Fuse heat dissipation structure and new energy automobile charging equipment

Abstract

The utility model discloses a heat dissipation structure of a fuse, and belongs to the technical field of electric vehicle charging. According to the heat dissipation structure provided by the utility model, the hole is formed below the fuse tube body on the PCB, one end of the heat conduction pad penetrates through the hole to abut against the fuse tube body, the other end of the heat conduction pad is fixedly connected with the liquid cooling plate, the part, located below the PCB, of the heat conduction pad further abuts against the pin of the fuse, and the heat conduction pad transmits heat of the tube body and the pin of the fuse to the liquid cooling plate. And the temperature is conducted to the outside of the equipment through the liquid cooling plate, so that the temperature of the fuse tube body and the pin is effectively reduced, and the safety of the circuit and the equipment is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of new energy vehicle charging, in particular to a fuse heat dissipation structure and new energy vehicle charging equipment. Background Art

[0002] New energy vehicle charging equipment converts the mains electricity into a suitable voltage that the car can accept and charges the car. In new energy vehicle charging equipment, fuses are used as current protection devices and are used very frequently. However, during the operation of the circuit, a large amount of heat is emitted from the pins and shell of the fuse. New energy vehicle charging equipment is usually set up in urban areas. If air cooling measures are used, it will generate a lot of noise. In addition, for insulation reasons, the thermal conductivity of the fuse shell is low, and it is difficult to reduce the temperature to a reasonable range by heat radiation alone. Therefore, the temperature of the fuse shell and pins often exceeds 200°, which cannot meet the safety specification requirement that the maximum temperature of the tube body is not higher than 120°C. Utility Model Content

[0003] In view of the above-mentioned problems of the background technology, the utility model provides a fuse heat dissipation structure and a new energy vehicle charging device.

[0004] The fuse heat dissipation structure provided by the utility model comprises a PCB board, a fuse, a thermal pad, and a liquid cooling device;

[0005] The fuse includes a tube body and pins located at both ends of the tube body;

[0006] The liquid cooling device comprises a liquid cooling plate;

[0007] The PCB board is provided with first openings at the pin positions at both ends of the fuse, and the pins of the fuse penetrate the first openings and are welded to the other side of the PCB board; the side of the PCB board away from the fuse tube body is fixedly connected to the liquid cooling plate;

[0008] The thermal pad is made of elastic thermally conductive material; the height of the thermal pad is greater than the vertical distance from the lowermost end of the fuse tube to the liquid cooling plate; the PCB board is provided with a second opening below the fuse tube, the thermal pad passes through the second opening and abuts against the fuse tube, and one end of the thermal pad away from the fuse tube is fixed to the liquid cooling plate; the length of the portion of the thermal pad located below the PCB board is greater than the distance between the pins at both ends of the fuse; the portion of the thermal pad located below the PCB board also abuts against the pins of the fuse.

[0009] Preferably, the length of the second opening is smaller than the length of the fuse tube body, and the width of the second opening is larger than the diameter of the fuse tube body.

[0010] Preferably, the length of the portion of the thermal pad located above the PCB board is smaller than the length of the second opening, and the width of the portion of the thermal pad located above the PCB board is smaller than the width of the second opening.

[0011] Preferably, the width of the portion of the thermal pad located above the PCB board is greater than the diameter of the fuse tube body.

[0012] Preferably, the width of the portion of the thermal pad located above the PCB board is equal to the diameter of the fuse tube body.

[0013] Preferably, the thermally conductive pad is a silicone elastomer mixed with ceramic thermally conductive powder.

[0014] Preferably, a gap is provided between the PCB board and the liquid cooling plate.

[0015] Preferably, the thermal pad is fixed to the liquid cooling plate by bonding.

[0016] The utility model also provides a new energy vehicle charging device, comprising the fuse heat dissipation structure as described above.

[0017] The utility model has the following beneficial effects: the heat dissipation structure provided by the utility model opens a hole below the fuse tube body on the PCB board, one end of the thermal pad passes through the opening and abuts against the fuse tube body, and the other end is fixedly connected to the liquid cooling plate, and the portion of the thermal pad located below the PCB board also abuts against the fuse pins, and the thermal pad transfers the heat of the fuse tube body and pins to the liquid cooling plate, and then conducts it to the outside of the device through the liquid cooling plate, thereby effectively reducing the temperature of the fuse tube body and pins and improving the safety of the circuit and the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A side view of a fuse heat dissipation structure provided in an embodiment of the utility model.

[0019] Figure 2 A three-dimensional diagram of a fuse heat dissipation structure provided in an embodiment of the utility model.

