Monocrystalline silicon wafer acid corrosion machine with air curtain

Abstract

The monocrystalline silicon wafer acid etching machine comprises an etching machine box body, a semi-closed operation chamber is arranged on the etching machine box body, the front side of the semi-closed operation chamber is open, a wall drawing device is arranged on the rear side of the semi-closed operation chamber, an operation table is arranged at the bottom of the semi-closed operation chamber, and a plurality of operation grooves are formed in the operation table. A compressed air pipeline is arranged on the front side of the operation groove and provided with an air outlet hole used for being matched with a wall pumping device to form an air curtain. One end of the compressed air pipeline is a compressed air inlet, and the other end of the compressed air pipeline is closed. The wall pumping device is arranged in the semi-closed operation chamber, the compressed air pipeline capable of forming stable airflow by continuously introducing compressed air is further arranged, the airflow flows into the semi-closed operation chamber along the operation table to form an air curtain blocking structure, the tail of the air curtain is connected with the wall pumping opening, and the tail of the air curtain and negative pressure at the wall pumping opening form an opposite airflow ring. Therefore, the acid gas / nitrogen oxide flue gas is effectively covered, and harmful smoke in the corrosion machine is prevented from overflowing.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer acid etching, and in particular relates to a single crystal silicon wafer acid etching machine with an air curtain. Background Art

[0002] The main processing flow of single crystal silicon acid etching wafers includes crystal pulling → rolling → slicing → cleaning → chamfering → cleaning → grinding → cleaning → acid etching → cleaning → packaging; after the silicon wafer has been mechanically processed by diamond wire cutting and grinding, its surface will form a damage layer with a certain depth due to the stress generated by the mechanical processing. Chemical etching is usually used to eliminate the surface damage layer. Chemical etching is generally divided into acid corrosion and alkaline corrosion. Acid corrosion has the advantages of low roughness, low metal ion residue, and low surface impurity absorption compared to alkaline corrosion; acid corrosion usually uses HF, HNO 3 , CH 3 A certain proportion of COOH mixed acid reacts chemically with the single crystal silicon wafer at a certain temperature. The existing conventional acid etching route is: the silicon wafer passes through the carrier in the pre-cleaning tank, the etching box, and the post-cleaning tank to complete the silicon wafer acid etching process, in which a large amount of yellow smoke formed by condensation of nitrogen oxides will be generated during the reaction in the etching box. Since the existing single crystal silicon wafer acid etching machine is semi-automatic, the operator is required to manually move the carrier. If the yellow smoke condensed by nitrogen oxides overflows, it will cause a greater safety risk to the operator and easily pollute the external working environment of the machine; based on this, the existing acid etching machine is equipped with an external acid mist tower, and a wall extraction pipe is added to the machine to suck out the yellow smoke and filter and neutralize it; however, since the working area belongs to an open front operating table, even if a wall extraction pipe is added, a part of the yellow smoke of nitrogen oxides or other volatiles of organic acids will still overflow from the front operating table during the process of taking and placing the etching box. Summary of the invention

[0003] In view of the problems existing in the prior art, the utility model proposes a single crystal silicon wafer acid etching machine with an air curtain, the purpose of which is to effectively cover the acid gas or nitrogen oxide fume on the etching machine operating table by combining a wall suction device and a compressed air pipeline, thereby preventing the overflow of harmful fumes in the machine and solving the problem of nitrogen oxide yellow smoke or other organic acid volatiles overflowing from the front operating table during the process of taking and placing the etching box.

[0004] The utility model discloses a single crystal silicon wafer acid etching machine with an air curtain, and the technical scheme adopted comprises an etching machine housing, a semi-enclosed operating room is arranged on the etching machine housing, the front side of the semi-enclosed operating room is open, and the rear side is provided with a wall pumping device, an operating table is arranged at the bottom of the semi-enclosed operating room, a plurality of operating slots are arranged on the operating table, a compressed air pipe is arranged on the front side of the operating slot, and an air outlet hole for cooperating with the wall pumping device to form an air curtain is arranged on the compressed air pipe; one end of the compressed air pipe is a compressed air inlet, and the other end is closed.

