High-power amplifier
By adopting progressive synthesis combined with waveguide synthesis technology and load chips to absorb reflected power in high-power amplifiers, the problems of low synthesis efficiency, difficulty in heat dissipation and poor reliability in the prior art are solved, and more efficient heat dissipation and higher reliability are achieved.
Patent Information
- Application Number
- CN202323365678.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-11
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2033-12-11
AI Technical Summary
Existing high-power amplifiers have shortcomings in synthesis efficiency and heat dissipation, resulting in high power consumption, large heat loss and poor reliability of the equipment.
The progressive synthesis and waveguide synthesis technology are adopted to absorb the reflected power generated by poor standing waves by adding a load chip to each synthesis circuit, and applying thermal conductivity grease between the aluminum shell and the heat dissipation plate, integrating multiple heat dissipation copper tubes to improve heat dissipation efficiency.
Improves synthesis efficiency, reduces equipment heat loss, improves reliability and efficiency, while achieving these effects without increasing the equipment volume.
Smart Images
Figure CN222620996U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of radio frequency signal processing, and in particular relates to a high-power amplifier. Background Art
[0002] The convenience of modern life is largely based on a complete and stable communication system, and the RF transceiver is the core part of the communication system. As the core circuit block in the RF front-end circuit, the RF transceiver mainly receives baseband signals and transmits signals to be transmitted by the terminal. The module that consumes the most energy in the entire RF link is the RF front-end module.
[0003] The power amplifier module plays a vital role in the development of wireless electronic communication technology. It has a huge impact on the communication distance and communication quality of the entire wireless transceiver.
[0004] Under the premise of ensuring the communication quality (linearity of RF signals), the energy conversion efficiency of the power amplifier is not high. Excessive power consumption of the amplifier will reduce the endurance of the RF transceiver on the one hand, and on the other hand, excessive power consumption will also reduce the efficiency of the power amplifier, converting a large amount of electrical energy into heat energy. If there is no appropriate heat dissipation system, it is easy to cause irreversible damage to the equipment.
[0005] For high-power power amplifiers, the existing technologies have the following main shortcomings:
[0006] 1. Low synthesis efficiency
[0007] Among the commonly used synthesis methods, the PCB step-by-step synthesis method is a conventional method with low design difficulty and easy implementation. However, due to the processing accuracy of the PCB, the physical loss of the RF board itself, and the influence of the port standing wave, the final synthesis efficiency of the power synthesis on the PCB is not high.
[0008] 2. Difficulty in heat dissipation
[0009] The temperature of the power tube inside the module is a key factor affecting the working efficiency and stability of the equipment. The higher the power amplifier device, the higher the demand for heat dissipation. How to balance the device volume and operating temperature rise is a difficult problem in power amplifier design.
[0010] 3. Poor reliability
[0011] When the power amplifier is working, the output power and heat consumption are very large, and the power amplifier outlet is usually connected to the duplexer and antenna. In the case of poor port standing wave, the power amplifier is prone to local heating due to excessive power reflection, thus causing damage. Utility Model Content
[0012] The utility model aims to provide a high-power amplifier, which solves the technical problems of combining progressive synthesis with waveguide synthesis, improving the final synthesis efficiency and reducing the heat loss of the equipment.
[0013] To achieve the above object, the utility model adopts the following technical scheme: a high-power amplifier, including a shell, an amplifier module is arranged in the shell, the amplifier module includes a radio frequency input interface, a driving stage power amplifier, a first splitter, a second splitter, a third splitter, a first load, a second load, a first final stage power amplifier, a second final stage power amplifier, a third final stage power amplifier, a fourth final stage power amplifier, a first synthesizer, a second synthesizer, a third load, a fourth load and an output interface, the radio frequency input interface is connected to the first splitter, the first splitter is connected to the second splitter and the third splitter respectively, The second splitter is connected to the first load, the first final power amplifier and the second final power amplifier respectively, the third splitter is connected to the third final power amplifier, the fourth final power amplifier and the second load respectively, the first final power amplifier and the second final power amplifier are both connected to the first synthesizer, the third final power amplifier and the fourth final power amplifier are both connected to the second synthesizer, the third load is connected to the first synthesizer, the fourth load is connected to the second synthesizer, the first synthesizer and the second synthesizer are both connected to the output interface, the output interface is connected to the external coaxial to waveguide synthesizer, and the external coaxial to waveguide synthesizer outputs the radio frequency signal.
