Circuit board for wearable device

Abstract

The utility model discloses a circuit board for a wearable device, belongs to the technical field of circuit boards, and aims to solve the problem that the use safety of the circuit board is reduced due to the fact that the waterproof performance and the dustproof performance of the circuit board in the use process are difficult to guarantee, the circuit board comprises a circuit board body, a flexible circuit board is arranged on the left side of the circuit board body, and an insertion piece is arranged at the left end of the flexible circuit board. A connecting sheet is arranged at the right end of the flexible circuit board, the flexible circuit board is mounted on the circuit board main body through the connecting sheet, mounting holes are formed in the circuit board main body close to four corners, electronic components are welded on the circuit board main body, and a sealing mechanism is arranged on the edge side of the circuit board main body; according to the utility model, moisture and dust are prevented from entering the circuit board main body through the sealing mechanism arranged on the edge of the circuit board main body, so that the stable operation of the circuit board main body in a severe environment is ensured, and the use safety when the circuit board is used in wearable equipment is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a circuit board for wearable devices. Background Art

[0002] Smart wearable devices are a general term for wearable devices that are designed and developed using wearable technology to intelligently design daily wearables, such as glasses, gloves, watches, clothing, shoes, etc. In a broad sense, wearable smart devices include those that are fully functional, large in size, and can achieve complete or partial functions without relying on smartphones, such as smart watches or smart glasses, as well as those that only focus on a certain type of application function and need to be used in conjunction with other devices such as smartphones, such as various smart bracelets and smart jewelry for vital sign monitoring. With the advancement of technology and the changes in user needs, the form and application hotspots of wearable smart devices are also constantly changing.

[0003] The prior art patent announcement number is CN209105494U, which is a flexible circuit board for smart wearable devices. The above patent includes a flexible circuit board body, an electronic component is arranged on the front of the flexible circuit board body, and the electronic component is arranged on the surface of the front reinforced plate. An electronic component placement groove is arranged below the electronic component, a perforation is arranged in the front reinforced plate, a substrate layer is arranged below the front reinforced plate, a conductive layer is arranged on one side of the substrate layer, the electronic component is electrically connected to the conductive layer, a second adhesive layer is arranged at the bottom of the conductive layer, and a back reinforced plate is arranged below the second adhesive layer. The back reinforced plate has a connection surface. On the flexible circuit board body A front reinforcement plate, a back reinforcement plate, a substrate layer and a conductive layer are provided, and the electronic components are electrically connected to the conductive layer. The structure of the front reinforcement plate and the back reinforcement plate can effectively improve the rigidity effect of the utility model and effectively improve the service life of the utility model. However, there are still the following deficiencies in actual use: From a practical point of view, since the circuit board is used on wearable devices, it is difficult to ensure its waterproof and dustproof properties during use. Since higher waterproof and dustproof properties are required to meet the wearable use in different outdoor scenarios, it is crucial to improve the waterproof and dustproof properties of the circuit board itself, thereby improving its safety of use.

[0004] Therefore, a circuit board for wearable devices is needed to solve the problem in the prior art that it is difficult to ensure the waterproofness and dustproofness of the circuit board during use, thereby reducing the safety of use. Utility Model Content

[0005] The purpose of the utility model is to provide a circuit board for a wearable device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a circuit board for a wearable device, comprising a circuit board main body, a flexible circuit board is arranged on the left side of the circuit board main body, an insert is arranged at the left end of the flexible circuit board, a connecting piece is arranged at the right end of the flexible circuit board, the flexible circuit board is installed on the circuit board main body through the connecting piece, mounting holes are arranged near the four corners of the circuit board main body, electronic components are welded on the circuit board main body, and a sealing mechanism is arranged on the edge side of the circuit board main body.

[0007] The sealing mechanism comprises a sealing strip and a sealing adhesive, and the sealing strip is attached to the edge side of the sealing mechanism through the sealing adhesive.

[0008] It should be noted in the solution that the sealant is specifically silicone sealant, and the sealing strip is specifically a silicone strip. The sealing strip is matched with the edge of the circuit board substrate by the sealant to fit the edges between the layers, thereby improving its waterproofness and dustproofness to ensure its normal operation.

[0009] It is further worth explaining that a circuit board substrate is arranged in the circuit board body, the circuit board substrate is connected to the electronic components, a heat dissipation layer is arranged on the upper part of the circuit board substrate and is laid on the outside of the electronic components, a thermal conductive adhesive is arranged on the bottom of the heat dissipation layer and is connected to the circuit board substrate through it, an upper protective layer is arranged on the upper part of the heat dissipation layer and is arranged on the outside of the electronic components, the upper protective layer and the heat dissipation layer are pressed together, a lower protective layer is arranged on the bottom of the circuit board substrate, and an adhesive is arranged between the lower protective layer and the circuit board substrate and are bonded to each other through the adhesive.

