications to the technical solution of the utility model, or modified into equivalent embodiments with equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model still falls within the scope of protection of the technical solution of the utility model.

Claims

1. A power module, characterized in that: Including heat dissipation components, bus capacitors and power modules: The heat dissipation assembly includes a heat dissipation substrate and a heat dissipation structure. The heat dissipation substrate has a heat dissipation cavity therein, and the heat dissipation cavity is arranged along the extension direction of the heat dissipation substrate. The heat dissipation structure is arranged in the heat dissipation cavity. The bus capacitor and the power module are respectively mounted on two opposite sides of the heat dissipation substrate, and both the bus capacitor and the power module are located on the outer surface of the heat dissipation cavity.

2. The power module according to claim 1, characterized in that: The number of the power module is at least one; the power module includes a U-phase power unit, a V-phase power unit and a W-phase power unit which are arranged on the heat dissipation substrate at intervals from each other.

3. The power module according to claim 1, characterized in that: A metal welding layer is provided on one side of the heat dissipation substrate, and the heat dissipation substrate is welded to the power module via the metal welding layer; or the heat dissipation substrate is sintered to the power module.

4. The power module according to claim 3, characterized in that: The heat dissipation substrate and the power module are welded by vapor phase welding or reflow welding.

5. The power module according to claim 1, characterized in that: The power module also includes a circuit board assembly and a signal connection assembly. The circuit board assembly is mounted on the heat dissipation substrate. The power module is located between the heat dissipation substrate and the circuit board assembly. The power module and the circuit board assembly are electrically connected via the signal connection assembly.

6. The power module according to claim 5, characterized in that: The signal connection assembly includes a plurality of flexible circuit boards, one end of the flexible circuit board is welded to the power module, and the other end of the flexible circuit board is plugged into the circuit board assembly.

7. The power module according to claim 5, characterized in that: The circuit board assembly is provided with a plurality of connection columns protruding toward the heat dissipation substrate, and the connection columns are connected to the heat dissipation substrate by welding or screws.

8. The power module according to claim 5, characterized in that: The circuit board assembly includes a circuit control board, the circuit control board is mounted on the heat dissipation substrate, and the circuit control board is electrically connected to the signal connection assembly; Alternatively, the circuit board assembly includes a support plate and a circuit control board, the circuit control board is mounted on the support plate, the support plate is connected to the heat dissipation substrate, and the signal connection assembly passes through the support plate and is electrically connected to the circuit control board.

9. The power module according to claim 1, characterized in that: The power module also includes a DC transfer copper bus, an AC transfer copper bus and a three-phase output copper bus. The power module and the bus capacitor are electrically connected via the DC transfer copper bus, and the power module and the three-phase output copper bus are connected via the AC transfer copper bus.

10. A vehicle inverter, characterized in that: A power module comprising any one of claims 1-9.

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