Millimeter wave transceiver and electronic equipment

Abstract

The utility model discloses a millimeter wave transceiver and an electronic device. The millimeter wave transceiver comprises a transmitting terminal, a receiving terminal, a transmitting terminal matching network, a receiving terminal matching network, a transmitting antenna and a receiving antenna. The transmitting end and the receiving end are integrated on the same chip and are spaced at a preset distance; one end of the transmitting end matching network is connected with the transmitting end, and the other end is connected with the transmitting antenna; one end of the receiving end matching network is connected with the receiving end, and the other end is connected with the receiving antenna; the transmitting antenna communicates with the receiving antenna through millimeter waves; according to the millimeter wave transceiver, the matching networks are additionally arranged at the transmitting end and the receiving end respectively, impedance matching is achieved, and the transmission performance is improved while the integrated design of the transceiver is ensured to reduce the size through the overall optimization design of the antenna and the specific circuit on the millimeter wave transceiver structure.

Description

Technical Field

[0001] The utility model relates to the field of transceivers, and in particular to a millimeter wave transceiver and electronic equipment. Background Art

[0002] In the field of general chip isolation, capacitive coupling, magnetic coupling and optical coupling are usually used to achieve the isolation requirements at both ends. In the Chinese invention patent with publication number CN115378468A, the concept of millimeter wave isolation is mentioned, which also achieves the purpose of isolation by utilizing the transmission characteristics of millimeter waves in the chip field.

[0003] However, since millimeter waves are used in the field of chip isolation, they are different from conventional wireless transmission. In conventional wireless transmission, the transmitter and receiver are relatively independent and can be designed separately, while in millimeter wave isolation, the transmitter and receiver appear in pairs and need to be considered as a whole during design; conventional wireless transmission is far-field communication, while millimeter wave isolation is near-field communication. Therefore, due to the above characteristics of millimeter wave isolation, when designing its circuit, it is necessary to consider the problem of affecting the transmission characteristics due to the fact that the transmitter and receiver are a whole and the distance is relatively close. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a millimeter wave transceiver and an electronic device, which can improve the transmission performance of the millimeter wave transceiver.

[0005] In order to solve the above technical problems, a technical solution adopted by the utility model is:

[0006] A millimeter wave transceiver comprises a transmitting end, a receiving end, a transmitting end matching network, a receiving end matching network, a transmitting antenna and a receiving antenna;

[0007] The transmitting end and the receiving end are integrated on the same chip and are separated by a preset distance;

[0008] One end of the transmitter matching network is connected to the transmitter, and the other end is connected to the transmitting antenna;

[0009] One end of the receiving end matching network is connected to the receiving end, and the other end is connected to the receiving antenna;

[0010] The transmitting antenna and the receiving antenna communicate with each other via millimeter waves.

[0011] Furthermore, the preset distance is 0.5 mm-3 mm.

[0012] Furthermore, it includes multiple channels, each of which includes the transmitting end, the receiving end, the transmitting end matching network, the receiving end matching network, the transmitting antenna and the receiving antenna.

[0013] Furthermore, the transmitting antenna and the receiving antenna are both horizontally polarized, vertically polarized, left-hand circularly polarized or right-hand circularly polarized antennas.

[0014] Furthermore, the transmitting antenna and the corresponding receiving antenna on each channel have the same polarization direction;

[0015] The polarization directions of adjacent transmitting antennas at the transmitting end are opposite.

[0016] Furthermore, it also includes a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a control circuit, a receiving feedback terminal and a transmitting feedback terminal corresponding to each transmitting terminal, and a high-power device driver corresponding to all receiving terminals;

[0017] The output end of the receiving end is connected to the input end of the second signal demodulation circuit;

[0018] The output ends of all the first signal demodulation circuits are connected to the input ends of the high-power device driver, and the output ends of the high-power device driver are connected to the input ends of all the second signal modulation circuits;

[0019] The output end of the second signal modulation circuit is connected to the input end of the transmission feedback end;

[0020] The output end of the transmitting feedback end communicates with the input end of the receiving feedback end via millimeter waves;

[0021] The output end of the receiving feedback end is connected to the input end of the second signal demodulation circuit;

[0022] The output end of the second signal demodulation circuit is connected to the input end of the control circuit;

[0023] The first output terminal of the control circuit is connected to the feedback terminal of the first signal modulation circuit;

[0024] The second output terminal of the control circuit is connected to the feedback terminal of the transmitting end;

[0025] The output end of the first signal modulation circuit is connected to the input end of the transmitting end.