[0014] Preferably, the amplifier modules are arranged on the same PCB board.
[0015] Preferably, the PCB board is arranged in the outer shell, and a heat sink is provided between the PCB board and the shell of the outer shell.
[0016] Preferably, a plurality of heat dissipating copper tubes are embedded in the shell of the housing.
[0017] Preferably, the driving stage power amplifier, the first final stage power amplifier, the second final stage power amplifier, the third final stage power amplifier and the fourth final stage power amplifier are all provided with heat dissipation blocks.
[0018] Preferably, the output interface includes two signal output ports, one connected to the first combiner and the other connected to the second combiner;
[0019] The shell of the housing is provided with an input port opening and an output port opening, the RF input interface extends out of the input port opening to connect with an external RF input signal, the output port opening includes a first opening and a second opening, and the two signal output ports extend out of the first opening and the second opening respectively to connect with an external coaxial to waveguide synthesizer.
[0020] Preferably, the signal output port connected to the first combiner extends out of the first opening, and the signal output port connected to the second combiner extends out of the second opening.
[0021] A high-power amplifier described in the utility model solves the technical problems of combining progressive synthesis with waveguide synthesis, improving the final synthesis efficiency, and reducing the heat loss of the equipment. The utility model has greatly improved the performance indicators of the equipment, and adopts a copper plate made of red copper material with extremely high thermal conductivity efficiency as the base of the power amplifier tube, and the PCB and the copper plate are tightly fitted through a pressure welding process, and thermal conductive silicone grease can be applied between the aluminum shell and the heat sink, and a plurality of heat dissipation copper tubes are integrated at the bottom of the shell. Starting from multiple aspects, the heat dissipation efficiency is comprehensively improved, and a load chip is added in the design of each synthesis loop, which can continuously absorb the reflected power caused by poor standing waves to avoid damage to the power amplifier circuit, thereby improving reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a schematic block diagram of the amplifier module of the utility model;
[0023] Figure 2 It is the front view of the assembly structure of the utility model;
[0024] Figure 3 It is a top view of the assembly structure of the utility model;
[0025] In the figure: housing 1, PCB board 2, power amplifier 3, heat dissipation block 4, heat dissipation plate 5, heat dissipation copper tube 6, RF input interface 7, input port opening 8, signal output port 9 connected to the second combiner, second opening 10, external coaxial to waveguide combiner 11, first opening 12, signal output port 13 connected to the first combiner. DETAILED DESCRIPTION
[0026] Depend on Figure 1-Figure 3 A high-power amplifier shown in the figure comprises a housing 1, an amplifier module is arranged in the housing 1, the amplifier module is arranged on the same PCB board 2, the amplifier module comprises a radio frequency input interface 7, a driving stage power amplifier, a first splitter, a second splitter, a third splitter, a first load, a second load, a first final stage power amplifier, a second final stage power amplifier, a third final stage power amplifier, a fourth final stage power amplifier, a first synthesizer, a second synthesizer, a third load, a fourth load and an output interface, the radio frequency input interface 7 is connected to the first splitter, the first splitter is connected to the second splitter and the third splitter respectively, The second splitter is connected to the first load, the first final stage power amplifier and the second final stage power amplifier respectively, the third splitter is connected to the third final stage power amplifier, the fourth final stage power amplifier and the second load respectively, the first final stage power amplifier and the second final stage power amplifier are both connected to the first synthesizer, the third final stage power amplifier and the fourth final stage power amplifier are both connected to the second synthesizer, the third load is connected to the first synthesizer, the fourth load is connected to the second synthesizer, the first synthesizer and the second synthesizer are both connected to the output interface, the output interface is connected to the external coaxial to waveguide synthesizer 11, and the external coaxial to waveguide synthesizer 11 outputs a radio frequency signal.