[0010] It should be further explained that the heat dissipation layer is made of metal or graphene composite material, and its thickness is 0.5mm to 2mm. The heat dissipation layer and the electronic components are in close contact through thermal conductive adhesive to improve the heat dissipation efficiency. The heat dissipation layer quickly dissipates the heat generated by the electronic components through heat conduction, convection, radiation, etc., to ensure the stable operation of the circuit board body.

[0011] As a preferred embodiment, the protective layer and the lower protective layer are made of polyimide or polytetrafluoroethylene material with a thickness of 0.1mm to 0.5mm. The upper protective layer and the lower protective layer are used to protect the circuits and electronic components in the circuit board body from erosion by the external environment, ensuring its stability and reliability.

[0012] As a preferred implementation, the sealing strip and the sealant match the thickness of the circuit board substrate, the heat dissipation layer, the upper protective layer and the lower protective layer.

[0013] Compared with the prior art, the circuit board for a wearable device provided by the utility model has at least the following beneficial effects:

[0014] (1) A sealing mechanism is provided on the edge of the circuit board body to prevent moisture and dust from entering the interior of the circuit board body, thereby ensuring the stable operation of the circuit board body in harsh environments and improving its safety when used in wearable devices.

[0015] (2) The heat dissipation layer set on the electronic components can quickly dissipate the heat generated by the electronic components to improve the heat dissipation efficiency. At the same time, the upper protective layer set on the upper part can protect the circuits and electronic components in the circuit board body from erosion by the external environment to ensure its stability and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2 It is a schematic diagram of the internal cutaway structure of the utility model;

[0018] Figure 3 for Figure 2 The enlarged structural diagram at A in the middle;

[0019] Figure 4 for Figure 2 Schematic diagram of the enlarged structure at point B.

[0020] In the figure: 1. circuit board body; 101. mounting hole; 102. electronic components; 2. flexible circuit board; 201. plug-in piece; 202. connecting piece; 3. circuit board substrate; 4. heat dissipation layer; 401. thermal conductive adhesive; 5. upper protective layer; 6. lower protective layer; 601. adhesive; 7. sealing mechanism; 701. sealing strip; 702. sealant. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the embodiments.

[0022] See also Figure 1-4 The utility model provides a circuit board for a wearable device, including a circuit board body 1, a flexible circuit board 2 is arranged on the left side of the circuit board body 1, a plug-in sheet 201 is arranged at the left end of the flexible circuit board 2, a connecting sheet 202 is arranged at the right end of the flexible circuit board 2, the flexible circuit board 2 is installed on the circuit board body 1 through the connecting sheet 202, mounting holes 101 are arranged on the circuit board body 1 near the four corners, electronic components 102 are welded on the circuit board body 1, and a sealing mechanism 7 is arranged on the edge side of the circuit board body 1.

[0023] The sealing mechanism 7 includes a sealing strip 701 and a sealing adhesive 702 . The sealing strip 701 is attached to the edge of the sealing mechanism 7 through the sealing adhesive 702 .

[0024] The sealing mechanism 7 is used to improve the sealing of the inside of the circuit board body 1, so as to improve its waterproof and dustproof properties, thereby improving the use of the wearable device in different scenarios and improving its safety.

[0025] Further as Figure 2 and Figure 4 As shown, it is worth to explain in detail that the sealant 702 is specifically silicone sealant, and the sealing strip 701 is specifically a silicone strip.

[0026] According to the above working process, it can be known that: the sealing mechanism 7 set on the edge of the circuit board body 1 can prevent moisture and dust from entering the inside of the circuit board body 1, so as to ensure the stable operation of the circuit board body 1 in harsh environments and improve its safety when used in wearable devices. The flexible circuit board 2 is connected to the circuit board body 1 through the connecting piece 202 to facilitate expansion connection and improve its use efficiency.

[0027] Further as Figure 2 , Figure 3 and Figure 4 As shown, it is worth specifically explaining that a circuit board substrate 3 is arranged in the circuit board body 1, and the circuit board substrate 3 is connected to the electronic component 102. A heat dissipation layer 4 is arranged on the upper part of the circuit board substrate 3 and is laid on the outside of the electronic component 102. A thermal conductive adhesive 401 is arranged at the bottom of the heat dissipation layer 4 and is connected to the circuit board substrate 3 through it. An upper protective layer 5 is arranged on the upper part of the heat dissipation layer 4 and is arranged on the outside of the electronic component 102. The upper protective layer 5 and the heat dissipation layer 4 are pressed together. A lower protective layer 6 is arranged at the bottom of the circuit board substrate 3, and an adhesive 601 is arranged between the lower protective layer 6 and the circuit board substrate 3 and are bonded to each other through the adhesive 601. The heat dissipation layer 4 is made of metal or graphene composite material with a thickness of 0.5mm to 2mm. The protective layer 5 and the lower protective layer 6 are made of polyimide or polytetrafluoroethylene material with a thickness of 0.1mm to 0.5mm.

[0028] The heat dissipation layer 4 is in close contact with the electronic components 102 through the thermal conductive adhesive 401 to improve the heat dissipation efficiency. The heat dissipation layer 4 quickly dissipates the heat generated by the electronic components 102 through heat conduction, convection, radiation, etc., to ensure the stable operation of the circuit board body 1. At the same time, it cooperates with the upper protective layer 5 arranged on the upper part to protect the circuit inside the circuit board body 1 and the electronic components 102 from erosion by the external environment, thereby ensuring its stability and reliability.