[0026] Furthermore, it also includes a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a transmission feedback terminal, a power detector and a power coupler corresponding to each transmitting terminal, and a high-power device driver corresponding to all receiving terminals;

[0027] The power coupler is connected between the receiving end matching network and the receiving antenna;

[0028] The output end of the receiving end is connected to the input end of the first signal demodulation circuit;

[0029] The output ends of all the first signal demodulation circuits are connected to the input ends of the high-power device driver, and the output ends of the high-power device driver are connected to the input ends of all the second signal modulation circuits;

[0030] The output end of the second signal modulation circuit is connected to the input end of the transmission feedback end;

[0031] The output end of the transmitting feedback end is connected to the feedback end of the power coupler;

[0032] The power detector is connected between the transmitting antenna and the transmitting end matching network;

[0033] The feedback end of the power detector is connected to the input end of the second signal demodulation circuit;

[0034] The output end of the second signal demodulation circuit is connected to the feedback end of the first signal modulation circuit;

[0035] The output end of the first signal modulation circuit is connected to the input end of the transmitting end.

[0036] Further, the transmitting end includes a first oscillator and a transmitting end power amplifier;

[0037] The output end of the first oscillator is connected to the first input end of the transmitting end power amplifier;

[0038] The second input end of the transmitting end power amplifier receives the signal to be modulated;

[0039] Or the input end of the first oscillator receives the signal to be modulated, and the output end is connected to the input end of the transmitting end power amplifier;

[0040] The output end of the transmitting end power amplifier is connected to the one end of the transmitting end matching network;

[0041] Or the transmitting end includes a first oscillator;

[0042] The input end of the first oscillator receives a signal to be modulated;

[0043] The output end of the first oscillator is connected to the one end of the transmitter matching network;

[0044] The receiving end includes a receiving end power amplifier and a detector;

[0045] The input end of the receiving end power amplifier is connected to the one end of the receiving end matching network;

[0046] The output end of the receiving end power amplifier is connected to the input end of the detector;

[0047] Or the receiving end includes a receiving end power amplifier and a mixer;

[0048] The input end of the receiving end power amplifier is connected to the one end of the receiving end matching network;

[0049] The first output terminal of the receiving end power amplifier is connected to the first input terminal of the mixer;

[0050] The second output terminal of the receiving end power amplifier is connected to the second input terminal of the mixer;

[0051] Or the receiving end includes a receiving end power amplifier, a mixer and a second oscillator;

[0052] The input end of the receiving end power amplifier is connected to the one end of the receiving end matching network;

[0053] The output end of the receiving end power amplifier is connected to the first input end of the mixer;

[0054] The output terminal of the second oscillator is connected to the second input terminal of the mixer.

[0055] Furthermore, the transmitting end and the receiving end are packaged in a horizontal direction or in a vertical direction.

[0056] Furthermore, the transmitting end and the receiving end are integrated on the same chip by means of a lead frame or a stacked package.

[0057] Furthermore, the lead frame method includes a flip chip welding method and a wire bonding method.

[0058] Furthermore, the flip-chip bonding method and the wire bonding method include a wafer-level fan-out method.

[0059] In order to solve the above technical problems, another technical solution adopted by the utility model is:

[0060] An electronic device comprises the above-mentioned millimeter wave transceiver.

[0061] Furthermore, the electronic device includes a motor driver, a DCDC power supply circuit, an isolated ADC or a battery system.

