Sputtering coating device

Abstract

The utility model discloses a sputter coating device. The sputter coating device comprises a shell, a gas distribution plate, an insulating block and a collimator, the shell comprises a film coating cavity, the gas distribution plate comprises a downward first bottom surface, the collimator comprises an upward first top surface, and the insulating block comprises an insulating surface. Wherein a gap exists between the isolation surface and the first bottom surface, or a gap exists between the isolation surface and the first top surface. According to the utility model, the insulating block is provided with the insulating surface, and the gap exists between the insulating surface and the adjacent device, so that even if coating particles serving as conductors are fully distributed on the sputtering surface, the insulating block and the device at one end of the insulating surface cannot be directly and electrically conducted through the coating particles due to the gap, and a very good insulating effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of coating equipment, in particular to a sputtering coating device. Background Art

[0002] Sputtering coating technology is a process in which electrons are accelerated to fly toward the substrate by the electric field and collide with argon atoms, ionizing a large number of argon ions. Argon ions are accelerated to bombard the target material by the electric field, sputtering a large number of coating particles, which are deposited on the substrate to form a film. The collimator in the coating device can guide the coating particles for more uniform coating. Since the collimator needs to be powered during operation, it is necessary to isolate the collimator from other components through an insulating block. As the insulating block is used for a longer time, the surface close to the coating chamber will be covered with coating particles, making the collimator and the gas distribution plate at both ends of the insulating block electrically conductive (the coating particles are conductors), thereby losing the insulating effect. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a sputtering coating device, by providing an isolation surface with a height difference with the abutting surface on the abutting surface of the insulating block, the isolation surface is connected to the sputtering surface, so that at least one end of the sputtering surface does not directly contact other components, even if the sputtering surface is covered with coating particles, the insulating block can still have a good insulation effect due to the gap between the isolation surface and the gas distribution plate or the collimator.

[0004] According to an embodiment of the utility model, the sputtering coating device comprises a shell, an air distribution plate, an insulating block and a collimator. The shell comprises a coating chamber, the air distribution plate is arranged in the coating chamber, the air distribution plate comprises an air vent, the air vent is connected to the coating chamber, the air distribution plate comprises a first bottom surface facing downward, the insulating block comprises a sputtering surface, a first abutting surface, a second abutting surface and an insulating surface, the sputtering surface faces the central axis of the coating chamber, the first abutting surface and the insulating surface are located on the same side of the insulating block, the first abutting surface and the insulating surface have the same orientation, any one of the first abutting surface and the second abutting surface and the sputtering surface are respectively located on different sides of the insulating block, the first abutting surface and the second abutting surface are arranged back to back, the two ends of the sputtering surface in the vertical direction are respectively connected to the insulating surface and the second abutting surface, and the collimator comprises a first top surface facing upward. The first abutting surface abuts against the first bottom surface, there is a gap between the isolation surface and the first bottom surface, and the second abutting surface abuts against the first top surface; or the first abutting surface abuts against the first top surface, there is a gap between the isolation surface and the first top surface, and the second abutting surface abuts against the first bottom surface.

[0005] The sputtering coating device according to the embodiment of the utility model has at least the following beneficial effects: during the use of the sputtering coating device, many coating particles will exist in the coating chamber, and as the use time increases, the sputtering surface of the insulating block close to the coating chamber will be covered with coating particles, and the insulating block of the embodiment of the utility model is provided with an isolation surface at one end of the sputtering surface, and there is a gap between the isolation surface and the adjacent components (collimator or gas distribution plate), so that even if the sputtering surface is covered with coating particles acting as conductors, the gap will prevent the insulating block and the components at one end of the isolation surface from being directly electrically connected through the coating particles, thereby achieving a good insulation effect.

[0006] According to some embodiments of the present invention, the first bottom surface, the sputtering surface, the first abutting surface, the second abutting surface, the isolation surface, and the first top surface are horizontal surfaces.

[0007] According to some embodiments of the present invention, a height difference between the first abutting surface and the insulating surface in the vertical direction is h1, and 0.1 mm≤h1≤2 mm.

[0008] According to some embodiments of the present invention, the length of the insulating surface in the horizontal direction is h2, and 0.5 mm ≤ h2 ≤ 20 mm.

[0009] According to some embodiments of the utility model, the gas distribution plate includes a first main body portion and a first extension portion, the first main body portion includes a first bottom surface, the first bottom surface abuts against the insulating block, the first extension portion protrudes vertically downward relative to the first bottom surface, the first extension portion and the insulating block are spaced apart along the normal of the sputtering surface, and the first extension portion is located in the coating chamber.

