Full-automatic valued ball production equipment

Abstract

The utility model discloses full-automatic value ball production equipment which comprises a machine table, a carrier conveying mechanism installed in the length direction of the machine table and a production unit located above the carrier conveying mechanism. The production unit comprises a PCB (Printed Circuit Board) value ball mechanism, a solder ball checking mechanism, a solder ball disassembling mechanism and a bonding pad decontamination mechanism which are sequentially connected to the top surface of the machine table; the carrier conveying mechanism consists of a carrier inflow connection table, a front-section assembly line track, a middle-section assembly line track and a carrier outflow connection table; according to the utility model, the functions of automatic laser value ball, automatic solder ball inspection, automatic solder ball disassembly and automatic pad cleaning and decontamination are integrated, the automation degree and the working efficiency are high, and the processing cost of the PCB value ball is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the field of ball value production facilities, in particular to a fully automatic ball value production device. Background Art

[0002] Ball setting is also called ball placement, which is the process of reinstalling solder balls on the PCB before re-soldering the disassembled PCB board. In the traditional PCB board ball setting and post-processing, single-station equipment is basically used for operation, and manual circulation tools are used for post-processing of solder balls. In addition, the post-processing of solder ball detection, disassembly, and cleaning are all done manually or semi-automatically, which has low work efficiency and high cost. Utility Model Content

[0003] The utility model aims to provide a fully automatic ball value production equipment to solve the problems of low working efficiency and high cost of traditional PCB board ball value facilities proposed in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a fully automatic ball-setting production equipment, comprising a machine, a carrier conveying mechanism installed in the length direction of the machine, and a production unit located above the carrier conveying mechanism; the production unit comprises a PCB board ball-setting mechanism, a solder ball inspection mechanism, a solder ball disassembly mechanism and a pad decontamination mechanism connected in sequence to the top surface of the machine, the PCB board ball-setting mechanism is used to solder the solder balls to the product pads, and the PCB board ball-setting mechanism comprises two groups of first Y-axis moving parts arranged along the width direction of the machine, a first X-axis moving part and a laser connected laterally above the two groups of first Y-axis moving parts, a reflector frame group arranged on the first Y-axis moving part, and a ball-setting bonding head installed on the first X-axis moving part; the solder ball inspection mechanism is used to detect the solder ball welding quality, the solder ball inspection mechanism comprises a front-stage XYZ motion platform, and a camera and a lens installed on the front-stage XYZ motion platform; the solder ball disassembly mechanism is used to ultrasonically disassemble bad solder joints, and the solder ball disassembly mechanism comprises The rear-stage XYZ motion platform and the ultrasonic desoldering head connected to the rear-stage XYZ motion platform; the pad decontamination mechanism is used to remove the scars and dirt on the pads, and the pad decontamination mechanism includes two groups of fourth Y-axis moving parts arranged along the width direction of the machine, a fourth X-axis moving part laterally connected above the two groups of fourth Y-axis moving parts, and a laser cleaning head connected to the fourth X-axis moving part; the carrier conveying mechanism is composed of the carrier inflow docking station, the front-stage assembly line track, the middle-stage assembly line track and the carrier outflow docking station The front section assembly line track is located directly below the ball bonding head, the middle section assembly line track is located below the lens, the carrier inflow docking station includes a front docking station support seat, a front flat belt installed on the front docking station support seat, and a front motor drive unit for driving the front flat belt to run; the carrier outflow docking station includes a rear docking station support seat, a rear flat belt installed on the rear docking station support seat, and a rear motor drive unit for driving the rear flat belt to run, and the rear flat belt is located directly above the ultrasonic desoldering head and the laser cleaning head.

[0005] Furthermore, the front-stage XYZ motion platform and the rear-stage XYZ motion platform are both composed of an X-axis screw motor, a Y-axis screw motor and a Z-axis screw motor, the Y-axis screw motor is installed on the X-axis screw motor, the Z-axis screw motor is installed on the Y-axis screw motor, a second supporting column is installed at the bottom of the X-axis screw motor of the front-stage XYZ motion platform, and a third supporting column is installed at the bottom of the X-axis screw motor of the rear-stage XYZ motion platform.

[0006] Furthermore, the first X-axis moving part, the first Y-axis moving part, the fourth X-axis moving part and the fourth Y-axis moving part all use screw motors, a first supporting column is provided at the bottom of the first Y-axis moving part, and a fourth supporting column is provided at the bottom of the fourth Y-axis moving part.