[0062] The beneficial effects of the utility model are as follows: in view of the characteristics of the millimeter wave transceiver in which the transmitting end and the receiving end appear in pairs and are integrated on the same chip and are separated by a preset distance, there is a coupling problem between the transmitting antenna and the receiving antenna, and matching networks are respectively added to the transmitting end and the receiving end to achieve impedance matching, and through the overall optimization design of the antenna and the specific circuit in the millimeter wave transceiver structure, the transmission performance is improved while ensuring the integrated design of the transceiver to reduce the volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 This is a schematic diagram of the structure of a millimeter wave transceiver according to an embodiment of the utility model;

[0064] Figure 2 This is a schematic diagram of the structure of a multi-channel millimeter wave transceiver according to an embodiment of the utility model;

[0065] Figure 3 A structural schematic diagram of an implementation method of a feedback mechanism in a high-power device driver according to an embodiment of the utility model;

[0066] Figure 4 It is a structural schematic diagram of another implementation method of realizing the feedback mechanism in the high-power device driver of the embodiment of the utility model;

[0067] Figure 5 A schematic diagram of a structure of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the utility model;

[0068] Figure 6 A schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the utility model;

[0069] Figure 7 A schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the utility model;

[0070] Figure 8 A schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the utility model;

[0071] Fig. 9 A schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the utility model;

[0072] Fig.10A schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the utility model;

[0073] Fig.11 A schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the utility model;

[0074] Fig.12 A schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the utility model;

[0075] Fig.13 A schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the utility model;

[0076] Fig.14 This is a structural schematic diagram of a packaging method for a transmitting end and a receiving end in a millimeter wave transceiver in an embodiment of the utility model;

[0077] Fig.15 A schematic diagram of another packaging method of a transmitting end and a receiving end in a millimeter wave transceiver according to an embodiment of the utility model;

[0078] Fig.16 A schematic structural diagram of an implementation method of a chip package for a millimeter wave transceiver according to an embodiment of the utility model;

[0079] Fig.17 A schematic structural diagram of another implementation method of a chip package of a millimeter wave transceiver according to an embodiment of the utility model;

[0080] Fig.18 It is a structural schematic diagram of the flip chip welding and wire bonding implementation method of the utility model embodiment;

[0081] Fig.19 It is a schematic structural diagram of a wafer-level fan-out method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0082] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.

[0083] The millimeter wave transceiver described above in this application can be applied to any electronic device that needs to be isolated, such as a motor driver, a DCDC power supply circuit, an isolated ADC or a battery system. The following is an explanation through specific implementation methods:

[0084] In an alternative embodiment, please refer to Figure 1, a millimeter wave transceiver, comprising a transmitting end TX, a receiving end RX, a transmitting end matching network, a receiving end matching network, a transmitting antenna and a receiving antenna;

[0085] The transmitting end and the receiving end are integrated on the same chip and are separated by a preset distance;

[0086] The preset distance is 0.5 mm to 3 mm, which belongs to the near field communication propagation area of ​​the antenna. The preset distance is determined by the isolation strength requirement and the packaging substrate material.

[0087] One end of the transmitter matching network is connected to the transmitter, and the other end is connected to the transmitting antenna;

[0088] One end of the receiving end matching network is connected to the receiving end, and the other end is connected to the receiving antenna;

[0089] The transmitting antenna communicates with the receiving antenna via millimeter waves;

[0090] In this embodiment, since the distance between the transmitting antenna and the receiving antenna is very close, the transmitting antenna and the receiving antenna not only transmit signals but also couple with each other. Therefore, it is necessary to add a transmitting end matching network and a receiving end matching network to achieve impedance matching and ensure the signal transmission performance.

[0091] In another optional embodiment, Figure 2 As shown, the above-mentioned millimeter wave transceiver includes multiple channels, each of which includes the transmitting end, the receiving end, the transmitting end matching network (not shown in the figure), the receiving end matching network (not shown in the figure), the transmitting antenna and the receiving antenna;

[0092] Figure 2 In the invention, each channel includes a signal modulation circuit and a signal demodulation circuit, the output end of the signal modulation circuit is connected to the input end of the transmitting end of the corresponding channel, and the output end of the receiving end of the corresponding channel is connected to the input end of the signal demodulation circuit.

[0093] In this embodiment, by implementing multiple channels on the same chip, multiple single-channel millimeter wave isolations are not required, which can further save area and cost.