[0010] According to some embodiments of the present invention, the width of the gap between the first protruding portion and the insulating block is h3, 2mm≤h3≤5mm.

[0011] According to some embodiments of the present invention, the projections of the first extension and the collimator in the vertical direction at least partially overlap, and there is a gap between the end of the first extension away from the first body and the collimator in the vertical direction, and the height of the gap is h4, 2mm≤h4≤4mm.

[0012] According to some embodiments of the present invention, the length of the insulating block in the vertical direction is h5, the length of the first extension portion in the vertical direction is h6, and h6>h5.

[0013] According to some embodiments of the present invention, 10 mm ≤ (h6 - h5) ≤ 40 mm.

[0014] According to some embodiments of the utility model, the sputtering coating device also includes a target material, the target material includes a second main body portion and a second extension portion, the second main body portion includes a second bottom surface facing downward, the second extension portion protrudes downward relative to the second bottom surface, and an air distribution plate is arranged below the second main body portion, the air distribution plate has a second top surface facing upward, and the height of the gap between the second top surface and the second bottom surface is h7, 2mm≤h7≤5mm.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0017] Figure 1 It is a structural schematic diagram of a sputtering coating device in one embodiment of the utility model;

[0018] Figure 2 for Figure 1 A magnified view of region A in FIG.

[0019] Figure 3 for Figure 2 A magnified view of area B in FIG.

[0020] Figure 4 It is a partial schematic diagram of the second embodiment of the utility model;

[0021] Figure 5 It is a partial schematic diagram of a sputtering coating device in the prior art.

[0022] Figure numerals: sputtering coating device 100, shell 101, coating chamber 102, air distribution plate 103, insulating block 104, collimator 105, magnetron 106, target 107, attachment plate 108, wafer stage 109, substrate 110, vent 201, second main body 202, second extension 203, second bottom surface 204, second top surface 205, first bottom surface 301, sputtering surface 302, first abutting surface 303, second abutting surface 304, isolation surface 305, first top surface 306, first main body 307, first extension 308. DETAILED DESCRIPTION

[0023] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0024] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0026] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0027] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0028] refer to Figures 1 to 3According to the embodiment of the present utility model, the sputtering coating device 100 includes a housing 101, an air distribution plate 103, an insulating block 104 and a collimator 105. The housing 101 includes a coating chamber 102, the air distribution plate 103 is arranged in the coating chamber 102, the air distribution plate 103 includes a vent 201, the vent 201 is connected to the coating chamber 102, the air distribution plate 103 includes a first bottom surface 301 facing downward, the insulating block 104 includes a sputtering surface 302, a first abutting surface 303, a second abutting surface 304 and an insulating surface 305, the sputtering surface 302 faces the central axis of the coating chamber 102, the first abutting surface 303 and the insulating surface 305 are located at the bottom of the coating chamber 102, and the second abutting surface 304 and the insulating surface 305 are located at the bottom of the coating chamber 102. On the same side of the insulating block 104, the first abutting surface 303 and the isolation surface 305 have the same orientation, any one of the first abutting surface 303 and the second abutting surface 304 and the sputtering surface 302 are respectively located on different sides of the insulating block 104, the first abutting surface 303 and the second abutting surface 304 are arranged back to back, and the two ends of the sputtering surface 302 in the vertical direction are respectively connected to the isolation surface 305 and the second abutting surface 304, and the collimator 105 includes an upward first top surface 306. Among them, the first abutting surface 303 abuts against the first bottom surface 301, there is a gap between the isolation surface 305 and the first bottom surface 301, and the second abutting surface 304 abuts against the first top surface 306. Reference Figure 5 , Figure 5 3 is a structural diagram of the prior art. During the use of the sputtering coating device 100, many coating particles will exist in the coating cavity 102. As the use time increases, the sputtering surface 302 of the insulating block 104 close to the coating cavity 102 will be covered with coating particles. The insulating block 104 of the utility model embodiment is provided with an isolation surface 305 at one end of the sputtering surface 302. There is a gap between the isolation surface 305 and the adjacent devices. Even if the sputtering surface 302 is covered with coating particles acting as conductors, the gap will prevent the insulating block 104 and the devices at one end of the isolation surface 305 from being directly electrically connected through the coating particles, thereby achieving a good insulation effect.