[0020] Figure 3 A side view from another perspective of the fuse heat dissipation structure provided in an embodiment of the utility model.

[0021] Figure 4 A side view of a thermal pad in a fuse heat dissipation structure provided in an embodiment of the utility model.

[0022] Figure 5 A three-dimensional diagram of a thermally conductive pad in a fuse heat dissipation structure provided in an embodiment of the utility model.

[0023] Figure 6A side view from another perspective of the thermal pad in the fuse heat dissipation structure provided by an embodiment of the utility model.

[0024] Figure 7 This is a simulation effect diagram of the glass fiber tube of the fuse heat dissipation structure provided in an embodiment of the utility model.

[0025] Figure 8 This is a simulation effect diagram of the ceramic tube of the fuse heat dissipation structure provided in the embodiment of the utility model.

[0026] In the attached picture:

[0027] 10. PCB board;

[0028] 20. Fuse; 21. Fuse body; 22. Fuse pin;

[0029] 30. Thermal pad;

[0030] 40. Liquid cooling plate. DETAILED DESCRIPTION

[0031] In order to have a clearer understanding of the technical features, purposes and effects of the present utility model, the specific implementation methods of the present utility model are now described in detail with reference to the accompanying drawings.

[0032] The fuse heat dissipation structure of the utility model is suitable for the charging circuit of new energy vehicles, and is also suitable for other scenarios using fuses and liquid cooling devices.

[0033] like Figure 1-6 As shown, an embodiment of the utility model provides a fuse heat dissipation structure, which includes a PCB board 10, a fuse 20, a thermal pad 30, and a liquid cooling device.

[0034] Because new energy vehicle charging equipment is usually installed in urban areas, if air cooling is used, it will generate a lot of noise. In addition, the liquid-cooled product has a smaller overall volume, and because the internal components are not in contact with the outside, the protection level is higher. Air-cooled products may have reduced reliability after long-term operation due to dust accumulation and other reasons, while the probability of this happening to liquid-cooled products is lower, so liquid-cooled products have higher reliability during long-term operation. Therefore, in the embodiment of the utility model, a liquid cooling device is used to conduct the heat generated by the fuse.

[0035] The fuse 20 includes a tube body 21 and pins 22 located at two ends of the tube body.

[0036] The liquid cooling device includes a liquid cooling plate 40 .

[0037] The liquid cooling plate 40 is generally an aluminum shell with a liquid circulation pipeline arranged therein. The temperature of the fluid in the liquid cooling plate 40 is usually set to 60°C.

[0038] The PCB board 10 is provided with first openings at the positions of the pins 22 at both ends of the fuse 20, and the pins 22 of the fuse 20 penetrate the first openings and are welded to the other side of the PCB board 10; the side of the PCB board 10 away from the fuse tube body 21 is fixedly connected to the liquid cooling plate 40;

[0039] The thermal pad 30 is made of elastic thermally conductive material; the height of the thermal pad 30 is greater than the vertical distance from the lower end of the fuse tube 21 to the liquid cooling plate 40; the PCB board 10 is provided with a second opening below the fuse tube 21, and the thermal pad 30 passes through the second opening to abut against the fuse tube 21, and one end of the thermal pad 30 away from the fuse tube 21 is fixed on the liquid cooling plate 40; the length of the portion of the thermal pad 30 located below the PCB board 10 is greater than the distance between the pins 22 at both ends of the fuse; the portion of the thermal pad 30 located below the PCB board 10 also abuts against the pins 22 of the fuse.

[0040] The second opening is designed to allow the thermal pad 30 to pass through the PCB board 10 and contact the fuse body 21. In order not to affect the welding effect of the fuse 20 and to ensure that the thermal pad 30 is in full contact with the fuse body 21, in the embodiment of the utility model, the length of the second opening is smaller than the length of the fuse body 21, and the width of the second opening is larger than the diameter of the fuse body 21.

[0041] In some embodiments of the present invention, the length of the portion of the thermal pad 30 located above the PCB board 10 is less than the length of the second opening, and the width of the portion of the thermal pad 30 located above the PCB board 10 is less than the width of the second opening. With such a design, the thermal pad 30 can easily pass through the second opening. Of course, because the thermal pad 30 is made of elastic material, the width of the portion of the thermal pad 30 located above the PCB board 10 can also be greater than or equal to the width of the second opening.