[0094] In another optional embodiment, the transmitting antenna and the receiving antenna are both horizontally polarized, vertically polarized, left-hand circularly polarized or right-hand circularly polarized, wherein the transmitting antenna and the corresponding receiving antenna on each channel have the same polarization direction;

[0095] The polarization directions of the transmitting antennas adjacent to the transmitting end are opposite, such as (horizontal and vertical polarization or left-hand and right-hand circular polarization;

[0096] In this embodiment, by setting the transmitting antenna and the receiving antenna to have the same polarization direction, and the transmitting antenna and the receiving antenna on the same channel have the same polarization direction, and the adjacent antennas at the same end have opposite polarization directions, interference problems between multiple channels can be effectively prevented.

[0097] In another optional embodiment, Figure 3 As shown, it also includes a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a control circuit, a receiving feedback end and a transmitting feedback end corresponding to each transmitting end, and a high-power device driver corresponding to all receiving ends; that is, for a multi-channel millimeter wave transceiver, each channel is provided with a first signal modulation circuit (i.e. Figure 3 The signal modulation circuit in the low voltage region of the first signal demodulation circuit (i.e. Figure 3 The signal demodulation circuit in the medium and high voltage area), the second signal modulation circuit (i.e. Figure 3 The signal modulation circuit in the high voltage region of the second signal demodulation circuit (i.e. Figure 3 Signal demodulation circuit in the medium and low voltage area), transmission feedback end (i.e. Figure 3 TX in the medium and high voltage area) and the receiving feedback end (i.e. Figure 3 RX in medium and low pressure areas);

[0098] The output end of the receiving end is connected to the input end of the second signal demodulation circuit;

[0099] The output ends of all the first signal demodulation circuits are connected to the input ends of the high-power device driver, and the output ends of the high-power device driver are connected to the input ends of all the second signal modulation circuits;

[0100] The output end of the second signal modulation circuit is connected to the input end of the transmission feedback end;

[0101] The output end of the transmitting feedback end communicates with the input end of the receiving feedback end via millimeter waves;

[0102] The output end of the receiving feedback end is connected to the input end of the second signal demodulation circuit;

[0103] The output end of the second signal demodulation circuit is connected to the input end of the control circuit;

[0104] The first output terminal of the control circuit is connected to the feedback terminal of the first signal modulation circuit;

[0105] The second output terminal of the control circuit is connected to the feedback terminal of the transmitting end;

[0106] The output end of the first signal modulation circuit is connected to the input end of the transmitting end.

[0107] In this embodiment, the millimeter wave transceiver is used to achieve isolation in a high-power device driver, and by providing a feedback mechanism on each channel, the input signal can be regulated according to the feedback signal, thereby further ensuring the signal transmission performance.

[0108] In another optional embodiment, Figure 4 As shown, the millimeter wave transceiver further includes a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a transmission feedback terminal, a power detector and a power coupler corresponding to each transmitting end, and a high-power device driver corresponding to all receiving ends; that is, for a multi-channel millimeter wave transceiver, each channel is provided with a first signal modulation circuit (i.e. Figure 4 The signal modulation circuit in the low voltage region of the first signal demodulation circuit (i.e. Figure 4 The signal demodulation circuit in the medium and high voltage region) and the second signal modulation circuit (i.e. Figure 4 The signal modulation circuit in the high voltage region of the second signal demodulation circuit (i.e. Figure 4 Signal demodulation circuit in the medium and low voltage area), power detector, power coupler and transmission feedback end (i.e. Figure 4 TX in medium and high voltage areas);

[0109] The power coupler is connected between the receiving end matching network and the receiving antenna, wherein the power coupler and the receiving end matching network can be designed separately or integrated;

[0110] The output end of the receiving end is connected to the input end of the first signal demodulation circuit;

[0111] The output ends of all the first signal demodulation circuits are connected to the input ends of the high-power device driver, and the output ends of the high-power device driver are connected to the input ends of all the second signal modulation circuits;

[0112] The output end of the second signal modulation circuit is connected to the input end of the transmission feedback end;

[0113] The output end of the transmitting feedback end is connected to the feedback end of the power coupler;

[0114] The power detector is connected between the transmitting antenna and the transmitting end matching network, wherein the power detector and the transmitting end matching network can be designed separately or integrated;

[0115] The feedback end of the power detector is connected to the input end of the second signal demodulation circuit;

[0116] The output end of the second signal demodulation circuit is connected to the feedback end of the first signal modulation circuit;

[0117] The output end of the first signal modulation circuit is connected to the input end of the transmitting end.