[0005] Furthermore, the operating table is inclined upward in a direction from front to back;

[0006] Furthermore, the wall pumping device comprises a wall pumping port provided on the rear wall of the semi-enclosed operating room and a wall pumping pipe connected to the wall pumping port;

[0007] Furthermore, the compressed air pipeline is arranged at the intersection of the operating table and the corrosion machine housing;

[0008] Furthermore, the air outlet holes are arranged in one or more rows at equal intervals, and the air outlet holes are in a flat trapezoidal structure;

[0009] Furthermore, the angle between the axial direction of the air outlet and the horizontal plane is 45°, 60° or 75°.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] The utility model is provided with a wall extraction device in the semi-enclosed operating room, and also with a compressed air duct that forms a stable airflow by continuously introducing compressed air. The airflow flows along the operating table into the semi-enclosed operating room to form an air curtain barrier structure, and the tail of the air curtain is connected to the wall extraction port and forms an airflow ring with the negative pressure at the wall extraction port, thereby achieving effective coverage of acid gas / nitrogen oxide fume and preventing the overflow of harmful smoke in the etching machine; in the process of taking and placing the etching box, it can also effectively prevent nitrogen oxide yellow smoke or other organic acid volatiles from overflowing from the machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of a single crystal silicon wafer acid etching machine with an air curtain according to the utility model;

[0013] Figure 2 This is a schematic diagram of the structure of the compressed air pipeline of the utility model;

[0014] In the figure: 1-semi-enclosed operating room, 2-corrosion machine housing, 3-operating table, 4-wall extraction device, 5-compressed air pipeline, 501-air outlet, 6-operating slot. DETAILED DESCRIPTION

[0015] In order to better understand the content of the utility model, the utility model will be further described below in conjunction with specific embodiments and drawings. The following embodiments are based on the technology of the utility model and provide detailed implementation methods and operating steps, but the protection scope of the utility model is not limited to the following embodiments.

[0016] In order to better understand the content of the utility model, the following directions are specified: Figure 1For limiting the conditions, the opening direction of the semi-enclosed operating room is taken as the front. In the description of the present utility model, it should also be noted that, unless otherwise clearly specified and limited, the terms "setting", "installation" and "connection" should be understood in a broad sense; for example, "connection" can be a fixed connection, a detachable connection or an integrated connection; it can be a direct connection or an indirect connection; for ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.

[0017] See also Figure 1-2 The utility model discloses a single crystal silicon wafer acid etching machine with air curtain, which specifically comprises an etching machine housing 2 (the etching machine housing is the prior art and will not be described in detail here) and a semi-enclosed operating chamber 1 located on the etching machine housing, wherein the semi-enclosed operating chamber 1 is a chamber opening forward, and the bottom of the semi-enclosed operating chamber is an operating table 3, on which a plurality of operating slots 6 for placing the etching box are arranged; a wall suction device 4 is arranged on the rear side of the semi-enclosed operating chamber, wherein the wall suction device 4 comprises a wall suction port arranged on the inner wall of the chamber and a wall suction pipe connected to the wall suction port, so as to suck out, filter and neutralize the nitrogen oxide yellow smoke or other volatiles of organic acid generated in the operating slot; a compressed air pipe 5 is arranged on the front side of the operating table 3 along the arrangement direction of the operating slots, the compressed air pipe 5 is a hollow structure, and three exhaust holes 501 are equidistantly arranged in the direction close to the operating table, and the exhaust holes are flat trapezoidal structures, which can further compress the gas, thereby increasing the gas flow rate and reducing the gas temperature; one end of the compressed air pipe 5 is a compressed air inlet, and the other end is closed.

[0018] In the utility model, the operating table 3 is inclined upward from the front to the back, and the harmful smoke can flow into the wall extraction device more smoothly through the guidance of the inclined surface, and the inclined surface plays a role of guiding flow.