[0029] It should be noted that the reference Figure 4 In some embodiments of the present invention, the first abutting surface 303 may abut against the first top surface 306, there may be a gap between the insulating surface 305 and the first top surface 306, and the second abutting surface 304 may abut against the first bottom surface 301, which may also provide a good insulation effect.

[0030] It should be noted that the reference Figure 1In some embodiments of the present invention, the sputtering coating device 100 also includes a magnetron 106, a target material 107 and a wafer stage 109. The magnetron 106 is arranged above the target material 107, and the wafer stage 109 is arranged in the coating chamber 102. The target material 107, the collimator 105 and the substrate 110 are spaced from top to bottom in sequence. The substrate 110 is placed on the wafer stage 109. The specific working process of the sputtering coating device 100 is as follows: the air vent 201 of the gas distribution plate 103 evenly distributes the working gas in the coating chamber 102, and a high voltage is applied between the target material 107 and the substrate 110 to ionize the working gas to form plasma, and bombard the surface of the target material 107 to sputter out its atoms or molecules. At the same time, by using the magnetron 106 to apply a magnetic field between the target 107 and the substrate 110, the target is deposited on the surface of the substrate 110, and the collimator 105 can guide the coating particles to coat the film more uniformly.

[0031] It should be noted that in some embodiments of the present invention, argon is used as the working gas. Argon is chemically inactive and is ionized into argon ions during the sputtering process. The argon ions are accelerated under the action of the electric field and collide with the target material 107, causing the target material 107 to sputter. Nitrogen is also used. Nitrogen is used as a protective gas when the target is replaced for coating. When the target material 107 needs to be replaced for coating another layer of film, nitrogen is flushed into the coating chamber 102 to ensure that the pressure in the coating chamber 102 is equal to the atmospheric pressure, so that the coating chamber 102 can be safely opened to replace the target material 107.

[0032] It should be noted that in some embodiments of the present invention, the surface of the air vent 201 of the air distribution plate 103 is rough, and the surface roughness of the air vent 201 is Ra4≤Ra≤Ra20. This can improve the adhesion ability of the surface and allow more coating particles to adhere, thereby preventing the old coating particles from contaminating the new coating surface during the process of replacing the new target material 107 and re-coating the substrate 110.

[0033] It should be noted that the reference Figure 1 In some embodiments of the present invention, the sputtering coating device 100 also includes an attachment plate 108, which is arranged around the coating chamber 102. The surface of the attachment plate 108 facing the coating chamber 102 is a rough surface, Ra4≤; the surface roughness of the attachment plate 108 close to the coating chamber 102 is Ra≤Ra20, which can improve the adhesion ability of the surface and can attach more coating particles, thereby preventing the old coating particles from contaminating the new coating surface during the process of replacing the new target material 107 and re-coating the substrate 110.

[0034] refer to Figure 3In some embodiments of the present invention, the first bottom surface 301, the sputtering surface 302, the first abutting surface 303, the second abutting surface 304, the isolation surface 305, and the first top surface 306 are horizontal surfaces. The horizontal surface can increase the abutting area between each surface while improving the overall stability. The horizontal surface is also more convenient to process and reduces the processing cost.

[0035] refer to Figure 2 and Figure 3 In some embodiments of the utility model, the height difference between the first abutting surface 303 and the isolation surface 305 in the vertical direction is h1, 0.1mm≤h1≤2mm. The height difference between the first abutting surface 303 and the isolation surface 305 in the vertical direction can make a gap between the isolation surface 305 and the first bottom surface 301 exist when the first abutting surface 303 abuts the first bottom surface 301, and one end of the sputtering surface 302 cannot be directly connected to the first bottom surface 301, which has a good insulation effect. When h1 is less than 0.1mm, the gap is too small, and the gap is easily filled with coating particles again, so that it is conductive, which is inconvenient to process. In addition, there are processing errors between parts or parts are deformed by heat expansion. A very narrow gap may cause contact between conductors for conduction or the gap is too small to cause arc discharge; when h1 is greater than 2mm, the gap is too large, the insulating block 104 is thinned too much, and the coating particles are more likely to enter the gap, so that the gap is also filled with coating particles, resulting in insulation failure.

[0036] It should be noted that the reference Figure 4 In some embodiments of the utility model, the first abutting surface 303 may abut against the first top surface 306, there may be a gap between the insulating surface 305 and the first top surface 306, and the second abutting surface 304 may abut against the first bottom surface 301. At this time, there may be a gap between the insulating surface 305 and the first top surface 306, which can also improve the insulation effect.