[0118] This implementation is another way to implement the backhaul mechanism. The backhaul mechanism is implemented using only one pair of antennas on each channel, further saving costs and reducing volume.

[0119] In another optional embodiment, Figure 5-Figure 13 (The matching network is not shown in the figure) Several implementation methods of the transmitter and receiver are listed as follows:

[0120] like Figure 5-Figure 7 As shown, the transmitting end includes a first oscillator and a transmitting end power amplifier, wherein the first oscillator is a voltage controlled oscillator VCO;

[0121] The output end of the first oscillator is connected to the first input end of the transmitting end power amplifier;

[0122] The second input end of the transmitting end power amplifier receives the signal to be modulated;

[0123] That is, in this implementation, the modulation of the carrier signal and the signal to be modulated is directly realized at the transmitting end power amplifier;

[0124] Or Figure 11-13 As shown, the input end of the first oscillator receives the signal to be modulated, and the output end is connected to the input end of the transmitting end power amplifier;

[0125] The output end of the transmitting end power amplifier is connected to the one end of the transmitting end matching network;

[0126] That is, in this implementation, the first oscillator at the transmitting end directly implements the modulation of the carrier signal and the signal to be modulated;

[0127] In the above two implementations, the mixer is omitted at the transmitting end, and the modulation of the carrier and the signal is directly set at the transmitting end power amplifier or the first oscillator. While omitting the mixer, the start-up time of the power amplifier is also reduced, saving power consumption to a certain extent.

[0128] Or Figure 8-Figure 10 As shown, the transmitting end includes a first oscillator;

[0129] The input end of the first oscillator receives a signal to be modulated;

[0130] The output end of the first oscillator is connected to the one end of the transmitter matching network;

[0131] That is, in this implementation, the first oscillator at the transmitting end not only generates a carrier wave, but is also responsible for modulating the signal and the carrier wave together to form a mixed wave, and then transmitting the mixed wave through the antenna, thereby satisfying signal transmission while saving space.

[0132] like Figure 5 , Figure 8 , Fig.11 As shown, the receiving end includes a receiving end power amplifier and a detector;

[0133] The input end of the receiving end power amplifier is connected to the one end of the receiving end matching network;

[0134] The output end of the receiving end power amplifier is connected to the input end of the detector;

[0135] Or Figure 7 , Fig.10 , Fig.13 As shown, the receiving end includes a receiving end power amplifier and a mixer;

[0136] The input end of the receiving end power amplifier is connected to the one end of the receiving end matching network;

[0137] The first output terminal of the receiving end power amplifier is connected to the first input terminal of the mixer;

[0138] The second output terminal of the receiving end power amplifier is connected to the second input terminal of the mixer;

[0139] Or Figure 6 , Fig. 9 , Fig.12 As shown, the receiving end includes a receiving end power amplifier, a mixer and a second oscillator LO;

[0140] The input end of the receiving end power amplifier is connected to the one end of the receiving end matching network;

[0141] The output end of the receiving end power amplifier is connected to the first input end of the mixer;

[0142] The output terminal of the second oscillator is connected to the second input terminal of the mixer.

[0143] In an optional embodiment, if Fig.14 As shown, the transmitting end M1 and the receiving end M2 are packaged with a preset distance in the horizontal direction;

[0144] Specifically, the millimeter wave transceiver includes a packaging layer, a first substrate and a second substrate stacked in sequence, wherein the transmitting end and the receiving end are horizontally and spaced apart and packaged in the packaging layer, that is, side transmission of signals between the transmitting end M1 and the receiving end M2 is realized.

[0145] In another optional embodiment, Fig.15 As shown, the transmitting end M1 and the receiving end M2 are packaged with a preset distance in the vertical direction;

[0146] Specifically, the millimeter wave transceiver includes a packaging layer, a first substrate and a second substrate stacked in sequence, wherein the transmitting end is encapsulated in the packaging layer, and the receiving end is encapsulated in the first substrate, thereby realizing face-to-face transmission of signals between the transmitting end M1 and the receiving end M2.