[0007] Furthermore, the motors of the front motor drive unit and the rear motor drive unit are both stepper motors, the front motor drive unit is installed on the side of the front docking platform support seat, and the rear motor drive unit is installed on the side of the rear docking platform support seat.

[0008] Furthermore, the reflector frame assembly is composed of a first reflector frame and a second reflector frame, and the bottoms of the first reflector frame and the second reflector frame are both connected to a reflector mounting seat.

[0009] The beneficial effects of the utility model are as follows: the utility model integrates the functions of automatic laser ball value, automatic solder ball inspection, automatic solder ball disassembly and automatic pad cleaning and decontamination, has a high degree of automation, can move the ball value bonding head under the cooperation of the first X-axis moving part and the first Y-axis moving part to perform a fully automatic bonding operation on the pads on the PCB board, controls the camera and the lens to perform fully automatic solder ball inspection on the bonded PCB board through the front-stage XYZ motion platform, controls the ultrasonic desoldering head to disassemble and process unqualified solder balls through the rear-stage XYZ motion platform, and simultaneously uses the fourth Y-axis moving part and the fourth X-axis moving part to adjust the position of the laser cleaning head to perform decontamination on the disassembled pads, thereby automatically completing the processing of the PCB board, greatly improving the work efficiency, reducing the processing cost of the PCB board ball value, and is conducive to the promotion and use of the fully automatic ball value production equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a structural diagram of the fully automatic ball value production equipment of the utility model;

[0011] Figure 2 For this utility model Figure 1 A schematic diagram of the structure enlargement at viewing angle A;

[0012] Figure 3 For this utility model Figure 1 A schematic diagram of the structure at B;

[0013] Figure 4 For this utility model Figure 1 Schematic diagram of the enlarged structure at the C perspective.

[0014] In the figure: 1 PCB board ball value mechanism, 101 first X-axis moving part, 102 laser, 103 No. 1 reflector frame, 104 sealing tube assembly, 105 reflector mounting seat, 106 first Y-axis moving part, 107 No. 2 reflector frame, 108 first support column, 109 front section assembly line track, 110 ball value bonding head, 111 dust hood, 112 first base, 2 solder ball inspection mechanism, 201 second base, 202 second support column, 203 front stage XYZ motion platform, 204 camera, 205 lens, 206 middle section assembly line track, 3 solder ball disassembly mechanism, 301 third base, 302 rear-stage XYZ motion platform, 303 ultrasonic desoldering head, 304 third supporting column, 4 pad decontamination mechanism, 401 fourth base, 402 fourth Y-axis moving part, 403 fourth X-axis moving part, 404 fourth supporting column, 405 laser cleaning head, 5 carrier inflow docking station, 501 front flat belt, 502 front docking station support seat, 503 front track width adjustment rod, 504 front handwheel, 505 front motor drive unit, 6 carrier outflow docking station, 601 rear flat belt, 602 rear docking station support seat, 603 rear track width adjustment rod, 604 rear handwheel, 605 rear motor drive unit. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] See also Figure 1-4, which provides a technical solution for the utility model, a fully automatic ball value production equipment, including a machine, a carrier conveying mechanism installed in the length direction of the machine, and a production unit located above the carrier conveying mechanism; wherein the machine is composed of a first base 112, a second base 201, a third base 301 and a fourth base 401 arranged in sequence from left to right; the production unit comprises a PCB board ball value mechanism 1, a solder ball inspection mechanism 2, a solder ball disassembly mechanism 3 and a pad decontamination mechanism 4 connected to the top surface of the machine in sequence, the PCB board ball value mechanism 1 is installed on the first base 112, the solder ball inspection mechanism 2 is installed on the second base 201, the solder ball disassembly mechanism 3 is installed on the third base 301, and the pad decontamination mechanism 4 is installed on the fourth base 401; wherein the PCB board ball value mechanism 1 is used to solder the balls It is welded to the product pad, and the PCB board ball-scaling mechanism 1 includes two groups of first Y-axis moving parts 106 arranged along the width direction of the machine, a first X-axis moving part 101 and a laser 102 laterally connected above the two groups of first Y-axis moving parts 106, a reflector frame group arranged on the first Y-axis moving part 106, and a ball-scaling bonding head 110 installed on the first X-axis moving part 101, a dust hood 111 is connected above the ball-scaling bonding head 110, and the laser 102 uses but is not limited to a femtosecond laser; wherein, the reflector frame group is composed of a No. 1 reflector frame 103 and a No. 2 reflector frame 107, the bottoms of the No. 1 reflector frame 103 and the No. 2 reflector frame 107 are both connected to a reflector mounting seat 105, and the bottoms of the No. 1 reflector frame 103 and the No. 2 reflector frame 107 are both connected to a sealing tube assembly 104.