[0027] The PCB board 2 is arranged in the housing 1 , a heat sink 5 is arranged between the PCB board 2 and the shell of the housing 1 , and a plurality of heat dissipation copper tubes 6 are embedded in the shell of the housing 1 .
[0028] The output interface includes two signal output ports, one connected to the first combiner and the other connected to the second combiner;
[0029] The shell of the housing 1 is provided with an input port opening 8 and an output port opening, the RF input interface 7 extends out of the input port opening 8 to connect with an external RF input signal, the output port opening includes a first opening 12 and a second opening 10, and the two signal output ports extend out of the first opening 12 and the second opening 10 respectively to connect with an external coaxial to waveguide synthesizer 11.
[0030] The signal output port 13 connected to the first combiner extends out of the first opening 12 , and the signal output port 9 connected to the second combiner extends out of the second opening 10 .
[0031] The driving stage power amplifier, the first final stage power amplifier, the second final stage power amplifier, the third final stage power amplifier and the fourth final stage power amplifier are all provided with a heat dissipation pressing block 4.
[0032] In this embodiment, the heat dissipation block 4 and the heat dissipation plate 5 are both made of copper, and thermal conductive silicone grease is applied between the heat dissipation block 4 and the power amplifier 3, and between the heat dissipation plate 5 and the PCB board 2. The power amplifier 3 includes a driver stage power amplifier, a first final stage power amplifier, a second final stage power amplifier, a third final stage power amplifier and a fourth final stage power amplifier.
[0033] The shell is made of aluminum.
[0034] When working, the driver-stage power amplifier receives the signal input for the first stage amplification, and then passes through the first splitter and the second splitter to divide the RF signal into 4 parts evenly, and transmit it to 4 final-stage power amplifiers with similar performance, namely the first final-stage power amplifier, the second final-stage power amplifier, the third final-stage power amplifier and the fourth final-stage power amplifier. After the signals are amplified, they each pass through a two-in-one synthesizer, namely the first synthesizer and the second synthesizer. The synthesized two signals are finally synthesized by a coaxial-to-waveguide synthesizer and output, thus completing the signal amplification.
[0035] The utility model improves the heat dissipation efficiency of the device, reduces the operating temperature of the device, and improves the reliability and efficiency of the device in multiple ways without increasing the size of the device. The synthesis method is improved without increasing the size of the device. While performing coaxial waveguide conversion, the radio frequency signal is synthesized in the waveguide cavity, and the synthesis efficiency is further improved. The power synthesis circuit adopts a bridge combined with a load to form an effect similar to that of a circulator, which reduces the influence of input and output standing waves on the device and improves reliability.
[0036] In this embodiment, the shell can be an aluminum hollowed-out rectangular parallelepiped. The PCB board 2 and the heat sink are tightly fitted into a whole through a pressure welding process. Thermal grease is applied between the heat sink and the shell 1, and finally the copper plate is fastened to the bottom of the shell 1 with screws.
[0037] The power amplifier 3 can be installed on the mounting hole reserved on the heat sink, and fastened with an aluminum heat sink pressing block 4 above the tube shell.
[0038] The RF input interface 7 may be an SMA interface, through which the RF signal is transmitted into the power amplifier, and after being amplified, is finally output through a coaxial-to-waveguide synthesizer.
[0039] During the sample debugging stage, the core indicator of the utility model is the output power within the working frequency band. By adjusting the static current of each power tube, the working state of each power amplifier is guaranteed to be normal and consistent, so as to achieve the maximum synthesis efficiency. The coupler and high-power load are connected at the output end, and tested with a power meter or vector network analyzer;
[0040] To test output spurious signals, make the power amplifier work normally, connect the output port to the RF coupler and high-power load, monitor the output of the power amplifier through a spectrum analyzer, and observe whether there are spurious signals in the passband. The difference between the output RF signal strength and the spurious signal strength is the output spurious signal.