[0147] In another optional implementation, the transmitting end and the receiving end are connected by a lead frame (eg Fig.16 ), or package on package (POP) (as shown Fig.17 As shown) are integrated on the same chip;

[0148] Among them, in the method of realizing packaging integration by means of lead frame, such as Fig.18 As shown, including flip chip (FlipChip), wire bonding (WireBond):

[0149] Flip-chip soldering: The millimeter-wave antenna and transceiver chip are integrated on the substrate and then attached to the frame as a whole;

[0150] Wire bonding: First, perform die attach, then wire bonding;

[0151] Among them, Fig.19 As shown, the flip-chip bonding method and the wire bonding method include a wafer-level fan-out type (FanOut+RDL) method;

[0152] There are two cases for integrating millimeter wave antennas using TSV / RDL technology at the wafer level:

[0153] One is that the antenna is on the back of the wafer, and the application end still needs to attach the chip FlipChip to the packaging substrate for wire bonding to lead out the signal;

[0154] The other is that the antenna is on the same surface as other signals, without the need for a substrate, and wire bonding can be done directly on the chip pad to achieve millimeter wave module communication;

[0155] The stacked package is to stack two or more packages in the vertical direction. The position of the antenna can be adjusted according to the actual situation. The upper and lower circuit modules of the POP package can be completely isolated. The upper signal is directly led out from the top. In addition, since there is space between the upper and lower modules to add other insulating materials, the voltage resistance level can be increased and controlled. At the same time, part of the horizontal dimensional pressure will be converted into a vertical form, thereby realizing face-to-face transmission of the antenna.

[0156] In another optional embodiment, an electronic device includes a millimeter wave transceiver according to any one of the above embodiments.

[0157] Among them, any electronic device that needs to be isolated can use the millimeter wave transceiver of the above implementation, and the electronic device includes a motor driver, a DCDC power supply circuit, an isolated ADC or a battery system.

[0158] In summary, the millimeter wave transceiver and electronic device provided by the utility model aim at the characteristics of the millimeter wave transceiver in which the transmitting end and the receiving end appear in pairs and are integrated on the same chip and are separated by a preset distance. The transmitting antenna and the receiving antenna have coupling problems, and matching networks are respectively added to the transmitting end and the receiving end to achieve impedance matching. By optimizing the overall design of the antenna and the specific circuit in the millimeter wave transceiver structure, the transmission performance is improved while ensuring the integrated design of the transceiver to reduce the volume, and the utility model can be applied to isolation circuits in various application scenarios.

[0159] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A millimeter wave transceiver, characterized in that: It includes a transmitter, a receiver, a transmitter matching network, a receiver matching network, a transmitter antenna and a receiver antenna; The transmitting end and the receiving end are integrated on the same chip and are separated by a preset distance; One end of the transmitter matching network is connected to the transmitter, and the other end is connected to the transmitting antenna; One end of the receiving end matching network is connected to the receiving end, and the other end is connected to the receiving antenna; The transmitting antenna and the receiving antenna communicate with each other via millimeter waves.

2. A millimeter wave transceiver according to claim 1, characterized in that: The preset distance is 0.5mm-3mm.

3. The millimeter wave transceiver according to claim 1, characterized in that: It comprises multiple channels, each of which comprises the transmitting end, the receiving end, the transmitting end matching network, the receiving end matching network, the transmitting antenna and the receiving antenna.

4. The millimeter wave transceiver according to claim 3, characterized in that: The transmitting antenna and the receiving antenna are both horizontally polarized, vertically polarized, left-hand circularly polarized or right-hand circularly polarized antennas.

5. The millimeter wave transceiver according to claim 4, characterized in that: The transmitting antenna and the corresponding receiving antenna on each channel have the same polarization direction; The polarization directions of adjacent transmitting antennas at the transmitting end are opposite.