[0017] In this embodiment, the solder ball inspection mechanism 2 is used to detect the solder ball welding quality, and the solder ball inspection mechanism 2 includes a front-stage XYZ motion platform 203, and a camera 204 and a lens 205 installed on the front-stage XYZ motion platform 203; the solder ball disassembly mechanism 3 is used to ultrasonically disassemble the bad solder joints, and the solder ball disassembly mechanism 3 includes a rear-stage XYZ motion platform 302, and an ultrasonic desoldering head 303 connected to the rear-stage XYZ motion platform 302; wherein the ultrasonic desoldering head 303 is a device that emits and receives ultrasonic waves during ultrasonic working, and the ultrasonic desoldering head 303 uses high-power ultrasonic waves to vibrate the welding interface of the product pad, destroying the crystal structure and the oxide covering layer, thereby weakening the damage to the welding surface. The desoldering speed is also fast; the pad decontamination mechanism 4 is used to remove the scars and dirt on the pad, and the pad decontamination mechanism 4 includes two groups of fourth Y-axis moving parts 402 arranged along the width direction of the machine, and a fourth X-axis moving part 402 connected horizontally above the two groups of fourth Y-axis moving parts 402. The fourth X-axis moving part 403 and the laser cleaning head 405 connected to the fourth X-axis moving part 403, wherein the two groups of fourth Y-axis moving parts 402 form a gantry double drive, and the fourth X-axis moving part 403 is arranged on the gantry double drive; in this embodiment, the front-stage XYZ motion platform 203 and the rear-stage XYZ motion platform 302 mentioned are both composed of an X-axis lead screw motor, a Y-axis lead screw motor and a Z-axis lead screw motor, the Y-axis lead screw motor is installed on the X-axis lead screw motor, and the Z-axis lead screw motor is installed on the Y-axis lead screw motor On the machine, a second supporting column 202 is installed at the bottom of the X-axis lead screw motor of the front-stage XYZ motion platform 203, and a third supporting column 304 is installed at the bottom of the X-axis lead screw motor of the rear-stage XYZ motion platform 302; wherein, the front-stage XYZ motion platform 203 is used to carry the camera 204 to move in the X-axis, Y-axis, and Z-axis directions to detect the solder balls, and the mentioned rear-stage XYZ motion platform 302 is used to carry the ultrasonic desoldering head 303 to move in the X-axis, Y-axis, and Z-axis directions to disassemble the solder balls and peel off the pads.

[0018] In this embodiment, the carrier conveying mechanism mentioned is composed of a carrier inflow docking station 5, a front section assembly line track 109, a middle section assembly line track 206 and a carrier outflow docking station 6. The front section assembly line track 109 is located directly below the ball bonding head 110, and the middle section assembly line track 206 is located below the lens 205. The carrier inflow docking station 5 includes a front docking station support seat 502, a front flat belt 501 installed on the front docking station support seat 502, and a front motor driving unit 505 for driving the front flat belt 501 to run; the carrier outflow docking station 6 includes a rear docking station support seat 602, a rear flat belt 601 installed on the rear docking station support seat 602, and a rear motor driving unit 605 for driving the rear flat belt 601 to run. The rear flat belt 601 is located between the ultrasonic desoldering head 303 and the laser cleaning head 304. The laser cleaning head 405 is directly above the head 405; the laser cleaning head 405 is used to remove the scars and dirt left on the soldering pad after the ultrasonic desoldering head 303 removes the solder balls, and the laser cleaning head 405 is used to remove the scars and dirt; wherein, the motors of the front motor drive unit 505 and the rear motor drive unit 605 are both but not limited to stepper motors, and the front motor drive unit 505 is installed on the side of the front docking platform support seat 502, and the rear motor drive unit 605 is installed on the side of the rear docking platform support seat 602; wherein, the front docking platform support seat 502 mentioned is provided with a front track width adjustment rod 503 and a front hand wheel 504, and the front hand wheel 504 is used to control the front track width adjustment rod 503; the rear docking platform support seat 602 is provided with a rear track width adjustment rod 603 and a rear hand wheel 604, and the rear hand wheel 604 is used to control the rear track width adjustment rod 603.