[0041] Test the in-band fluctuations by turning on the network analyzer power output and slowly increasing the output of the network analyzer until the output curve on the network analyzer remains unchanged and the power amplifier is close to saturation. View the amplitude-frequency characteristic curve of the device under test on the network analyzer and read the difference in decibel values between the maximum and minimum points on the curve.
[0042] A high-power amplifier described in the utility model solves the technical problems of combining progressive synthesis with waveguide synthesis, improving the final synthesis efficiency, and reducing the heat loss of the equipment. The utility model has greatly improved the performance indicators of the equipment, and adopts a copper plate made of red copper material with extremely high thermal conductivity efficiency as the base of the power amplifier tube, and the PCB and the copper plate are tightly fitted through a pressure welding process, and thermal conductive silicone grease can be applied between the aluminum shell and the heat sink, and a plurality of heat dissipation copper tubes are integrated at the bottom of the shell. Starting from multiple aspects, the heat dissipation efficiency is comprehensively improved, and a load chip is added in the design of each synthesis loop, which can continuously absorb the reflected power caused by poor standing waves to avoid damage to the power amplifier circuit, thereby improving reliability.
Claims
1. A high power amplifier, characterized in that: The invention comprises a housing (1), wherein an amplifier module is arranged in the housing (1), wherein the amplifier module comprises a radio frequency input interface (7), a driving stage power amplifier, a first splitter, a second splitter, a third splitter, a first load, a second load, a first final stage power amplifier, a second final stage power amplifier, a third final stage power amplifier, a fourth final stage power amplifier, a first synthesizer, a second synthesizer, a third load, a fourth load and an output interface, wherein the radio frequency input interface (7) is connected to the first splitter, the first splitter is respectively connected to the second splitter and the third splitter, the second splitter is respectively connected to the first load The first and second loads are connected to the first and second final-stage power amplifiers, the first and second final-stage power amplifiers are connected to the first and second final-stage power amplifiers, the third splitter is connected to the third and fourth final-stage power amplifiers, respectively, the first and second final-stage power amplifiers are both connected to the first synthesizer, the third and fourth final-stage power amplifiers are both connected to the second synthesizer, the third load is connected to the first synthesizer, the fourth load is connected to the second synthesizer, the first and second synthesizers are both connected to the output interface, the output interface is connected to the external coaxial-to-waveguide synthesizer (11), and the external coaxial-to-waveguide synthesizer (11) outputs a radio frequency signal.
2. A high power amplifier as claimed in claim 1, characterized in that: The amplifier modules are arranged on the same PCB board (2).
3. A high power amplifier as claimed in claim 2, characterized in that: The PCB board (2) is arranged in the outer shell (1), and a heat dissipation plate (5) is arranged between the PCB board (2) and the shell of the outer shell (1).
4. A high power amplifier as claimed in claim 2, characterized in that: A plurality of heat dissipation copper tubes (6) are embedded in the shell of the outer shell (1).
5. A high power amplifier as claimed in claim 1, characterized in that: The driving stage power amplifier, the first final stage power amplifier, the second final stage power amplifier, the third final stage power amplifier and the fourth final stage power amplifier are all provided with a heat dissipation pressing block (4).
6. A high power amplifier as claimed in claim 1, characterized in that: The output interface includes two signal output ports, one connected to the first combiner and the other connected to the second combiner; An input port opening (8) and an output port opening are provided on the shell of the housing (1); a radio frequency input interface (7) extends out of the input port opening (8) to connect to an external radio frequency input signal; the output port opening includes a first opening (12) and a second opening (10); two signal output ports extend out of the first opening (12) and the second opening (10) to connect to an external coaxial-to-waveguide synthesizer (11).
7. A high power amplifier as claimed in claim 6, characterized in that: A signal output port (13) connected to the first combiner extends out of the first opening (12), and a signal output port (9) connected to the second combiner extends out of the second opening (10).