6. A millimeter wave transceiver according to any one of claims 1 to 5, characterized in that: It also includes a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a control circuit, a receiving feedback terminal and a transmitting feedback terminal corresponding to each transmitting terminal, and a high-power device driver corresponding to all receiving terminals; The output end of the receiving end is connected to the input end of the first signal demodulation circuit; The output ends of all the first signal demodulation circuits are connected to the input ends of the high-power device driver, and the output ends of the high-power device driver are connected to the input ends of all the second signal modulation circuits; The output end of the second signal modulation circuit is connected to the input end of the transmission feedback end; The output end of the transmitting feedback end communicates with the input end of the receiving feedback end via millimeter waves; The output end of the receiving feedback end is connected to the input end of the second signal demodulation circuit; The output end of the second signal demodulation circuit is connected to the input end of the control circuit; The first output terminal of the control circuit is connected to the feedback terminal of the first signal modulation circuit; The second output terminal of the control circuit is connected to the feedback terminal of the transmitting end; The output end of the first signal modulation circuit is connected to the input end of the transmitting end.

7. A millimeter wave transceiver according to any one of claims 1 to 5, characterized in that: It also includes a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a transmission feedback terminal, a power detector and a power coupler corresponding to each transmitting terminal, and a high-power device driver corresponding to all receiving terminals; The power coupler is connected between the receiving end matching network and the receiving antenna; The output end of the receiving end is connected to the input end of the first signal demodulation circuit; The output ends of all the first signal demodulation circuits are connected to the input ends of the high-power device driver, and the output ends of the high-power device driver are connected to the input ends of all the second signal modulation circuits; The output end of the second signal modulation circuit is connected to the input end of the transmission feedback end; The output end of the transmitting feedback end is connected to the feedback end of the power coupler; The power detector is connected between the transmitting antenna and the transmitting end matching network; The feedback end of the power detector is connected to the input end of the second signal demodulation circuit; The output end of the second signal demodulation circuit is connected to the feedback end of the first signal modulation circuit; The output end of the first signal modulation circuit is connected to the input end of the transmitting end.

8. A millimeter wave transceiver according to any one of claims 1 to 5, characterized in that: The transmitting end includes a first oscillator and a transmitting end power amplifier; The output end of the first oscillator is connected to the first input end of the transmitting end power amplifier; The second input end of the transmitting end power amplifier receives the signal to be modulated; Or the input end of the first oscillator receives the signal to be modulated, and the output end is connected to the input end of the transmitting end power amplifier; The output end of the transmitting end power amplifier is connected to the one end of the transmitting end matching network; Or the transmitting end includes a first oscillator; The input end of the first oscillator receives a signal to be modulated; The output end of the first oscillator is connected to the one end of the transmitter matching network; The receiving end includes a receiving end power amplifier and a detector; The input end of the receiving end power amplifier is connected to the one end of the receiving end matching network; The output end of the receiving end power amplifier is connected to the input end of the detector; Or the receiving end includes a receiving end power amplifier and a mixer; The input end of the receiving end power amplifier is connected to the one end of the receiving end matching network; The first output terminal of the receiving end power amplifier is connected to the first input terminal of the mixer; The second output terminal of the receiving end power amplifier is connected to the second input terminal of the mixer; Or the receiving end includes a receiving end power amplifier, a mixer and a second oscillator; The input end of the receiving end power amplifier is connected to the one end of the receiving end matching network; The output end of the receiving end power amplifier is connected to the first input end of the mixer; The output terminal of the second oscillator is connected to the second input terminal of the mixer.

9. A millimeter wave transceiver according to any one of claims 1 to 5, characterized in that: The transmitting end and the receiving end are packaged along a horizontal direction or a vertical direction.

10. The millimeter wave transceiver according to claim 9, characterized in that: The transmitting end and the receiving end are integrated on the same chip by means of a lead frame or a stacked package.

11. The millimeter wave transceiver according to claim 10, characterized in that: The lead frame method includes a flip chip welding method and a wire bonding method.

12. The millimeter wave transceiver according to claim 11, characterized in that: The flip-chip bonding method and the wire bonding method include a wafer-level fan-out method.

13. An electronic device, characterized in that: It comprises a millimeter wave transceiver as claimed in any one of claims 1 to 5 and 8 to 12.

14. An electronic device according to claim 13, characterized in that: The electronic device includes a motor driver, a DCDC power supply circuit, an isolated ADC or a battery system.

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