[0037] refer to Figure 2 and Figure 3 In some embodiments of the present invention, the length of the isolation surface 305 in the horizontal direction is h2, 0.5mm≤h2≤20mm. The length of the isolation surface 305 in the horizontal direction is such that even if the coating particles are sputtered to the gap between the isolation surface 305 and the first bottom surface 301, they will fall on the isolation surface 305 and will not be electrically connected to the first bottom surface 301, thus achieving a good insulation effect. When h2 is less than 0.5mm, the length is too small, and the coating particles are more likely to cover the isolation surface 305 and thus stack, and are easily electrically connected to the first bottom surface 301; when h2 is greater than 20mm, the length is too large, and the area of ​​the first abutting surface 303 on the same side as the isolation surface 305 will be too small, thereby reducing the structural stability of the air distribution plate 103 placed on the first abutting surface 303.

[0038] refer to Figure 2 and Figure 3 In some embodiments of the present invention, the gas distribution plate 103 includes a first main body 307 and a first extension 308. The first main body 307 includes a first bottom surface 301, the first bottom surface 301 abuts against the insulating block 104, the first extension 308 vertically protrudes downward relative to the first bottom surface 301, the first extension 308 and the insulating block 104 are spaced apart along the normal direction of the sputtering surface 302, and the first extension 308 is located in the coating chamber 102. The first extension 308 plays a further protective role on the sputtering surface 302. When the coating particles move toward the sputtering surface 302, a part of them will be blocked by the first extension 308, which slows down the process of the sputtering surface 302 being covered with coating particles and improves the service life of the insulating block 104.

[0039] refer to Figure 2 and Figure 3 In some embodiments of the present invention, the width of the gap between the first extension 308 and the insulating block 104 is h3, 2mm≤h3≤5mm. The gap h3 can accommodate some of the coated particles, so that the sputtering surface 302 of the insulating block 104 plays a role in attaching some of the coated particles. If there is no gap, the area where the coated particles can be attached will be reduced, and the two ends of the insulating block 104 will be more easily electrically connected by the coated particles. When h3 is less than 2mm, the gap is too small, and it is not easy for the coated particles to penetrate into the gap, which easily leads to accumulation at the entrance of the gap, making the maze design in the gap ineffective and the insulation effect worse; when h3 is greater than 5mm, the gap is too large, and it is easier for the coated particles to enter the gap, which increases the speed of the coated particles attaching to the sputtering surface 302 and reduces the service life of the insulating block 104.

[0040] refer to Figure 2 and Figure 3 In some embodiments of the present invention, the projections of the first extension 308 and the collimator 105 in the vertical direction at least partially overlap, and there is a gap between the end of the first extension 308 away from the first body 307 and the collimator 105 in the vertical direction, and the height of the gap is h4, 2mm≤h4≤4mm. h4 can prevent the gas distribution plate 103 from being directly electrically connected to the collimator 105, thereby improving the insulation effect. When h4 is less than 2mm, the gap is too small, and the gas distribution plate 103 and the collimator 105 may be directly electrically connected due to the effect of high voltage. At the same time, a too small gap will easily cause the coating particles to accumulate and fill the entrance of the gap, thereby making the gas distribution plate 103 and the collimator 105 electrically connected; when h4 is greater than 4mm, the gap is too large, and it is easier for the coating particles to enter the gap, thereby increasing the speed at which the coating particles adhere to the sputtering surface 302 and reducing the service life of the insulating block 104.

[0041] refer to Figure 2 and Figure 3In some embodiments of the present invention, the length of the insulating block 104 in the vertical direction is h5, and the length of the first extension 308 in the vertical direction is h6, where h6>h5. h6>h5 makes the path formed by the coating particles bypassing the first extension 308 and then attaching to the sputtering surface 302 a U-shaped path, which increases the difficulty of the coating particles bypassing the first extension 308 and attaching to the sputtering surface 302, and increases the service life of the insulating block 104.

[0042] refer to Figure 2 and Figure 3 In some embodiments of the present invention, 10mm≤(h6-h5)≤40mm. When (h6-h5) is less than 10mm, the height difference is too small, and the coating particles can easily bypass the first extension 308 and adhere to the sputtering surface 302, and the difficulty of the U-shaped path is relatively low; when (h6-h5) is greater than 40mm, under the premise that the insulating block 104 itself has a certain thickness and the gas distribution plate 103 cannot be directly connected to the collimator 105, the first extension 308 will be very long, thereby increasing the overall height of the gas distribution plate 103 and the overall height of the sputtering coating device 100, which is not conducive to the needs of miniaturized production.