[0019] It should be noted that the front track width adjustment rod 503 and the rear track width adjustment rod 603 mentioned above can adjust the width of the assembly line track so as to be suitable for vehicles of different sizes; the front hand wheel 504 is used to control the front track width adjustment rod 503, and the rear hand wheel 604 is used to control the rear track width adjustment rod 603.

[0020] In this embodiment, the first X-axis moving part 101, the first Y-axis moving part 106, the fourth X-axis moving part 403 and the fourth Y-axis moving part 402 all use but are not limited to screw motors, and a first supporting column 108 is provided at the bottom of the first Y-axis moving part 106, and a fourth supporting column 404 is provided at the bottom of the fourth Y-axis moving part 402; wherein, the front flat belt 501, the front section assembly line track 109, the middle section assembly line track 206 and the rear flat belt 601 constitute a conveyor belt to transport the carrier, and the front motor drive part 505 cooperates with the rear motor drive part 605 to drive the conveyor belt to transport the carrier.

[0021] When the fully automatic ball-cutting production equipment is in use, the carrier conveying mechanism and the PCB board ball-cutting mechanism 1 are in operation, and the carrier with the PCB board flows from the carrier into the docking station 5 and is transferred into the front-end assembly line track 109. After the carrier reaches the processing position, that is, reaches the ball-cutting bonding head 110, the carrier conveying mechanism stops operating. At this time, the first X-axis moving part 101 and the first Y-axis moving part 106 drive the ball-cutting bonding head 110 to move to the top of the carrier, and the laser 102 operates to emit a laser beam, which passes through the sealing tube assembly 104, the No. 1 reflector frame 103, the No. 2 reflector frame 107 and the ball-cutting bonding head 110. The laser beam is in the ball-cutting bonding head 110 and the ball-cutting bonding head 110 is bonded. The head 110 performs solder wire bonding on the PCB board; when one pad is bonded, the first X-axis moving part 101 cooperates with the first Y-axis moving part 106 to drive the ball bonding head 110 to move to other pads in turn to perform operations; while bonding, the dust hood 111 absorbs the smoke generated by the soldering tin wire; when all pads are bonded, the laser 102 turns off the laser beam, and the carrier conveying mechanism operates to transport the bonded PCB board to the solder ball inspection mechanism 2, that is, the bonded PCB board flows to the middle section assembly line track 206; when the bonded PCB board enters the range of the solder ball inspection mechanism 2, the carrier conveying mechanism stops running, and the front stage XYZ motion stops running. The platform 203 drives the camera 204 and the lens 205 to detect the solder balls on the PCB board in turn. After the detection is completed, the front-stage XYZ motion platform 203 returns to the initial origin position and waits for the next carrier to come in. At this time, the carrier conveying mechanism operates to transport the PCB board to the solder ball disassembly mechanism 3. At this time, the carrier conveying mechanism stops running again, and the rear-stage XYZ motion platform 302 drives the ultrasonic desoldering head 303 to destroy and remove unqualified solder balls in turn, and the qualified solder balls are not processed; when the unqualified solder balls are destroyed and removed, the ultrasonic desoldering head 303 stops working, the rear-stage XYZ motion platform 302 returns to the original position, and the carrier conveying mechanism operates The PCB board is transferred to the pad decontamination mechanism 4. When the PCB board is transferred to the pad decontamination mechanism 4, the carrier conveying mechanism stops running again. The fourth Y-axis moving part 402 and the fourth X-axis moving part 403 cooperate to drive the laser cleaning head 405 to remove the scars and dirt on the solder ball pad. After the cleaning is completed, the laser cleaning head 405 stops running. The laser cleaning head 405 is returned to the original position through the cooperation of the fourth Y-axis moving part 402 and the fourth X-axis moving part 403. At this time, the carrier conveying mechanism runs to output the PCB board through the carrier outflow docking station 6, and the laser ball value, detection, disassembly and laser cleaning processes of the PCB board can be completed.