[0019] In the utility model, the compressed air duct 5 is arranged at the intersection of the operating table and the corrosion machine case, but in other embodiments, the compressed air duct is arranged in front of the operating slot, and can cooperate with the wall suction device to form an air curtain to block harmful smoke. The specific position is designed according to actual conditions.

[0020] In the present invention, the angle between the axial direction of the air outlet 501 and the horizontal plane is 45°, 60° or 75°, and can be adaptively changed according to the inclination angle of the operating table.

[0021] In the present invention, the compressed air pipeline is made of PFA material; the compressed air inlet of the compressed air pipeline is connected to the air intake device, and the air intake device is an existing conventional gas circulation device (such as an air intake pipe, an air valve, etc.).

[0022] The specific working process of the utility model is as follows: the compressed air inlet passes the gas into the compressed air pipeline, and the gas is bundled by the gas outlet 501 to form a flat airflow. The flat airflow gathered by the single exhaust hole forms an air curtain, which flows along the operating table to the semi-enclosed operating room. The tail of the air curtain is connected to the wall outlet, and the negative pressure at the wall outlet forms an airflow ring, thereby effectively covering the acid gas or nitrogen oxide fume and preventing the overflow of harmful smoke in the corrosion machine. In the utility model, the three exhaust holes 501 form a three-layer air curtain barrier structure (such as Figure 2 ), and combined with the wall extraction device, the yellow smoke of nitrogen oxides or other volatiles of organic acids generated in the operating tank are sucked out to achieve effective suppression of acidic smoke; however, in other embodiments, the air outlet holes 501 may be one row or multiple rows, and the number of air outlet holes in each row is not less than two. The number of air outlet holes can be set according to actual conditions, and the formed air curtain can produce a barrier effect on acid mist.

[0023] The above is only a preferred embodiment of the utility model. The utility model can have other forms of embodiments according to the above preparation method, which will not be listed one by one. Therefore, any simple modification, equivalent change and modification made by any technician familiar with the profession to the above embodiment according to the technical essence of the utility model without departing from the scope of the technical solution of the utility model still falls within the scope of the technical solution of the utility model.

Claims

1. A single crystal silicon wafer acid etching machine with air curtain, comprising an etching machine housing (2), characterized in that: A semi-enclosed operating room (1) is provided on the corrosion machine housing, the front side of the semi-enclosed operating room (1) is open, and the rear side is provided with a wall pumping device (4), an operating table (3) is provided at the bottom of the semi-enclosed operating room, a plurality of operating slots (6) are provided on the operating table, a compressed air pipe (5) is provided on the front side of the operating slot, and an air outlet hole (501) is provided on the compressed air pipe for cooperating with the wall pumping device to form an air curtain; one end of the compressed air pipe (5) is a compressed air inlet, and the other end is closed.

2. A single crystal silicon wafer acid etching machine with air curtain as claimed in claim 1, characterized in that: The operating table (3) is inclined upward from front to back.

3. A single crystal silicon wafer acid etching machine with air curtain as claimed in claim 1, characterized in that: The wall pumping device (4) comprises a wall pumping port arranged on the rear wall of the semi-enclosed operating room and a wall pumping pipe connected to the wall pumping port.

4. A single crystal silicon wafer acid etching machine with air curtain as claimed in claim 1, characterized in that: The compressed air pipeline (5) is arranged at the intersection of the operating table and the corrosion machine housing.

5. The single crystal silicon wafer acid etching machine with air curtain as claimed in claim 1, characterized in that: The air outlet holes (501) are arranged in one or more rows at equal intervals, and the air outlet holes are in a flat trapezoidal structure.

6. A single crystal silicon wafer acid etching machine with air curtain as claimed in any one of claims 1 and 5, characterized in that: The angle between the axial direction of the air outlet (501) and the horizontal plane is 45°, 60° or 75°.

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