Pin correction device for chip packaging
By designing the pin correction device of the chip package, using the driving mechanism of the lifting block and the pressure rod, the changes in pin position after the package is completed are directly corrected, solving the problem of low production efficiency and achieving efficient pin correction.
Patent Information
- Application Number
- CN202420461957.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-11
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-03-11
AI Technical Summary
After the chip packaging is completed, it is necessary to repackage due to changes in pin position or shape, resulting in low production efficiency.
Design a chip-packaged pin correction device, including a base, guide rail, lift block, limit plate, correction block, pressure rod and drive assembly. Through the up and down movement of the lift block and the rotation of the press rod, the pin is pressed to the correct position by matching the shape of the correcting groove and press rod.
No need to repackage the chip, directly correct the pin position, significantly improving production efficiency.
Smart Images

Figure CN222637229U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a chip pin processing device, in particular to a chip package pin correction device. Background Art
[0002] An important function of chip packaging is to lead out the internal circuit of the chip through pins, so that it can "communicate" with the external circuit.
[0003] After the chip is packaged, due to various reasons (such as collision during transportation, etc.), the pin position and shape will change. The general treatment method is to repackage such chips.
[0004] The existing technology for repackaging chips has the problem of low production efficiency. Utility Model Content
[0005] For packaged chips, they need to be repackaged due to pin problems, which leads to a technical problem of low production efficiency. The utility model provides a pin correction device for chip packaging, which has the advantage of being able to directly correct the problematic pins and improve production efficiency.
[0006] The technical solution of the utility model is:
[0007] A pin correction device for chip packaging, comprising:
[0008] The base has a guide rail in the middle portion that passes through both ends of the base, and a through hole in the middle portion of the guide rail;
[0009] A lifting block is movably disposed in the through hole, and the cross-sectional structure of the lifting block is the same as that of the guide rail;
[0010] A limit plate is located above the lifting block, and two sides of the limit plate are respectively connected to the base;
[0011] Two correction blocks are respectively arranged on both sides of the limit plate, and the bottom surface of the correction block is provided with a plurality of correction grooves, and the shape of the top surface of the correction groove is the same as the shape of the pin;
[0012] A plurality of pressure rods are rotatably arranged on the side of the correction block through a connecting rod, the shape of the pressure rods is the same as that of the pins, and can be embedded in the correction groove;
[0013] The driving assembly comprises a lifting mechanism for driving the lifting block to move up and down and a rotating mechanism for driving the pressure rod to rotate.
[0014] Optionally, the distance between the bottom surface of the lifting block and the base is greater than the radius of the pressure rod when it rotates.
[0015] Optionally, the lifting mechanism comprises:
[0016] A rack, one end of which is arranged on the bottom surface of the lifting block, and the other end of the rack is arranged vertically downward;
[0017] The first motor is connected to the bottom of the base, and the output shaft of the first motor is provided with a first gear meshing with the rack.
[0018] Optionally, the rotating mechanism comprises:
[0019] A rotating shaft, the two ends of which are rotatably arranged at the two ends of the correction block, and one end of which is provided with a second gear;
[0020] a second motor, disposed on the correction block, wherein an output shaft of the second motor is provided with a third gear meshing with the second gear;
[0021] Wherein, all the pressure rods are arranged on the rotating shaft through connecting rods.
[0022] Optionally, each of the three edges at the bottom of the correction groove has an inclined guide surface.
[0023] Optionally, the connecting rod is a C-shaped structure, and the width of the connecting rod is less than or equal to the width of the pressure rod.
[0024] Optionally, two guide rods are vertically provided at the bottom of the lifting block.
[0025] Optionally, both ends of the correction block are connected to the top surface of the base through support rods, a connecting frame is provided in the middle of the top surfaces of the two correction blocks, and the limiting plate is provided on the connecting frame.
[0026] Compared with the prior art, the beneficial effects of the utility model are:
[0027] First, a guide rail is set on the base, and one end of the guide rail is connected to the output end of the alignment machine. When a chip with a pin problem passes through the lifting block, the lifting mechanism drives the lifting block to rise and push the chip against the limit plate. At this time, the pins of the chip package will enter the correction groove on the correction block. Then, under the driving action of the rotating component, the connecting rod and the pressure rod rotate together, and the pressure rod can enter the correction groove to squeeze the pin.
[0028] Since the shape of the pressure rod and the shape of the top surface of the correction groove are the same as the shape of the pin, the pin with an incorrect posture can be pressed back to a correct posture during the process of the pressure rod squeezing the pin, thereby correcting the pin.
[0029] Through this technical solution, there is no need to reprocess chip packages with incorrect pin postures, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0031] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0032] Figure 2 It is a schematic diagram of the three-dimensional structure of the utility model when viewed from above;
[0033] Figure 3 It is a schematic diagram of the cross-sectional structure of the utility model. DETAILED DESCRIPTION
[0034] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.