[0042] In some embodiments of the present invention, the width of the portion of the thermal pad 30 located above the PCB board 10 is greater than the diameter of the fuse tube 21 and less than the width of the second opening. In other embodiments of the present invention, the width of the portion of the thermal pad 30 located above the PCB board 10 is equal to the diameter of the fuse tube 21. In both cases, it is ensured that the thermal pad 30 has sufficient contact area with the fuse tube 21, and the thermal pad 30 can easily pass through the second opening.

[0043] The thermal pad 30 passes through the second opening and abuts against the tube body 21 of the fuse. Because the thermal pad 30 is made of elastic material and the height of the thermal pad 30 is greater than the vertical distance from the bottom of the fuse tube body 21 to the liquid cooling plate 40, the tube body 21 of the fuse squeezes the thermal pad 30 to form a curved contact surface, and the heat of the tube body is transferred to the thermal pad 30 through the contact surface.

[0044] The length of the portion of the thermal pad 30 located below the PCB board 10 is greater than the distance between the pins 22 at both ends of the fuse so that the portion of the thermal pad 30 located below the PCB board 10 is still in contact with the pins 22 of the fuse, and the heat of the pins 22 of the fuse and the solder joints between the pins 22 and the PCB is conducted away. The heat transferred by the fuse 20 through the pins 22 is greater than the heat transferred through the tube body 21.

[0045] In the embodiment of the utility model, the contact surface between the thermal pad 30 and the fuse tube body 21 is a plane or a curved surface. If the contact surface is a plane, it will become a curved surface due to the extrusion of the fuse tube body, and the curved surface will wrap the tube body, and the heat will be conducted through the curved surface.

[0046] In the embodiment of the utility model, the length of the portion of the thermal pad located below the PCB board is greater than the distance between the pins at both ends of the fuse, so that the portion of the thermal pad located below the PCB board also abuts against the pins of the fuse.

[0047] like Figure 4-6 As shown, the contact surface between the thermal pad 30 and the fuse tube 21 is a curved surface, and the structure of the thermal pad is similar to a bonded body of two rectangular parallelepipeds, the contact surface between the upper rectangular parallelepiped and the fuse tube 21 is a curved surface, the length of the upper rectangular parallelepiped is less than or equal to the length of the second opening, the length of the lower rectangular parallelepiped is greater than the distance between the pins at both ends of the fuse, the upper rectangular parallelepiped passes through the second opening of the PCB board and abuts against the fuse tube, and the larger rectangular parallelepiped at one end abuts against the pin of the fuse, and at one end is bonded to the liquid cooling plate. In some embodiments of the utility model, the widths of the upper and lower rectangular parallelepipeds are the same, and in other embodiments of the utility model, the width of the lower rectangular parallelepiped is greater than the width of the upper rectangular parallelepiped, so as to increase the volume of the thermal pad and enhance the heat conduction effect.

[0048] The present invention has no particular restrictions on the material of the thermal pad. In practical applications, an elastic material with a suitable thermal conductivity coefficient is selected to make the thermal pad as needed. In some embodiments of the present invention, the thermal pad is an organic silicon elastomer mixed with ceramic thermal conductive powder.

[0049] In the embodiment of the utility model, a gap is provided between the PCB board and the liquid cooling plate. The gap is used for heat dissipation of the thermal pad. The utility model has no special restrictions on the size of the gap. In practical applications, the height of the thermal pad below the PCB board is designed according to the gap and the elastic coefficient of the thermal pad.

[0050] In the embodiment of the utility model, the thermal pad is fixed to the liquid cooling plate by bonding. The utility model has no particular restrictions on the bonding method. In some embodiments of the utility model, the thermal pad comes with a weak adhesive backing when it leaves the factory, and can be directly bonded to the liquid cooling plate. After the PCB and the fuse are installed, the fuse will also compress the thermal pad, making the thermal pad more firmly bonded.

[0051] The heat dissipation effect of the heat dissipation structure of the present invention is described below through two sets of simulation experiment data.

[0052] The main data used in the simulation experiment are as follows: the pin spacing at both ends of the fuse is 44.7mm, the diameter of the fuse body is 9.2mm, the length of the fuse pin is 18.44mm, the second opening is 35.6mm long and 9.2mm wide, the thickness of the PCB board is 2mm, the length of the rectangular block above the thermal pad is 35.6mm, the width is 9.2mm, and the height is 7.1mm, the length of the rectangular block below the thermal pad is 44.7mm, the width is 9.2mm, and the height is 3.5mm, the height of the thermal pad above the PCB board is 5.1mm; the fluid temperature in the liquid cooling plate is 60℃.

[0053] The fuse body used in the first group of experiments was a glass fiber tube, and the fuse body used in the second group of experiments was a ceramic tube. Both simulation experiments used a set of materials with different thermal conductivities to construct thermal pads and measure the maximum temperature on the fuse surface.