[0029] Further as Figure 2 , Figure 3 and Figure 4 As shown, it is worth explaining in detail that the sealing strip 701 and the sealant 702 match the thickness setting of the circuit board substrate 3, the heat dissipation layer 4, the upper protective layer 5 and the lower protective layer 6.

[0030] The sealing strip 701 is matched with the edge of the circuit board substrate 3 by the sealant 702 to seal the edges between the layers, thereby improving its waterproofness and dustproofness to ensure its normal operation.

[0031] This solution has the following working process: when this device is used, the size and shape of the circuit board substrate 3 are determined according to the design requirements and size restrictions of the wearable device, and the electronic components 102 are welded on the upper part thereof through the circuit design of the upper part thereof, and the material and thickness of the heat dissipation layer 4 are determined according to the heat generation and heat dissipation requirements of the electronic components 102, and the heat dissipation layer 4 material is cut into the required size and shape, and is installed on the electronic components 102 by pasting or pressing, and the heat dissipation layer 4 and the electronic components 102 are in close contact through the thermal conductive adhesive 401 to improve the heat dissipation effect. The upper protective layer 5 is installed on the heat dissipation layer 4 by pasting or pressing, and the lower protective layer 6 is arranged under the circuit board substrate 3 by adhesive 601 to ensure its stability and reliability. Then, the sealing strip 701 is matched with the edge of the circuit board substrate 3 by sealant 702 to seal the edges between the layers and improve its waterproof and dustproof properties. After the circuit board body 1 is installed through the mounting hole 101, the flexible circuit board 2 can be connected to the circuit board body 1 through the connecting piece 202 to facilitate expansion connection and improve its use efficiency.

[0032] In summary: the sealing mechanism 7 provided on the edge of the circuit board body 1 can prevent moisture and dust from entering the interior of the circuit board body 1, thereby ensuring the stable operation of the circuit board body 1 in harsh environments and improving its safety when used in wearable devices; the heat dissipation layer 4 provided on the electronic components 102 can quickly dissipate the heat generated by the electronic components 102 to improve the heat dissipation efficiency, and at the same time cooperate with the upper protective layer 5 provided on the upper part to protect the circuits in the circuit board body 1 and the electronic components 102 from erosion by the external environment, thereby ensuring its stability and reliability.

Claims

1. A circuit board for a wearable device, comprising a circuit board body (1), characterized in that: A flexible circuit board (2) is arranged on the left side of the circuit board body (1); an insert (201) is arranged on the left end of the flexible circuit board (2); a connecting piece (202) is arranged on the right end of the flexible circuit board (2); the flexible circuit board (2) is mounted on the circuit board body (1) via the connecting piece (202); mounting holes (101) are arranged near four corners of the circuit board body (1); electronic components (102) are welded on the circuit board body (1); and a sealing mechanism (7) is arranged on the edge side of the circuit board body (1); The sealing mechanism (7) comprises a sealing strip (701) and a sealing adhesive (702), and the sealing strip (701) is attached to the edge side of the sealing mechanism (7) via the sealing adhesive (702).

2. A circuit board for a wearable device according to claim 1, characterized in that: The sealant (702) is specifically a silicone sealant, and the sealing strip (701) is specifically a silicone strip.

3. A circuit board for a wearable device according to claim 1, characterized in that: A circuit board substrate (3) is arranged inside the circuit board body (1), the circuit board substrate (3) is connected to the electronic component (102), a heat dissipation layer (4) is arranged on the upper part of the circuit board substrate (3) and is laid on the outer side of the electronic component (102), a heat conductive adhesive (401) is arranged on the bottom of the heat dissipation layer (4) and is connected to the circuit board substrate (3) through the heat conductive adhesive (401), an upper protective layer (5) is arranged on the upper part of the heat dissipation layer (4) and is arranged on the outer side of the electronic component (102), the upper protective layer (5) and the heat dissipation layer (4) are pressed together, a lower protective layer (6) is arranged on the bottom of the circuit board substrate (3), an adhesive (601) is arranged between the lower protective layer (6) and the circuit board substrate (3), and the lower protective layer (6) and the circuit board substrate (3) are bonded to each other through the adhesive (601).

4. A circuit board for a wearable device according to claim 3, characterized in that: The heat dissipation layer (4) is made of metal or graphene composite material and has a thickness of 0.5 mm to 2 mm.

5. A circuit board for a wearable device according to claim 3, characterized in that: The protective layer (5) and the lower protective layer (6) are made of polyimide or polytetrafluoroethylene material, and have a thickness of 0.1 mm to 0.5 mm.

6. A circuit board for a wearable device according to claim 1, characterized in that: The sealing strip (701) and the sealing glue (702) match the thickness of the circuit board substrate (3), the heat dissipation layer (4), the upper protective layer (5) and the lower protective layer (6).

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