[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the products of the present invention are conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0037] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.
[0038] Example:
[0039] See also Figure 1-Figure 3 A pin correction device for chip packaging includes a base 1, a lifting block 2, a limit plate 3, a correction block 4, a pressure rod 5, a connecting rod 6 and a driving assembly, wherein the driving assembly includes a rotating mechanism and a lifting mechanism. Specifically, the top surface of the base 1 has two grooves parallel to each other, and there is a spacing between the two grooves, so that there is a convex structure between the two grooves, and the convex structure forms a guide rail 7, and when the packaged chip moves on the guide rail 7, the pins of the chip package slide in the two grooves, and the chip body slides on the top surface of the guide rail 7.
[0040] Both ends of the guide rail 7 pass through both ends of the base 1 , and one end of the guide rail 7 is connected to the output end of an arrangement device. A common arrangement device is composed of a vibrator and a vibrating disk, and has a square through hole in the middle of the guide rail 7 .
[0041] The lifting block 2 is movably arranged in the through hole, and the cross-sectional shape of the lifting block 2 is the same as the cross-sectional shape of the guide rail 7 , and in an initial state, the lifting block 2 is aligned with the guide rail 7 .
[0042] A lifting mechanism is provided at the bottom of the lifting block 2, and the lifting mechanism is mainly used to drive the lifting block 2 to reciprocate in the vertical direction.
[0043] A limit plate 3 is arranged above the lifting block 2 , the bottom surface of the limit plate 3 is on a horizontal plane, and both sides of the limit block are connected to the base 1 .
[0044] A correction block 4 is provided on both sides of the limit block, and the correction block 4 is a rectangular parallelepiped structure, and the length direction of the correction block 4 is consistent with the length direction of the guide rail 7. Both ends of the correction block 4 are connected to the top surface of the base 1 through a support rod, and a connecting frame is provided in the middle of the top surface of the two correction blocks 4, and the limit plate 3 is arranged on the connecting frame.
[0045] The bottom surface of the correction block 4 is provided with a correction groove 8, the length direction of the correction groove 8 is perpendicular to the length direction of the correction block 4, and a plurality of correction grooves 8 are provided at equal intervals along the length direction of the correction block 4. The correction groove 8 is provided on the opposite side of the two correction blocks 4, the top surface of the correction groove 8 is located in the middle of the correction block 4, and the top surface shape of the correction groove 8 is the same as the shape of the pin with the correct posture (the pin with the correct posture refers to the pin that meets the requirements). The spacing between adjacent correction grooves 8 adapts to the adjacent pins on the same chip package.
[0046] A plurality of pressure rods 5 are respectively arranged on the sides of the two correction blocks 4 that are away from each other, and the number of the correction slots 8 on the same correction block 4 is the same as the number of pressure rods 5. The shape of the pressure rod 5 is the same as the shape of the pin, and all the pressure rods 5 can be embedded in all the correction slots 8 in a one-to-one matching manner.
[0047] The pressure rod 5 is rotatably connected to the side of the correction block 4 through the connecting rod 6, and the connecting rod 6 is connected to a rotating mechanism, which is used to drive the connecting rod 6 and the pressure rod 5 to rotate.
[0048] In this embodiment, a guide rail 7 is firstly arranged on the base 1, and one end of the guide rail 7 is connected to the output end of the arrangement machine. When a chip with a pin problem passes through the lifting block 2, the lifting mechanism drives the lifting block 2 to rise and press the chip onto the limit plate 3. At this time, the pins of the chip package will enter the correction groove 8 on the correction block 4. Then, under the driving action of the rotating assembly, the connecting rod 6 and the pressing rod 5 rotate together, and the pressing rod 5 can enter the correction groove 8 to squeeze the pins.
[0049] Since the shape of the pressing rod 5 and the shape of the top surface of the correction groove 8 are the same as the shape of the pin, the pin with an incorrect posture can be pressed back to the correct posture during the process of the pressing rod 5 squeezing the pin, thereby correcting the pin.
[0050] Through this technical solution, there is no need to reprocess chip packages with incorrect pin postures, thereby improving production efficiency.
[0051] Preferably, the distance between the bottom surface of the lifting block 2 and the top surface of the base 1 is greater than the radius of the pressure rod 5 when it rotates. Through this structure, it is ensured that the end of the pressure rod 5 away from its rotation axis will not collide with the top surface of the base 1, so that the pressure rod 5 can be in a completely vertical downward state, providing sufficient space for the lifting block 2 to drive the chip package to rise.
[0052] In one specific embodiment:
[0053] The lifting mechanism includes a rack 9, a first gear 10 and a first motor 11, wherein one end of the rack 9 is fixedly arranged on the bottom surface of the lifting block 2, and the other end of the rack 9 is arranged vertically downward. The first motor 11 is fixedly arranged on the bottom surface of the base 1 through a U-shaped connecting piece, and a first gear 10 is coaxially arranged on the output shaft of the first motor 11, and the first gear 10 is meshed with the rack 9.