[0043] refer to Figure 2 In some embodiments of the present invention, the sputtering coating device 100 further includes a target 107, the target 107 includes a second main body 202 and a second extension 203, the second main body 202 includes a second bottom surface 204 facing downward, the second extension 203 protrudes downward relative to the second bottom surface 204, the gas distribution plate 103 is arranged below the second main body 202, the gas distribution plate 103 has a second top surface 205 facing upward, the height of the gap between the second top surface 205 and the second bottom surface 204 is h7, 2mm≤h7≤5mm. The target 107 has a high voltage, and the gap h7 can prevent the gas distribution plate 103 from being directly electrically connected to the target 107. When h7 is less than 2mm, the gap is too small, and the high-voltage target 107 in a vacuum environment is prone to sparking. Similarly, when h7 is greater than 5mm, the gap is too large, and the high-voltage target 107 in a vacuum environment is also prone to sparking.

[0044] The embodiments of the utility model are described in detail above in conjunction with the accompanying drawings, but the utility model is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the utility model. In addition, the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

Claims

1. A sputtering coating device, characterized in that: include: A housing, the housing comprising a coating cavity; An air distribution plate, the air distribution plate is arranged in the coating chamber, the air distribution plate comprises an air vent, the air vent is communicated with the coating chamber, and the air distribution plate comprises a first bottom surface facing downward; An insulating block, the insulating block comprising a sputtering surface, a first abutting surface, a second abutting surface and an isolation surface, the sputtering surface faces the central axis of the coating chamber, the first abutting surface and the isolation surface are located on the same side of the insulating block, the first abutting surface and the isolation surface have the same orientation, any one of the first abutting surface and the second abutting surface and the sputtering surface are respectively located on different sides of the insulating block, the first abutting surface and the second abutting surface are arranged back to back with each other, and the two ends of the sputtering surface in the vertical direction are respectively connected to the isolation surface and the second abutting surface; A collimator, the collimator comprising a first top surface facing upward; Wherein, the first abutting surface abuts against the first bottom surface, there is a gap between the isolation surface and the first bottom surface, and the second abutting surface abuts against the first top surface; Alternatively, the first abutting surface abuts against the first top surface, a gap exists between the isolation surface and the first top surface, and the second abutting surface abuts against the first bottom surface.

2. The sputtering coating device according to claim 1, characterized in that: The first bottom surface, the sputtering surface, the first abutting surface, the second abutting surface, the isolation surface, and the first top surface are horizontal surfaces.

3. The sputtering coating device according to claim 1, characterized in that: A height difference between the first abutting surface and the isolation surface in the vertical direction is h1, and 0.1 mm≤h1≤2 mm.

4. The sputtering coating device according to claim 1, characterized in that: The length of the isolation surface in the horizontal direction is h2, 0.5mm≤h2≤20mm.

5. The sputtering coating device according to claim 1, characterized in that: The gas distribution plate includes a first main body and a first extension. The first main body includes the first bottom surface, the first bottom surface abuts the insulating block, the first extension protrudes vertically downward relative to the first bottom surface, the first extension and the insulating block are spaced apart along the normal of the sputtering surface, and the first extension is located in the coating chamber.

6. The sputtering coating device according to claim 5, characterized in that: The width of the gap between the first protruding portion and the insulating block is h3, 2mm≤h3≤5mm.

7. The sputtering coating device according to claim 5, characterized in that: The projections of the first extension portion and the collimator in the vertical direction at least partially overlap, and there is a gap between the end of the first extension portion away from the first main body portion and the collimator in the vertical direction, and the height of the gap is h4, 2mm≤h4≤4mm.

8. The sputtering coating device according to claim 5, characterized in that: The length of the insulating block in the vertical direction is h5, and the length of the first protruding portion in the vertical direction is h6, where h6>h5.

9. The sputtering coating device according to claim 8, characterized in that: 10mm≤(h6-h5)≤40mm.

10. The sputtering coating device according to claim 1, characterized in that: The sputtering coating device also includes a target material, which includes a second main body portion and a second extending portion, the second main body portion includes a second bottom surface facing downward, the second extending portion protrudes downward relative to the second bottom surface, the air distribution plate is arranged below the second main body portion, the air distribution plate has a second top surface facing upward, and the height of the gap between the second top surface and the second bottom surface is h7, 2mm≤h7≤5mm.

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