[0054] Table 1 Thermal conductivity simulation data of glass fiber tube and ceramic tube

[0055]

[0056] Figure 7-8 The thermal conductivity effect diagram of glass fiber tube and ceramic tube drawn according to the data in Table 1. It can be seen from the figure that after adding the thermal pad, the maximum temperature of the tube surface has dropped significantly, and the thermal conductivity is optimal when it is 5W / (m·K). The temperature does not drop significantly when the thermal conductivity is further increased. The safety specification of the fuse requires that the maximum surface temperature of the tube should not exceed 120℃. It can be seen from Table 1 that the fuse using ceramic tube, combined with the thermal pad with suitable thermal conductivity, can reduce the maximum surface temperature of the fuse tube to within the safety specification through the solution provided by the utility model.

[0057] In practical applications, a better thermal conductivity can be obtained through simulation experiments, and elastic materials with corresponding thermal conductivity can be selected to make thermal pads, and then real environment tests can be carried out.

[0058] An embodiment of the utility model further provides a new energy vehicle charging device, which includes the fuse heat dissipation structure as described above.

[0059] The utility model has the following beneficial effects: the heat dissipation structure provided by the utility model opens a hole below the fuse tube body on the PCB board, one end of the thermal pad passes through the opening and abuts against the fuse tube body, and the other end is fixedly connected to the liquid cooling plate, and the portion of the thermal pad located below the PCB board also abuts against the fuse pins, and the thermal pad transfers the heat of the fuse tube body and pins to the liquid cooling plate, and then conducts it to the outside of the device through the liquid cooling plate, thereby effectively reducing the temperature of the fuse tube body and pins and improving the safety of the circuit and the device.

[0060] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms of deformation without departing from the scope of protection of the utility model and the claims, which all fall within the protection of the utility model.

Claims

1. A fuse heat dissipation structure, characterized in that: The heat dissipation structure comprises a PCB board (10), a fuse (20), a thermal pad (30), and a liquid cooling device; The fuse (20) comprises a tube body (21) and pins (22) located at two ends of the tube body; The liquid cooling device comprises a liquid cooling plate (40); The PCB board (10) is provided with first openings at the positions of the pins (22) at both ends of the fuse, and the pins (22) of the fuse penetrate the first openings and are welded to the other side of the PCB board (10); a side of the PCB board (10) away from the fuse tube body (21) is fixedly connected to the liquid cooling plate (40); The thermal pad (30) is made of an elastic thermally conductive material; the height of the thermal pad (30) is greater than the vertical distance from the lowest end of the fuse tube (21) to the liquid cooling plate (40); the PCB (10) is provided with a second opening below the fuse tube (21); the thermal pad (30) passes through the second opening and abuts against the fuse tube (21); one end of the thermal pad (30) away from the fuse tube (21) is fixed on the liquid cooling plate (40); the length of the portion of the thermal pad (30) located below the PCB (10) is greater than the distance between the pins (22) at both ends of the fuse; and the portion of the thermal pad (30) located below the PCB (10) also abuts against the pins (22) of the fuse.

2. The fuse heat dissipation structure according to claim 1, characterized in that: The length of the second opening is smaller than the length of the fuse tube body (21), and the width of the second opening is larger than the diameter of the fuse tube body (21).

3. The fuse heat dissipation structure according to claim 2, characterized in that: The length of the portion of the thermal pad (30) located above the PCB board (10) is smaller than the length of the second opening, and the width of the portion of the thermal pad (30) located above the PCB board (10) is smaller than the width of the second opening.

4. The fuse heat dissipation structure according to claim 3, characterized in that: The width of the portion of the thermal pad (30) located above the PCB board (10) is greater than the diameter of the fuse tube body (21).

5. The fuse heat dissipation structure according to claim 3, characterized in that: The width of the portion of the thermal pad (30) located above the PCB board (10) is equal to the diameter of the fuse tube (21).

6. The fuse heat dissipation structure according to claim 1, characterized in that: The thermally conductive pad (30) is an organic silicon elastomer mixed with ceramic thermally conductive powder.

7. The fuse heat dissipation structure according to claim 1, characterized in that: A gap is provided between the PCB board (10) and the liquid cooling plate (40).

8. The fuse heat dissipation structure according to claim 1, characterized in that: The thermal pad (30) is fixed on the liquid cooling plate (40) by bonding.

9. A new energy vehicle charging device, characterized in that: The invention comprises the fuse heat dissipation structure according to any one of claims 1 to 8.

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