[0054] The first motor 11 drives the first gear 10 to rotate, so that the lifting block 2 can be driven to rise and fall in the vertical direction through the cooperation between the first gear 10 and the rack 9 .
[0055] Preferably, the two ends of the connecting piece are respectively fixed to the two ends of the through hole on the bottom surface of the base 1, and the middle part of the connecting piece has a hole for the rack 9 to pass through, and there are two additional small holes. Two guide rods 13 are also vertically arranged on the bottom surface of the lifting block 2, and the two guide rods 13 are respectively slidably matched with the two small holes. By providing the guide rods 13 and the small holes, the movement direction of the lifting block 2 is limited to prevent the lifting block 2 from rotating.
[0056] In another specific embodiment:
[0057] The rotating mechanism includes a rotating shaft 14, a second motor 15, a second gear 16 and a third gear 17. The two ends of the rotating shaft 14 are respectively connected to the two ends of the correction block 4 through a base, and the length direction of the rotating shaft 14 is the same as the length direction of the correction block 4. One end of the rotating shaft 14 passes through a base, and a second gear 16 is coaxially arranged on this end of the rotating shaft 14.
[0058] The rotating shaft 14 is arranged on a side surface of the two correction blocks 4 away from each other. A second motor 15 is arranged on the top surface of the correction block 4, and a third gear 17 is arranged on the output shaft of the second motor 15. At the same time, the third gear 17 is meshed with the second gear 16.
[0059] The ends of all the connecting rods 6 are fixedly arranged on the cylindrical surface of the rotating shaft 14. In this embodiment, the second motor 15 drives the second gear 16 and the third gear 17 to rotate, thereby driving the connecting rods 6 and the pressure rod 5 to rotate through the rotating shaft 14.
[0060] In another specific embodiment:
[0061] The three edges at the bottom of the correction groove 8 are respectively provided with an inclined guide surface. By providing the guide surface, the inclined pin can be guided into the correction groove 8, thereby avoiding direct contact between the pin and the bottom surface of the correction block 4, resulting in the pin being broken.
[0062] In another specific embodiment:
[0063] The connecting rod 6 is a C-shaped structure, and the width of the connecting rod 6 is less than or equal to the width of the pressing rod 5 , so that the connecting rod 6 can completely send the pressing rod 5 into the correction groove 8 .
[0064] The above-mentioned embodiments only express the specific implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.
Claims
1. A pin correction device for chip packaging, characterized in that: include: The base has a guide rail in the middle portion that passes through both ends of the base, and a through hole in the middle portion of the guide rail; A lifting block is movably disposed in the through hole, and the cross-sectional structure of the lifting block is the same as that of the guide rail; A limit plate is located above the lifting block, and both sides of the limit plate are respectively connected to the base; two correction blocks are respectively arranged on both sides of the limit plate, and the bottom surface of the correction block is provided with a plurality of correction grooves, and the shape of the top surface of the correction groove is the same as the shape of the pin; A plurality of pressure rods are rotatably arranged on the side of the correction block through a connecting rod, the shape of the pressure rods is the same as that of the pins, and can be embedded in the correction groove; The driving assembly comprises a lifting mechanism for driving the lifting block to move up and down and a rotating mechanism for driving the pressure rod to rotate.
2. The pin correction device for chip packaging according to claim 1, characterized in that: The distance between the bottom surface of the lifting block and the base is greater than the radius of the pressing rod when it rotates.
3. The pin correction device for chip packaging according to claim 1, characterized in that: The lifting mechanism comprises: A rack, one end of which is arranged on the bottom surface of the lifting block, and the other end of the rack is arranged vertically downward; The first motor is connected to the bottom of the base, and the output shaft of the first motor is provided with a first gear meshing with the rack.
4. The pin correction device for chip packaging according to claim 1, characterized in that: The rotating mechanism comprises: A rotating shaft, the two ends of which are rotatably arranged at the two ends of the correction block, and one end of which is provided with a second gear; a second motor, which is arranged on the correction block, and the output shaft of the second motor is provided with a third gear meshing with the second gear; Wherein, all the pressure rods are arranged on the rotating shaft through connecting rods.
5. The pin correction device for chip packaging according to claim 1, characterized in that: The three edges of the bottom of the correction groove are respectively provided with an inclined guiding surface.
6. The pin correction device for chip packaging according to claim 1, characterized in that: The connecting rod is a C-shaped structure, and the width of the connecting rod is less than or equal to the width of the pressure rod.
7. The pin correction device for chip packaging according to claim 1, characterized in that: Two guide rods are vertically arranged at the bottom of the lifting block.
8. The pin correction device for chip packaging according to claim 1, characterized in that: The two ends of the correction block are connected to the top surface of the base through support rods, a connecting frame is arranged in the middle of the top surfaces of the two correction blocks, and the limiting plate is arranged on the connecting frame.