[0022] Among them, the principle of the laser cleaning head 405 is a facility that uses a laser beam to irradiate the surface of the workpiece and remove surface attachments or coating processes through the interaction between the laser and the material. Laser cleaning is efficient, fast, non-destructive, pollution-free, safe and reliable. It is suitable for removing coatings of various thicknesses and compositions, and is easy to realize automatic control; its basic laser principles include: absorption effect, when the laser beam is irradiated on the pollutant, the pollutant absorbs the laser energy, causing the surface temperature to rise; thermal expansion and contraction effect, the pollutant instantly heats up and expands rapidly due to the high energy of the laser beam, and then rapidly contracts due to heat loss and the departure of the laser beam, generating intense thermal stress; inert desorption effect, the laser stimulates the pollutant to undergo a chemical reaction, changes its molecular structure, causes it to lose its adhesion ability, and achieves desorption; thermodynamic effect, the high energy density of the laser beam causes part of the surface material to instantly vaporize, generating high-pressure gas and steam, which impacts the pollutant off the surface.

[0023] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0024] The above embodiments only express the preferred implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be understood that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. In the utility model, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection, or integrated; it can be a mechanical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components; among them, there are many ways of detachable installation, for example, it can be through the method of plug-in and snap-fit, for example, through the method of bolt connection, etc.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic ball value production equipment, comprising a machine, a carrier conveying mechanism installed in the length direction of the machine, and a production unit located above the carrier conveying mechanism; characterized in that: The production unit comprises a PCB board ball-counting mechanism, a solder ball inspection mechanism, a solder ball disassembling mechanism and a pad decontamination mechanism which are sequentially connected to the top surface of the machine. The PCB board ball-counting mechanism is used to solder solder balls to product pads, and the PCB board ball-counting mechanism comprises two groups of first Y-axis moving parts arranged along the width direction of the machine, a first X-axis moving part and a laser which are laterally connected above the two groups of first Y-axis moving parts, a reflector frame set arranged on the first Y-axis moving part, and a ball-counting bonding head installed on the first X-axis moving part; the solder ball inspection mechanism is used to detect the solder ball welding quality, and the solder ball inspection mechanism comprises a front-stage XYZ motion platform, and a camera and a lens installed on the front-stage XYZ motion platform; the solder ball disassembling mechanism is used to ultrasonically disassemble bad solder joints, and the solder ball disassembling mechanism comprises a rear-stage XYZ motion platform, and an ultrasonic desoldering head connected to the rear-stage XYZ motion platform; the pad decontamination mechanism The mechanism is used to remove scars and dirt on the pad, and the pad decontamination mechanism includes two groups of fourth Y-axis moving parts arranged along the width direction of the machine, a fourth X-axis moving part laterally connected above the two groups of fourth Y-axis moving parts, and a laser cleaning head connected to the fourth X-axis moving part; the carrier conveying mechanism is composed of a carrier inflow docking station, a front-section assembly line track, a middle-section assembly line track and a carrier outflow docking station, the front-section assembly line track is located directly below the ball bonding head, the middle-section assembly line track is located below the lens, the carrier inflow docking station includes a front docking station support seat, a front flat belt installed on the front docking station support seat, and a front motor drive unit for driving the front flat belt to run; the carrier outflow docking station includes a rear docking station support seat, a rear flat belt installed on the rear docking station support seat, and a rear motor drive unit for driving the rear flat belt to run, and the rear flat belt is located directly above the ultrasonic desoldering head and the laser cleaning head.

2. The fully automatic ball production equipment according to claim 1 is characterized in that: The front-stage XYZ motion platform and the rear-stage XYZ motion platform are both composed of an X-axis lead screw motor, a Y-axis lead screw motor and a Z-axis lead screw motor. The Y-axis lead screw motor is installed on the X-axis lead screw motor, and the Z-axis lead screw motor is installed on the Y-axis lead screw motor. A second supporting column is installed at the bottom of the X-axis lead screw motor of the front-stage XYZ motion platform, and a third supporting column is installed at the bottom of the X-axis lead screw motor of the rear-stage XYZ motion platform.

3. The fully automatic ball production equipment according to claim 1 is characterized in that: The first X-axis moving part, the first Y-axis moving part, the fourth X-axis moving part and the fourth Y-axis moving part all use screw motors. The bottom of the first Y-axis moving part is provided with a first supporting column, and the bottom of the fourth Y-axis moving part is provided with a fourth supporting column.

4. The fully automatic ball production equipment according to claim 1 is characterized in that: The motors of the front motor drive unit and the rear motor drive unit are both stepper motors. The front motor drive unit is installed on the side of the front docking platform support seat, and the rear motor drive unit is installed on the side of the rear docking platform support seat.

5. The fully automatic ball production equipment according to claim 1 is characterized in that: The reflector frame assembly is composed of a first reflector frame and a second reflector frame, and the bottoms of the first reflector frame and the second reflector frame are both connected with reflector mounting seats.

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